Patent application number | Description | Published |
20080296351 | DIFFUSION BONDED FLUID FLOW APPARATUS USEFUL IN SEMICONDUCTOR MANUFACTURING - The present invention relates to a method of diffusion bonding of steel and steel alloys, to fabricate a fluid delivery system of the kind which would be useful in semiconductor processing and in other applications which require high purity fluid handling. | 12-04-2008 |
20080296354 | STAINLESS STEEL OR STAINLESS STEEL ALLOY FOR DIFFUSION BONDING - The present invention relates to stainless steel sheets which would be useful in semiconductor processing and in other applications which require high purity fluid handling. The invention also relates to a method of selecting and processing such sheets. | 12-04-2008 |
20090057375 | Method of improving surface roughness of fluid flow conduits within a diffusion bonded fluid flow structure - The present invention relates to a method of diffusion bonding sheets of patterned material to fabricate a fluid delivery system; and particularly relates to a method of improving the interior surface roughness of fluid flow conduits formed within the diffusion bonded fluid delivery system structure. | 03-05-2009 |
20090072009 | Method of preventing bonding between a load distribution block and a plate set of stacked sheets during diffusion bonding of a fluid flow structure - The present invention relates to diffusion bonding of patterned sheets to form a fluid flow handling structure, and to a method of preventing bonding between a load distribution block and a plate set of stacked sheets during the diffusion bonding process. | 03-19-2009 |
20120266984 | CHEMICAL DELIVERY SYSTEM - Embodiments of chemical delivery systems disclosed herein may include an enclosure; a first compartment disposed within the enclosure and having a plurality of first conduits to carry a first set of chemical species, the first compartment further having a first draw opening and a first exhaust opening to facilitate flow of a purge gas through the first compartment; and a second compartment disposed within the enclosure and having a plurality of second conduits to carry a second set of chemical species, the second compartment further having a second draw opening and a second exhaust opening to facilitate flow of the purge gas through the second compartment, wherein the first set of chemical species is different than the second set of chemical species, and wherein a draw velocity of the purge gas through the second compartment is higher than the draw velocity of the purge gas through the first compartment. | 10-25-2012 |
20130220221 | METHOD AND APPARATUS FOR PRECURSOR DELIVERY - Methods and apparatus for delivering a gas mixture to a process chamber are provided herein. In some embodiments, a precursor delivery apparatus may include an ampoule having a body with a first volume to hold a liquid precursor, an inlet to receive the liquid precursor and a carrier gas, and an outlet to flow a gas mixture of the liquid precursor and the carrier gas from the ampoule; a first heater disposed proximate to or in the first volume to heat the liquid precursor disposed in the first volume proximate to or at a first location within the first volume where the liquid precursor contacts the carrier gas; and a heat transfer apparatus disposed about the body to at least one of provide heat to or remove heat from the ampoule. | 08-29-2013 |
20130319013 | COMPACT AMPOULE THERMAL MANAGEMENT SYSTEM - Apparatus for thermal management of a precursor for use in substrate processing are provided herein. In some embodiments, an apparatus for thermal management of a precursor for use in substrate processing may include a body having an opening sized to receive a storage container having a liquid or solid precursor disposed therein, the body fabricated from thermally conductive material; one or more thermoelectric devices coupled to the body proximate the opening; and a heat sink coupled to the one or more thermoelectric devices. | 12-05-2013 |
20130319015 | COMPACT AMPOULE THERMAL MANAGEMENT SYSTEM - Methods and apparatus for thermal management of a precursor for use in substrate processing are provided herein. In some embodiments, an apparatus for thermal management of a precursor for use in substrate processing may include a body having an opening sized to receive a storage container having a liquid or solid precursor disposed therein, the body fabricated from thermally conductive material; one or more thermoelectric devices coupled to the body proximate the opening; a heat sink coupled to the one or more thermoelectric devices; and a fan disposed proximate to a back side of the heat sink to provide a flow of air to the heat sink. | 12-05-2013 |