Patent application number | Description | Published |
20110077092 | Unbalance correction device of propeller shaft - The present invention provides a device for correcting an unbalance of a propeller shaft, specifically an unbalance correction device of a propeller shaft capable of securing a considerable amount of correction, reducing the generation of noise and the like, and preventing the adverse effect of welding heat caused by welding and fixing the balance weight from exerting on a vibration absorbing rubber member. The unbalance correction device of a propeller shaft is configured from a propeller shaft to which a damper is mounted, and a balance weight in which a primary weight plate part and an auxiliary weight plate part are formed continuously and integrally along a longitudinal direction, and a protruding piece is protrusively formed on a concave arced surface on a rear surface side of the primary weight plate part and from each corner part at four locations. The primary weight plate part is disposed in a non-mounted area of the damper at an axial direction end of the outer shaft with a longitudinal direction of the balance weight coinciding with an axial direction of the outer shaft, and the balance weight is configured such that only the protruding piece comes in contact with and is welded to an outer peripheral side face of the outer shaft. | 03-31-2011 |
20120241022 | RELIEF VALVE DEVICE - The invention allows securing greater discharge pressure and flow rate at high revolutions of an engine in order to secure lubrication and cooling, while reducing discharge pressure and flow rate at low and medium revolutions of the engine in order to improve efficiency. The invention includes a housing; a relief valve; a valve passage; a main discharge flow channel; a main relief flow channel; an auxiliary relief flow channel; a solenoid valve mounted on the auxiliary relief flow channel; and a spring. The solenoid valve is controlled so as to switch between communication and shut-off between the auxiliary relief flow channel and the large-diameter passage section in accordance with an increase or decrease in engine revolutions, and oil in the large-diameter passage section is discharged when the shut-off is implemented. | 09-27-2012 |
20120244027 | PUMP DEVICE - The invention has: a housing; a pump section formed of a drive gear unit and a driven gear unit; a main flow channel through which oil pressure is applied to the driven gear unit in a discharge volume reduction direction; a first branching flow channel through which oil pressure that assists oil pressure from the main flow channel is applied; a second branching flow channel through which oil pressure is applied to the driven gear unit in a discharge increase direction; a first flow channel control section; a second flow channel control section; and a spring that elastically urges the driven gear unit in a discharge increase direction. The first flow channel control section and the second flow channel control section can perform switching control in accordance with each increase or decrease of engine revolutions and in pressure. | 09-27-2012 |
Patent application number | Description | Published |
20100167362 | Saponin-decomposing enzyme, gene thereof and large-scale production system for producing soyasapogenol B - The present invention provides a protein having saponin-decomposing activity, more specifically a protein which can decompose a glycoside having soyasapogenol B as an aglycone to produce soyasapogenol B, a polynucleotide encoding such a protein, and a method of producing soyasapogenol B on a large scale using the same. A protein according to the present invention are concerned with (a), (b) or (c), namely (a) a protein comprising an amino acid sequence selected from the group consisting of the amino acid sequences shown in SEQ ID NOs: 2, 4, and 6; (b) a protein that has at least 50% homology to the protein comprising the amino acid sequence of the sequence described in (a) and having saponin-decomposing activity; or (c) a protein comprising a modified amino acid sequence of the sequence described in (a) that has one or more amino acid residues deleted, substituted, inserted, or added and having saponin-decomposing activity. | 07-01-2010 |
20100255543 | METHOD FOR PRODUCTION OF NON-NATURAL ANTIBIOTIC - Disclosed is a transformant prepared by introducing a ketoreductase gene involved in the biosynthesis of L-epivancosamine into an actinobacterium originally capable of producing daunorubicin. Also disclosed is a process of efficiently producing a non-natural daunorubicin derivative using the transformant. The transformant is capable of efficiently producing a non-natural daunorubicin derivative such as epidaunorubicin. | 10-07-2010 |
20140051147 | SURFACTANT TOLERANT CELLULASE AND METHOD FOR MODIFICATION THEREOF - A method for suppressing a reduction in an endoglucanase activity in the presence of a surfactant, characterized by modifying a protein having the endoglucanase activity in which the N-terminus is an amino acid other than pyroglutamic acid, to a protein having the N-terminus of pyroglutamic acid, is disclosed. Further, a modified protein having an endoglucanase activity wherein the N-terminal amino acid is converted into pyroglutamic acid by an amino acid modification, a polynucleotide encoding the protein, an expression vector comprising the polynucleotide, a host cell transformed with the expression vector, and a process for producing the protein by cultivating the host cell, are disclosed. | 02-20-2014 |
Patent application number | Description | Published |
20100077383 | SIMULATION METHOD AND STORAGE MEDIUM FOR STORING PROGRAM - A method for debugging software on a computer includes performing a simulation in which a signal undesired during normal operation is added to a signal value when the signal value is input to a plurality of external terminals included in hardware that executes the software and includes a processor and at least one input and output device, and judging whether or not a factor determining the signal value corresponding to the external terminal requested to display the signal value is the input from the outside to the hardware by checking whether or not the signal undesired during the normal operation is added. | 03-25-2010 |
20120229368 | DISPLAY AND LABELED ARTICLE - A display includes a first optical effect layer including a first interface part, the first interface part being provided with recesses or protrusions arranged two-dimensionally at the minimum center-to-center distance of 200 nm to 500 nm, each of the recesses or protrusions having a forward-tapered shape, a reflective material layer covering at least a part of the first interface part, and a second optical effect layer including, at a position of a first portion of the first interface part that is covered with the reflective material layer, a portion that faces the reflective material layer with the first optical effect layer interposed therebetween or faces the first optical effect layer with the reflective material layer interposed therebetween, the second optical effect layer containing at least one of a cholesteric liquid crystal, a pearl pigment and a multilayer interference film. | 09-13-2012 |
20130328396 | POWER SUPPLY STATE MONITORING DEVICE, POWER SUPPLY STATE MONITORING METHOD, AND PROGRAM - Provided is a power supply state monitoring device and so on which is capable of notifying a user of the fact that there is a problem with an AC cord and the fact that a power supply apparatus itself is not mounted separately. The power supply state monitoring device is a device which is provided in a main body of an apparatus in which a first power supply apparatus including an AC cord and a second power supply apparatus including an AC cord can be mounted, and monitors the state of power to be supplied from the second power supply apparatus to the main body of the apparatus when power is supplied from the first power supply apparatus to the main body of the apparatus, determines whether or not the second power supply apparatus is mounted in the main body of the apparatus based on a power-supply mount-state notification signal from the second power supply apparatus, if the second power supply apparatus is mounted in the main body of the apparatus, determines whether or not the power is supplied from the AC cord of the second power supply apparatus based on an AC-supply state notification signal from the second power supply apparatus, and if the power is not supplied from the AC cord, notifies a user of the fact that the second power supply apparatus is mounted in the main body of the apparatus and the power is not supplied from the AC cord. | 12-12-2013 |
Patent application number | Description | Published |
20090171648 | INSTRUCTION CHECK PROGRAM, INSTRUCTION CHECK APPARATUS, AND I/O SIMULATOR - A computer-readable medium encoded with an instruction check program for making a computer to check a status of execution of an instruction by an I/O simulator that performs an operation simulation according to a structure of an I/O area of a microcomputer, the instruction check program when executed by a computer causes the computer to perform a method including obtaining specification information of the microcomputer describing an input and an output condition of a hardware resource in the I/O area, detecting a simulation of a reference instruction to the hardware resource executed by the I/O simulator, determining correctness of the reference instruction by comparing a content of the simulation of the reference instruction detected by the detecting with the input and output condition of the hardware resource included in the obtained specification information, and outputting an error signal when it is determined that the reference instruction is incorrect. | 07-02-2009 |
20090316741 | Temperature control apparatus and optical transmission device using same - A temperature control apparatus that performs stabile temperature control operation, besides avoiding generation of unwanted noise. A thermo-control device cools or heats an object according to a supply current that a thermo-control driver provides according to a specified control voltage. A temperature sensor observes the temperature of the object. A variable voltage controller varies the control voltage such that the observed temperature of the object will be a specified reference temperature. The variable voltage controller begins to operate in alternate setting mode when the control voltage is expected to enter a voltage range in which the thermo-control driver could malfunction. During that mode, the variable voltage controller outputs a first control voltage and a second control voltage alternately at predetermined intervals. The first and second control voltages are malfunction-free voltages near the malfunction-prone voltage range. | 12-24-2009 |
20120024593 | PRINTED CIRCUIT BOARD UNIT, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD UNIT, AND ELECTRIC APPARATUS - A printed circuit board unit includes a first substrate, a second substrate, and a spacer. The second substrate is coupled to the first substrate via a solder material. The second substrate has different coefficient of thermal expansion from the first substrate. The spacer is disposed between the first substrate and the second substrate. The spacer is formed of a thermally-expandable material and a thermosetting material. The thermosetting material has a curing temperature higher than a melting point of the solder material. | 02-02-2012 |
Patent application number | Description | Published |
20120153220 | Si ALLOY NEGATIVE ELECTRODE ACTIVE MATERIAL FOR ELECTRIC DEVICE | 06-21-2012 |
20120175551 | Si ALLOY NEGATIVE ELECTRODE ACTIVE MATERIAL FOR ELECTRIC DEVICE | 07-12-2012 |
20130240800 | SI ALLOY-CONTAINING NEGATIVE ELECTRODE ACTIVE MATERIAL FOR ELECTRICAL DEVICES - Disclosed is a negative electrode active material for electrical devices, comprising an alloy having a composition represented by the formula: Si | 09-19-2013 |
20130341560 | NEGATIVE ELECTRODE ACTIVE MATERIAL FOR ELECTRIC DEVICE - A negative electrode active material for an electric device includes an alloy containing silicon in a range from 25% to 54% exclusive, carbon in a range from 1% to 47% exclusive, zinc in a range from 13% to 69% exclusive in terms of mass ratio, and inevitable impurities as a residue. For example, the negative electrode active material can be obtained with a multi DC magnetron sputtering apparatus by use of silicon, carbon and zinc as targets. An electric device using this negative electrode active material can improve the initial charge-discharge efficiency while keeping the cycle property. | 12-26-2013 |
20140001401 | NEGATIVE ELECTRODE ACTIVE MATERIAL FOR ELECTRIC DEVICE, NEGATIVE ELECTRODE FOR ELECTRIC DEVICE AND ELECTRIC DEVICE | 01-02-2014 |
20140086788 | NEGATIVE ELECTRODE ACTIVE MATERIAL FOR ELECTRIC DEVICE, NEGATIVE ELECTRODE FOR ELECTRIC DEVICE AND ELECTRIC DEVICE - A negative electrode active material for an electric device includes an alloy containing Si in a range from greater than or equal to 17% by mass to less than 90% by mass, Ti in a range from 10% by mass to 83% by mass exclusive, Ge in a range from 0% by mass to 73% by mass exclusive, and inevitable impurities as a residue. The negative electrode active material can be obtained with a multi DC magnetron sputtering apparatus by use of, for example, Si, Ti and Ge as targets. An electric device employing the negative electrode active material can achieve long cycle life, and ensure a high capacity and improved cycle durability. | 03-27-2014 |
20140086792 | NEGATIVE ELECTRODE ACTIVE MATERIAL FOR ELECTRIC DEVICE - The negative electrode active material for an electric device of the present invention has an alloy containing Si in a range from 12% by mass or more to less than 100% by mass, Sn in a range from more than 0% by mass to 45% by mass or less, Al in a range from more than 0% by mass to 43% by mass or less, and indispensable impurities as remains. The negative electrode active material can be obtained, for example, using a multiple DC magnetron sputtering apparatus with Si, Sn and Al as targets. Electric devices to which the negative electrode active material of the present invention is applied have an improved cycle life and are excellent in the capacity and cycle durability. | 03-27-2014 |
20140099229 | NEGATIVE ELECTRODE ACTIVE MATERIAL FOR ELECTRIC DEVICE - A negative electrode active material for an electric device includes an alloy containing Si in a range of greater than or equal to 27% by mass and less than 100% by mass, Sn in a range of greater than 0% by mass and less than or equal to 73% by mass, V in a range of greater than 0% by mass and less than or equal to 73% by mass, and inevitable impurities as a residue. The negative electrode active material can be obtained with, for example, a multi DC magnetron sputtering apparatus by use of Si, Sn, and V as targets. An electric device using the negative electrode active material can achieve long cycle life and ensure a high capacity and cycle durability. | 04-10-2014 |
20140110628 | NEGATIVE ELECTRODE ACTIVE MATERIAL FOR ELECTRIC DEVICE - A negative electrode active material for an electric device includes an alloy containing silicon in a range from 33% by mass to 50% by mass, zinc in a range of greater than 0% by mass and less than or equal to 46% by mass exclusive, vanadium in a range from 21% by mass to 67% by mass, and inevitable impurities as a residue. The negative electrode active material can be obtained with a multi DC magnetron sputtering apparatus by use of, for example, silicon, zinc, and vanadium as targets. An electric device using the negative electrode active material can achieve long cycle life and ensure a high capacity and cycle durability. | 04-24-2014 |
20140272589 | NEGATIVE ELECTRODE ACTIVE MATERIAL FOR ELECTRIC DEVICE - A negative electrode active material for an electric device according to the present invention includes crystalline metal having a structure in which a size in a perpendicular direction to a crystal slip plane is 500 nm or less. More preferably, the size in the perpendicular direction to the crystal slip plane is controlled to become 100 nm or less. As described above, a thickness in an orientation of the slip plane is controlled to become sufficiently small, and accordingly, micronization of the crystalline metal is suppressed even if breakage occurs from the slip plane taken as a starting point. Hence, a deterioration of a cycle lifetime can be prevented by applying the negative electrode active material for an electric device, which is as described above, or a negative electrode using the same, to an electric device, for example, such as a lithium ion secondary battery. | 09-18-2014 |
20140319414 | NEGATIVE ELECTRODE ACTIVE MATERIAL FOR ELECTRIC DEVICE - A negative electrode active material for an electric device includes an alloy containing Si in a range from 23% to 64% exclusive, Sn in a range from 4% to 58% inclusive, Zn in a range from 0% to 65% exclusive, and inevitable impurities as a residue. The negative electrode active material can be obtained with a multi DC magnetron sputtering apparatus by use of, for example, silicon, tin and zinc as targets. An electric device such as a lithium ion secondary battery employing the negative electrode active material can improve cycle life of the battery and ensure a high capacity and high cycle durability. | 10-30-2014 |
20140353546 | NEGATIVE ELECTRODE ACTIVE MATERIAL FOR ELECTRIC DEVICE - A negative electrode active material for an electric device includes an alloy containing, in terms of mass ratio, 35%≦Si≦78%, 7%≦Sn≦30%, 0%12-04-2014 | |
20140374666 | NEGATIVE ELECTRODE ACTIVE MATERIAL FOR ELECTRIC DEVICE, NEGATIVE ELECTRODE FOR ELECTRIC DEVICE AND ELECTRIC DEVICE - A negative electrode active material for an electric device includes an alloy containing greater than or equal to 29% by mass of silicon and containing tin, carbon and inevitable impurities as a residue. | 12-25-2014 |
20150295228 | NEGATIVE ELECTRODE FOR ELECTRIC DEVICE AND ELECTRIC DEVICE USING THE SAME - The negative electrode for an electric device includes a current collector and an electrode layer containing a negative electrode active material, an electrically-conductive auxiliary agent and a binder and formed on a surface of the current collector, wherein the negative electrode active material contains an alloy represented by the following formula (1): Si | 10-15-2015 |
Patent application number | Description | Published |
20130083488 | SEMICONDUCTOR PACKAGE, WIRING BOARD UNIT, AND ELECTRONIC APPARATUS - A semiconductor package which is allocated between a wiring board and a cooling member, the semiconductor package, includes: a package board; a heating element which is mounted on the package board; a chip part which is mounted on the package board and provided around the heating element; and a heat transfer element having a main body unit which is jointed to the heating element with a metal joint material and a leg part which extends from the main body part to the package board and of which a tip is attached to the package board, and wherein the leg part, comprising: a first leg part allocated in a corner of the package board; and a second leg part which is allocated inside the first leg part between the heating element and the chip part on the package board. | 04-04-2013 |
20130314877 | SEMICONDUCTOR PACKAGE AND WIRING BOARD UNIT - A semiconductor package includes: a package substrate; a semiconductor chip mounted on the package substrate; a heat conductor that has a body section joined to the semiconductor chip via a metal joining material and a leg section that surrounds the semiconductor chip, the leg section extending from the body section to the package substrate and having an end bonded to the package substrate; and stress reducing members configured to reduce stress exerted on the metal joining material located on the semiconductor chip, the stress reducing members being disposed on the package substrate at positions corresponding to corners of the semiconductor chip inside the leg section and joined to the package substrate and the body section. | 11-28-2013 |
20130341767 | SEMICONDUCTOR DEVICE MOUNTING STRUCTURE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS - A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate. | 12-26-2013 |
20140193953 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE MOUNTING STRUCTURE - A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate. | 07-10-2014 |
20140319667 | SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF - A semiconductor apparatus includes: a package substrate on which a semiconductor device is disposed; a mounting board over which the package substrate is mounted; a first restraint that penetrates through the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are separated from each other; and a second restraint that is disposed between the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are closer to each other. | 10-30-2014 |
20140376187 | PACKAGE MOUNTING STRUCTURE - A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate. | 12-25-2014 |
20150264810 | CIRCUIT BOARD AND MANUFACTURING METHOD OF CIRCUIT BOARD - A circuit board includes: a substrate; a through hole formed in the substrate; and a connection terminal provided in the through hole; wherein the connection terminal includes a pedestal portion provided within the through hole and a pin which is provided at a center of the pedestal portion and extends from the pedestal portion toward a first surface of the substrate, so that a first end portion protrudes from the first surface. | 09-17-2015 |
Patent application number | Description | Published |
20150303450 | NEGATIVE ELECTRODE FOR ELECTRICAL DEVICE, AND ELECTRICAL DEVICE USING THE SAME - A negative electrode for an electrical device includes: a current collector, and an electrode layer containing a negative electrode active material, an electrically-conductive auxiliary agent and a binder, wherein the negative electrode active material contains an alloy represented by a following formula (1): Si | 10-22-2015 |
20150303451 | NEGATIVE ELECTRODE FOR ELECTRIC DEVICE AND ELECTRIC DEVICE USING THE SAME - The negative electrode for an electric device includes: a current collector; and an electrode layer containing a negative electrode active material, an electrically-conductive auxiliary agent and a binder and formed on a surface of the current collector. The negative electrode active material is a mixture of a carbon material and an alloy represented by the following formula (1): Si | 10-22-2015 |
20150303455 | NEGATIVE ELECTRODE FOR ELECTRIC DEVICE AND ELECTRIC DEVICE USING THE SAME - The negative electrode for an electric device includes: a current collector; and an electrode layer containing a negative electrode active material, an electrically-conductive auxiliary agent and a binder and formed on a surface of the current collector. The negative electrode active material is a mixture of a carbon material and an alloy expressed by formula (1): Si | 10-22-2015 |
20150303464 | NEGATIVE ELECTRODE FOR ELECTRICAL DEVICE, AND ELECTRICAL DEVICE USING THE SAME - A negative electrode for an electrical device includes: a current collector; and an electrode layer containing a negative electrode active material, an electrically-conductive auxiliary agent and a binder and formed on a surface of the current collector, wherein the negative electrode active material contains an alloy represented by a following formula (1): Si | 10-22-2015 |
20150303465 | NEGATIVE ELECTRODE FOR ELECTRIC DEVICE AND ELECTRIC DEVICE USING THE SAME - The negative electrode for an electric device includes a current collector and an electrode layer containing a negative electrode active material, an electrically-conductive auxiliary agent and a binder and formed on a surface of the current collector, wherein the negative electrode active material contains an alloy represented by the following formula (1): Si | 10-22-2015 |
20150303466 | NEGATIVE ELECTRODE FOR ELECTRIC DEVICE AND ELECTRIC DEVICE USING THE SAME - The negative electrode for an electric device includes a current collector and an electrode layer containing a negative electrode active material, a conductive auxiliary agent and a binder and formed on a surface of the current collector, wherein the negative electrode active material contains an alloy represented by the following formula (1): Si | 10-22-2015 |