Patent application number | Description | Published |
20110048773 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an interlayer resin insulation layer having a penetrating hole for a via conductor, a conductive circuit formed on one surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and having a protruding portion protruding from the other surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the protruding portion of the via conductor. The via conductor is connected to the conductive circuit and has a first conductive layer formed on the side wall of the penetrating hole and a plated layer filling the penetrating hole. | 03-03-2011 |
20110067913 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an interlayer resin insulation layer having the first surface, the second surface on the opposite side of the first surface, and a penetrating hole for a via conductor, a conductive circuit formed on the first surface of the interlayer resin insulation layer, a via conductor formed in the penetrating hole and connected to the conductive circuit on the first surface of the interlayer resin insulation layer, and a surface-treatment coating formed on the surface of the via conductor exposed from the second surface of the interlayer resin insulation layer through the penetrating hole. The via conductor is made of a first conductive layer formed on the side wall of the penetrating hole and a plated-metal filling the penetrating hole. The surface of the via conductor is recessed from the second surface of the interlayer resin insulation layer. | 03-24-2011 |
20120193780 | SEMICONDUCTOR MOUNTING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MOUNTING DEVICE - A semiconductor mounting device including a first substrate having first insulation layers, first conductor layers formed on the first insulation layers and via conductors connecting the first conductor layers, a second substrate having a core substrate, second conductor layers, through-hole conductors and buildup layers having second insulation layers and third conductor layers, first bumps connecting the first and second substrates and formed on the outermost first conductor layer on the outermost first insulation layer, and second bumps positioned to connect a semiconductor element and formed on the outermost third conductor layer on the outermost second insulation layer. The second substrate has greater thickness than the first substrate, the second conductor layers are formed on surfaces of the core substrate, respectively, the through-hole conductors are formed through the core substrate and connecting the second conductor layers, and the buildup layers are formed on the core substrate and second conductor layers, respectively. | 08-02-2012 |
20130164440 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a printed wiring board includes forming a removable layer on a support substrate, forming an interlayer resin insulation layer on the removable layer, forming a penetrating hole in the interlayer resin insulation layer, forming a first conductive layer on the interlayer resin insulation layer and on a side wall of the penetrating hole, forming a conductive circuit on the interlayer resin insulation layer, forming a via conductor in the penetrating hole, removing the support substrate from the interlayer resin insulation layer by using the removable layer, forming a protruding portion of the via conductor protruding from a surface of the interlayer resin insulation layer, and forming a surface-treatment coating on a surface of the protruding portion of the via conductor. | 06-27-2013 |
20140113414 | SEMICONDUCTOR MOUNTING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MOUNTING DEVICE - A semiconductor mounting device including a first substrate having first insulation layers, first conductor layers formed on the first insulation layers and via conductors connecting the first conductor layers, a second substrate having a core substrate, second conductor layers, through-hole conductors and buildup layers having second insulation layers and third conductor layers, first bumps connecting the first and second substrates and formed on the outermost first conductor layer on the outermost first insulation layer, and second bumps positioned to connect a semiconductor element and formed on the outermost third conductor layer on the outermost second insulation layer. The second substrate has greater thickness than the first substrate, the second conductor layers are formed on surfaces of the core substrate, respectively, the through-hole conductors are formed through the core substrate and connecting the second conductor layers, and the buildup layers are formed on the core substrate and second conductor layers, respectively. | 04-24-2014 |
20150075851 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an interlayer resin insulation layer having a penetrating hole, a conductive circuit formed on a first surface of the interlayer resin insulation layer, a filled via conductor formed in the penetrating hole of the interlayer resin insulation layer and connected to the conductive circuit, a first surface-treatment coating structure formed on a first surface of the filled via conductor and having an electroless plating structure, and a second surface-treatment coating structure formed on a second surface of the filled via conductor on an opposite side with respect to the first surface-treatment coating structure and having an electroless plating structure. The filled via conductor includes a first conductive layer formed on side wall of the penetrating hole and a plated material filling the penetrating hole, and the first surface-treatment coating structure has a thickness which is different from a thickness of the second surface-treatment coating structure. | 03-19-2015 |
Patent application number | Description | Published |
20080267734 | BOOKBINDING APPARATUS AND IMAGE FORMING SYSTEM - A bookbinding apparatus having: a coating device for coating adhesive onto a spine of a sheet bundle; a first moving device which moves the coating device along the spine of the sheet bundle; a second moving device which moves the coating device in a substantially perpendicular direction to a surface of the spine; and a control device, wherein the control device controls the first moving device to move the coating device along the spine from near a one corner of the spine of the sheet bundle toward another corner until the coating device reaches to near the another corner of the spine of the sheet bundle, then controls the second moving device to separate the coating device away from the spine of the sheet bundle and keeps the coating device for a predetermined duration after separating | 10-30-2008 |
20080304934 | BOOKBINDING APPARATUS AND BOOKBINDING SYSTEM - A bookbinding apparatus which forms a sheet bundle by aligning a plurality of sheets fed from an image forming apparatus and prepares a booklet by applying adhesive on a spine of the sheet bundle, the bookbinding apparatus includes: a storage member for storing the adhesive; a rotating member for rotating in contact with the adhesive in the storage member; a heater for melting the adhesive in the storage member and for heating the adhesive so as to reach a preset temperature; and a control device for controlling the preset temperature, at a termination of the bookbinding job, to switch from a first preset temperature for a time of bookbinding to a second preset temperature which is below the first preset temperature and equal to or above a melting point of the adhesive. | 12-11-2008 |
20090081002 | BOOKBINDING APPARATUS AND BOOKBINDING SYSTEM - To form a consistent non-application area at an end of a spine of a sheet bundle by adjusting either an application start timing or application termination timing of adhesive through an application device. | 03-26-2009 |
20120119435 | SHEET ALIGNMENT APPARATUS AND IMAGE FORMING SYSTEM USING THE SAME - A sheet alignment apparatus includes: a sheet storage section for storing sheets; a sheet push-up section for conveying the sheets in the sheet discharge direction; a sheet discharge section having a pair of forward and reverse rotatable rollers configured to align sheet between the rollers and the sheet push-up section and to then discharge the sheets by sandwiching the sheet in the nip portion between the pair of rollers; and a sheet width direction alignment section located between the sheet storage section and the sheet discharge section and configured to align the sheets in the width direction perpendicular to the sheet discharge direction, wherein the sheet discharge section causes the pair of rollers in the reverse direction so as to separate the sheet edge in the sheet discharge section from the nip portion before the lateral alignment performed by the sheet width direction alignment section. | 05-17-2012 |
20130183076 | CUTTING DEVICE AND RECORDING APPARATUS - A cutting device includes a cutting blade configured to cut a recording medium; a support unit that supports the cutting blade to be movable in an inclined direction with respect to a surface of the recording medium such that the cutting blade is moved toward the recording medium while moving in a width direction of the recording medium; and a movable unit that causes the cutting blade supported by the support unit to be moved in the inclined direction to cut the recording medium. | 07-18-2013 |
20140125531 | VEHICLE ANTENNA UNIT - A perpendicular substrate antenna | 05-08-2014 |
20140145805 | RELAY - A relay includes: a fixed terminal on which a fixed contact is provided; a movable terminal on which a movable contact is provided; a cam that has an elliptical circumference shape, and is rotatable while a portion of the circumference shape is contacting a surface of the movable terminal; and a driving unit that rotates the cam so that respective portions located at one ends of a major axis and a minor axis of the elliptical circumference shape alternately contact the surface of the movable terminal; wherein when the portion located at one end of the major axis of the elliptical circumference shape of the cam contacts the surface of the movable terminal, the movable terminal is deformed elastically so that the movable contact contacts the fixed contact. | 05-29-2014 |
20140240065 | ELECTROMAGNETIC RELAY - An electromagnetic relay which is provided with an armature, a moving electrode which has a moving plate and a moving contact and a fixed electrode which faces the moving electrode and has a fixed plate and a fixed contact. At least a portion of the moving plate onto which the moving contact is arranged and at least a portion of the fixed plate onto which the fixed contact is arranged are inclined in width direction. | 08-28-2014 |
20150054907 | PRINTER - Provided is a printer capable of enhancing the cutting efficiency of printing paper. A printer, includes a printing unit; a fixed blade; a movable blade provided to be movable relative to the fixed blade, and cut the printing medium with the fixed blade; and a tension mechanism applying a tensional force to the printing medium. The tension mechanism includes a receiving member disposed on the discharge side of the fixed blade; and a pressing member extending from the movable blade toward the discharge side, moving with the movable blade. The pressing member includes a pressing part configured to press the printing medium against the receiving member and move toward the discharge side while holding the printing medium between the pressing part and the receiving member, as the movable blade moves toward the fixed blade. | 02-26-2015 |