Patent application number | Description | Published |
20140351496 | Optimized Configurable NAND Parameters - Configurable parameters may be used to access NAND flash memory according to schemes that optimize such parameters according to predicted characteristics of memory cells, for example, as a function of certain memory cell device geometry, which may be predicted based on the location of a particular device within a memory array. | 11-27-2014 |
20140355345 | Adaptive Operation of Three Dimensional Memory - When data from a portion of a three dimensional NAND memory array is determined to be uncorrectable by Error Correction Code (ECC), a determination is made as to whether data is uncorrectable by ECC throughout some unit that is larger than the portion. If modified read conditions provide ECC correctable data, the modified read conditions are recorded for subsequent reads of the larger unit. | 12-04-2014 |
20140359400 | Selection of Data for Redundancy Calculation in Three Dimensional Nonvolatile Memory - Portions of data stored in a three dimensional memory array are selected based on their locations for calculation of redundancy data. Locations are selected so that no two portions in a set of portions for a given calculation are likely to become uncorrectable at the same time. Selected portions may be separated by at least one word line and separated by at least one string in a block. | 12-04-2014 |
20150063028 | Bad Block Reconfiguration in Nonvolatile Memory - When a bad block is found in a nonvolatile memory array, the block is marked as a bad block so that it is not subsequently used. The block is also reconfigured as a bad block by increasing resistance of vertical NAND strings in the block by increasing threshold voltage of at least some transistors along vertical NAND strings, for example, select transistors or memory cell transistors. | 03-05-2015 |
20150085574 | Back Gate Operation with Elevated Threshold Voltage - In a three dimensional NAND memory, increased threshold voltages in back gate transistors may cause program failures, particularly along word lines near back gates. When back gate transistor threshold voltages cannot be returned to a desired threshold voltage range then modified program conditions, including increased back gate voltage, may be used to allow programming. | 03-26-2015 |
20150117099 | Selection of Data for Redundancy Calculation By Likely Error Rate - Layers in a multi-layer memory array are categorized according to likely error rates as predicted from their memory hole diameters. Data to be stored along a word line in a high risk layer is subject to a redundancy operation (e.g. XOR) with data to be stored along a word line in a low risk layer so that the risk of both being bad is low. | 04-30-2015 |
20150121156 | Block Structure Profiling in Three Dimensional Memory - Memory hole diameter in a three dimensional memory array may be calculated from characteristics that are observed during programming. Suitable operating parameters may be selected for operating a block based on memory hole diameters. Hot counts of blocks may be adjusted according to memory hole size so that blocks that are expected to fail earlier because of small memory holes are more lightly used than blocks with larger memory holes. | 04-30-2015 |
20150121157 | Selection of Data for Redundancy Calculation By Likely Error Rate - Layers in a multi-layer memory array are categorized according to likely error rates as predicted from their memory hole diameters. Data to be stored along a word line in a high risk layer is subject to a redundancy operation (e.g. XOR) with data to be stored along a word line in a low risk layer so that the risk of both being bad is low. | 04-30-2015 |