Patent application number | Description | Published |
20090020419 | Physical Sensor And Method Of Process - There is provided a physical sensor which ensures long-term reliability and can be miniaturized and increased in density, and a method of producing the same. A physical sensor includes a supporting substrate, an element substrate that includes a sensor element and is joined to the supporting substrate through an insulating layer, a glass cap that covers an area of the sensor element and is joined to the element substrate, and a built-in electrode that is electrically connected to the sensor element. The built-in electrode is formed in a through hole passing through the element substrate, the insulating layer and the supporting substrate. A portion of the glass cap that covers an area of the built-in electrode is anodically bonded to the element substrate. | 01-22-2009 |
20090092291 | PERSONAL AUTHENTICATION APPARATUS AND METHOD - There is provided a finger-vein authentication apparatus including a light source for illuminating one surface of both side-surfaces of a fingertip of a finger with light, and an image sensor for imaging the other surface of the fingertip, the light source and the image sensor being positioned at both sides of a nail of the fingertip with the nail sandwiched therebetween, wherein a fingertip guidance jig for supporting the fingertip and a finger-root guidance jig for supporting a finger-root of the finger are disposed between the light source and the image sensor, a light-shielding unit being disposed on the light-source side, the light-shielding unit being used for shielding the illumination light such that the illumination light will not travel to a ball side of the finger. | 04-09-2009 |
20110100126 | Capacitance Sensor - A technique in which a false detection and a wrong diagnosis can be suppressed in a capacitance sensor represented by an acceleration sensor is provided. A first capacitative element and a second capacitative element, which configure a capacitance detection unit, and a third capacitative element and a fourth capacitative element, which configure a forced oscillation generation unit, are electrically separated from each other. That is, the diagnosis movable electrode that configures the third capacitative element and the fourth capacitative element is formed integrally with the movable part. On the other hand, the diagnosis fixed electrode and the diagnosis fixed electrode are electrically separated from the detection fixed electrode and the detection fixed electrode. | 05-05-2011 |
20110209815 | Manufacturing Method of Combined Sensor - A movable device of acceleration sensors and a vibration device of a gyroscope are formed on the same sensor wafer spaced apart from each other by a wall. A cap wafer having gaps corresponding to the movable mechanical components of the acceleration sensors and gyroscope is provided for the wafer and an adsorbent divided into a plurality of divisional portions is disposed in the gap for the gyroscope. After the sensor wafer and the cap wafer have been bonded together at a temperature of inactivation of the adsorbent and in an atmospheric pressure ambience of noble gas and activated gas, the adsorbent divisional portions are activated in sequence to adsorb the activated gas so as to adjust the pressure inside the gyroscope, thus manufacturing a combined sensor wafer. | 09-01-2011 |
20110219873 | Angular Rate Sensor - An angular rate sensor includes a metallic core board having a core meal layer made of a metal plate and a wiring layer including a wiring structure, a semiconductor device for detecting an angular rate fixed on the core metal layer, and a cap fixed to the wiring layer. The semiconductor device for detecting an angular rate is disposed in a hollow chamber formed by the cap and the metallic core board. The metallic core board, the semiconductor device, and the cap are molded with resin. Consequently, the angular rate sensor has a packaging structure in which electromagnetic noise resistance and moisture resistance are improved while stress applied to the semiconductor device for detecting an angular rate is reduced. | 09-15-2011 |
20130068020 | Combined Sensor and Method for Manufacturing the Same - An acceleration sensor and an angular velocity sensor are sealed in respective pressure atmospheres suitable therefor in the process of a series of bonding steps, thereby improving the detection sensibilities of the sensors. | 03-21-2013 |
20130098152 | Inertia Sensor - This invention is directed to provision of high-performance inertial sensor that can sustain SNR even in an environment where vibration disturbance exists. A vibration type inertial sensor comprises: two deadweights ( | 04-25-2013 |
20130133422 | Inertial Sensor - In order to provide an inertial sensor capable of suppressing a wrong diagnosis even in an adverse environment such that sudden noise occurs, an inertial sensor is provided with a movable part ( | 05-30-2013 |
20130226506 | Physical Quantity Detection Device, And Network System - An object is to provide a physical quantity detection device capable of reducing a communication load for transmitting a sensor detection result, and also, of reducing a processing load of a receiving device receiving the sensor detection result. | 08-29-2013 |
20130241013 | Physical Quantity Detector - Provided is an inertial sensor device comprising a detection part having an MEMS structure, wherein convenience during sensor installation is ensured while erroneous operation caused by the application of external vibration is controlled. To achieve this objective, an anti-vibration structure ( | 09-19-2013 |
20130285172 | Combined Sensor - To provide a combined sensor that can detect a plurality of physical quantities. With the combined sensor, it is possible to realize, while maintaining performance, a reduction in size and a reduction in costs by increasing elements that can be shared among respective sensors. A weight M | 10-31-2013 |
20130319075 | Sensor Module and Sensor System - Reliability and accuracy of a sensor are secured while adjustment cost of a sensor module is suppressed. A signal component analysis part | 12-05-2013 |
20130340524 | INERTIAL SENSOR - In an inertial sensor, an acceleration sensor element section includes a first movable section configured to respond to acceleration applied thereto and a diagnosis electrode configured to displace the first movable section with an electrostatic force according to voltage application from a control circuit section. An angular velocity sensor element section includes a second movable section configured to respond to an angular velocity applied thereto and a driving electrode configured to displace the second movable section with an electrostatic force according to voltage application from the control circuit section. A voltage signal input to the driving electrode and a voltage signal input to the diagnosis electrode are the same voltage signal. The voltage signal input to the diagnosis electrode is a signal for detecting a mechanical failure. Carrier signal for detecting displacement of the first movable section has frequency higher than frequency of signal applied to the diagnosis electrode. | 12-26-2013 |
20140058617 | Acceleration Detection Apparatus - Provided is an acceleration detection apparatus installed in a vehicle and including a plurality of acceleration sensors having different characteristics, a function to input diagnosis signals in order to diagnose the outputs of the acceleration sensors and diagnose the fault detection functions while the vehicle stops, and a function to compare the outputs of the sensors in order to detect a fault while the vehicle runs. | 02-27-2014 |