Patent application number | Description | Published |
20110080067 | SQUIRREL-CAGE ROTOR AND MANUFACTURING METHOD OF SQUIRREL-CAGE ROTOR - A squirrel-cage rotor including a rotor core provided with a plurality of circumferentially disposed slot holes opened in a rotational axis direction of the rotor; a pair of end rings disposed at opposite sides of the rotor core in the rotational axis direction of the rotor, each end ring being provided with a plurality of circumferentially disposed through holes opened corresponding to the plurality of circumferentially disposed slot holes; and a plurality of bar elements respectively inserted through the plurality of slot holes and the plurality of through holes. Each of the pair of end rings is prepared by laminating a plurality of sheet members, and opposite ends of each of the plurality of bar elements and the pair of end rings are brazed together through a brazing filler metal sandwiched between adjacent sheet members in advance, the brazing filler metal being adapted to melt and flow when the rotor is heated. | 04-07-2011 |
20120217839 | SQUIRREL-CAGE ROTOR FOR INDUCTION MOTOR - A squirrel-cage rotor includes a rotor core formed having a plurality of slots, a plurality of conductor bars inserted into the slots respectively and made of copper or copper alloy, two conductor end rings joined to the plurality of conductor bars on both end faces of the rotor core and made of copper or copper alloy and a reinforcing-member end ring attached to at least one of the conductor end rings and made of material having a specific strength greater than that of either copper or copper alloy. The plurality of conductor bars are arranged so as to extend through the conductor end rings and the reinforcing-member end ring. Consequently, the rotor can be manufactured by any manufacturing method but die-casting. Further, the conductor end rings can be reinforced with an easily-obtainable material and additionally, the junction of conductor end rings can be easily viewed from an outside. | 08-30-2012 |
20120228985 | SQUIRREL-CAGE ROTOR OF INDUCTION MOTOR AND PRODUCTION METHOD THEREOF WHEREIN END RING IS BRAZED WITH BAR - A squirrel-cage rotor of an induction motor and a production method thereof, wherein locating of the brazing material is not necessary in order to reduce manhours for brazing, and a bar is easily connected to an end ring. Before assembling a rotor core, a silver plated layer is formed on at least one of an end ring and a conductive bar. In order to melt the silver plated layer, the rotor is heated to a temperature which is equal to or larger than the melting point of the silver plated layer. The melted layer functions as a brazing material, whereby the end ring and the conductive bar are connected. | 09-13-2012 |
Patent application number | Description | Published |
20090054089 | COMMUNICATION TERMINAL, SECURE DEVICE, AND INTERGRATED CIRCUIT - The present invention has an object to provide a communication terminal, a secure device, and an integrated circuit, by which before data is transmitted by a transmission-sided communication terminal, a security process operation is carried out under environment of a communication terminal having a possibility of using the data with respect to threats caused by computer viruses and the like, which are operated in an illegal manner and are operable in correspondence with various sorts of platforms, and thus, safety characteristics with respect to the data can be assured. | 02-26-2009 |
20090119516 | SECURE DEVICE AND READER-WRITER - The invention is to solve a problem such that a server application that a secure device has cannot be used by a client application that a different secure device has. | 05-07-2009 |
20110208474 | INSTALLATION ERROR ESTIMATING DEVICE AND INSTALLATION ERROR ESTIMATING METHOD - The installation error estimating device is capable of enabling error-free high-precision positioning with simple installation. The device has a predicted pattern acquisition unit (an observation point setting unit ( | 08-25-2011 |
20120114183 | OPERATION ANALYSIS DEVICE AND OPERATION ANALYSIS METHOD - A motion analysis apparatus is provided that enables a contribution degree that suits analysis conditions to be set easily. A motion analysis apparatus ( | 05-10-2012 |
20130230211 | POSTURE ESTIMATION DEVICE AND POSTURE ESTIMATION METHOD - The present invention is a posture estimation device for estimating a wide variety of 3-dimensional postures by using a skeletal model. The posture estimation device ( | 09-05-2013 |
20130243259 | OBJECT DETECTION DEVICE AND OBJECT DETECTION METHOD - Disclosed is an object detection method capable of detecting with high precision information relating to a jointed object from image data. An object detection device ( | 09-19-2013 |
20130251203 | PERSON DETECTION DEVICE AND PERSON DETECTION METHOD - Provided is a person detection device with which it is possible to estimate a state of a part of a person from an image. A person detection device ( | 09-26-2013 |
20130259391 | STATE-OF-POSTURE ESTIMATION DEVICE AND STATE-OF-POSTURE ESTIMATION METHOD - This posture state estimation device is capable of estimating with high accuracy the posture state of an object. The posture state estimation device ( | 10-03-2013 |
20130301882 | ORIENTATION STATE ESTIMATION DEVICE AND ORIENTATION STATE ESTIMATION METHOD - Disclosed is an orientation state estimation device capable of estimating with high accuracy the orientation state of a jointed body. An orientation state estimation device ( | 11-14-2013 |
20140140596 | POSTURE ESTIMATION DEVICE, POSTURE ESTIMATION METHOD, AND POSTURE ESTIMATION PROGRAM - A posture estimation device, which is able to estimate the posture of a humanoid articulated body with high precision, has: a head estimation unit ( | 05-22-2014 |
20140163424 | POSTURE ESTIMATION DEVICE, POSTURE ESTIMATION SYSTEM, AND POSTURE ESTIMATION METHOD - Provided is a posture estimation device with which it is possible to estimate the posture of an object having joints with a high degree of precision. A posture estimation device ( | 06-12-2014 |
20150055875 | SITE ESTIMATION DEVICE, SITE ESTIMATION METHOD, AND SITE ESTIMATION PROGRAM - With this device, an edge pair likelihood map generation unit ( | 02-26-2015 |
Patent application number | Description | Published |
20090196789 | SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER HAVING SOLDER BUMP - To provide a solder alloy, a solder ball and an electronic member having a solder bump, used for connection with a mother board or the like, having a melting temperature of less than 250° C. for the solder alloy, achieving high drop impact resistance required in mobile devices or the like. A solder alloy is used which consists of not less than 0.1 mass ppm of boron and not greater than 200 mass ppm of boron and a remainder comprising substantially not less than 40% by mass of Sn, in which its melting temperature is less than 250° C. | 08-06-2009 |
20110308371 | SAW WIRE AND METHOD OF MANUFACTURING SAW WIRE - There are provided a fixed-abrasive grain saw wire with a superior cutting performance and a manufacturing method thereof. Particularly, there are provided a fixed-abrasive grain saw wire with abrasive grains adhered to a metal wire via a Zn-based or Sn-based low-melting-point metal and a high-melting-point metal having a melting point higher than that of the low-melting-point metal, and a manufacturing method thereof. | 12-22-2011 |
20120038042 | LEAD-FREE SOLDER ALLOY, SOLDER BALL, AND ELECTRONIC MEMBER COMPRISING SOLDER BUMP - A lead-free solder alloy, a solder ball and an electronic member comprising a solder bump which enable the prevention of the occurrence of yellow discoloration on the surface of a solder after soldering, the surface of a solder bump after the formation of the bump in a BGA, and the surface of a solder bump after a burn-in test of a BGA. Specifically disclosed are: a lead-free solder alloy; a solder ball; and an electronic member comprising a solder bump, containing at least one additive element selected from Li, Na, K, Ca, Be, Mg, Sc, Y, lanthanoid series elements, Ti, Zr, Hf, Nb, Ta, Mo, Zn, Al, Ga, In, Si and Mn in the total amount of 1 ppm by mass to 0.1% by mass inclusive, with the remainder being 40% by mass or more of Sn. | 02-16-2012 |
20120223430 | SOLDER BALL FOR SEMICONDUCTOR PACKAGING AND ELECTRONIC MEMBER USING THE SAME - The present invention relates to a solder ball for semiconductor packaging and an electronic member having such solder ball. Specifically there are provided: a solder ball capable of ensuring a sufficient thermal fatigue property even when a diameter thereof is not larger than 250 μm as observed in recent years; and an electronic member having such solder ball. More specifically, there are provided: a solder ball for semiconductor packaging that is made of a solder alloy containing Sn as a main element, 0.1-2.5% Ag by mass, 0.1-1.5% Cu by mass and at least one of Mg, Al and Zn in a total amount of 0.0001-0.005% by mass, such solder ball having a surface including a noncrystalline phase that has a thickness of 1-50 nm and contains at least one of Mg, Al and Zn, O and Sn, and an electronic member having such solder ball. | 09-06-2012 |
20130236734 | METAL FOIL FOR BASE MATERIAL AND PRODUCING METHOD THEREOF - A metal foil including: a steel layer whose thickness is 10 to 200 μm; an Al-containing metal layer arranged on the steel layer; and plural granular alloys which exist in an interface between the steel layer and the Al-containing metal layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 μm, is absent on the contour curve, and wherein, when an equivalent sphere diameter of the granular alloys is x in units of μm and a thickness of the Al-containing metal layer is T in units of μm, the granular alloys satisfy x≦0.5T. | 09-12-2013 |
20130236737 | METAL FOIL FOR BASE MATERIAL - A metal foil including: a steel layer whose thickness is 10 to 200 μm; an alloy layer which contains Fe and Al and which is formed on the steel layer; and an Al-containing metal layer arranged on the alloy layer, wherein, when a cutting-plane line of a surface of the Al-containing metal layer is defined as a contour curve and an approximation straight line of the contour curve is defined as a contour average straight line, a maximum point, whose distance from the contour average straight line is more than 10 μm, is absent on the contour curve, and a thickness of the alloy layer is 0.1 to 8 μm and the alloy layer contains an Al | 09-12-2013 |
20140054766 | LEAD-FREE SOLDER BUMP BONDING STRUCTURE - According to a lead-free solder bump bonding structure, by causing the interface (IMC interface) of the intermetallic compound layer at a lead-free-solder-bump side to have scallop shapes of equal to or less than 0.02 [portions/μm] without forming in advance an Ni layer as a barrier layer on the surfaces of respective Cu electrodes of first and second electronic components like conventional technologies, a Cu diffusion can be inhibited, thereby inhibiting an occurrence of an electromigration. Hence, the burden at the time of manufacturing can be reduced by what corresponds to an omission of the formation process of the Ni layer as a barrier layer on the Cu electrode surfaces, and thus a lead-free solder bump bonding structure can be provided which reduces a burden at the time of manufacturing in comparison with conventional technologies and which can inhibit an occurrence of an electromigration. | 02-27-2014 |
20140109962 | INTERCONNECTOR FOR SOLAR CELLS, AND SOLAR CELL MODULE - The purpose of the present invention is to provide an interconnector for solar cells, which reduces the stress acting on a solar cell and suppresses warping and cracking of the solar cell. An interconnector for solar cells of the present invention is characterized by comprising an electrically conductive wire part and a surface layer that is formed on at least one wide surface of the electrically conductive wire part. The interconnector for solar cells is also characterized in that the surface layer has a function of reducing the stress that is caused by the difference between the thermal expansion coefficient of the electrically conductive part and the thermal expansion coefficient of a solar cell, said stress being generated when the interconnector is joined to the solar cell. | 04-24-2014 |