Patent application number | Description | Published |
20140319665 | Power Semiconductor Package - A semiconductor package that includes a substrate having a metallic back plate, an insulation body and a plurality of conductive pads on the insulation body, and a semiconductor die coupled to said conductive pads, the conductive pads including regions readied for direct connection to pads external to the package using a conductive adhesive. | 10-30-2014 |
20150255376 | Power Semiconductor Package - A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can. | 09-10-2015 |
20150255382 | Semiconductor Package with Conductive Clip - A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can. | 09-10-2015 |
20150262960 | Power Semiconductor Package with Conductive Clips - A power semiconductor package that includes a semiconductor die having at least two power electrodes and a conductive clip electrically and mechanically coupled to each power electrode. | 09-17-2015 |
20150332988 | Semiconductor Package with Multiple Dies - A semiconductor package that includes a substrate having a metallic back plate, an insulation body and a plurality of conductive pads on the insulation body, and a semiconductor die coupled to said conductive pads, the conductive pads including regions readied for direct connection to pads external to the package using a conductive adhesive. | 11-19-2015 |
20150340304 | Power Semiconductor Package - A semiconductor package that includes a substrate having a metallic back plate, an insulation body and a plurality of conductive pads on the insulation body, and a semiconductor die coupled to said conductive pads, the conductive pads including regions readied for direct connection to pads external to the package using a conductive adhesive. | 11-26-2015 |
20160086881 | Electronic Component - In an embodiment, an electronic component includes a dielectric core layer having a first major surface, a semiconductor die embedded in the dielectric core layer, and a first conductive layer. The semiconductor die includes a first major surface and at least two conductive fingers arranged on the first major surface which are coupled to a common potential. The first conductive layer is arranged on, and electrically coupled to, the at least two conductive fingers and extends from the at least two conductive fingers over the first major surface of the dielectric core layer. | 03-24-2016 |
20160126210 | Electronic Component, System and Method - In an embodiment, an electronic component includes a power semiconductor device embedded in a dielectric core layer and at least one contact layer protruding from a first side face of the dielectric core layer. The contact layer includes an electrically insulating layer and at least one contact pad arranged on the electrically insulating layer. The at least one contact pad is electrically coupled with the power semiconductor device. | 05-05-2016 |
20160128197 | System and Method - In an embodiment, a method includes arranging a first carrier on a first major surface of a circuit board such that an electronic component arranged on the first carrier is positioned in an aperture in the circuit board and spaced apart from side walls of the aperture, and arranging a second carrier on a second major surface of the circuit board such that the second carrier covers the electronic component and the aperture, the second major surface of the circuit board opposing the first major surface of the circuit board. The electronic component includes a power semiconductor device embedded in a dielectric core layer and at least one contact pad arranged on a first major surface of the dielectric core layer. | 05-05-2016 |
20160128198 | Electronic Component - In an embodiment, a method includes inserting an electronic component including a power semiconductor device embedded in a dielectric core layer into a slot in a side face of a circuit board. The inserting the electronic component causes one or more electrically conductive contacts on one or more surfaces of the electronic component to electrically couple with one or more corresponding electrical contacts arranged on one or more surfaces of the slot. | 05-05-2016 |