Patent application number | Description | Published |
20090007381 | INTEGRATED HINGE AND TEMPORARY DOOR CHECKER - A temporary checking device is provided that works in conjunction with elements of a vehicle hinge that remain in the vehicle's final configuration. The hinge includes a hinge pin rotatably connecting a door hinge bracket to a pillar hinge bracket. The checking device includes a spring portion that is disposed between the door hinge bracket and the pillar hinge bracket. The spring portion is compressed during movement of the door hinge bracket relative to the pillar hinge bracket from either of two rest positions. The spring portion urges the vehicle door affixed thereto back into one of the rest positions, thus allowing manufacturing operations such as painting, etc., to be performed on the vehicle. | 01-08-2009 |
20090015036 | INTEGRATED HINGE AND TEMPORARY DOOR CHECKER - A temporary checking device is provided that works in conjunction with elements of a vehicle hinge that remain in the vehicle's final configuration. The hinge includes a hinge pin rotatably connecting a door hinge bracket to a pillar hinge bracket. The checking device includes a spring portion that is disposed between the door hinge bracket and the pillar hinge bracket. The spring portion is compressed during movement of the door hinge bracket relative to the pillar hinge bracket from either of two rest positions. The spring portion urges the vehicle door affixed thereto back into one of the rest positions, thus allowing manufacturing operations such as painting, etc., to be performed on the vehicle. | 01-15-2009 |
20100180419 | INTEGRATED HINGE AND TEMPORARY DOOR CHECKER - A temporary checking device is provided that works in conjunction with elements of a vehicle hinge that remain in the vehicle's final configuration. The hinge includes a hinge pin rotatably connecting a door hinge bracket to a pillar hinge bracket. The checking device includes a spring portion that is disposed between the door hinge bracket and the pillar hinge bracket. The spring portion is compressed during movement of the door hinge bracket relative to the pillar hinge bracket from either of two rest positions. The spring portion urges the vehicle door affixed thereto back into one of the rest positions, thus allowing manufacturing operations such as painting, etc., to be performed on the vehicle. | 07-22-2010 |
20100186193 | INTEGRATED HINGE AND TEMPORARY DOOR CHECKER - A temporary checking device is provided that works in conjunction with elements of a vehicle hinge that remain in the vehicle's final configuration. The hinge includes a hinge pin rotatably connecting a door hinge bracket to a pillar hinge bracket. The checking device includes a spring portion that is disposed between the door hinge bracket and the pillar hinge bracket. The spring portion is compressed during movement of the door hinge bracket relative to the pillar hinge bracket from either of two rest positions. The spring portion urges the vehicle door affixed thereto back into one of the rest positions, thus allowing manufacturing operations such as painting, etc., to be performed on the vehicle. | 07-29-2010 |
Patent application number | Description | Published |
20110146436 | BALL RECIRCULATION FOR A BALL SCREW - An internal ball recirculation insert for a ball screw assembly. The ball screw assembly having a ball nut with at least one radial bore though it, a ball screw and load bearing balls. The ball screw and ball nut having complimental helical grooves, forming helical ball raceways when the ball screw and ball nut are assembled. The internal ball recirculation insert sized to fit into the radial bore of the ball nut, having a body portion, securing arms, a ball channel for channeling balls from one ball raceway to another and a friction or retention device around the circumference of the body portion. The friction device extending outwardly from a side wall of the recirculation insert, and contacting a wall of the radial bore in the ball nut. | 06-23-2011 |
20120132499 | WHEEL SPINDLE DRIVE ELEMENT - A wheel spindle drive element for a wheel disconnect system. The wheel spindle assembling onto an outer diameter of a spindle, displacing material to form a joint with high torque transmission characteristics. | 05-31-2012 |
20130266250 | FLEXIBLE BEARING CAGE - A rolling element guide for a bearing assembly formed with cantilevered arms, the arms flexibly adjusting to contact with a guide surface of an inner or outer ring of a bearing. Lubrication channels in a surface of the cage are also disclosed. | 10-10-2013 |
20130307241 | STABILIZER BAR - A disconnectible stabilizer bar assembly for a vehicle having first and second stabilizer bar halves, a housing fixed to an end portion of each stabilizer bar half, so as to align the two halves. The housing containing a stator with magnetic coil, a rotor with exterior magnets and threaded onto a hollow screw, with the stator selectively rotating the rotor and the rotation translated into axial movement of the screw. The screw having meshing means on an interior surface and an end face, the interior meshing means meshed with an exterior meshing means on one of the stabilizer bar halves, and the end face meshing means selectively coupled and decoupled with aligned mashing means on the other of the stabilizer bar halves. | 11-21-2013 |
20150075002 | WHEEL SPINDLE DRIVE ELEMENT - A wheel spindle drive element for a wheel disconnect system. The wheel spindle assembling onto an outer diameter of a spindle, displacing material to form a joint with high torque transmission characteristics. | 03-19-2015 |
20150075939 | WHEEL SPINDLE DRIVE ELEMENT - A wheel spindle drive element for a wheel disconnect system. The wheel spindle assembling onto an outer diameter of a spindle, displacing material to form a joint with high torque transmission characteristics. | 03-19-2015 |
Patent application number | Description | Published |
20110162307 | INSULATED PANELS AND SYSTEMS AND METHODS FOR FORMING SEALED INSULATED PANELS - Insulated panels and methods of forming insulated panels are provided. According to the method, mold bulkhead and a sealing strip including a first anchor extension, a second anchor extension, and a panel cap are provided. The method also includes removably attaching the exterior face of the sealing strip to the interior mold surface on at least one of the plurality of mold sides, wherein the first anchor extension and the second anchor extension project into the interior mold volume, and wherein the sealing strip defines a sealed insulation zone. A curable building material is introduced into the interior mold volume to form a first slab. The first slab at least partially surrounds the first anchor extension. The method also includes inserting an insulation material layer into the interior mold volume, wherein the insulation material layer is at least partially within the sealed insulation zone. A curable building material is introduced into the interior mold volume adjacent to the insulation material layer to form a second slab. The second slab at least partially surrounds the second anchor extension. The method also includes the step of allowing the curable building material to cure to provide a cured insulated panel, wherein the panel cap defines at least a portion of at least one of the plurality of intermediate faces. | 07-07-2011 |
20150204084 | HEIGHT-ADJUSTABLE CAPS FOR CONCRETE SHUTTERING FORMWORK - Concrete shuttering formwork according to the present disclosure comprises a body, a height-adjustable cap, and an optional, detachable void cap. Generally, concrete shuttering formwork assembled utilizing the height-adjustable cap according to the present disclosure stays in place and allows adjoining bays to be poured one after the other. Once the poured concrete has cured, the detachable void cap can either be left in place or removed. If removed, the resulting gap can subsequently be filled with a joint sealant. | 07-23-2015 |
Patent application number | Description | Published |
20130023107 | METHOD OF PROCESSING DEVICE WAFER - A method of processing a device wafer includes the carrier wafer preparing step of preparing a carrier wafer including an excessive carrier region on a surface thereof which is disposed in a position corresponding to an excessive outer circumferential region on a surface of the device wafer, the recess forming step of forming a recess in the excessive carrier region the carrier wafer, after the recess forming step, the adhesive placing step of placing an adhesive in the recess so as to project from the surface of the carrier wafer, after the adhesive placing step, the wafer bonding step of bonding the surface of the carrier wafer and the surface of the device wafer to each other, thereby securing the device wafer to the carrier wafer with the adhesive, and after the wafer bonding step, the thinning step of thinning the device wafer to a predetermined thickness by grinding or polishing a reverse side of the device wafer. | 01-24-2013 |
20130230966 | PROCESSING METHOD FOR BUMP-INCLUDED DEVICE WAFER - A processing method for a bump-included device wafer which includes an adhesive providing step of providing an adhesive in an annular groove of a carrier wafer so that the adhesive projects from the upper surface of an annular projection of the carrier wafer; a wafer attaching step of attaching and fixing the front side of the device wafer through the adhesive to the front side of the carrier wafer so as to accommodate bumps in a recess of the carrier wafer after performing the adhesive providing step; and a thickness reducing step of grinding or polishing the back side of the device wafer to reduce the thickness of the device wafer to a predetermined thickness after performing the wafer attaching step. | 09-05-2013 |
20150251902 | MEMS DEVICE CHIP MANUFACTURING METHOD - A MEMS device chip manufacturing method including a grinding step of grinding a device forming area of a wafer to thereby form a recess and an annular reinforcing portion surrounding the recess, a MEMS device forming step of performing any processing including etching to the wafer after performing the grinding step to thereby form a plurality of MEMS devices partitioned by a plurality of crossing division lines in the device forming area, and a dividing step of dividing the wafer along the division lines after performing the MEMS device forming step to thereby manufacture a plurality of MEMS device chips. | 09-10-2015 |