Patent application number | Description | Published |
20080232745 | HIGH-TEMPERATURE PRESSURE SENSOR AND METHOD OF ASSEMBLY - A method for assembling a Fabry-Perot interferometer includes depositing a first metal layer on an end portion of a ferrule, depositing a second metal layer on a back portion of a die, placing the first metal layer and the second metal layer in contact with each other with respective first and second orifices aligned with respect to each other, and bonding the ferrule to the die by thermo compression. The resulting interferometer includes a glass die with a cavity, a silicon diaphragm disposed over the opening of the cavity and bonded to the glass die, a ferrule bonded to the glass die by thermo compression with the first and second orifices being aligned to each other, and an optical fiber inserted through the other end of the ferrule in direct contact to a back portion of the die and aligned with the first orifice. | 09-25-2008 |
20090096088 | SEALED WAFER PACKAGING OF MICROELECTROMECHANICAL SYSTEMS - Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants. | 04-16-2009 |
20090107812 | ELECTRICAL CONNECTION THROUGH A SUBSTRATE TO A MICROELECTROMECHANICAL DEVICE - An electrical through-connection, or via, that passes through a substrate to a bus on a first surface of the substrate. The via may be configured with an interlock such that the electrically conductive core of the via is constrained to thermally expand towards the second surface, away from the bus, thus preventing damage to the bus. The interlock may be a local constriction or enlargement of the via near the first surface of the substrate. The via may be greater in length along the bus than a unit spacing of beams in a parallel microswitch array actuated in unison along the bus. The via may be narrower in width than in length, and may form a trapezoidal geometry that is larger at the second surface of the substrate than at the first surface. | 04-30-2009 |
20090159409 | MEMS MICROSWITCH HAVING A DUAL ACTUATOR AND SHARED GATE - In accordance with one aspect of the present invention, a MEMS switch is provided. The MEMS switch includes a substrate, a first and a second actuating element electrically coupled together, an anchor mechanically coupled to the substrate and supporting at least one of the first and second actuating elements, and a gate driver configured to actuate the first and second actuating elements. | 06-25-2009 |
20090159410 | MEMS MICROSWITCH HAVING A CONDUCTIVE MECHANICAL STOP - A MEMS switch includes a substrate, a movable actuator coupled to the substrate, a substrate contact, a substrate electrode, and a conductive stopper electrically coupled to the movable actuator and structured to prevent the movable actuator from contacting the substrate electrode while allowing the movable actuator to make contact with the substrate contact. | 06-25-2009 |
20090160584 | MEMS SWITCH WITH IMPROVED STANDOFF VOLTAGE CONTROL - A MEMS switch is provided including a substrate, a movable actuator coupled to the substrate and having a first side and a second side, a first fixed electrode coupled to the substrate and positioned on the first side of the movable actuator to generate a first actuation force to pull the movable actuator toward a conduction state, and a second fixed electrode coupled to the substrate and positioned on the second side of the movable actuator to generate a second actuation force to pull the movable actuator toward a non-conducting state. | 06-25-2009 |
20100018843 | LOW WORK FUNCTION ELECTRICAL COMPONENT - An electrical component is disclosed. The electrical component includes at least two electrical contacts movable relative to each other between an open position and a closed position, wherein at least one of the electrical contacts includes a material having a work function that is less than about 3.5 eV, and wherein the distance between the electrical contacts, in the closed position, is greater than 0 nm and up to about 30 nm. A device including a plurality of electrical switches is also disclosed. | 01-28-2010 |
20100252403 | HIGH VOLTAGE SWITCH AND METHOD OF MAKING - Electrostatic devices, systems and methods are presented. One embodiment is an electrostatic device including a substrate, a first electrode disposed on the substrate, a movable element having a second electrode and a control electrode. The control electrode is disposed in electrostatic communication with the movable element. The control electrode includes a protection layer having resistivity in a range of from about 1 ohm-cm to about 10 kohm-cm. | 10-07-2010 |
20100302691 | METHOD AND SYSTEM TO ENHANCE RELIABILITY OF SWITCH ARRAY - A method to reduce an inductive voltage surge across a switch array is disclosed. The method comprises the steps of, (a) directing at least a portion of an electric current away from at least a portion of said switch array; and (b) independently opening different portions of the switch array. A system to reduce an inductive voltage surge across an electrical device comprising a current bypass circuit is also disclosed. | 12-02-2010 |
20110036690 | SWITCH STRUCTURES - A device, such as a switch structure, is provided, the device including a contact and a conductive element. The conductive element can be configured to be selectively moveable between a non-contacting position, in which the conductive element is separated from the contact (in some cases by a distance less than or equal to about 4 μm, and in others by less than or equal to about 1 μm), and a contacting position, in which the conductive element contacts and establishes electrical communication with the contact. When the conductive element is disposed in the non-contacting position, the contact and the conductive element can be configured to support an electric field therebetween with a magnitude of greater than 320 V μm | 02-17-2011 |
20110067983 | SWITCH STRUCTURE AND METHOD - Provided is a device, such as a switch structure, that includes a contact and a conductive element that is configured to be deformable between a first position in which the conductive element is separated from the contact and a second position in which the conductive element contacts the contact. The conductive element can be formed substantially of metallic material configured to inhibit time-dependent deformation. For example, the metallic material may be configured to exhibit a maximum steady-state plastic strain rate of less than 10 | 03-24-2011 |
20110128112 | SWITCH STRUCTURES - A device, such as a switch structure, is provided. The switch structure can include a contact and a conductive element each respectively disposed on a substrate. The conductive element can be composed substantially of metallic material, and can be configured to be deformable between a first position, in which the conductive element is separated from the contact by a separation distance, and a second position, in which the conductive element contacts the contact and stores mechanical energy. The conductive element can be further configured such that, subsequent to being deformed into the second position at a temperature between about room temperature and about half of a melting temperature of the metallic material for a cumulative time of at least 10 | 06-02-2011 |
20110198967 | Switching Array Having Circuitry to Adjust a Temporal Distribution of a Gating Signal Applied to the Array - A Micro-electro-mechanical systems (MEMS) switching array includes circuitry, which may be coupled to a gate line of the array to adjust a temporal distribution of a gating signal applied to a plurality of MEMS switches that make up the switching array. The temporal distribution may be shaped to reduce a voltage surge that can develop in the switches during switching of electrical current. This voltage surge reduction is conducive to improving the durability of the array. | 08-18-2011 |
20120080214 | SMOOTH ELECTRODE AND METHOD OF FABICATING SAME - A smooth electrode is provided. The smooth electrode includes at least one metal layer having thickness greater than about 1 micron; wherein an average surface roughness of the smooth electrode is less than about 10 nm. | 04-05-2012 |
20120249261 | SYSTEMS AND METHODS FOR ENHANCING RELIABILITY OF MEMS DEVICES - A micro-electromechanical system (MEMS) device that in one embodiment includes at least two MEMS switches coupled to each other in a back-to-back configuration. The first and second suspended elements corresponding to first and second MEMS switches are electrically coupled. Further, first and second contacts corresponding to the first and second MEMS switches are configured such that a differential voltage between the second suspended element and the second contact is approximately equal to a differential voltage between the first suspended element and the first contact. The MEMS device includes at least one actuator coupled to one or more of the first and second suspended elements to actuate one or more of the first and the second suspended elements. In one example, the MEMS device includes one or more passive elements coupled to one or more of the first and second MEMS switches. | 10-04-2012 |
20130025934 | ELECTRICAL DISTRIBUTION SYSTEM - An apparatus, such as an electrical distribution system, is provided. The apparatus can include a first conductor and a second conductor. Multiple conduction paths can form parallel electrical connections along a connection span between the first and second conductors, with each of the conduction paths having a respectively similar nominal electrical resistance. The first and second conductors can have respective cross-sectional areas that decrease in opposing directions along said connection span. | 01-31-2013 |
20130134018 | MICRO-ELECTROMECHANICAL SWITCH AND A RELATED METHOD THEREOF - The switch incudes a beam electrode disposed on a substrate. A beam includes at least one anchor portion coupled to the beam electrode, a first beam portion extending from the at least one anchor portion along a first direction; and a second beam portion extending from the at least one anchor portion along a second direction opposite to the first direction. A first control electrode is disposed on the substrate facing the first beam portion. A first contact electrode is disposed on the substrate facing the first beam portion. A second control electrode is disposed on the substrate facing the second beam portion. The first control electrode and the second control electrode are coupled to form a gate. A second contact electrode is disposed on the substrate facing the second beam portion. | 05-30-2013 |
20140305777 | INTEGRATED MICRO-ELECTROMECHANICAL SWITCHES AND A RELATED METHOD THEREOF - A system includes a plurality of micro-electromechanical switches including a plurality of gates, coupled to each other. Each micro-electromechanical switch includes a beam electrode disposed on a substrate. A beam includes an anchor portion coupled to the beam electrode. The beam includes a first beam portion extending from the anchor portion along a first direction; and a second beam portion extending from the anchor portion along a second direction opposite to the first direction. A first control electrode and a first contact electrode are disposed on the substrate, facing the first beam portion. A second control electrode and a second contact electrode are disposed on the substrate, facing the second beam portion. The first control electrode and the second control electrode are coupled to form a gate among the plurality of gates. The plurality of micro-electromechanical switches is arranged in at least one of a series arrangement, parallel arrangement. | 10-16-2014 |