Patent application number | Description | Published |
20090069478 | Flame-Retardant Polyamide Composition - To provide a polyamide resin composition which inhibits generation of a gas, formation of decomposition products and discoloration of molded articles even under high molding temperature conditions, is excellent in incombustibility and toughness, and heat resistance in a reflow soldering step being required for surface mounting. The present invention provides a flame-retardant polyamide composition comprising 20 to 80% by mass of polyamide (A), 5 to 40% by mass of a flame retardant (B), 0.01 to 0.45% by mass of an antimony compound (C) and 0.5 to 10% by mass of a salt of zinc or calcium (D). | 03-12-2009 |
20090069479 | Flame-retardant polyamide composition - A flame-retardant polyamide composition having excellent properties in mechanical properties such as toughness, in heat resistance, incombustibility and flowability in a reflow soldering process, and in heat stability during molding. There is provided a flame-retardant polyamide composition comprising 20 to 80% by mass of polyamide resin (A), 5 to 40% by mass of flame retardant with specific bromine content and molecular weight (B) and 0.5 to 10% by mass of flame retardant auxiliary agent (C) optionally together with hydrotalcite compound of specific composition (D). | 03-12-2009 |
20100076137 | FLAME -RETARDANT POLYAMIDE COMPOSITION - Disclosed is a flame-retardant polyamide composition excellent in fluidity during molding and granulation ability on a twin-screw extruder or the like. A molded article produced from the composition is excellent in mechanical properties including stiffness, heat resistance and flame retardancy during a reflow soldering process, and shows low warpage. Specifically disclosed is a flame-retardant polyamide composition comprising 20 to 80 mass % of a specific polyamide resin (A), 1 to 40 mass % of a flame retardant (B), 5 to 60 mass % of a glass fiber (C), and 0.5 to 5 mass % of an auxiliary flame retardant (D), which can be molded in an article having reduced warpage. Preferably, the glass fiber (C) has a cross section having an aspect ratio of greater than 3. | 03-25-2010 |
20100113657 | FLAME-RETARDANT POLYAMIDE COMPOSITION - Disclosed is a flame-retardant polyamide composition which is excellent in mechanical properties such as toughness, and heat resistance, flame retardancy and flow ability during a reflow soldering process. In addition, this polyamide composition exhibits high thermal stability during molding. Specifically disclosed is a flame-retardant polyamide composition containing (A) 20-80% by weight of a specific polyamide resin, (B) 10-20% by weight of a metal phosphinate, (C) 0.05-1% by weight of a lithium salt, a calcium salt, a barium salt, a zinc salt or an aluminum salt of montanic acid, behenic acid or stearic acid. It is preferable that this flame-retardant polyamide composition contains no halogen flame retardant. | 05-06-2010 |
20100261818 | FLAME-RETARDANT POLYAMIDE COMPOSITION - Disclosed is a flame-retardant polyamide composition which has excellent mechanical properties such as toughness, excellent heat resistance and flow ability during reflow soldering, and good thermal stability during molding, without using a halogen flame-retardant. This flame-retardant polyamide composition exhibits stable flame retardance particularly when a thin article is molded. Specifically disclosed is a flame-retardant polyamide composition containing 20-80% by mass of a specific polyamide resin (A), 5-30% by mass of a phosphinate compound (B), and 0.01-10% by mass of a phosphazene compound (C). | 10-14-2010 |
20100261819 | FLAME-RETARDANT POLYAMIDE COMPOSITION - Disclosed is a flame-retardant polyamide composition which has excellent mechanical properties such as toughness, excellent heat resistance and flow ability during reflow soldering, and good thermal stability during molding, without using a halogen flame-retardant. This flame-retardant polyamide composition exhibits stable flame retardance particularly when a thin article is molded. Specifically disclosed is a flame-retardant polyamide composition containing 20-80% by mass of a specific polyamide resin (A), 10-20% by mass of a phosphinate (B), and 0.05-10% by mass of a specific flame retardant assistant (C). | 10-14-2010 |
20110257313 | FLAME-RETARDANT POLYAMIDE COMPOSITION - A halogen-free flame-retardant polyamide composition which generates no halogen compound during combustion. The composition has excellent thermal stability during high-temperature molding and is capable of showing high flame retardancy when burned. The composition is effective in inhibiting steel materials, such as the screw or cylinder of an extruder or molding machine, from corroding or wearing. The flame-retardant polyamide composition in a preferred embodiment comprises 20-60 mass % polyamide resin (A), 5-40 mass % thermoplastic resin (B) other than (A), 3-15 mass % flame retardant (C) having no halogen radicals in the molecule, and 0-50 mass % reinforcement (D), wherein the thermoplastic resin (B) satisfies the UL94V-0 standards, the flame retardant (C) is a phosphinic acid salt compound, and the sum of the thermoplastic resin (B) and the flame retardant (C) is 16-45 mass %. | 10-20-2011 |
Patent application number | Description | Published |
20120133709 | MANUFACTURING METHOD OF INKJET HEAD AND INKJET HEAD - According to one embodiment, when an electrode protection film of an inorganic material, which is apt to form a pin hole by influence of roughness of a ground, is used, an electrode as a smoothed electrode is formed on the ground of the electrode protection film by a plating method, or a film is formed as a smoothed layer (film) by an inorganic coating material such as SIRAGUSITAL (trade name: New Technology Creating Institute Co., Ltd.), such that the thickness of the electrode protection film is 1.0 μm or more, and the average surface roughness of the ground of the electrode protection film is 0.6 μm or less. | 05-31-2012 |
20130180654 | MANUFACTURING METHOD OF INKJET HEAD - According to one embodiment, forming an electrode part, in which after an electrode is formed on an inner surface of a groove part formed in a substrate of the inkjet head, a smoothed film made of an inorganic material and having an average surface roughness of 0.6 μm or less is formed on a surface of the electrode, and then, an electrode protection film having a thickness of 1.0 μm or more is formed on a surface of the smoothed film; bonding a nozzle plate to an opening end face of a pressure chamber in the groove part by an adhesive after the electrode part is formed; and forming, in the nozzle plate, a nozzle communicating with the pressure chamber by laser machining after the nozzle plate is bonded. | 07-18-2013 |
Patent application number | Description | Published |
20120229577 | INK-JET HEAD AND METHOD OF MANUFACTURING INK-JET HEAD - According to one embodiment, an ink-jet head includes a substrate, a piezoelectric member, electrically conductive portions, a frame member, an insulating film, an electronic component and a protective agent. The piezoelectric member is mounted on the substrate and includes pressure chambers. The electrically conductive portions extend from the pressure chambers and are disposed on the substrate. The frame member inside which the piezoelectric member is disposed is attached to the substrate from above the electrically conductive portions. The insulating film covers the piezoelectric member, the frame member, and a part of the electrically conductive portions. The electronic component is connected to the electrically conductive portions. The protective agent covers an end portion of the insulating film located between the frame member and the electronic component and the electrically conductive portions between the electronic component and the end portion of the insulating film. | 09-13-2012 |
20120229578 | INK-JET HEAD AND METHOD OF MANUFACTURING INK-JET HEAD - According to one embodiment, an ink-jet head includes a main body, electrodes, electrically conductive portions, an insulating film, a frame member, a lid member, an electronic component, a protective agent. The main body includes pressure chambers. The insulating film covers the electrodes and a part of the electrically conductive portions. The frame member is attached to the main body from above the insulating film. The protective agent covers an end portion of the insulating film located between the frame member and the electronic component and the electrically conductive portions between the electronic component and the end portion of the insulating film. | 09-13-2012 |
20120236079 | INKJET HEAD AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, an inkjet head comprises a substrate, and a nozzle plate. The substrate includes grooves. The nozzle plate includes nozzles that are formed by laser processing to communicate with the grooves. Electrodes are formed on respective internal surfaces of the grooves. Each of the electrodes is formed of a plurality of metal layers, and includes a flat surface that is apart from the internal surfaces of the grooves. A first inorganic film is superposed on the surfaces of the electrodes. A second inorganic film is superposed on the first inorganic film. | 09-20-2012 |
20140125739 | INKJET HEAD AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, an inkjet head comprises a substrate, and a nozzle plate. The substrate includes grooves. The nozzle plate includes nozzles that are formed by laser processing to communicate with the grooves. Electrodes are formed on respective internal surfaces of the grooves. Each of the electrodes is formed of a plurality of metal layers, and includes a flat surface that is apart from the internal surfaces of the grooves. A first inorganic film is superposed on the surfaces of the electrodes. A second inorganic film is superposed on the first inorganic film. | 05-08-2014 |
20140285580 | INKJET HEAD AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, an inkjet head comprises a substrate, and a nozzle plate. The substrate includes grooves. The nozzle plate includes nozzles that are formed by laser processing to communicate with the grooves. Electrodes are formed on respective internal surfaces of the grooves. Each of the electrodes is formed of a plurality of metal layers, and includes a flat surface that is apart from the internal surfaces of the grooves. A first inorganic film is superposed on the surfaces of the electrodes. A second inorganic film is superposed on the first inorganic film. | 09-25-2014 |