Patent application number | Description | Published |
20080252689 | LIQUID DISCHARGE HEAD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a liquid discharge head including an energy generating element, which generates energy utilized for discharging a liquid, and a discharge portion provided at a position facing the energy generating element and having a discharge port for discharging the liquid is provided. This method includes the steps of forming a negative photosensitive resin layer used for a member that forms the discharge port on the substrate, and exposing the layer to an i-line to form the discharge portion that is tapered in a direction from the substrate to the discharge port, wherein the layer has an absorbance per 1 μm thickness of about 0.02 to about 0.07 for light used for the exposure. | 10-16-2008 |
20090095708 | METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD - A method for manufacturing a liquid discharge head including a substrate on which supply ports for supplying a liquid are provided, includes forming a first supply port among the supply ports by performing crystal anisotropic etching on the substrate from one surface of the substrate, and forming a plurality of second supply ports among the supply ports by performing dry etching on the substrate using a crystal anisotropic etching method from a surface exposed toward the one surface of the substrate to a rear surface so that the independent second supply ports are respectively opened on the rear surface. | 04-16-2009 |
20090133256 | MANUFACTURING METHOD OF LIQUID EJECTION HEAD - A manufacturing method of a liquid ejection head provided with a flow passage communicating with an ejection outlet for ejecting liquid includes steps of preparing a substrate on which a flow passage wall forming member for forming a part of a wall of the flow passage and a solid layer having a shape of a part of the flow passage contact each other, wherein the flow passage wall forming member has a height, from a surface of the substrate, substantially equal to that of the solid layer; providing on the solid layer a pattern having a shape of another part of the flow passage; providing a coating layer, for forming another part of the wall of the flow passage, so as to coat the pattern; providing the ejection outlet to the coating layer; and forming the flow passage by removing the solid layer and the pattern. | 05-28-2009 |
20090136875 | MANUFACTURING METHOD OF LIQUID EJECTION HEAD - A manufacturing method of a liquid ejection head including an ejection outlet forming member provided with an ejection outlet for ejecting liquid and a flow passage communicating with the ejection outlet is constituted by the steps of: preparing a substrate on which a flow passage wall forming member for forming a part of a wall of the flow passage and a solid layer having a shape of a part of the flow passage contact each other, wherein the flow passage wall forming member has a height, from a surface of the substrate, substantially equal to that of the solid layer; providing a first layer, on the solid layer and the flow passage wall forming member, formed of a negative photosensitive resin material for forming another part of the wall of the flow passage; exposing to light a portion of the first layer correspondingly to the another part of the wall of the flow passage; providing a second layer, on the exposed first layer, formed of a negative photosensitive resin material to constitute the ejection outlet forming member; exposing to light a portion of the second layer correspondingly to the ejection outlet forming member; and forming the ejection outlet and another part of the flow passage by removing unexposed portions of the first layer and the second layer. | 05-28-2009 |
20090167812 | LIQUID DISCHARGE HEAD AND METHOD OF MANUFACTURING THE SAME - Provided is a method of manufacturing a liquid discharge head including: forming a first pattern for forming the flow path on the substrate; forming a first coating layer which covers the first pattern; forming a hole in the first coating layer, through which the first pattern is exposed; forming a second pattern for forming the flow path on the first coating layer, such that the second pattern contacts with the first pattern through the hole; forming a second coating layer for covering the second pattern; forming the discharge port in the second coating layer; and removing the first pattern and the second pattern to form the flow path. | 07-02-2009 |
20090267997 | INK JET HEAD - An ink jet head includes a substrate having an ink supply port; an ejection outlet for ejecting ink supplied through the supply port; a flow path portion which provides fluid communication between the supply port and the ejection outlet; wherein the flow path portion includes a near portion which is near to the substrate and a remote portion which is remote from the substrate, and a width of the near portion is different from a width of the remote portion in a sectional plane perpendicular to a direction of flow of the ink, and wherein a stepped portion is provided between the near portion and the remote portion. | 10-29-2009 |
20090314742 | METHOD FOR PROCESSING SUBSTRATE AND METHOD FOR PRODUCING LIQUID EJECTION HEAD AND SUBSTRATE FOR LIQUID EJECTION HEAD - A method for processing a substrate includes preparing a substrate having a first layer on a first surface side thereof, the first layer having a material capable of suppressing transmission of laser light, processing the substrate with laser light from a second surface that is opposite the first surface of the substrate toward the first surface of the substrate, and allowing the laser light to reach the first layer to form a hole in the substrate, and performing etching of the substrate from the second surface through the hole. | 12-24-2009 |
20100149260 | INK JET HEAD AND METHOD OF MANUFACTURING THE SAME - An ink jet head includes a Si substrate with a surface having a {100} orientation; a passage holding ink on the Si substrate; an ink discharge port which is communicatively connected to the passage and through which ink is ejected; and a supply port which extends through the Si substrate, which is communicatively connected to the passage, and which supplies ink to the passage. The supply port has walls having two {111} planes facing each other. | 06-17-2010 |
20100156990 | LIQUID DISCHARGE HEAD AND METHOD OF MANUFACTURING THE LIQUID DISCHARGE HEAD - A liquid discharge head includes an Si substrate which is provided with an element for generating energy used in discharging a liquid and a liquid supply port which is provided to pass through the Si substrate from first surface to rear surface so as to supply a liquid to the element. A method of manufacturing the substrate includes: forming a plurality of concave portions on the rear surface of the Si substrate of which a plane orientation is {100}, the concave portions facing the first surface and aligned in rows along a <100> direction the first surface; and forming a plurality of the supply ports by carrying out a crystal axis anisotropic etching on the Si substrate through the concave portions using an etching liquid of which an etching rate of the {100} plane of the Si substrate is slower than that of the {110} plane of the Si substrate. | 06-24-2010 |
20100287773 | METHOD FOR MANUFACTURING MICROSTRUCTURE, AND METHOD FOR MANUFACTURING LIQUID JETTING HEAD - A manufacturing method for a liquid ejecting head, wherein said liquid ejection head includes a flow passage wall member having an ejection outlet for ejecting liquid and the liquid flow path in fluid communication with the ejection outlet, said manufacturing including providing a substrate provision an organic resin material layer of organic resin material for forming the flow passage wall member; and forming the flow passage wall member by forming the flow path and the ejection outlet by removing partly said organic resin material layer by illuminating the organic resin material layer with a laser beam which has a pulse width of not less than 2 picosec and not more than 20 picosec and which has a focal point inside said organic resin material layer, with movement of the focal point of the laser beam. | 11-18-2010 |
20110070667 | METHOD OF PROCESSING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE FOR USE IN LIQUID EJECTION HEAD - A substrate processing method includes preparing a substrate, a first mask adjacent to a first surface of the substrate and including a first light transmitting portion allowing light to be transmitted therethrough, a condenser adjacent to the first surface, a second mask including a second light transmitting portion, and a photo detecting member including a photo detecting portion detecting light having passed through the second light transmitting portion, the condenser condensing light having passed through the first light transmitting portion toward the second light transmitting portion, the second light transmitting portion allowing the light condensed by the condenser to be transmitted therethrough, and forming a recess in the substrate by laser beam irradiation from a direction opposite to the first surface. When an intensity of the laser beam detected by the photo detecting portion is at or above a specific intensity, the irradiation of the laser beam is stopped. | 03-24-2011 |
20110108532 | LASER PROCESSING METHOD - Provided is a laser processing method capable of improving precision of a processing shape and degree of freedom of the processing shape. When a recess portion is formed in a substrate (W) which is an object to be processed, an inner portion of the substrate (W) is scanned with a condensing point (L | 05-12-2011 |
20120028383 | PROCESSING METHOD OF SILICON SUBSTRATE AND LIQUID EJECTION HEAD MANUFACTURING METHOD - A processing method of a silicon substrate including forming a second opening in a bottom portion of a first opening using a patterning mask having a pattern opening by plasma reactive ion etching. The reactive ion etching is performed with a shield structure formed in or on the silicon substrate, the shield structure preventing inside of the first opening from being exposed to the plasma. | 02-02-2012 |
20120069094 | LIQUID EJECTION HEAD AND MANUFACTURING METHOD THEREFOR - Provided is a liquid ejection head including a substrate including a liquid supply port and an energy generating element, in which the liquid supply port has at least one groove shape formed in a wall surface thereof, the at least one groove shape extending from a rear surface, which is a surface opposite to a front surface on which the energy generating element is formed, toward the front surface. | 03-22-2012 |
20120282715 | STRUCTURE MANUFACTURING METHOD AND LIQUID DISCHARGE HEAD SUBSTRATE MANUFACTURING METHOD - A method for processing a silicon substrate includes providing a combination of a first silicon substrate, a second silicon substrate, and an intermediate layer including a plurality of recessed portions, which is provided between the first silicon substrate and the second silicon substrate, forming a first through hole that goes through the first silicon substrate by executing etching of the first silicon substrate on a surface of the first silicon substrate opposite to a bonding surface with the intermediate layer by using a first mask, and exposing a portion of the intermediate layer corresponding to the plurality of recessed portions of the intermediate layer, forming a plurality of openings on the intermediate layer by removing a portion constituting a bottom of the plurality of recessed portions, and forming a second through hole that goes through the second silicon substrate by executing second etching of the second silicon substrate by using the intermediate layer on which the plurality of openings are formed as a mask. | 11-08-2012 |
20130057619 | LIQUID DISCHARGE HEAD AND METHOD OF MANUFACTURING THE SAME - Provided is a method of manufacturing a liquid discharge head including: forming a first pattern for forming the flow path on the substrate; forming a first coating layer which covers the first pattern; forming a hole in the first coating layer, through which the first pattern is exposed; forming a second pattern for forming the flow path on the first coating layer, such that the second pattern contacts with the first pattern through the hole; forming a second coating layer for covering the second pattern; forming the discharge port in the second coating layer; and removing the first pattern and the second pattern to form the flow path. | 03-07-2013 |
20130187987 | LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING SAME - A method of manufacturing a liquid ejection head includes the steps of ( | 07-25-2013 |
20130265368 | LIQUID EJECTING HEAD AND METHOD FOR PRODUCING THE SAME - A method for producing a liquid ejecting head of the present invention includes the steps of: forming an etching stop layer on a portion corresponding to a region in which an independent supply port is formed, on a first face of a substrate; conducting dry etching treatment for the substrate from a second face side until the etched portion reaches the etching stop layer; and removing the etching stop layer by isotropic etching to form the independent supply port, after having conducted the dry etching treatment, wherein the isotropic etching is conducted in such a state that a side etching stopper portion having etching resistance to the isotropic etching is formed in the side face perimeter of the etching stop layer. | 10-10-2013 |
20140313259 | LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS - The present invention provides a liquid ejecting head provided with a suction port capable of avoiding the return of mists, which have once sucked through a suction port, to the suction port. In view of this, the inner diameter L of a suction tube for allowing liquid mists taken in through the suction port to pass is designed such that a meniscus is formed before a liquid droplet adhering to the inside of the suction tube grows enough to move toward the suction port. | 10-23-2014 |
20150085014 | LIQUID EJECTION APPARATUS, MIST COLLECTING MECHANISM AND MIST COLLECTION METHOD - There are provided a mist collecting mechanism capable of efficiently sucking and collecting an air blown out from a blow-out unit and a liquid ejection apparatus including the mist collecting mechanism. The mist collecting mechanism includes a suction port configured to suck an air containing mists. Moreover, the mist collecting mechanism includes a first blow-out port that blows out an air in order to guide the air containing mists to the suction port. Moreover, the mist collecting mechanism includes a second blow-out port that blows out an air in order to adjust a position, toward which the air blown out from the first blow-out port flows, so that the air blown out from the first blow-out port is appropriately sucked by the suction port. | 03-26-2015 |
20150085015 | PRINTING APPARATUS - Air blown out from one blowing-out opening of a pinch roller which is within a predetermined angle range forms an air flow of a flow rate Fc which heads for a region between a suction mechanism and a print medium. This makes it possible to efficiently guide the air blown out from the blowing-out opening into the region, and as a result, ink mist can be collected satisfactorily even in a case where the amount of air blown from the pinch roller is relatively small. Further, in this case, the flow rate Fe of a flow blown from the pinch roller is appropriately determined, whereby the suction mechanism can collect substantially 100% of air and ink mist flowing into the region. | 03-26-2015 |