Patent application number | Description | Published |
20090175470 | ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME - An acoustic wave device includes a substrate; an acoustic wave element provided on the substrate; a terminal that is provided on the substrate and is electrically coupled to the acoustic wave element; a first insulating layer that is provided on the substrate and has a first opening at a region thereof overlapped with at least a part of the terminal; a second insulating layer that has an second opening at a region thereof overlapped with at least a part of the first opening and is provided on the first insulating layer and the acoustic wave element so that a cavity is formed above the acoustic wave element; a third insulating layer that has a third opening including the region where the first opening and the second opening are overlapped with each other, and is provided on the second insulating layer; a metal post that is electrically coupled to the terminal and is provided in the first opening, the second opening and the third opening; and a solder ball provided on the metal post. | 07-09-2009 |
20130087605 | CONDUCTIVE BONDING MATERIAL, CONDUCTOR BONDING METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD - A conductive bonding material comprising: a first metal particle; a second metal particle having an average particle diameter larger than an average particle diameter of the first metal particle; and a third metal particle having an average particle diameter larger than the average particle diameter of the first metal particle, a relative density larger than a relative density of the first metal particle, and a melting point higher than a melting point of the second metal particle. | 04-11-2013 |
20130088839 | BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE ASSEMBLY - There is provided a method of manufacturing a board module which includes attaching a metal particle to a surface of a solder bump, which includes at least a tin component and is mounted on an electrode provided on a first surface of an electric part or a printed circuit board, the metal particle having a higher specific gravity and a higher melting point than the solder bump, making the first surface face up, heating the solder bump to a temperature equal to or higher than the melting point of the solder bump so that the metal particle precipitates in the solder bump, and forming an inter-metal compound layer, which has a higher melting point than a melting point of the solder bump, at an interface between the solder bump and the electrode by using the metal particle, which has precipitated, and the tin component of the solder bump. | 04-11-2013 |
20130128477 | METHOD OF DETERMINING REINFORCEMENT POSITION OF CIRCUIT SUBSTRATE AND SUBSTRATE ASSEMBLY - A method of determining a reinforcement position of a circuit board includes: setting a numerical model of a circuit board in which an electronic component is mounted in a front surface by bumps, and a reinforcing member is attached to a position corresponding to a bump located in a corner part of the electrical component in a back surface; incorporating information about a stud that is located in a periphery of the electronic component and fixes the circuit board to a chassis of the electronic device; performing a simulation for obtaining values of stresses generated in bumps of corner parts when a force is applied to the electronic component from a back side of the circuit board; and determining an arrangement of the reinforcing member in accordance with a position of the stud based on the values of stresses obtained by the simulation. | 05-23-2013 |
20130140069 | CONDUCTIVE BONDING MATERIAL, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE - A conductive bonding material includes: copper particles coated with either gallium or gallium alloy; and either tin particles or tin alloy particles. An electronic component includes: a wiring board having electrode pads; a component mounted on the wiring board and having a plurality of electrodes; a sealing resin covering the component; and a plurality of terminals coupled to a wiring line in the wiring board to an external substrate, wherein the plurality of electrodes being coupled to the electrode pads through a conductive bonding material containing copper particles coated with either gallium or gallium alloy particles and either tin particles or tin alloy particles. | 06-06-2013 |
20130233494 | COMPONENT ADHESIVE BONDING STRUCTURE AND COMPONENT SEPARATION METHOD - A configuration includes the adhesive member to adhesively bond components together and a thermo-expandable material to expand upon being heated in the way of being disposed between at least one of the components adhesively bonded together by the adhesive member and the adhesive member and to push the adhesive member in a direction of getting apart from at least one of the components. | 09-12-2013 |
20130313309 | CONDUCTIVE BONDING MATERIAL, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - A conductive bonding material includes: a solder component including a metal foamed body of a first metal having at least one pore, the pore absorbs melted first metal when the metal foamed body is heated at a temperature higher than the melting point of the first metal, and a second metal having a melting point lower than the melting point of the first metal. | 11-28-2013 |
20140036198 | SUBSTRATE MODULE, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD FOR ELECTRONIC APPARATUS - A substrate module includes: a substrate on which an electronic component is mounted; and a sealing resin that seals the electronic component, and has an opening, the opening being open along an extending direction of the substrate. | 02-06-2014 |
20140086525 | OPTICAL UNIT AND METHOD OF MANUFACTURING THE SAME - An optical unit in which an optical part having an optical element is mounted on a base having an optical waveguide includes a hydrophobic first area formed in a region including an optical axis of the optical part, a hydrophobic second area formed in a region facing the first area on a surface of the base, and a hydrophilic filler which fills peripheries of the first area and the second area between the optical part and the base. | 03-27-2014 |
20140285989 | METHOD OF MOUNTING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE - A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a first melting point of the first solder joint material; arranging the semiconductor element so that a second pad formed on the semiconductor element faces the first pad and a joint gap is provided between the semiconductor element and the substrate; and performing reflow at a reflow temperature lower than the first melting point and higher than the second melting point to join the first solder joint material and the second solder joint material. | 09-25-2014 |