Patent application number | Description | Published |
20110012264 | OPTOELECTRONIC DEVICE WITH HEAT SPREADER UNIT - Optoelectronic devices with heat spreader units are described. An optoelectronic device includes a back-contact optoelectronic cell including a plurality of back-contact metallization regions. One or more heat spreader units are disposed above the plurality of back-contact metallization regions. A heat sink is disposed above the one or more heat spreader units. | 01-20-2011 |
20120012156 | OPTOELECTRONIC DEVICE WITH HEAT SPREADER UNIT - A solar module includes a solar cell, a heat spreader layer disposed above the solar cell, and a cell interconnect disposed above the solar cell. From a top-down perspective, the heat spreader layer at least partially surrounds an exposed portion of the cell interconnect. | 01-19-2012 |
20120031464 | DIODE AND HEAT SPREADER FOR SOLAR MODULE - Arrangements of diodes and heat spreaders for solar modules are described. For example, a solar module may include a backsheet with a low profile, surface-mount diode disposed above the backsheet. A pair of ribbon interconnects is coupled to the low profile, surface-mount diode and may penetrate the backsheet. | 02-09-2012 |
20120074576 | INTERCONNECT FOR AN OPTOELECTRONIC DEVICE - Interconnects for optoelectronic devices are described. An interconnect may include a stress relief feature. An interconnect may include an L-shaped feature. | 03-29-2012 |
20130228906 | INTERCONNECT FOR AN OPTOELECTRONIC DEVICE - Interconnects for optoelectronic devices are described. For example, an interconnect for an optoelectronic device includes an interconnect body having an inner surface, an outer surface, a first end, and a second end. A plurality of bond pads is coupled to the inner surface of the interconnect body, between the first and second ends. A stress relief feature is disposed in the interconnect body. The stress relief feature includes a slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body. | 09-05-2013 |
20130251940 | METHOD OF CUTTING AN INGOT FOR SOLAR CELL FABRICATION - Methods of cutting ingots for solar cell fabrication, as well ingots and grippers there for, are described. In an example, a method of cutting an ingot includes gripping a portion of the ingot directly with a gripper of a cutting apparatus. The ingot is partially cut to form a plurality of wafer portions projecting from an uncut portion of the ingot. The ingot is further cut to separate the plurality of wafer portions from the uncut portion, to provide a plurality of discrete wafers. | 09-26-2013 |
20130255870 | COMBINED EDGE SEALING AND EDGE PROTECTION OF MULTI-LAYERED REFLECTORS - The area of Concentrating Solar Power (CSP) and Concentrating Photovoltaics (CPV) require reliable, robust and durable reflectors capable of withstanding different environments, weather and transportation conditions. It is therefore important to use a method for fabricating a reflector which seals a reflector edge against moisture, corrosion and contaminants and protects the edge from cracks and damage. Embodiments of this method include depositing a clear sealant over the reflector edges, extending a reflective film over the edges of the reflector then sealing from the back and laminating a flexible strip of a clear polymer such as PVB and EVA around the top edge, a bottom edge, and all side edges of the reflector. Another embodiment includes performing hemming process on a front assembly of the reflector over the edges of a back assembly forming a sacrificial layer at the back of the reflector to prevent delamination. | 10-03-2013 |
20140048119 | DIODE AND HEAT SPREADER FOR SOLAR MODULE - Arrangements of diodes and heat spreaders for solar modules are described. For example, a solar module may include a backsheet with a low profile, surface-mount diode disposed above the backsheet. A pair of ribbon interconnects is coupled to the low profile, surface-mount diode and may penetrate the backsheet. | 02-20-2014 |
20140291852 | INTERCONNECT FOR AN OPTOELECTRONIC DEVICE - Interconnects for optoelectronic devices are described. For example, an interconnect for an optoelectronic device includes an interconnect body having an inner surface, an outer surface, a first end, and a second end. A plurality of bond pads is coupled to the inner surface of the interconnect body, between the first and second ends. A stress relief feature is disposed in the interconnect body. The stress relief feature includes a slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body. | 10-02-2014 |
20150020867 | Optoelectronic Device with Heat Spreader Unit - A solar module includes a solar cell, a heat spreader layer disposed above the solar cell, and a cell interconnect disposed above the solar cell. From a top-down perspective, the heat spreader layer at least partially surrounds an exposed portion of the cell interconnect. | 01-22-2015 |