Patent application number | Description | Published |
20100009178 | NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE AND USE THEREFOR - The invention relates to a nonstick material for use during removal of a part ( | 01-14-2010 |
20100025086 | METHOD FOR PRODUCING A FLEXI-RIGID PRINTED CIRCUIT BOARD AND FLEXI-RIGID PRINTED CIRCUIT BOARD - The invention relates to a method for producing a flexi-rigid printed circuit board, at least one rigid zone ( | 02-04-2010 |
20100059262 | METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE - The invention relates to a method for removing a part of a substantially planar material layer ( | 03-11-2010 |
20110272177 | METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION PREVENTION MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD AND USE OF SUCH A METHOD - In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region ( | 11-10-2011 |
20130008703 | METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD COMPRISING AN ELECTRONIC COMPONENT INTEGRATED THEREIN - In a method for integrating a component ( | 01-10-2013 |
20130149506 | NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE AND USE THEREFOR - The invention relates to a nonstick material for use during removal of a part ( | 06-13-2013 |
20130176692 | METHOD FOR PRODUCING A CIRCUIT BOARD CONSISTING OF A PLURALITY OF CIRCUIT BOARD AREAS AND CIRCUIT BOARD - For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled. | 07-11-2013 |
20140008012 | METHOD FOR PRODUCING MORE PARTICULARLY PROCESSING OR POPULATING, A CIRCUIT BOARD ELEMENT AND CARRIER FOR USE IN SUCH A METHOD - In a method for producing a circuit board element, the following steps are provided:
| 01-09-2014 |
20140216795 | METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION PREVENTION MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD AND USE OF SUCH A METHOD - In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region ( | 08-07-2014 |
20140331494 | Method for the Production of a Circuit Board involving the Removal of a Subregion thereof, and Use of such a Method - The invention relates to a method for producing a circuit board ( | 11-13-2014 |
20140373350 | Method for the Production of a Circuit Board Involving the Removal of a Subregion thereof, and Use of such a Method - The invention relates to a method for producing a circuit board involving the removal of a subregion thereof. In said method, at least two layers or plies of the circuit board ( | 12-25-2014 |