Patent application number | Description | Published |
20100317310 | DIRECTIVITY CONTROL SYSTEM, CONTROL DEVICE, COOPERATIVE STATION DEVICE, RECEPTION STATION DEVICE, AND METHOD OF CONTROLLING DIRECTIVITY - A directivity control system includes a first reception station device which receives an interference signal and a desired signal; a cooperative station device disposed at a different place from the first reception station device, which receives a signal using an antenna; and a control device which controls the directivity of an antenna of the first reception station device, wherein the control device regards a combination of the antenna of the first reception station device and the antenna of the cooperative station device as one array antenna, and calculates a sum, using a weight, of a received signal received using the antenna of the first reception station device and a received signal received using the antenna of the cooperative station device to compose a directivity pattern having a null in an arrival direction of the interference signal in the array antenna. | 12-16-2010 |
20110107171 | RECEPTION METHOD AND RECEPTION DEVICE - In a multicarrier wireless communication system adopting forward error correction codes, a reception method adapted to a receiver | 05-05-2011 |
20110129047 | RECEPTION DEVICE AND RECEPTION METHOD - It is possible to reduce the effect of an interference signal while suppressing increases in a circuit scale and a processing time. A reception device receives a multicarrier signal and an interference signal via a radio transmission path, detects a frequency position of the interference signal, performs filtering to suppress the multicarrier signal and the interference signal at the detected frequency position of the interference signal, removes a guard interval from the multicarrier signal suppressed by the filtering, demodulates each subcarrier of the multicarrier signal from which the guard interval is removed, and performs error correction on the demodulated signal. | 06-02-2011 |
20110211646 | CONTROL STATION DEVICE, TRANSMITTING STATION DEVICE, COMMUNICATION METHOD, AND COMMUNICATION SYSTEM - In a communication system configured by a transmitting station device and a receiving station device for transmitting and receiving a multicarrier signal using a spectrum including a plurality of subcarriers, a superposed rate which is a rate in which a superposed band in which interference is occurring is used in a used frequency band used for transmitting the multicarrier signal is set so as to increase frequency utilization efficiency of the used frequency band, and the multicarrier signal is transmitted using a spectrum allocated in accordance with the set superposed rate. | 09-01-2011 |
20110243268 | WIRELESS COMMUNICATION SYSTEM AND WIRELESS COMMUNICATION METHOD - In a wireless communication system including a transmitter device and a receiver device used for transmission of wireless signals having a plurality of sub-carriers, the transmitter device performs error correction coding on transmitting data and selects at least one of the plurality of sub-carriers used for transmission of error-correction coded data as a null sub-carrier having zero amplitude, thus transmitting the error-correction coded data, whilst the receiver device receives signals having the plurality of sub-carriers from the transmitter device so as to retrieve original transmitted data by implementing error correction decoding on received signals, thus determining whether an interference wave occurs in the sub-carrier upon detecting reception power exceeding a predetermined threshold in the sub-carrier serving as the null sub-carrier. | 10-06-2011 |
20110249569 | COMMUNICATION SYSTEM, TRANSMITTING DEVICE, RECEIVING DEVICE, TRANSMISSION METHOD, AND COMMUNICATION METHOD - A communication system which superposes and transfers a wireless multicarrier signal including a plurality of subcarriers is provided with: a transmitting device which performs allocation of predetermined data generated based on transmission data to both a non-superposed band which is a frequency band in which no interference signal is present and a superposed band which is a frequency band in which the interference signal is present, or to the non-superposed band while giving a higher priority to the non-superposed band, and generates and transmits the multicarrier signal based on the allocation; and a receiving device which receives the multicarrier signal transmitted from the transmitting device. | 10-13-2011 |
20130308591 | WIRELESS COMMUNICATION SYSTEM, TRANSMITTING DEVICE, RECEIVING DEVICE, AND WIRELESS COMMUNICATION METHOD - The receiving device of the present invention is provided with a means that receives, as a received signal, a signal that has been transmitted a transmitting device by dividing by N the spectrum of a signal to be transmitted and performing spectrum editing to reduce its occupied bands; a means that generates a first decoded signal by error-correcting and decoding this received signal in the bandwidth of the signal to be transmitted; a means that generates a transmission replica signal from this first decoded signal and divides by N the spectrum of this transmission replica signal to generate N sub-replicas; a means that generates a compensated received signal by restoring the spectrum of the signal to be transmitted from the transmitting device using the N sub-replicas and the received signal; and a means that decodes this compensated received signal to generate a second decoded signal. | 11-21-2013 |
Patent application number | Description | Published |
20080286594 | Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device - The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges. | 11-20-2008 |
20080305583 | Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device - The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges. | 12-11-2008 |
20090186216 | Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device - The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges. | 07-23-2009 |
20120068312 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 03-22-2012 |
20120073743 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 03-29-2012 |
20120094471 | WAFER PROCESSING TAPE, METHOD OF MANUFACTURING WAFER PROCESSING TAPE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release base material from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased. Methods of manufacturing the tape and a semiconductor device are also provided. | 04-19-2012 |
20120135176 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 05-31-2012 |
20130045585 | ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE - The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges. | 02-21-2013 |
20130224932 | ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE - The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges. | 08-29-2013 |
20130273718 | TAPE FOR PROCESSING WAFER, METHOD FOR MANUFACTURING TAPE FOR PROCESSING WAFER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release substrate from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased and the wafer processing tape can be suppressed from being peeled off from the wafer ring during processes. | 10-17-2013 |
20130295314 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 11-07-2013 |
20130302570 | ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - An adhesive sheet comprising a release substrate | 11-14-2013 |
Patent application number | Description | Published |
20090251019 | AC generator for vehicles - AC generator for vehicles is provided with a frame that supports a rotor and a stator, a rectifier that rectifies an output of the stator and has an output terminal, and a rear cover that covers electric parts including the rectifier. The rear cover is provided with a drain hole in the side part of the output terminal, and a wall part that adjoins the drain hole provided in the output terminal side. | 10-08-2009 |
20120045158 | ALTERNATOR FOR AUTOMOBILE HAVING WASHER BETWEEN HOUSING AND OUTER RACE OF BEARING - An alternator has front and rear bearings, supported by front and rear frames, to rotatably support a shaft of a rotor extending along axial direction. A washer is located between the rear frame and the rear bearing to apply pressing force to the rear bearing slightly movable along axial direction. The washer has a ring-shaped base portion concentrically located with the rear bearing, slanting portions extending from the base portion toward outside of radial direction such that two adjacent slanting portions arranged as each pair along circumferential direction are inclined to different sides of axial direction, and flattened portions extending from respective slanting portions toward outside and being parallel to the base portion. Flattened portions shifted to front side are in contact with the rear bearing, and flattened portions shifted to rear side are in contact with the rear frame. | 02-23-2012 |
20120326572 | ALTERNATOR FOR VEHICLE WITH HEAT DISSIPATING FIN - An alternator for a vehicle is provided which is equipped with a heat dissipator and a cooling air generator. The heat dissipator is disposed in a rectifier to cool rectifying devices. The cooling air generator generates a flow of cooling air to the heat dissipator. The heat dissipator has a plurality of sub-fins formed thereon. Each of the sub-fins is defined by a combination of a protrusion and a recess. The protrusions are formed on one of opposed major surfaces of the heat dissipator, while the recesses are formed on the other major surface, one in coincidence with each of the protrusions in a thickness-wise direction of the heat dissipator. This permits the heat dissipator to be pressed to form the protrusions and the recesses to make the sub-fins simultaneously, thus allowing a heat-dissipating area to be increased to ensure a desired degree of heat capacity thereof. | 12-27-2012 |
Patent application number | Description | Published |
20080233677 | Semiconductor device and method of manufacturing the same - Two semiconductor substrates are first bonded together by means of a metal bump, while respective one-side surfaces on which device patterns are formed are faced each other, and a resin is then filled into a gap between the respective one-side surfaces and thereafter each of the semiconductor substrates is polished and thinned to a prescribed thickness. Furthermore, a via hole and an insulating film are formed; part of a portion in contact with the metal bump, of the insulating film, is opened; the inside of the via hole is filled with a conductor; and an electrode pad is formed on the conductor, to thereby form structures. Finally, a required number of structures are electrically connected with each other through the electrode pad and stacked to thereby obtain a semiconductor device. | 09-25-2008 |
20080291649 | Capacitor built-in substrate and method of manufacturing the same and electronic component device - A capacitor built-in substrate of the present invention includes; a base resin layer; a plurality of capacitors arranged side by side in a lateral direction in a state that the capacitors are passed through the base resin layer, each of the capacitors constructed by a first electrode provided to pass through the base resin layer and having projection portions projected from both surface sides of the base resin layer respectively such that the projection portion on one surface side of the base resin layer serves as a connection portion, a dielectric layer for covering the projection portion of the first electrode on other surface side of the base resin layer, and a second electrode for covering the dielectric layer; a through electrode provided to pass through the base resin layer and having projection portions projected from both surface sides of the base resin layer respectively; and a built-up wiring formed on the other surface side of the base resin layer and connected to the second electrodes of the capacitors and one end side of the through electrode. | 11-27-2008 |
20100148340 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor device includes: (a) half-dicing a semiconductor wafer including plural semiconductor chips, thereby forming dicing grooves in the semiconductor wafer, wherein each semiconductor chip includes a circuit and pads and wherein the semiconductor wafer includes: a first surface on which the circuit and the pads are formed; and a second surface opposite to the first surface, (b) connecting the pads to each other by conductive connectors; (c) sealing the first surface of the semiconductor wafer, the dicing grooves and the conductive connectors with a resin; (d) grinding the second surface of the semiconductor wafer, thereby forming a group of sealed chips; (e) dividing the group of sealed chips into individual sealed chips; (f) mounting and stacking the individual sealed chips on a wiring substrate having connection terminals thereon; and (g) electrically-connecting the conductive connectors and the connection terminals using a conductive member. | 06-17-2010 |
20100231344 | INDUCTOR DEVICE, AND METHOD OF MANUFACTURING THE SAME - An inductor device includes a first magnetic body pattern layer in which slits are provided and which is made to a pattern, a lower insulating layer formed on the first magnetic body pattern layer, a planar coil layer formed on the lower insulating layer, an upper insulating layer formed on the planar coil layer, and a second magnetic body pattern layer formed on the upper insulating layer and in which slits are provided and which is made to a pattern, wherein the first magnetic body pattern layer and the second magnetic body pattern layer are arranged to intersect orthogonally with the planar coil layer. | 09-16-2010 |
Patent application number | Description | Published |
20090008148 | INDUCTOR BUILT-IN WIRING BOARD HAVING SHIELD FUNCTION - There is provided a wiring board having a shield function. The wiring board includes: a plurality of conductive shield patterns adapted to surround a circumference of at least one electronic component mounting area on the wiring board, the plurality of conductive shield patterns being adjacent to each other; and at least one inductor formed of a conductive pattern and provided between the conductive shield patterns. | 01-08-2009 |
20090243035 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE MOUNTING STRUCTURE - In a semiconductor device that is formed by joining two semiconductor elements together to oppose device layers to each other, inductor patterns for transmitting and receiving a signal and feeding a power and bumps for connecting electrically the semiconductor elements and for supporting the inductor patterns and the semiconductor elements being arranged opposedly in an electrically isolated state are provided on a surface of the device layer of at least one of semiconductor elements and an electrically insulating material is filled in a space between opposing surfaces of the semiconductor elements. | 10-01-2009 |
20090290317 | PRINTED CIRCUIT BOARD, METHOD OF FABRICATING PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE - A printed circuit board has capacitors, a grounding wiring pattern having a bonding surface on which a semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to first electrodes of the capacitors, and a power supply wiring pattern having a bonding surface on which the semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to second electrodes of the capacitors. The grounding and power supply wiring patterns are alternately arranged in a predetermined direction, and the capacitors are coupled in parallel with respect to the grounding and power supply wiring patterns. | 11-26-2009 |