Patent application number | Description | Published |
20080315254 | SEMICONDUCTOR DEVICE FABRICATION METHOD, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR LAYER FORMATION METHOD - A semiconductor device fabrication method and a semiconductor layer formation method for making a semiconductor layer having excellent morphology selectively epitaxial-grow over a semiconductor, and a semiconductor device. When a recessed source/drain pMOSFET is fabricated, a gate electrode is formed over a Si substrate in which STIs are formed with a gate insulating film therebetween (step S | 12-25-2008 |
20090045471 | Semiconductor device fabricated by selective epitaxial growth method - A semiconductor device in which selectivity in epitaxial growth is improved. There is provided a semiconductor device comprising a gate electrode formed over an Si substrate, which is a semiconductor substrate, with a gate insulating film therebetween and an insulating layer formed over sides of the gate electrode and containing a halogen element. With this semiconductor device, a silicon nitride film which contains the halogen element is formed over the sides of the gate electrode when an SiGe layer is formed over the Si substrate. Therefore, the SiGe layer epitaxial-grows over the Si substrate with high selectivity. As a result, an OFF-state leakage current which flows between, for example, the gate electrode and source/drain regions is suppressed and a manufacturing process suitable for actual mass production is established. | 02-19-2009 |
20090117715 | Semiconductor device fabricated by selective epitaxial growth method - A semiconductor device in which selectivity in epitaxial growth is improved. There is provided a semiconductor device comprising a gate electrode formed over an Si substrate, which is a semiconductor substrate, with a gate insulating film therebetween and an insulating layer formed over sides of the gate electrode and containing a halogen element. With this semiconductor device, a silicon nitride film which contains the halogen element is formed over the sides of the gate electrode when an SiGe layer is formed over the Si substrate. Therefore, the SiGe layer epitaxial-grows over the Si substrate with high selectivity. As a result, an OFF-state leakage current which flows between, for example, the gate electrode and source/drain regions is suppressed and a manufacturing process suitable for actual mass production is established. | 05-07-2009 |
20090276779 | JOB MANAGEMENT APPARATUS - When there is a job activation request accompanied with variable information in which an execution attribute and an identifier of a job are associated, a job definition in which an execution attribute is described with an arbitrary identifier is referred, and based on the variable information, an identifier within the job definition is replaced with the execution attribute to create a job. Then, the job created in this manner is activated. | 11-05-2009 |
20100015774 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A first p-type SiGe mixed crystal layer is formed by an epitaxial growth method in a trench, and a second p-type SiGe mixed crystal layer is formed. On the second SiGe mixed crystal layer, a third p-type SiGe mixed crystal layer is formed. The height of an uppermost surface of the first SiGe mixed crystal layer from the bottom of the trench is lower than the depth of the trench with the surface of the silicon substrate being the standard. The height of an uppermost surface of the second SiGe mixed crystal layer from the bottom of the trench is higher than the depth of the trench with the surface of the silicon substrate being the standard. Ge concentrations in the first and third SiGe mixed crystal layers are lower than a Ge concentration in the second SiGe mixed crystal layer. | 01-21-2010 |
20110014765 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A method of manufacturing a semiconductor device including forming a gate insulating film and a gate electrode over a Si substrate; forming a recess in the Si substrate at both sides of the gate electrode; forming a first Si layer including Ge in the recess; forming an interlayer over the first Si layer; forming a second Si layer including Ge over the interlayer; wherein the interlayer is composed of Si or Si including Ge, and a Ge concentration of the interlayer is less than a Ge concentration of the first Si layer and a Ge concentration of the second Si layer. | 01-20-2011 |
20110296425 | Management apparatus, management system, and recording medium for recording management program - A management apparatus includes a job definition information storage section for storing, at each period, a job definition file including execution characteristics indicating the start condition of each job in the execution schedule, the estimated execution time of the job, the state of the job, and a restriction at the time of setting the start schedule of the job; an exclusion information storage section for storing exclusion definition information indicating the jobs to be executed exclusively from each other; a reset job specifying section for acquiring a first job definition file of a schedule to be executed and a second job definition file of an executed schedule, then extracting, as a reset job, an abnormally terminated job from the second job definition file, and extracting a job using the reset job and the issue message of the reset job as start conditions, to store the extracted jobs in a related job set table; an execution possible time zone calculating section for searching, as an execution possible time zone, a time zone enabling execution of the job stored in the related job set table, from the first job definition file based on the second job definition file and the exclusion definition information; a start schedule adjusting section for setting the start schedule of the job stored in the related job set table based on the execution possible time zone; and a start schedule time setting section for setting the start time of the job set in the first job definition file, based on the start schedule of the job stored in the related job set table. | 12-01-2011 |
20120009750 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A first p-type SiGe mixed crystal layer is formed by an epitaxial growth method in a trench, and a second p-type SiGe mixed crystal layer is formed. On the second SiGe mixed crystal layer, a third p-type SiGe mixed crystal layer is formed. The height of an uppermost surface of the first SiGe mixed crystal layer from the bottom of the trench is lower than the depth of the trench with the surface of the silicon substrate being the standard. The height of an uppermost surface of the second SiGe mixed crystal layer from the bottom of the trench is higher than the depth of the trench with the surface of the silicon substrate being the standard. Ge concentrations in the first and third SiGe mixed crystal layers are lower than a Ge concentration in the second SiGe mixed crystal layer. | 01-12-2012 |
20120329229 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A first p-type SiGe mixed crystal layer is formed by an epitaxial growth method in a trench, and a second p-type SiGe mixed crystal layer is formed. On the second SiGe mixed crystal layer, a third p-type SiGe mixed crystal layer is formed. The height of an uppermost surface of the first SiGe mixed crystal layer from the bottom of the trench is lower than the depth of the trench with the surface of the silicon substrate being the standard. The height of an uppermost surface of the second SiGe mixed crystal layer from the bottom of the trench is higher than the depth of the trench with the surface of the silicon substrate being the standard. Ge concentrations in the first and third SiGe mixed crystal layers are lower than a Ge concentration in the second SiGe mixed crystal layer. | 12-27-2012 |