Patent application number | Description | Published |
20120029220 | TITANIUM COMPLEX, PROCESSES FOR PRODUCING THE SAME, TITANIUM-CONTAINING THIN FILM, AND PROCESS FOR PRODUCING THE SAME - A subject for the invention is to provide novel titanium complexes which have a high vapor pressure and high thermal stability and serve as an excellent material for producing a titanium-containing thin film by a technique such as the CVD method or ALD method and to further provide processes for producing these complexes, titanium-containing thin films produced from the complexes, and a process for producing the thin films. The invention relates to producing a titanium complex represented by general formula (1): | 02-02-2012 |
20120227625 | RUTHENIUM COMPLEX MIXTURE, METHOD OF PRODUCING THE SAME, COMPOSITION FOR FILM FORMATION, RUTHENIUM-CONTAINING FILM, AND METHOD OF PRODUCING THE SAME - For forming a thin ruthenium film of good quality by CVD method, it is necessary to form the thin film at low temperature. There hence is a desire for a ruthenium compound having a high reactivity to heat. This invention relates to a method of producing a ruthenium-containing film by CVD or the like using, as a raw material, a ruthenium complex mixture containing (2,4-dimethylpentadienyl)(ethyl-cyclopentadienyl)ruthenium and bis(2,4-dimethylpentadienyl)ruthenium, the amount of the latter compound being 0.1 to 100% by weight based on the weight of (2,4-dimethylpentadienyl)(ethylcyclopentadienyl)ruthenium, and the like. | 09-13-2012 |
20130123528 | HYDROSILANE DERIVATIVE, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING SILICON-CONTAINING THIN FILM - This invention aims at providing a material from which a silicon-containing thin film can be efficiently produced at a low temperature of 500° C. or less without using plasma or the like. The invention relates to produce a hydrosilane derivative represented by the general formula (1′) by reacting a chlorosilane derivative ( | 05-16-2013 |
Patent application number | Description | Published |
20090185064 | IMAGE-PICKUP APPARATUS AND DISPLAY CONTROLLING METHOD FOR IMAGE-PICKUP APPARATUS - The image-pickup apparatus includes an image-pickup element photoelectrically converting an object image, an image generating unit configured to generate a first image by using an output from the image-pickup element, a focus controller configured to perform focus control of an image-pickup optical system, and an enlarging processing unit configured to enlarge a partial area including a specific object in the first image to generate a second image larger than the partial area. A display controller configured to cause a display state of a monitor to shift from a state where the first image is displayed on the monitor to a state where the second image is displayed on the monitor together with the first image, in response to acquisition of an in-focus state of the image-pickup optical system for the specific object by the focus control. | 07-23-2009 |
20100188533 | IMAGE SENSING APPARATUS AND CONTROL METHOD THEREOF - An image sensing apparatus has an image sensing unit that outputs an image signal in accordance with incident light through an optical system including a zoom lens. The apparatus performs photographing by exposing the image sensing unit while driving the zoom lens, and stores attached information relating to photography at a predetermined timing after driving of the zoom lens has started during photographing. After the end of exposure of the image sensing unit, an image signal output from the image sensing unit is recorded in association with the stored attached information. | 07-29-2010 |
20110043929 | ZOOM LENS BARREL - A lens control apparatus having a zoom lens includes first and second operation members that give a zoom instruction for moving the zoom lens, and a controller that changes a zoom stop position to a first pattern according to the operation of the first operation member, and changes the zoom stop position to a second pattern, which has an interval wider than that in the first pattern, according to the operation of the second operation member. | 02-24-2011 |
20130250437 | ZOOM LENS BARREL - A lens control apparatus having a zoom lens includes first and second operation members that give a zoom instruction for moving the zoom lens, and a controller that changes a zoom stop position to a first pattern according to the operation of the first operation member, and changes the zoom stop position to a second pattern, which has an interval wider than that in the first pattern, according to the operation of the second operation member. | 09-26-2013 |
20140240850 | Zoom Lens Barrel - A lens control apparatus having a zoom lens includes first and second operation members that give a zoom instruction for moving the zoom lens, and a controller that changes a zoom stop position to a first pattern according to the operation of the first operation member, and changes the zoom stop position to a second pattern, which has an interval wider than that in the first pattern, according to the operation of the second operation member. | 08-28-2014 |
Patent application number | Description | Published |
20120311260 | STORAGE MANAGING SYSTEM, COMPUTER SYSTEM, AND STORAGE MANAGING METHOD - The present invention provides a configuration which can realize both two objects of prevention of performance deterioration and a reduction in storage management cost and shift a volume to a storage device which supports a hierarchical pool. To provide the configuration, a storage managing system acquires access information indicating an access load to a logical volume in a storage subsystem from a device file in a host server as access information in a page unit. The storage managing system acquires, from a storage subsystem having a hierarchical pool function, information concerning the configuration and a capacity of hierarchies of the storage subsystem. A capacity of the logical volume is calculated from the number of pages and a page unit capacity indicated by the access information. The storage managing system calculates, on the basis of information concerning the capacity of the logical volume and information concerning the configuration and the capacity of the hierarchies, a configuration candidate of a hierarchical pool for allocating a storage region for storing data included in the logical volume via the hierarchical pool to a virtual logical pool and outputs the configuration candidate of the hierarchical pool. | 12-06-2012 |
20120311292 | STORAGE MANAGING SYSTEM, COMPUTER SYSTEM, AND STORAGE MANAGING METHOD - The present invention provides a technique for arranging a virtual logical volume group for satisfying target response performance and realizing a cost reduction. For this purpose, in the present invention, in a storage managing system which manages a storage subsystem comprising in a pool using plural storage devices (hierarchies) having different performances and provides plural virtual logical volumes from the pool, the plural virtual logical volumes are classified into plural groups on the basis of information concerning target response performance concerning each of the plural virtual logical volumes such that each of the plural virtual logical volumes satisfies the target response performance. A new pool is allocated to each of the plural groups of the virtual logical volumes. Further, information indicating a correspondence relation between the pool and the virtual logical volumes included in the groups is generated and the information is output. | 12-06-2012 |
Patent application number | Description | Published |
20110163433 | LEAD FRAME SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR APPARATUS - A lead frame substrate, including: a metal plate having a first surface and a second surface; a semiconductor element mount portion and a semiconductor element electrode connection terminal that are formed on the first surface; an external connection terminal formed on the second surface and electrically connected to the semiconductor element electrode connection terminal; a conducting wire that connects the semiconductor element electrode connection terminal and the external connection terminal to each other; a resin layer formed on the metal plate; a hole portion that is partly formed in the second surface of the metal plate and does not penetrate the metal plate; and a plurality of protrusions that are formed on a bottom surface of the hole portion and protrude in a direction away from the metal plate, the protrusions having a height lower than a position of the second surface, not being in electrical conduction with the conducting wire, and being dispersed separately. | 07-07-2011 |
20110163435 | Lead frame substrate and method of manufacturing the same, and semiconductor device - A lead frame substrate, includes: a metal plate having first and second surfaces; a semiconductor element mounting section, semiconductor element electrode connection terminals, and a first outer frame section formed on the first surface; external connection terminals formed on the second surface and electrically connected with the semiconductor element electrode connection terminals; a second outer frame section formed on the second surface; and a resin layer formed on a gap between the first outer frame and the second outer frame. Each external connection terminal buried in the resin layer has at least one projection formed on a side surface thereof throughout a side lower portion of the first surface. | 07-07-2011 |
20110169145 | MANUFACTURING METHOD OF LEAD FRAME SUBSTRATE AND SEMICONDUCTOR APPARATUS - A lead frame substrate, including: a metal plate with a first surface and a second surface; a connection post formed on the first surface; wiring formed on the second surface; and a pre-molding resin layer, in which a thickness of the pre-molding resin layer is the same as a height of the connection post. | 07-14-2011 |
20110169153 | Lead frame substrate and method of manufacturing the same - A method includes: forming a photoresist pattern to form each of a semiconductor element mounting section on which a semiconductor element is mounted, semiconductor element electrode connection terminals for connection with electrodes of the semiconductor element, and a first outer frame section on a first surface of a metal plate; forming a photoresist pattern to form each of external connection terminals, a second outer frame section, and grooves in at least a part of the second outer frame section on a second surface of the metal plate; etching a metal plate exposing section, in which the metal plate of the second surface is exposed, to form holes that do not pass through the metal plate exposing section and grooves that run from an inside to an outside of the second outer frame section; coating a pre-mold resin on the holes and the grooves, and heating the pre-mold resin under pressure using a flat-bed press to form a resin layer; and etching the first surface to form the semiconductor element mounting section, the semiconductor element electrode connection terminals electrically connected with the external connection terminals, and the first outer frame section. | 07-14-2011 |
20120018860 | METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE - Provided is a manufacturing method of a substrate for a semiconductor element including the steps of: providing a first photosensitive resin layer on a first surface of a metal plate; providing a second photosensitive resin layer on a second surface different from the first surface of the metal plate; forming a first etching mask for forming a connection post on the first surface of the metal plate; forming a second etching mask for forming a wiring pattern on the second surface of the metal plate; forming the connection post by performing an etching from the first surface to a midway of the metal plate; filling in a premold resin to a portion of the first surface where the connection post does not exist; processing so that a height of the connection post of the first surface is lower than a height of the premold resin surrounding the connection post; and forming the wiring pattern by performing an etching on the second surface. | 01-26-2012 |
20120018867 | SUBSTRATE FOR SEMICONDUCTOR ELEMENT, METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE - Provided is a manufacturing method of a semiconductor element substrate including: a step of forming a first photoresist pattern on a first surface of a metallic plate, to form a semiconductor element mounting part, a semiconductor element electrode connection terminal, a wiring, an outer frame part, and a slit; a step of forming a second photoresist pattern on the second surface of the metallic plate; a step of forming the slit by half etching to connect the metallic chip with a four corners of the outer frame part; a step of forming a plurality of concaved parts on the second surface of the metallic plate; a step of forming a resin layer by injecting a resin to the plurality of concaved parts; and a step of etching the first surface of the metallic plate and forming the semiconductor element electrode connection terminal and the outer frame. | 01-26-2012 |
20120061809 | METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE - Provided is a manufacturing method of a substrate for a semiconductor element, the manufacturing method including the steps of: providing a first photosensitive resin layer at a first surface of a metal plate; providing a second photosensitive resin layer at a second surface of the metal plate different from the first surface; forming a first etching mask for forming a connection post on the first surface of the metal plate; forming a second etching mask for forming a wiring post on the second surface of the metal plate; forming the connection post by performing an etching on the first surface of the metal plate from a first surface side to a midway of the metal plate; applying a premold resin in liquid form to the first surface of the metal plate which underwent the etching on the first surface; forming a premold resin layer by solidifying the premold resin in liquid form being applied; and forming a wiring pattern by performing an etching on the second surface of the metal plate from a second surface side. | 03-15-2012 |
20120061829 | METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE - A manufacturing method of a substrate for a semiconductor element, wherein a first step includes: forming a first and second photosensitive resin layer on a first and second surface of a metal plate, respectively; forming a first and second resist pattern on the first and second surface, for forming a connection post and a wiring pattern, respectively. A second step includes: forming the connection post and wiring pattern; filling in a premold liquid resin to the first surface which was etched; forming a premold resin layer by hardening the premold liquid resin; performing a grinding operation on the first surface, and exposing an upper bottom surface of the connection post from the premold resin layer. A groove structure is formed by the first and second steps, wherein a depth of the groove is up to an intermediate part in a thickness direction of the metal plate. | 03-15-2012 |
Patent application number | Description | Published |
20110203403 | Steering position adjustment device - A spring for assisting a tilt adjustment operation can be easily and rapidly attached to a fixed bracket and a movable bracket. Each of two flanges of a fixed bracket has a tilted flange plate and a locking piece. The locking piece has a guiding edge, a locking recess, an insertion recess, and a fixing hole. In a spring member, a first locking shaft portion is formed on the rear side of two coil portions, and a second locking shaft portion is formed rearward from the distal end of the first locking shaft portion. The first locking shaft portion is engaged with the locking recess, and the second locking shaft portion is engaged with the fixing hole. The distance between the first locking shaft portions of the spring member is less that the distance between the two guiding edges. | 08-25-2011 |
20120247258 | STEERING DEVICE - A steering device includes: an inner column; an outer column that includes a left-right pair of outer column half bodies having holding surface portions formed on respective inner surface sides thereof, the two holding surface portions together constituting a holding inner peripheral surface for holding an outer peripheral surface of the inner column; a pivot bracket in which hanging side portions are formed on either width direction side of a pivot upper portion; a fixing bracket provided with fixing side portions on either width direction side; and a clamping tool. Respective width direction outside surfaces of the two outer column half bodies are sandwiched between the two hanging side portions of the pivot bracket, and the two fixing side portions of the fixing bracket are connected such that the two width direction outside surfaces of the two outer column half bodies can be clamped and released by the clamping tool. | 10-04-2012 |
20120248752 | STEERING APPARATUS - A steering apparatus has a steering shaft | 10-04-2012 |
20120312117 | STEERING APPARATUS - A steering apparatus exhibits favorable lever operability and generates a powerful steering column fastening and fixing force during tilt and telescopic adjustment. It has a simple structure includes: a column supporting member; a fixed bracket having, fixed side portions; a lock bolt that penetrates the respective fixed side portions of the fixed bracket together with the column supporting member; a main driving cam; a driven cam; an intermediate cam; and an operating lever. The lock bolt penetrates the main driving cam, the driven cam, and the intermediate cam, the main driving cam is rotated by the operating lever, the driven cam is attached to the fixed side portions to be incapable of rotating, the intermediate cam is disposed between the main driving cam and the driven cam, and the intermediate cam is caused to approach and separate from the main driving cam and the driven cam. | 12-13-2012 |
Patent application number | Description | Published |
20130135053 | POWER AMPLIFIER - A power amplifier includes a first matching circuit configured to perform harmonic processing of an input signal, and a second matching circuit configured to perform the harmonic processing of an output signal, the output signal being generated by amplifying a power of the input signal. The power amplifier rotates a phase of output impedance at a matching point of the harmonic included in the generated output signal when the power of the input signal is decreased from a value higher than a certain value to a value lower than the certain value. | 05-30-2013 |
20130149979 | AMPLIFIER - An amplifier includes a first amplification element configured to amplify a first signal in one of first and second operation classes, a second amplification element configured to amplify a second signal in one of first and second operation classes, a first transmission line through which the amplified first signal is transferred, and a coupler configured to couple the transferred first signal and the amplified second signal, wherein the first amplification element amplifies the first signal in the first operation class and the second amplification element amplifies the second signal in the second operation class, when the first signal and the second signal have a first frequency band, and wherein the first amplification element amplifies the first signal in the second operation class and the second amplification element amplifies the second signal in the first operation class, when the first signal and the second signal have a second frequency band. | 06-13-2013 |
20130222058 | AMPLIFIER - An amplifier includes an amplifying element that amplifies an input signal; an output terminal that outputs the signal amplified by the amplifying element; a matching circuit disposed in series between the amplifying element and the output terminal, and performing impedance matching; an impedance converter disposed in series between the amplifying element and the matching circuit or between the matching circuit and the output terminal; and a first resonator and a second resonator connected at the ends of the impedance converter. | 08-29-2013 |
20130229227 | AMPLIFICATION APPARATUS - A first amplification section and a second amplification section included in an amplification apparatus amplify two constant amplitude signals generated by vector decomposition. An impedance inverting circuit inverts the impedance of the signal amplified by the second amplification section. A combining circuit corrects the phases of the signal amplified by the first amplification section and the signal whose impedance is inverted by the impedance inverting circuit, and combines and outputs these signals. The combining circuit includes a line which is (λ/4)+γ in length and which is an asymmetrical circuit element and a line which is (λ/4)−δ in length and which is an asymmetrical circuit element. | 09-05-2013 |
20140055199 | POWER AMPLIFICATION DEVICE - A power amplification device, includes: an amplifier to amplify an input signal; a switched capacitor, provided at an output stage of the amplifier, to change capacitance based on a first control signal; a matching unit, provided at the output stage of the amplifier and including a varactor pair in which two varactor diodes are coupled in series or a varactor pair in which two varactor diodes are coupled in parallel, to change capacitance based on a second control signal; a detection circuit to detect power of the input signal; a quantization circuit to quantize a detected power value, form a quantized bit string having a high-order bit group and a low-order bit group, and output the high-order bit group as the first control signal to the switched capacitor; and a conversion circuit to convert the low-order bit group into an analog value and form the second control signal. | 02-27-2014 |
20140218105 | AMPLIFIER AND AMPLIFYING METHOD - An amplifier includes: an amplifying device configured to amplify an input signal; and a matching circuit coupled to the amplifying device, and including an impedance transformer and a parallel resonance circuit coupled to a wiring which spans from the impedance transformer to the amplifying device, wherein a circuit length of the impedance transformer is longer than one-fourth of wavelength of an electronic wave having a frequency which is substantially equal to a resonance frequency of the parallel resonance circuit. | 08-07-2014 |
20140285262 | CONTROL DEVICE OF POWER AMPLIFIER AND METHOD OF CONTROLLING POWER AMPLIFIER - A control device of a power amplifier includes: a limiter configured to limit a level of an input signal to the power amplifier; and a control unit configured to, when the limiter operates, make an operation voltage of the power amplifier invariable and control load of an output matching circuit of the power amplifier based on an amplitude of the input signal, and, when the limiter does not operate, to make the load of the output matching circuit invariable and control the operation voltage of the power amplifier. | 09-25-2014 |
20140292405 | AMPLIFICATION DEVICE AND AMPLIFICATION METHOD - An amplification device includes: an amplitude adjustment circuit configured to adjust an amplitude level of an input signal so as to keep the amplitude level within a given range; an amplifier configured to amplify the adjusted signal; and a circuitry configured to change an amplitude level of the amplified signal, based on the amplitude level of the input signal and a first distortion compensation corresponding to the amplitude level of the input signal. | 10-02-2014 |
20150102859 | AMPLIFYING APPARATUS, COMMUNICATION APPARATUS AND AMPLIFICATION METHOD - An amplifying apparatus includes a decomposer, two amplifiers, a combiner, and a controller. The decomposer decomposes an input signal into two signals having different phases. The two amplifiers amplify the decomposed two signals, respectively. The combiner combines output of the amplifiers. The controller controls at least one of waveform information of at least one of the two signals and an operating state of the two amplifiers such that an output characteristic of the combiner matches a desired characteristic. | 04-16-2015 |