Patent application number | Description | Published |
20080257937 | Electronic Component Mounting System, Electronic Component Mounting Device, and Electronic Component Mounting Method - To provide an electronic component mounting system, an electronic component placing device, and an electronic component mounting method, which can prevent waste due to the place of an electronic component onto a unit substrate having a print failure. | 10-23-2008 |
20080289175 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data. | 11-27-2008 |
20080289518 | SCREEN PRINTING APPARATUS AND SCREEN PRINTING METHOD - In supply of feedback data to improve a positional deviation quantity and a deviation state of a soldering paste printed on individual substrates held on the carrier, a plurality of average values of individual positional deviation for each of the individual substrates are obtained, and then, if the deviation value ΔM indicating a difference between the maximum value Mmax and the minimum value Mmin of the plurality of average values M of individual positional deviation is less than or equal to the tolerance value Δ(t), an intermediate value of the maximum value Mmax and the minimum value Mmin is obtained, and the positioning parameters of the mask plate and the carrier are corrected based on the intermediate value (Mmax+Mmin)/2. | 11-27-2008 |
20090014501 | ELECTRONIC COMPONENT MOUNTING SYSTEM, ELECTRONIC COMPONENT PLACING APPARATUS, AND ELECTRONIC COMPONENT MOUNTING METHOD - Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by solder-joint. | 01-15-2009 |
20090064489 | ELECTRONIC COMPONENTS MOUNTING SYSTEM, PLACEMENT STATE INSPECTING APPARATUS, AND ELECTRONIC COMPONENTS MOUNTING METHOD - In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process. | 03-12-2009 |
20090293265 | ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD - One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality. | 12-03-2009 |
20100071195 | ELECTRIC COMPONENT MOUNTING SYSTEM AND ELECTRIC COMPONENT MOUNTING METHOD - To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality. | 03-25-2010 |
20110292981 | INFORMATION PROCESSING APPARATUS AND INFORMATION GENERATION METHOD - An information processing apparatus includes: a reception unit configured to receive a packet string in which packet groups including data on a plurality of video frames and having an identifier indicating a beginning of the video frame assigned to respective packets including each initial part of the plurality of video frames are arranged in a video reproduction order; a counting unit configured to count a number of received packets corresponding to each of the plurality of video frames based on respective initial packets in the packet string; and a generation unit configured to generate video quality estimation information for each of the plurality of video frames to estimate a quality of the video in which the plurality of video frames are decoded on a reception terminal based on the number of received packets corresponding to each of the plurality of video frames. | 12-01-2011 |
20120237132 | IMAGE-ENCODING METHOD, IMAGE-ENCODING DEVICE, AND COMPUTER-READABLE RECORDING MEDIUM STORING IMAGE-ENCODING PROGRAM - A method for encoding an image having a resolution that is not a multiple of a size of a block to be encoded, includes adding, by a processor, an extension image to the image to generate an image to be encoded, the extension image being an image to be added to the image and being an image in which a boundary pixel that is present at a boundary between the extension image and the image, and an adjacent pixel that is adjacent to the boundary pixel have a difference in pixel value therebetween that has an absolute value that is equal to or greater than a certain value; and disabling a deblocking filter process at the boundary between the extension image and the image in a locally decoded image that corresponds to the image to be encoded. | 09-20-2012 |
20120290598 | INFORMATION PROCESSING PROGRAM, INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD - A non-transitory medium recording an information processing program causing a computer to execute procedures, the procedures includes receiving, as input, positional information that indicates a position of a part of the data file from the reference position, searching a second management information item corresponding to the input, searching a first management information item corresponding to the input and the searched second management information item, and accessing the part that is among the parts of the data file and stored at a position indicated by the searched first management information item; calculating, based on a frequency of access to the accessed part, a distribution of frequencies of access to the parts associated with the first management information items; and updating, based on the distribution of the frequencies, the positional information indicated by the second management information items and first management information items. | 11-15-2012 |