Patent application number | Description | Published |
20110220512 | Plating bath and method - Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 09-15-2011 |
20110220513 | Plating bath and method - Copper plating baths containing a leveling agent that is a reaction product of a certain benzimidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 09-15-2011 |
20110290660 | PLATING BATH AND METHOD - Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 12-01-2011 |
20120097548 | STABLE NANOPARTICLES FOR ELECTROLESS PLATING - Stable tin-free palladium catalysts are used to metalize through-holes of printed circuit boards. A stabilizer is included in the catalyst formulation which prevents precipitation and agglomeration of the palladium. | 04-26-2012 |
20120145554 | PLATING CATALYST AND METHOD - Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices. | 06-14-2012 |
20120145555 | PLATING CATALYST AND METHOD - Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices. | 06-14-2012 |
20130048505 | PLATING BATH AND METHOD - Copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 02-28-2013 |
20130098770 | PLATING BATH AND METHOD - Copper plating baths containing a leveling agent that is a reaction product of one or more of certain pyridine compounds with one or more epoxide-containing compounds, that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed. | 04-25-2013 |
20130216713 | STABLE TIN FREE CATALYSTS FOR ELECTROLESS METALLIZATION - Catalysts which include nanoparticles of palladium metal and cellulose derivatives are used in electroless metal plating. The palladium catalysts are free of tin. | 08-22-2013 |
20130216718 | STABLE CATALYST FOR ELECTROLESS METALLIZATION - Catalysts include nanoparticles of catalytic metal and cellulose or cellulose derivatives. The catalysts are used in electroless metal plating. The catalysts are free of tin. | 08-22-2013 |
20130230657 | STABLE CATALYSTS FOR ELECTROLESS METALLIZATION - Catalysts include nanoparticles of catalytic metal and gallic acid or gallic acid derivatives or salts thereof. The catalysts are used in electroless metal plating. The catalysts are free of tin. | 09-05-2013 |
20140027297 | PLATING BATH AND METHOD - This invention relates to copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds useful to deposit copper on the surface of a conductive layer. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. This invention also relates to methods of depositing copper layers using such copper plating baths. | 01-30-2014 |
20140027298 | PLATING BATH AND METHOD - This invention relates to copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds useful to deposit copper on the surface of a conductive layer. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. This invention also relates to methods of depositing copper layers using such copper plating baths. | 01-30-2014 |
20140083860 | PLATING CATALYST AND METHOD - Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices. | 03-27-2014 |
20140087062 | PLATING CATALYST AND METHOD - Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices. | 03-27-2014 |
20140093647 | METHOD FOR ELECTROLESS METALLIZATION - A method for forming a polymerized film on a surface of a non-conductive material and subsequently forming an electroless metal plating film on the surface is described. The method includes the step of contacting the surface of the material with a solution including (A) an amine compound having at least two functional groups, where at least one of the functional groups is an amino group, and (B) an aromatic compound having at least one hydroxyl group on the aromatic ring. | 04-03-2014 |
20140272144 | STABLE CATALYSTS FOR ELECTROLESS METALLIZATION - Aqueous catalysts of nanoparticles of precious metals and stabilizers of flavonoid derivatives are used to electrolessly plate metal on non-conductive substrates. Such substrates include printed circuit boards. | 09-18-2014 |
20150024123 | CATALYSTS FOR ELECTROLESS METALLIZATION CONTAINING IMINODIACETIC ACID AND DERIVATIVES - Catalysts include iminodiacetic acid and derivatives thereof as ligands for metal ions which have catalytic activity. The catalysts may be used to electrolessly plate metal on metal clad and un-clad substrates. | 01-22-2015 |