Patent application number | Description | Published |
20090027541 | Solid State Imaging Device - A solid-state imaging device provided with a light receiving surface, in which plural unit pixels, each having a photoelectric transducer to convert light signals into electric signals, are two-dimensionally arranged; a microlens to focus a light beam, the microlens being arranged in each unit pixel corresponding to the photoelectric transducer; an aperture section, to allow the light beam to enter the photoelectric transducer, the aperture section being arranged in each unit pixel corresponding to the photoelectric transducer; a wiring layer, which comprises plural layers, and is formed between the photoelectric transducer and the microlens, wherein the plural unit pixels are arranged such that each of the photoelectric transducer is located axisymmetrically with a symmetrical axis of a first centerline passing through an approximate center of the light receiving surface. | 01-29-2009 |
20090303361 | SOLID-STATE IMAGE PICKUP APPARATUS - A solid-state image pickup apparatus includes: a pixel portion in which at least one pixel with a photo-electric conversion element is arranged; an analog/digital converter comprising: a delay circuit in which delay elements are connected in multiple stages, the delay elements having a delay amount in accordance with a difference between an output voltage that is output from the pixel portion for every pixel and a predetermined reference voltage; and a decoder portion that, after detecting a number of circulations, in the delay circuit, of a pulse propagating in the delay circuit and a number of stages, of the delay elements connected in multiple stages, through which the pulse has propagated, outputs a digital signal based on the detected number of circulations and stages for each of the pixels; and a control circuit which controls the analog/digital converter so as to modify a number of bits of the digital signal that is output from the analog/digital converter, in accordance with on a preset shooting mode, in which the control circuit modifies a period where the pulse propagates in the delay circuit. | 12-10-2009 |
20100177238 | Imaging Device - Provided is an imaging device which simplifies an assembling adjustment so as to reduce the manufacturing time and cost, wherein second lens L | 07-15-2010 |
20100208354 | Method for Producing Wafer Lens Assembly and Method for Producing Wafer Lens - There is provided a method for producing a wafer lens assembly capable of adhering a wafer lens and a spacer surely. The wafer lens assembly includes a first substrate including plural optical members formed of a curable resin on at least one surface, a second substrate joined to the first substrate, and a stop member arranged between the first and second substrates. The first and second substrates are adhered with an adhesive made of a photo-curable resin. The method includes an adhesive applying step of applying the adhesive made of a photo-curable resin on a joining area, a stop-member forming step, and a photo-curing step of irradiating and hardening the adhesive applied in the adhesive applying step with light after the stop-member forming step. The stop member is formed so as not to prevent the light irradiated in the photo-curing step from reaching the adhesive. | 08-19-2010 |
20100214458 | Method for Manufacturing Imaging Device, Imaging Device and Portable Terminal - Provided are a manufacturing method for obtaining a low-cost imaging device, and the low-cost imaging device manufactured by such method. The method for manufacturing the imaging device is provided with a step of integrally forming a plurality of imaging devices by using a plurality of imaging optical systems for guiding photographing object light and a plurality of imaging elements for photoelectrically converting the photographing object light, and a step of dividing the integrally formed imaging devices by cutting into individual imaging devices. In the step of integrally forming the imaging devices, a shape for positioning the integrally formed imaging devices is formed. | 08-26-2010 |
20100315546 | Imaging Device and Manufacturing method therefor - There is provided an imaging device capable of easily shielding an imaging element. The imaging device comprises a conductive mirror frame, an element unit including an imaging element equipped with a photoelectric converter, and an imaging lens attached within the mirror frame and imaging a subject image on the photoelectric converter of the imaging element. The element unit has an exposed conductive member contactable to the mirror frame. | 12-16-2010 |
20110042840 | Method for Producing Molded Body or Wafer Lens - The present invention aims to improve shape precision of a molded body when a plurality of molded bodies, which are projections or recesses made of a curable resin, are formed on both sides of a glass substrate. Disclosed is a method for producing a molded body, which comprises a step of preparing a first mold having a plurality of negative molding surfaces having shapes corresponding to a plurality of molding parts; a step of applying a curable resin onto a surface of the first mold on which the molding surfaces are formed; and a curing step of curing the applied curable resin. The curing step includes a photocuring step wherein curing of the curable resin is carried out by irradiating the resin with light, and a heat curing step wherein the curable resin partly cured by the photocuring step is further cured by being subjected to a heat treatment | 02-24-2011 |
20110194003 | SOLID-STATE IMAGING DEVICE, METHOD OF DRIVING SOLID-STATE IMAGING DEVICE, AND IMAGE PROCESSING DEVICE - An image processing device comprising: first A/D converters that receive output signals of respective columns of a plurality of pixels arranged in a matrix form, convert the output signals into first digital signals, and output the first digital signals; a second A/D converter that receives a correction signal, converts the correction signal into a second digital signal, and outputs the second digital signal; a first correction calculation unit that produces a first correction formula; a second correction calculation unit that produces a second correction formula based on the second digital signal; a determination unit that compares a coefficient of the second correction formula and a coefficient of a second correction formula produced before the second correction formula, and determines whether or not to produce the first correction formula based on the comparison result; and a signal output unit that outputs an update signal when it is determined to produce the first correction formula. | 08-11-2011 |
20120175500 | SOLID STATE IMAGE PICKUP DEVICE - A solid state image pickup device may include a pixel unit that includes a photoelectric conversion element, the pixel unit including a plurality of pixels that are arranged in a form of a two-dimensional matrix in the pixel unit, each of the plurality of pixels outputting a reset signal and a pixel signal, an analog signal processing unit that includes a first capacitor and a second capacitor, a delay circuit that includes a plurality of delay elements that are connected in a ring form, an A/D converter that detects the number of stages in which the pulse signal has propagated through the delay elements in the delay circuit during a sampling time period and generates a digital signal based on the detected number of stages, and a switching circuit that switches a connection of the first capacitor. | 07-12-2012 |
20120212829 | Method for Producing Wafer Lens Assembly and Method for Producing Wafer Lens - There is provided a method for producing a wafer lens assembly capable of adhering a wafer lens and a spacer surely. The wafer lens assembly includes a first substrate including plural optical members formed of a curable resin on at least one surface, a second substrate joined to the first substrate, and a stop member arranged between the first and second substrates. The first and second substrates are adhered with an adhesive made of a photo-curable resin. The method includes an adhesive applying step of applying the adhesive made of a photo-curable resin on a joining area, a stop-member forming step, and a photo-curing step of irradiating and hardening the adhesive applied in the adhesive applying step with light after the stop-member forming step. The stop member is formed so as not to prevent the light irradiated in the photo-curing step from reaching the adhesive. | 08-23-2012 |
20130250152 | IMAGING DEVICE - An imaging device includes a plurality of first pixels, each of which outputs a first pixel signal, a plurality of second pixels, each of which outputs a second pixel signal, a ramp wave generator that outputs a ramp signal that monotonously increases or monotonously decreases over time, a phase shift pulse generator that outputs first to n-th phase shift pulse signals, a first pixel latch group that latches the first to n-th phase shift pulse signals when the first pixel signal and the ramp signal have a predetermined relationship, a second pixel latch group that latches the first to n-th phase shift pulse signals when the second pixel signal and the ramp signal have the predetermined relationship, first to n-th power source lines to supply a power source and first to n-th phase shift pulse supply lines to supply the phase shift pulses. | 09-26-2013 |