Patent application number | Description | Published |
20080210065 | Method For Cutting Lead Terminal Of Packaged Electronic Component - A method for cutting a lead terminal of a packaged electronic component including a resin package ( | 09-04-2008 |
20080237627 | Semiconductor light-emitting device - A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region. | 10-02-2008 |
20080303045 | Semiconductor light emitting device - A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the semiconductor light emitting element. The lead includes an exposed portion that is not covered by the resin package. The exposed portion includes a first portion and a second portion, where the first portion has a first mount surface oriented backward along the optical axis of the lens, and the second portion has a second mount surface oriented perpendicularly to the optical axis of the lens. | 12-11-2008 |
20100044737 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device (A) includes a lead frame ( | 02-25-2010 |
20100072496 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device (A | 03-25-2010 |
20100171730 | DISPLAY - A display (A) includes a light source unit ( | 07-08-2010 |
20100276808 | SURFACE MOUNTING ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - The electric component includes at least a set of electrode terminals | 11-04-2010 |
20110042710 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region. | 02-24-2011 |
20110278623 | METHOD FOR MANUFACTURING LED MODULE, AND LED MODULE - A method for manufacturing an LED module is provided that includes the steps of mounting an LED chip | 11-17-2011 |
20120168812 | SEMICONDUCTOR LIGHT-EMITTING DEVICE - A semiconductor light-emitting device includes a lead frame, a semiconductor light-emitting element mounted on the top surface of the bonding region, and a case covering part of the lead frame. The bottom surface of the bonding region is exposed to the outside of the case. The lead frame includes a thin extension extending from the bonding region and having a top surface which is flush with the top surface of the bonding region. The thin extension has a bottom surface which is offset from the bottom surface of the bonding region toward the top surface of the bonding region. | 07-05-2012 |
20120205677 | LED MODULE - An LED module includes a substrate, one or more LED chips supported by a main surface of the substrate, and wirings. The substrate has one or more through holes penetrating from the main surface to a rear surface. The wirings are formed on the substrate and make electrical conduction with the LED chips. The wirings include pads which are formed on the main surface and make electrical conduction with the LED chips, rear surface electrodes which are formed on the rear surface, and through wirings which make electrical conduction between the pads and the rear surface electrodes and are formed on the inner sides of the through holes. | 08-16-2012 |
20120205710 | LED MODULE - A LED module includes a substrate, a LED chip supported on the substrate, a metal wiring installed on the substrate, the metal wiring including a mounting portion on which the LED chip is mounted, an encapsulating resin configured to cover the LED chip and the metal wiring, and a clad member configured to cover the metal wiring to expose the mounting portion, the encapsulating resin arranged to cover the clad member. | 08-16-2012 |
20120286301 | LED MODULE - An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion. | 11-15-2012 |
20130020595 | LED MODULE AND LED MODULE MOUNTING STRUCTURE - An LED module includes a substrate having a main surface and a rear surface located opposite the main surface, a main surface electrode located on the main surface, a plurality of penetration electrodes connected to the main surface electrode and extending through the substrate, three or more LED chips arranged on the main surface electrode along a first direction, and a case arranged on the main surface to surround the main surface electrode. The LED chips include at least one LED chip that can emit red light, at least one LED chip that can emit green light and at least one LED chip that can emit blue light. | 01-24-2013 |
20130020605 | LED MODULE - An LED module according to the present invention includes an LED unit | 01-24-2013 |
20130027930 | LED MODULE - An LED module | 01-31-2013 |
20130043501 | LED MODULE - An LED module A | 02-21-2013 |
20130043504 | LED MODULE | 02-21-2013 |
20130175559 | LED MODULE - An LED module | 07-11-2013 |
20130193845 | LED MODULE - An LED module includes: an LED chip; and a resin case having a reflective surface surrounding the LED chip. An area contact inhibitor to inhibit area contact with an adjacent LED module is formed on an outer surface of the resin case. | 08-01-2013 |
20140042471 | LIGHT-EMITTING APPARATUS AND MANUFACTURING METHOD THEREOF - A light-emitting apparatus includes a light-emitting, a first lead, a second lead, and a resin molded body configured to support the first lead and the second lead. The main surfaces of the first and second leads includes first and second coverage areas covered by the resin molded body and first and second exposure regions exposed from the resin molded body at a window portion of the resin molded body, respectively. First and second metal layers are provided to cover main surfaces of the first and second leads at first and second exposure regions, respectively. | 02-13-2014 |
20140209964 | LED MODULE - A LED module includes a substrate, a LED chip supported on the substrate, a metal wiring installed on the substrate, the metal wiring including a mounting portion on which the LED chip is mounted, an encapsulating resin configured to cover the LED chip and the metal wiring, and a clad member configured to cover the metal wiring to expose the mounting portion, the encapsulating resin arranged to cover the clad member. | 07-31-2014 |