Medd
Barry Medd, Bourne GB
Patent application number | Description | Published |
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20100186394 | Exhaust gas after treatment assembly - A combustion engine exhaust after treatment system mount, including a body, with a first mounting position, a second mounting position, and a foot for mounting the body to an engine or wall, the first mounting position having a first mounting surface, the second mounting position having a second mounting surface, the first mounting position having a first longitudinal axis, and the second mounting position having a second longitudinal axis, the first axis positioned substantially parallel to the second axis. In another aspect a combustion engine exhaust after treatment system is disclosed including such a mount and at least two exhaust gas after treatment components chosen from the group including a particle filter (PF), a muffler, a heat source for PF regeneration, a Selective Catalytic Reductor (SCR) and a mixing chamber, at least one of the components being positioned in the first mounting position and the at least one other component being positioned in the second mounting position, fluidly connected to the first component. | 07-29-2010 |
Morris James Medd, London CA
Patent application number | Description | Published |
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20120318581 | FORMING A SHAFT FOR AN UNDERGROUND MINE - In forming a mine shaft for an underground mine, earth excavated by a boring machine may be transported upwardly by a handling unit to a transfer station where it may be transferred into skips, which may be raised and lowered along skip guides within the shaft hole for transport of the excavated material to an earth surface region. The transfer station may be moved downwardly as excavation progresses. | 12-20-2012 |
Steven Medd, Danbury, CT US
Patent application number | Description | Published |
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20150045277 | POST-CMP FORMULATION HAVING IMPROVED BARRIER LAYER COMPATIBILITY AND CLEANING PERFORMANCE - A cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include at least one quaternary base, at least one amine, at least one azole corrosion inhibitor, at least one reducing agent, and at least one solvent. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device while being compatible with barrier layers, wherein the barrier layers are substantially devoid of tantalum or titanium. | 02-12-2015 |