Patent application number | Description | Published |
20080227272 | Wafer dividing method - A method of dividing a wafer having a plurality of streets which are formed in a lattice pattern on the front surface and having devices which are formed in a plurality of areas sectioned by the plurality of streets into individual devices along the streets, the method comprising the steps of applying a laser beam of a wavelength having permeability for the wafer along the streets to form a deteriorated layer along the streets in the inside of the wafer; forming a groove in areas corresponding to the streets from the rear side of the wafer; and exerting external force to the wafer where the deteriorated layer and the groove have been formed along the streets to divide the wafer into individual devices along the streets where the deteriorated layers and the grooves have been formed. | 09-18-2008 |
20080268619 | Wafer dividing method - A method of dividing a wafer having devices which are formed in a plurality of areas sectioned by a plurality of streets formed in a lattice pattern on the front surface of a substrate and a protective film which covers the front surfaces of the devices into individual devices along the streets, comprising the steps of: | 10-30-2008 |
20080293218 | WAFER DIVIDING METHOD - A wafer dividing method is provided that includes a protective plate sticking step of sticking the face of the wafer to the face of a protective plate by a pressure sensitive adhesive material whose adhesive force is decreased by an external stimulus; a degeneration layer formation step of throwing a laser beam, which permeates the wafer, along the street to the back side of the wafer, thereby forming a degeneration layer of a thickness corresponding to at least the finished thickness of the device within the wafer, the degeneration layer starting at the face of the wafer; a back grinding step of grinding the back of the wafer to form the wafer into the finished thickness of the device; a wafer support step of sticking the back of the wafer to a surface of a dicing tape mounted on an annular frame; an adhesive force decreasing step of imparting an external stimulus to the pressure sensitive adhesive material, thereby decreasing the adhesive force of the pressure sensitive adhesive material; a protective plate peeling step of peeling the protective plate from the face of the wafer; and a wafer rupture step of imparting an external force to the wafer, thereby rupturing the wafer along the street. | 11-27-2008 |
20080293220 | Wafer dividing method - A method of dividing a wafer having a plurality of dividing lines which are formed in a lattice pattern on the front surface, into individual chips along the dividing lines, the method comprising a wafer affixing step for affixing the front surface of the wafer to the front surface of a holding plate having stiffness through an adherent layer; a grinding step for grinding the rear surface of the wafer affixed to the holding plate to a predetermined thickness; a deteriorated layer forming step for applying a pulse laser beam of a wavelength having permeability for the wafer from the rear surface of the wafer which is affixed to the holding plate and has undergone the grinding step to form a deteriorated layer in the inside of the wafer along the dividing lines; a wafer transfer step for putting the rear surface of the wafer which has undergone the deteriorated layer forming step on an adherent tape mounted on an annular frame and removing the holding plate from the front surface of the wafer; and a wafer dividing step for exerting external force to the wafer put on the adherent tape to divide the wafer along the dividing lines. | 11-27-2008 |
20090176575 | GAME SERVER SYSTEM, GAME ELEMENT PROVIDING METHOD, GAME DEVICE, AND PROGRAM PRODUCT - There are stored in a database stored in a host server ( | 07-09-2009 |
20090215245 | Wafer dividing method - A method of dividing a wafer having a plurality of streets, which are formed in a lattice pattern on the front surface, and having devices, which are formed in a plurality of areas sectioned by the plurality of streets, into individual devices along the streets, comprising: a protective member-affixing step for affixing a protective member for protecting devices onto the front surface of the wafer; a deteriorated layer-forming step for applying a laser beam of a wavelength having permeability for the wafer from the rear surface side of the wafer along the streets to form a deteriorated layer along the streets in an area where it does not reach the final thickness of each device from the front surface of the wafer and the rear surface of the wafer in the inside of the wafer; a groove-forming step for cutting areas corresponding to the streets from the rear surface side of the wafer where the deteriorated layer has been formed along the streets to form a groove reaching the deteriorated layer; a dividing the wafer into individual devices along the streets where the deteriorated layer and the groove have been formed by exerting external force to the wafer; and a grinding the rear surface of the wafer which has been divided into individual devices until the final thickness of each device is achieved. | 08-27-2009 |
20090262618 | TILT ADJUSTING METHOD AND INFORMATION RECORDING/REPRODUCING APPARATUS USING THE SAME - [Problems] To effectively perform optimal tilt adjustment. [Means for Solving the Problems] A tilt adjusting method adjusts a tilt angle of an actual incident light and reflected light with respect to an incident light and a reflected light under optimal tilt when recording and reproducing data onto/from an information recording medium. Two or more output signals having a balance between a signal component and a noise component changing with respect to a parameter of a correction object are extracted from the reproduction signal of the information recording medium and the signal component and the noise component are evaluated for performing signal correction, thereby calculating a first and a second coefficient. When the first coefficient is out of a set reference range, the tilt adjustment is performed by the first coefficient and when the first coefficient in the set reference range, the tilt adjustment is performed by the second coefficient. | 10-22-2009 |
20090280894 | Game System, Server Apparatus, Terminal, And Computer Program Product - In a game system, a server apparatus ( | 11-12-2009 |
20090298264 | METHOD OF CUTTING ADHESIVE FILM ON A SINGULATED WAFER BACKSIDE - On the back surface of the chip of which a front surface is formed with an electronic circuit, an adhesive film of a shape and dimensions corresponding to at least the back surface of the chip is adhered to obtain the semiconductor chip with the entire back surface covered with the adhesive film. Such a semiconductor chip is obtained by forming a division groove in the front surface of a semiconductor wafer to be divided into plural chips, grinding a back surface of the wafer until the division groove appears to divide the wafer into plural chips, adhering the adhesive film and a dicing tape on the entire back surface of the wafer, and stretching the dicing tape to cut the adhesive film along the division groove. | 12-03-2009 |
20090298593 | Server Apparatus And Game System - In a game system, a server apparatus ( | 12-03-2009 |
20090303853 | Optical information recording/reproduction apparatus and recording condition adjusting method - An adaptive equalization circuit ( | 12-10-2009 |
20100039912 | OPTICAL INFORMATION RECORDING/REPRODUCING UNIT AND METHOD OF MEASURING RECORDED-MARK QUALITY - An equalizer ( | 02-18-2010 |
20110034007 | DIVIDING METHOD FOR PLATELIKE WORKPIECE - A dividing method for a platelike workpiece having a two-layer structure such that a solder layer (metal layer) is formed on the back side of a wafer (substrate). First, a modified layer is formed in the wafer along each division line formed on the front side of the wafer. Thereafter, the workpiece is bent along each division line to thereby divide the wafer along each division line from the corresponding modified layer as a starting point and simultaneously form a weak portion in the solder layer along each division line. Thereafter, an expandion tape attached to the solder layer is expanded to apply an external force to the solder layer, thereby dividing the solder layer along each division line from the corresponding weak portion as a starting point. Thus, the workpiece is completely divided. | 02-10-2011 |
20110077081 | GAME SYSTEM AND COMPUTER READABLE MEDIUM - There is provided a game system in which areas where operation instruction markers of each player influence each other. The game system 1 determines a division position DP of lane L where an operation instruction marker IM is displayed each time when a predetermined condition is satisfied during a game, and a size of display area DA of the lane of each player based on the determined division position DP. The game system 1 also determines the position of operation instruction marker IM corresponding to each operation timing 20 described in sequence data SD so that the position changes with the progress of music being reproduced, and displays a game image GI where the operation instruction markers IM corresponding to each players P are arranged in the display area DA corresponding to the player P. | 03-31-2011 |
20120201673 | MECHANICAL SEAL - Provided is a mechanical seal that ensures the flow rate of a cooling fluid, which is necessary to cool a slide seal surface, and that can prevent erosion from occurring. In the mechanical seal, the ratio between the depth and the width of each groove of a partial impeller is 2.0-5.0; the ratio of the distance between the grooves of the partial impeller to the width of a weir of a casing is 0.5-3.1; the ratio of the total length of the widths of the grooves of the partial impeller to the total length of the peripheral surface of the partial impeller, in which the grooves are formed, is 0.28-0.8; or the ratio of the length of the projected portion of the tip of each groove of the partial impeller to the width of a cooling liquid discharging groove of the casing is greater than 0 and less than or equal to 0.65. | 08-09-2012 |
20130275893 | SCREEN CREATION SYSTEM FOR PROGRAMMABLE DISPLAY - A screen creation system for creating a screen to be displayed at a graphical user interface of a programmable display includes: a registering unit that registers setting items that are set as a template regarding a configuration of a plurality of parts that makes the screen as elements that constitute the screen. When a new registration of the template is instructed regarding parts that are selected from the graphical user interface, the registering unit for registering the template is configured to: group and present setting items for each one of the selected parts based on properties thereof; and accept selection of the setting items to be included in the template. | 10-17-2013 |
20140134324 | AUTOMATIC LITHIUM TARGET REGENERATING APPARATUS AND AUTOMATIC LITHIUM TARGET REGENERATING METHOD - Provided are an automatic lithium target regenerating apparatus and an automatic lithium target regenerating method, which are equipped with a measurement function of a lithium film thickness of a lithium target, and may automatically regenerate the consumed lithium target by moving a vapor deposition source to the lithium target. An automatic lithium target regenerating apparatus ( | 05-15-2014 |
20140295643 | WAFER PROCESSING METHOD - In a wafer processing method, a modified layer is formed inside a wafer along planned dividing lines by irradiating the wafer with a laser beam with such a wavelength as to be transmitted through the wafer from the back surface side of the wafer along the dividing lines. A first modified layer is formed near the back surface of the wafer by irradiating the wafer with the light focal point of the laser beam positioned near the back surface of the wafer. The wafer is then irradiated with the light focal point of the laser beam positioned on the front surface side. Then plural second modified layers are formed in a multi-layering manner with sequential movement of the light focal point toward an area leading to the first modified layer. The wafer is divided into individual devices along the dividing lines by applying an external force to the wafer. | 10-02-2014 |
20140315372 | WAFER PROCESSING METHOD - A wafer processing method including a wafer supporting step of attaching a front side of a dicing tape formed of synthetic resin to a back side of a wafer and supporting a peripheral portion of the dicing tape to an annular frame, a dicing tape heating step of heating a back side of the dicing tape attached to the wafer to soften the dicing tape, thereby flattening the back side of the dicing tape, and a modified layer forming step of applying a laser beam having a transmission wavelength to the wafer through the dicing tape from the back side thereof along the division lines in the condition where the focal point of the laser beam is set inside the wafer, thereby forming a modified layer inside the wafer along each division line. | 10-23-2014 |