Patent application number | Description | Published |
20090082063 | Method and system for providing a multimedia presentation to a mobile device user - There is provided a method for use by a mobile device for providing an entertainment presentation to a user. The method comprises downloading a multimedia presentation control software by the mobile device, wherein the mobile device includes a controller and a smart chip operable to support electronic commerce transactions, registering a first action by the mobile device in response to a first smart chip event caused by the user, activating a function of the multimedia presentation control software in response to the first action, and providing the entertainment presentation to the user of the mobile device using the multimedia presentation control software. | 03-26-2009 |
20100174208 | LIVING BODY MEASUREMENT APPARATUS - A living body measurement apparatus according to the present invention functions both as a muscular tissue hardness tester for measuring hardness of muscular tissue of a living body and as an algesiometer for measuring a degree of sense of pain of the living body, and the apparatus includes: an contacting section which includes a first contact surface contacting the living body, and which applies pressure to the living body; an auxiliary section which includes a second contact surface contacting the living body, and which supports the second contact surface so that the second contact surface perform reciprocating movement between a coplanar position in which the second contact surface is disposed substantially coplanar with the first contact surface and a retracted position in which the second contact surface is retracted with respect to the first contact surface; and a locking mechanism which locks the auxiliary section in a state in which the second contact surface is disposed at the retracted position. | 07-08-2010 |
20100328756 | ELECTROPHORETIC DISPLAYING APPARATUS - An electrophoretic displaying apparatus, comprises: a first substrate and a second substrate placed opposite with a predetermined interval; a plurality of pixel electrodes arranged on the first substrate; signal lines arranged between the adjoining pixel electrodes; an opposed electrode provided on the second substrate; partition walls provided to stand toward the second substrate over the signal lines of the first substrate so as to enclose the plurality of pixel electrodes; and solvents severally containing a plurality of particles dispersed therein to be filled up in regions enclosed by the partition walls, wherein antireflective layer is formed on the first substrate correspondingly to the partition walls, and the signal lines is formed on a layer between the partition walls and the antireflective layer. | 12-30-2010 |
20110130682 | MUSCLE HARDNESS METER - A muscle hardness meter according to the present invention, which measures the hardness of muscle tissue of a living organism, includes: an auxiliary part which touches a periphery of a section of the living organism to be measured so as to apply pressure to the periphery; a touching part which touches the section to be measured so as to apply pressure to the section to be measured; a first pressure sensor which measures pressures that the touching part and the auxiliary part sustain, respectively, from the section to be measured and the periphery, and outputs a first measurement result; a second pressure sensor which measures a pressure that the touching part sustains from the section to be measured, and outputs a second measurement result; a notification part which notifies the second measurement result; and a control part which determines whether or not the first measurement result reaches a reference pressure value input in advance and notifies the second measurement result to the notification part at a time when it is determined that the first measurement result reaches the reference value. | 06-02-2011 |
20110144541 | BIOMETRIC DATA-MEASURING INSTRUMENT, BIOMETRIC DATA-MEASURING SYSTEM, MUSCLE STRENGTH METER, AND MUSCLE STRENGTH-MEASURING SYSTEM - A biometric data-measuring instrument that measures data relating to a living organism by applying pressure to the living organism. The instrument includes: a casing, an auxiliary contacting part that extends from the casing, the auxiliary contacting part being contacted against a vicinity of a point to be measured on the living organism and applying pressure to the vicinity of the point to be measured, a main contacting part that, in a state where the auxiliary contacting part is applying pressure to the vicinity of the point to be measured, is contacted against the point to be measured and applies pressure to the point to be measured in the direction in which the auxiliary contacting part is applying pressure to the vicinity of the point to be measured, a pressure sensor that is provided inside the casing and measures a pressure that the main contacting part receives from the point to be measured, and a biometric data display unit that is provided on the casing and displays the measured biometric data. A tip of the auxiliary contacting part extends outward from a base side thereof. | 06-16-2011 |
20120019896 | ELECTROPHORETIC DISPLAY DEVICE - An electrophoretic display device includes: a first substrate and a second substrate which are arranged opposite to each other at a predetermined interval; a plurality of pixel electrodes which are aligned on the first substrate; a wiring which is arranged between adjacent pixel electrodes among the pixel electrodes; an opposite electrode which is provided on the second substrate; a partition wall which is provided above the wiring of the first substrate to stand toward the second substrate so as to surround the pixel electrodes; and a solvent which fills up a space surrounded by the partition wall and in which a plurality of particles are dispersed. The partition wall has a rectangular shape including four sides, at least one of which partially has an expanded-width portion wider than other portion of the at least one of the four sides. | 01-26-2012 |
20130070643 | NETWORK SELECTION SUPPORTING METHOD AND NETWORK SELECTION SUPPORTING APPARATUS - To support selection of a communication system of a network applied to an FA system of a user, a network selection supporting method according to an embodiment of the present invention includes a condition displaying step of displaying, on a condition input screen, one or a plurality of selection conditions set in advance related to the communication system of the network applied to the FA system, a condition receiving step of receiving an input of a selection condition desired by the user among the selection conditions displayed on the condition input screen, a communication system searching step of searching through a communication system database and finding a communication system matching the input selection condition, and a communication system list displaying step of displaying a search result of the communication system on the communication system list display screen as a list. | 03-21-2013 |
20150109638 | IMAGE FORMING SYSTEM - An image forming system includes mobile terminals and image forming apparatuses, in which one image forming apparatus receives setting information to be used in order to use the image forming apparatus, the setting information being stored in one mobile terminal and able to be transmitted to another mobile terminal that will use another image forming apparatus based on the setting information. The one image forming apparatus determines whether the setting information is to be changed based on a comparison between the ability of the image forming apparatuses and, when determining that the setting information is to be changed, changes the setting information and send the changed setting information to the other mobile terminal. | 04-23-2015 |
20150348238 | IMAGE PROCESSING APPARATUS, AND NON-TRANSITORY COMPUTER READABLE MEDIUM - Provided is an image processing apparatus including a color conversion unit that performs color conversion to convert an original image to a luminance image and to a chromaticity image, an illumination image generation unit that generates an illumination image having an illumination component of the luminance image as a pixel value from the luminance image, a reflectance image generation unit that generates a reflectance image having a stabilized reflectance component of the luminance image as a pixel value, a luminance reproduction image generation unit that enhances the reflectance component of the luminance image to generate a luminance reproduction image reproduced with being improved visibility of the luminance image, and an inverse color conversion unit that performs conversion inverse to the color conversion performed by the color conversion unit on the luminance reproduction image and the chromaticity image. | 12-03-2015 |
20150370429 | IN-VEHICLE APPARATUS AND CONTROL METHOD OF IN-VEHICLE APPARATUS - An in-vehicle apparatus and a control method of an in-vehicle apparatus, which is applied to a multimedia terminal having, for example, a function of navigation equipment and a function of video playback so as to improve usability to a user in a case of accepting an operation through a touch panel and a remote commander. A touch panel menu screen suitable for an operation through a touch panel and a remote commander menu screen suitable for an operation through a remote commander are switched to be displayed so as to accept an operation by a user. | 12-24-2015 |
Patent application number | Description | Published |
20100176403 | SILICON CARBIDE SUBSTRATE, EPITAXIAL WAFER AND MANUFACTURING METHOD OF SILICON CARBIDE SUBSTRATE - An SiC substrate includes the steps of preparing a base substrate having a main surface and made of SiC, washing the main surface using a first alkaline solution, and washing the main surface using a second alkaline solution after the step of washing with the first alkaline solution. The SiC substrate has the main surface, and an average of residues on the main surface are equal to or larger than 0.2 and smaller than 200 in number. | 07-15-2010 |
20110175107 | SILICON CARBIDE SUBSTRATE - A base portion is made of silicon carbide and has a main surface. At least one silicon carbide layer is provided on the main surface of the base portion in a manner exposing a region of the main surface along an outer edge of the main surface. At least one protection layer is provided on this region of the main surface of the base portion along the outer edge of the main surface. Thus, a silicon carbide substrate can be polished with high in-plane uniformity. | 07-21-2011 |
20110175108 | LIGHT-EMITTING DEVICE - A silicon carbide substrate has a first layer facing a semiconductor layer and a second layer stacked on the first layer. Dislocation density of the second layer is higher than dislocation density of the first layer. Thus, quantum efficiency and power efficiency of a light-emitting device can both be high. | 07-21-2011 |
20110198027 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE - A base portion and first and second silicon carbide substrates are disposed in a processing chamber such that a first side surface of a first silicon carbide substrate and a side surface of a second silicon carbide substrate face each other. The processing chamber has an inner surface at least a portion of which is covered with an absorbing portion including Ta atoms and C atoms. In order to connect the first and second side surfaces to each other, a temperature in the processing chamber is increased to reach or exceed a temperature at which silicon carbide can sublime. In the step of increasing the temperature, at least a portion of the absorbing portion is carbonized. | 08-18-2011 |
20110226182 | CRUCIBLE, CRYSTAL PRODUCTION DEVICE, AND HOLDER - A crucible includes a body portion having a hollow inner portion, and a projection portion connected to an inner circumferential surface of the body portion and projecting toward the inner portion. The projection portion has a side surface provided with a thread. A holder includes a base and a protrusion connected to an end portion of the base. The protrusion has an inner circumferential side provided with a thread. A crystal production device includes the crucible and the holder. The holder is attached to the projection portion of the crucible by means of the threads formed in the holder and the crucible. | 09-22-2011 |
20110233561 | SEMICONDUCTOR SUBSTRATE - A supporting portion is made of silicon carbide. At least one layer has first and second surfaces. The first surface is supported by the supporting portion. The at least one layer has first and second regions. The first region is made of silicon carbide of a single-crystal structure. The second region is made of graphite. The second surface has a surface formed by the first region. The first surface has a surface formed by the first region, and a surface formed by the second region. In this way, a semiconductor substrate can be provided which has a region made of silicon carbide having a single-crystal structure and a supporting portion made of silicon carbide and allows for reduced electric resistance of an interface therebetween. | 09-29-2011 |
20110262680 | SILICON CARBIDE SUBSTRATE AND METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE - A sublimation preventing layer is formed to cover a first region of a main surface of a material substrate. First and second single-crystal layers are arranged on the material substrate such that a gap between first and second side surfaces is located over the sublimation preventing layer. The material substrate and the first and second single-crystal layers are heated to sublimate silicon carbide from a second region of the main surface and recrystallize the sublimated silicon carbide on the first backside surface of the first single-crystal layer and the second backside surface of the second single-crystal layer, thereby forming a base substrate connected to each of the first and second backside surfaces. This can prevent formation of voids in a silicon carbide substrate having such a plurality of single-crystal layers. | 10-27-2011 |
20110262681 | SILICON CARBIDE SUBSTRATE AND METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE - A carbon layer is formed on a first region of a main surface of a material substrate. On the material substrate, first and second single-crystal layers are arranged such that each of a first backside surface of the first single-crystal layer and a second backside surface of the second single-crystal layer has a portion facing a second region of the main surface of the material substrate and such that a gap between a first side surface of the first single-crystal layer and a second side surface of the second single-crystal layer is located over the carbon layer. By heating the material substrate and the first and second single-crystal layers, a base substrate connected to each of the first and second backside surfaces is formed. In this way, voids can be prevented from being formed in the silicon carbide substrate having such a plurality of single-crystal layers. | 10-27-2011 |
20110272087 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE - Upon arranging a base portion and first and second silicon carbide layers such that each of a first backside surface of the first silicon carbide layer and a second backside surface of the second silicon carbide layer faces a first main surface of the base portion, at least one of the first and second silicon carbide layers is partially projected as a projection to outside the first main surface when viewed in a planar view. Each of the first and second backside surfaces and the first main surface are connected to each other by heating. This heating carbonizes at least a part of the projection, thereby forming a carbonized portion. When removing the projection, the carbonized portion is processed. In this way, the planar shape of a silicon carbide substrate can be readily adjusted. | 11-10-2011 |
20110275224 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE - A material substrate is prepared which has a first surface and a second surface opposite to each other in a thickness direction and is made of silicon carbide. The material substrate is partially carbonized to divide the material substrate into a carbonized portion made of a material obtained by carbonizing silicon carbide, and a silicon carbide portion made of silicon carbide. This step of partially carbonizing the material substrate is performed to partially carbonize the second surface. In order to adjust a shape of the material substrate when viewed in a planar view, a portion of the material substrate is removed. This step of removing the portion of the material substrate includes the step of processing the carbonized portion. Accordingly, a silicon carbide substrate having a desired planar shape can be obtained readily. | 11-10-2011 |
20110278593 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SILICON CARBIDE SUBSTRATE, AND SEMICONDUCTOR DEVICE - A method for manufacturing a silicon carbide substrate includes the steps of: preparing a SiC substrate made of single-crystal silicon carbide; disposing a base substrate in a crucible so as to face a main surface of the SiC substrate; and forming a base layer made of silicon carbide in contact with the main surface of the SiC substrate, by heating the base substrate in the crucible to fall within a range of temperature higher than a sublimation temperature of silicon carbide constituting the base substrate. In the step of forming the base layer, a gas containing silicon is introduced into the crucible. | 11-17-2011 |
20110278594 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SILICON CARBIDE SUBSTRATE, AND SEMICONDUCTOR DEVICE - A method for manufacturing a silicon carbide substrate includes the steps of: preparing a SiC substrate made of single-crystal silicon carbide; disposing a base substrate in a crucible so as to face a main surface of the SiC substrate; and forming a base layer made of silicon carbide in contact with the main surface of the SiC substrate by heating the base substrate in the crucible to fall within a range of temperature equal to or higher than a sublimation temperature of silicon carbide constituting the base substrate. The crucible has an inner wall at least a portion of which is provided with a coating layer made of silicon carbide. | 11-17-2011 |
20110278595 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SILICON CARBIDE SUBSTRATE, AND SEMICONDUCTOR DEVICE - A method for manufacturing a silicon carbide substrate includes the steps of: preparing a base substrate made of silicon carbide and a SiC substrate made of single-crystal silicon carbide; fabricating a stacked substrate by placing said SiC substrate on and in contact with a main surface of said base substrate; and connecting said base substrate and said SiC substrate to each other by heating said stacked substrate in a container to fall within a range of temperature equal to or greater than a sublimation temperature of silicon carbide constituting said base substrate. In the step of connecting said base substrate and said SiC substrate, a silicon carbide body made of silicon carbide and different from said base substrate and said SiC substrate is disposed in said container. | 11-17-2011 |
20110284871 | SILICON CARBIDE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE - A silicon carbide substrate includes a base layer made of silicon carbide, an SiC layer made of single crystal silicon carbide, arranged on the base layer, and having a concentration of inevitable impurities lower than the concentration of inevitable impurities in the base layer, and a cover layer made of silicon carbide, formed on a main surface of the base layer at a side opposite to the SiC layer, and having a concentration of inevitable impurities lower than the concentration of inevitable impurities in the base layer. | 11-24-2011 |
20110284872 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SILICON CARBIDE SUBSTRATE, AND SEMICONDUCTOR DEVICE - A method for manufacturing a silicon carbide substrate includes the steps of: preparing a base substrate made of silicon carbide, and a SiC substrate made of single-crystal silicon carbide; fabricating a stacked substrate by placing the SiC substrate on and in contact with a main surface of the base substrate; connecting the base substrate and the SiC substrate by heating the stacked substrate to allow the base substrate to have a temperature higher than that of the SiC substrate; and forming an epitaxial growth layer on an opposite main surface, to the SiC substrate, of the base substrate connected to the SiC substrate. | 11-24-2011 |
20110287603 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE - First and second supported portions each made of silicon carbide and a supporting portion made of silicon carbide are arranged such that the first and second supported portions and the supporting portion face each other and a gap is provided between the first and second supported portions. By sublimating and recrystallizing silicon carbide of the supporting portion, the supporting portion is connected to each of the first and second single-crystal substrates. On this occasion, a through hole is formed in the supporting portion so as to be connected to the gap. Accordingly, a path is formed which allows a fluid to pass through the gap and the through hole. By closing this path, the fluid can be prevented from being leaked through the silicon carbide substrate. | 11-24-2011 |
20120056201 | INSULATED GATE BIPOLAR TRANSISTOR - An IGBT, which is a vertical type IGBT allowing for reduced on-resistance while restraining defects from being produced, includes: a silicon carbide substrate, a drift layer, a well region, an n | 03-08-2012 |
20120056202 | SEMICONDUCTOR DEVICE - A MOSFET, which is a semiconductor device allowing for reduced on-resistance while restraining stacking faults from being produced due to heat treatment in a device manufacturing process, includes: a silicon carbide substrate; an active layer made of single-crystal silicon carbide and disposed on one main surface of the silicon carbide substrate; a source contact electrode disposed on the active layer; and a drain electrode formed on the other main surface of the silicon carbide substrate. The silicon carbide substrate includes: a base layer made of silicon carbide; and a SiC layer made of single-crystal silicon carbide and disposed on the base layer. Further, the base layer has an impurity concentration greater than 2×10 | 03-08-2012 |
20120056203 | SEMICONDUCTOR DEVICE - A JFET, which is a semiconductor device allowing for reduced manufacturing cost, includes: a silicon carbide substrate; an active layer made of single-crystal silicon carbide and disposed on one main surface of the silicon carbide substrate; a source electrode disposed on the active layer; and a drain electrode formed on the active layer and separated from the source electrode. The silicon carbide substrate includes: a base layer made of single-crystal silicon carbide, and a SiC layer made of single-crystal silicon carbide and disposed on the base layer. The SiC layer has a defect density smaller than that of the base layer. | 03-08-2012 |
20120077346 | SILICON CARBIDE SUBSTRATE, EPITAXIAL WAFER AND MANUFACTURING METHOD OF SILICON CARBIDE SUBSTRATE - An SiC substrate includes the steps of preparing a base substrate having a main surface and made of SiC, washing the main surface using a first alkaline solution, and washing the main surface using a second alkaline solution after the step of washing with the first alkaline solution. The SiC substrate has the main surface, and an average of residues on the main surface are equal to or larger than 0.2 and smaller than 200 in number. | 03-29-2012 |
20120126251 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SILICON CARBIDE SUBSTRATE, AND SEMICONDUCTOR DEVICE - A method for manufacturing a silicon carbide substrate achieves reduced manufacturing cost. The method includes the steps of: preparing a base substrate and a SiC substrate; fabricating a stacked substrate by stacking the base substrate and the SiC substrate; fabricating a connected substrate by heating the stacked substrate; transferring a void, formed at a connection interface, in a thickness direction of the connected substrate by heating the connected substrate to cause the base substrate to have a temperature higher than that of the SiC substrate; and removing the void by removing a region including a main surface of the base substrate opposite to the SiC substrate. | 05-24-2012 |
20120161157 | SILICON CARBIDE SUBSTRATE - A silicon carbide substrate, which achieves restrained warpage even when a different-type material layer made of a material other than silicon carbide, includes: a base layer made of silicon carbide; and a plurality of SiC layers arranged side by side on the base layer when viewed in a planar view and each made of single-crystal silicon carbide. A gap is formed between end surfaces of adjacent SiC layers. | 06-28-2012 |
20120161158 | COMBINED SUBSTRATE HAVING SILICON CARBIDE SUBSTRATE - A first silicon carbide substrate has a first backside surface connected to a supporting portion, a first front-side surface opposite to the first backside surface, and a first side surface connecting the first backside surface and the first front-side surface to each other. A second silicon carbide substrate has a second backside surface connected to the supporting portion, a second front-side surface opposite to the second backside surface, and a second side surface connecting the second backside surface and the second front-side surface to each other and forming a gap between the first side surface and the second side surface. A closing portion closes the gap. Thereby, foreign matters can be prevented from remaining in a gap between a plurality of silicon carbide substrates provided in a combined substrate. | 06-28-2012 |
20120168774 | SILICON CARBIDE SUBSTRATE AND METHOD FOR MANUFACTURING SAME - A silicon carbide substrate and a method for manufacturing the silicon carbide substrate are obtained, each of which achieves reduced manufacturing cost of semiconductor devices using the silicon carbide substrate. A method for manufacturing a SiC-combined substrate includes the steps of: preparing a plurality of single-crystal bodies each made of silicon carbide (SiC); forming a collected body; connecting the single-crystal bodies to each other; and slicing the collected body. In the step, the plurality of SiC single-crystal ingots are arranged with a silicon (Si) containing Si layer interposed therebetween, so as to form the collected body including the single-crystal bodies. In the step, adjacent SiC single-crystal ingots are connected to each other via at least a portion of the Si layer, the portion being formed into silicon carbide by heating the collected body. In step, the collected body in which the SiC single-crystal ingots are connected to each other is sliced. | 07-05-2012 |
20120183466 | SILICON CARBIDE CRYSTAL AND METHOD OF MANUFACTURING SILICON CARBIDE CRYSTAL - An SiC crystal has Fe concentration not higher than 0.1 ppm and Al concentration not higher than 100 ppm. A method of manufacturing an SiC crystal includes the following steps. SiC powders for polishing are prepared as a first source material. A first SiC crystal is grown by sublimating the first source material through heating and precipitating an SiC crystal. A second source material is formed by crushing the first SiC crystal. A second SiC crystal is grown by sublimating the second source material through heating and precipitating an SiC crystal. Thus, an SiC crystal and a method of manufacturing an SiC crystal capable of achieving suppressed lowering in quality can be obtained. | 07-19-2012 |
20120184113 | METHOD AND DEVICE FOR MANUFACTURING SILICON CARBIDE SUBSTRATE - A step of preparing a stack is performed to position each single-crystal substrate in a first single-crystal substrate group and a first base substrate face to face with each other, position each single-crystal substrate in a second single-crystal substrate group and a second base substrate face to face with each other, and stack the first single-crystal substrate group, the first base substrate, an insertion portion, the second single-crystal substrate group, and the second base substrate in one direction in this order. Next, the stack is heated so as to allow a temperature of the stack to reach a temperature at which silicon carbide can sublime and so as to form a temperature gradient in the stack with the temperature thereof getting increased in the above-described direction. In this way, silicon carbide substrates can be manufactured efficiently. | 07-19-2012 |
20120244307 | SILICON CARBIDE SUBSTRATE - A silicon carbide substrate includes: a base substrate having a diameter of 70 mm or greater; and a plurality of SiC substrates made of single-crystal silicon carbide and arranged side by side on the base substrate when viewed in a planar view. In other words, the plurality of SiC substrates are arranged side by side on and along the main surface of the base substrate. Further, each of the SiC substrates has a main surface opposite to the base substrate and having an off angle of 20° or smaller relative to a {0001} plane. | 09-27-2012 |
20120273800 | COMPOSITE SUBSTRATE HAVING SINGLE-CRYSTAL SILICON CARBIDE SUBSTRATE - A first vertex of a first single-crystal silicon carbide substrate and a second vertex of a second single-crystal silicon carbide substrate abut each other such that a first side of the first single-crystal silicon carbide substrate and a second side of the second single-crystal silicon carbide substrate are aligned. In addition, at least a part of the first side and at least a part of the second side abut on a third side of a third single-crystal silicon carbide substrate. Thus, in manufacturing a semiconductor device including a composite substrate, process fluctuations caused by a gap between the single-crystal silicon carbide substrates can be suppressed. | 11-01-2012 |
20120275984 | METHOD FOR MANUFACTURING SILICON CARBIDE SINGLE CRYSTAL, AND SILICON CARBIDE SUBSTRATE - Each of first and second material substrates made of single crystal silicon carbide has first and second back surfaces, first and second side surfaces, and first and second front surfaces. The first and second back surfaces are connected to a supporting portion. The first and second side surfaces face each other with a gap interposed therebetween, the gap having an opening between the first and second front surfaces. A closing portion for closing the gap over the opening is formed. A connecting portion for closing the opening is formed by depositing a sublimate from the first and second side surfaces onto the closing portion. The closing portion is removed. A silicon carbide single crystal is grown on the first and second front surfaces. | 11-01-2012 |
20120276715 | METHOD FOR MANUFACTURING COMBINED SUBSTRATE HAVING SILICON CARBIDE SUBSTRATE - A connected substrate having a supporting portion and first and second silicon carbide substrates is prepared. The first silicon carbide substrate has a first backside surface connected to the supporting portion, a first front-side surface, and a first side surface connecting the first backside surface and the first front-side surface to each other. The second silicon carbide substrate has a second backside surface connected to the supporting portion, a second front-side surface, and a second side surface connecting the second backside surface and the second front-side surface to each other and forming a gap between the first side surface and the second side surface. A filling portion for filling the gap is formed. Then, the first and second front-side surfaces are polished. Then, the filling portion is removed. Then, a closing portion for closing the gap is formed. | 11-01-2012 |
20120294790 | SILICON CARBIDE SUBSTRATE, SILICON CARBIDE INGOT, AND METHODS FOR MANUFACTURING SILICON CARBIDE SUBSTRATE AND SILICON CARBIDE INGOT - A method of manufacturing a silicon carbide ingot having highly uniform characteristics includes a preparation step of preparing a base substrate made of single crystal silicon carbide and having an off angle of 0.1° or more and 10° or less in an off angle direction which is either a <11-20> direction or a <1-100> direction relative to a (0001) plane, and a film formation step of growing a silicon carbide layer on a surface of the base substrate. In the film formation step, a region having a (0001) facet | 11-22-2012 |
20120295112 | SILICON CARBIDE POWDER AND METHOD FOR PRODUCING SILICON CARBIDE POWDER - There are provided a silicon carbide powder for silicon carbide crystal growth and a method for producing the silicon carbide powder. The silicon carbide powder is formed by heating a mixture of a silicon small piece and a carbon powder and thereafter pulverizing the mixture, and is substantially composed of silicon carbide. | 11-22-2012 |
20120308758 | SILICON CARBIDE CRYSTAL INGOT, SILICON CARBIDE CRYSTAL WAFER, AND METHOD FOR FABRICATING SILICON CARBIDE CRYSTAL INGOT - A silicon carbide crystal ingot having a surface greater than or equal to 4 inches, having an n-type dopant concentration greater than or equal to 1×10 | 12-06-2012 |
20120315427 | SINGLE CRYSTAL SILICON CARBIDE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A single crystal silicon carbide substrate has a 4H-polytype crystal structure, has with nitrogen atoms doped as a conduction impurity with an atomic concentration of more than 1×10 | 12-13-2012 |
20130009171 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - A semiconductor device has a semiconductor layer and a substrate. The semiconductor layer constitutes at least a part of a current path, and is made of silicon carbide. The substrate has a first surface supporting the semiconductor layer, and a second surface opposite to the first surface. Further, the substrate is made of silicon carbide having a 4H type single-crystal structure. Further, the substrate has a physical property in which a ratio of a peak strength in a wavelength of around 500 nm to a peak strength in a wavelength of around 390 nm is 0.1 or smaller in photoluminescence measurement. In this way, the semiconductor device is obtained to have a low on-resistance. | 01-10-2013 |
20130068157 | METHOD OF MANUFACTURING SILICON CARBIDE CRYSTAL - A method of manufacturing silicon carbide crystal includes the steps of forming silicon carbide crystal on a main surface of a base composed of carbon and removing the base from silicon carbide crystal by oxidizing carbon. According to the manufacturing method, by gasifying the base integrated with the silicon carbide crystal by oxidizing carbon forming the base, the base is removed from the silicon carbide crystal. Therefore, since it is not necessary to apply physical force to the silicon carbide crystal or the base for separating them from each other, occurrence of a defect involved with removal of the base can be suppressed. Therefore, high-quality silicon carbide crystal having fewer defects can be manufactured. | 03-21-2013 |
20130095285 | SILICON CARBIDE SUBSTRATE, SILICON CARBIDE INGOT, AND METHOD OF MANUFACTURING THE SAME - A silicon carbide substrate and a silicon carbide ingot excellent in uniformity in characteristics, and a method of manufacturing the same are obtained. A method of manufacturing a silicon carbide ingot includes the steps of preparing a base substrate having an off angle with respect to a (0001) plane not greater than 10° and composed of single crystal silicon carbide and growing a silicon carbide layer on a surface of the base substrate. In the step of growing a silicon carbide layer, a temperature gradient in a direction of width when viewed in a direction of growth of the silicon carbide layer is set to 20° C./cm or more. | 04-18-2013 |
20130095294 | SILICON CARBIDE INGOT AND SILICON CARBIDE SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME - A silicon carbide ingot excellent in uniformity in characteristics and a silicon carbide substrate obtained by slicing the silicon carbide ingot, and a method of manufacturing the same are obtained. A method of manufacturing a silicon carbide ingot includes the steps of preparing a base substrate having an off angle with respect to a (0001) plane not greater than 1° and composed of single crystal silicon carbide and growing a silicon carbide layer on a surface of the base substrate. In the step of growing a silicon carbide layer, a temperature gradient in a direction of width when viewed in a direction of growth of the silicon carbide layer is set to 10° C./cm or less. | 04-18-2013 |
20130099252 | METHOD OF MANUFACTURING SILICON CARBIDE SUBSTRATE AND SILICON CARBIDE SUBSTRATE - A method of manufacturing a silicon carbide substrate includes the steps of preparing an ingot composed of single crystal silicon carbide, obtaining a silicon carbide substrate by slicing the ingot, and polishing a surface of the silicon carbide substrate. In the step of obtaining a silicon carbide substrate, the ingot is sliced such that cutting proceeds in a direction in which an angle formed with respect to a <11-20> direction or a <1-100> direction is 15±5° in an orthogonal projection on a {0001} plane. In the step of polishing a surface of the silicon carbide substrate, at least one of main surfaces of the silicon carbide substrate is polished while the entire surface of at least one of the main surfaces of the silicon carbide substrate is in contact with a polishing surface. | 04-25-2013 |
20130109110 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 05-02-2013 |
20130239881 | METHOD AND DEVICE FOR MANUFACTURING SILICON CARBIDE SINGLE-CRYSTAL - A method for manufacturing a silicon carbide single-crystal having a diameter of more than 100 mm and a maximum height of 20 mm or more using a sublimation method includes the following steps. That is, there are prepared a seed substrate made of silicon carbide and a silicon carbide source material. By sublimating the silicon carbide source material, the silicon carbide single-crystal is grown on a growth surface of the seed substrate. In the step of growing the silicon carbide single-crystal, a first carbon member provided at a position facing a side wall of the seed substrate is etched at a rate of 0.1 mm/hour or less. By suppressing a change in growth condition for the silicon carbide single-crystal in the crucible, there can be provided a method for manufacturing a silicon carbide single-crystal so as to stably grow the silicon carbide single-crystal. | 09-19-2013 |
20130255568 | METHOD FOR MANUFACTURING SILICON CARBIDE SINGLE CRYSTAL - A method for manufacturing silicon carbide single crystal having a diameter larger than 100 mm by sublimation includes the following steps. A seed substrate made of silicon carbide and silicon carbide raw material are prepared. Silicon carbide single crystal is grown on the growth face of the seed substrate by sublimating the silicon carbide raw material. In the step of growing silicon carbide single crystal, the maximum growing rate of the silicon carbide single crystal growing on the growth face of the seed substrate is greater than the maximum growing rate of the silicon carbide crystal growing on the surface of the silicon carbide raw material. Thus, there can be provided a method for manufacturing silicon carbide single crystal allowing a thick silicon carbide single crystal film to be obtained, when silicon carbide single crystal having a diameter larger than 100 mm is grown. | 10-03-2013 |
20140004303 | SILICON CARBIDE CRYSTAL AND METHOD OF MANUFACTURING SILICON CARBIDE CRYSTAL | 01-02-2014 |
20140138709 | SILICON CARBIDE SUBSTRATE - A first circular surface ( | 05-22-2014 |
20140287226 | INGOT, SILICON CARBIDE SUBSTRATE, AND METHOD FOR PRODUCING INGOT - There is obtained an ingot in which generation of crack is suppressed. The ingot includes: a seed substrate formed of silicon carbide; and a silicon carbide layer grown on the seed substrate. The silicon carbide layer has a thickness of 15 mm or more in a growth direction. When measuring a lattice constant in the silicon carbide layer at a plurality of measurement points in the growth direction, a difference between a maximum value of the lattice constant and a minimum value of the lattice constant is 0.004 nm or less. A distance between adjacent two points of the measurement points is 5 mm. | 09-25-2014 |
20140295171 | INGOT, SILICON CARBIDE SUBSTRATE, AND METHOD FOR PRODUCING INGOT - An ingot in which generation of crack is sufficiently suppressed is obtained. The ingot includes: a seed substrate formed of silicon carbide; and a silicon carbide layer grown on the seed substrate and containing nitrogen atoms. The silicon carbide layer has a thickness of 15 mm or more in a growth direction. In the silicon carbide layer, a concentration gradient of the nitrogen atoms in the growth direction is 5×10 | 10-02-2014 |
20140299048 | METHOD OF MANUFACTURING SILICON CARBIDE SINGLE CRYSTAL - A temperature of a source material and a temperature of a seed substrate are defined as T | 10-09-2014 |
20150255279 | SILICON CARBIDE SUBSTRATE, SILICON CARBIDE INGOT, AND METHODS FOR MANUFACTURING SILICON CARBIDE SUBSTRATE AND SILICON CARBIDE INGOT - A silicon carbide substrate, a silicon carbide ingot, and methods for manufacturing the silicon carbide substrate and the silicon carbide ingot capable of improving a yield of a semiconductor device having silicon carbide as constituent material are provided. In the silicon carbide substrate, patterns formed by crossing straight lines extending along the <11-20> direction and being observable by means of an X-ray topography are present at a number density of less than or equal to 0.1 patterns/cm | 09-10-2015 |
Patent application number | Description | Published |
20110165764 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE - A first silicon carbide substrate having a first back-side surface and a second silicon carbide substrate having a second back-side surface are prepared. The first and second silicon carbide substrates are placed so as to expose each of the first and second back-side surfaces in one direction. A connecting portion is formed to connect the first and second back-side surfaces to each other. The step of forming the connecting portion includes a step of forming a growth layer made of silicon carbide on each of the first and second back-side surfaces, using a sublimation method of supplying a sublimate thereto in the one direction. | 07-07-2011 |
20110233562 | SUBSTRATE, SUBSTRATE WITH THIN FILM, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A substrate achieving suppressed deterioration of processing accuracy of a semiconductor device due to bending of the substrate, a substrate with a thin film and a semiconductor device formed with the substrate above, and a method of manufacturing the semiconductor device above are obtained. A substrate according to the present invention has a main surface having a diameter of 2 inches or greater, a value for bow at the main surface being not smaller than −40 μm and not greater than −5 μm, and a value for warp at the main surface being not smaller than 5 μm and not greater than 40 μm. Preferably, a value for surface roughness Ra of the main surface of the substrate is not greater than 1 nm and a value for surface roughness Ra of a main surface is not greater than 100 nm. | 09-29-2011 |
20110284873 | SILICON CARBIDE SUBSTRATE - A silicon carbide substrate has a substrate region and a support portion. The substrate region has a first single crystal substrate. The support portion is joined to a first backside surface of the first single crystal. The dislocation density of the first single crystal substrate is lower than the dislocation density of the support portion. At least one of the substrate region and the support portion has voids. | 11-24-2011 |
20110306181 | METHOD OF MANUFACTURING SILICON CARBIDE SUBSTRATE - A method of manufacturing a silicon carbide substrate includes the steps of: preparing a base substrate formed of silicon carbide and a SiC substrate formed of single crystal silicon carbide; fabricating a stacked substrate by stacking the base substrate and the SiC substrate to have their main surfaces in contact with each other; heating the stacked substrate to join the base substrate and the SiC substrate and thereby fabricating a joined substrate; and heating the joined substrate such that a temperature difference is formed between the base substrate and the SiC substrate, and thereby discharging voids formed at the step of fabricating the joined substrate at an interface between the base substrate and the SiC substrate to the outside. | 12-15-2011 |
20120003811 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE - A first silicon carbide substrate has a first front-side surface and a first side surface. A second silicon carbide substrate has a second front-side surface and a second side surface. The second side surface is disposed such that a gap having an opening between the first and second front-side surfaces of the first and second silicon carbide substrates is disposed between the first side surface and the second side surface. A closing portion is provided to close the gap over the opening. By depositing sublimates from the first and second side surfaces onto the closing portion, a connecting portion is formed to connect the first and second side surfaces to each other so as to close the opening. After the step of forming the connecting portion, the closing portion is removed. | 01-05-2012 |
20120003812 | METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE - A plurality of silicon carbide substrates and a support portion are heated. A temperature of a first radiation plane facing the plurality of silicon carbide substrates in a first space extending from the plurality of silicon carbide substrates in a direction perpendicular to one plane and away from the support portion is set to a first temperature. A temperature of a second radiation plane facing the support portion in a second space extending from the support portion in a direction perpendicular to one plane and away from the plurality of silicon carbide substrates is set to a second temperature higher than the first temperature. A temperature of a third radiation plane facing the plurality of silicon carbide substrates in a third space extending from a gap among the plurality of silicon carbide substrates along one plane is set to a third temperature lower than the second temperature. | 01-05-2012 |
20120003823 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE - A combined substrate is prepared which has a supporting portion and first and second silicon carbide substrates. The first silicon carbide substrate has a first front-side surface and a first side surface. The second silicon carbide substrate has a second front-side surface and a second side surface. The second side surface is disposed such that a gap having an opening between the first and second front-side surfaces is formed between the first side surface and the second side surface. By introducing melted silicon from the opening into the gap, a silicon connecting portion is formed to connect the first and second side surfaces so as to close the opening. By carbonizing the silicon connecting portion, a silicon carbide connecting portion is formed. | 01-05-2012 |
20120006255 | METHOD OF MANUFACTURING SINGLE CRYSTAL - A seed crystal having a frontside surface and a backside surface is prepared. Surface roughness of the backside surface of the seed crystal is increased. A coating film including carbon is formed on the backside surface of the seed crystal. The coating film and a pedestal are brought into contact with each other with an adhesive interposed therebetween. The adhesive is cured to fix the seed crystal to the pedestal. A single crystal is grown on the seed crystal. Before the growth is performed, a carbon film is formed by carbonizing the coating film. | 01-12-2012 |
20120009761 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE - At least one single crystal substrate, each having a backside surface and made of silicon carbide, and a supporting portion having a main surface and made of silicon carbide, are prepared. In this preparing step, at least one of the backside surface and main surface is formed by machining. By this forming step, a surface layer having distortion in the crystal structure is formed on at least one of the backside surface and main surface. The surface layer is removed at least partially. Following this removing step, the backside surface and main surface are connected to each other. | 01-12-2012 |
20120012862 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE, SILICON CARBIDE SUBSTRATE, AND SEMICONDUCTOR DEVICE - A method for manufacturing a silicon carbide substrate includes the steps of: preparing a base substrate made of silicon carbide and a SiC substrate made of single-crystal silicon carbide; and connecting the base substrate and SiC substrate to each other by forming an intermediate layer, which is made of carbon that is a conductor, between the base substrate and the SiC substrate. | 01-19-2012 |
20120015499 | METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE - A combined substrate is prepared which has a supporting portion and first and second silicon carbide substrates. Between the first and second silicon carbide substrates, a gap having an opening exists. A closing layer for the gap is formed over the opening. The closing layer at least includes a silicon layer. In order to form a cover made of silicon carbide and closing the gap over the opening, the silicon layer is carbonized. By depositing sublimates from the first and second side surfaces of the first and second silicon carbide substrates onto the cover, a connecting portion is formed to close the opening. The cover is removed. | 01-19-2012 |
20120017826 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE - A supporting portion ( | 01-26-2012 |
20120025208 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE AND SILICON CARBIDE SUBSTRATE - A method for manufacturing a silicon carbide substrate includes the steps of: preparing a base substrate made of silicon carbide and a SiC substrate made of single-crystal silicon carbide; forming a Si film made of silicon on a main surface of the base substrate; fabricating a stacked substrate by placing the SiC substrate on and in contact with the Si film; and connecting the base substrate and the SiC substrate to each other by heating the stacked substrate to convert, into silicon carbide, at least a region making contact with the base substrate and a region making contact with the SiC substrate in the Si film. | 02-02-2012 |
20120032191 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE AND SILICON CARBIDE SUBSTRATE - A method for manufacturing a silicon carbide substrate ( | 02-09-2012 |
20120061686 | SILICON CARBIDE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SILICON CARBIDE SUBSTRATE - A silicon carbide substrate allowing reduction in cost for manufacturing a semiconductor device including a silicon carbide substrate includes a base substrate composed of silicon carbide and an SiC layer composed of single crystal silicon carbide different from the base substrate and arranged on the base substrate in contact therewith. Thus, the silicon carbide substrate | 03-15-2012 |
20120061687 | SILICON CARBIDE SUBSTRATE AND SEMICONDUCTOR DEVICE - A silicon carbide substrate, which allows for reduced resistivity in the thickness direction thereof while restraining stacking faults from being produced due to heat treatment, includes: a base layer made of silicon carbide; and a SiC layer made of single-crystal silicon carbide and disposed on one main surface of the base layer. The base layer has an impurity concentration greater than 2×10 | 03-15-2012 |
20120068195 | METHOD FOR MANUFACTURING SILICON CARBIDE SUBSTRATE AND SILICON CARBIDE SUBSTRATE - A method for manufacturing a silicon carbide substrate includes the steps of: preparing a plurality of SiC substrates each made of single-crystal silicon carbide; forming a base layer made of silicon carbide and holding the plurality of SiC substrates, which are arranged side by side when viewed in a planar view; and forming a filling portion filling a gap between the plurality of SiC substrates. | 03-22-2012 |
20120070605 | SILICON CARBIDE INGOT, SILICON CARBIDE SUBSTRATE, MANUFACTURING METHOD THEREOF, CRUCIBLE, AND SEMICONDUCTOR SUBSTRATE - An SiC ingot includes a bottom face having 4 sides; four side faces extending from the bottom face in a direction intersecting the direction of the bottom face; and a growth face connected with the side faces located at a side opposite to the bottom face. At least one of the bottom face, the side faces, and the growth face is the {0001} plane, {1-100} plane, {11-20} plane, or a plane having an inclination within 10° relative to these planes. | 03-22-2012 |
20120091472 | SILICON CARBIDE SUBSTRATE - A first circular surface is provided with a first notch portion having a first shape. A second circular surface is opposite to the first circular surface and is provided with a second notch portion having a second shape. A side surface connects the first circular surface and the second circular surface to each other. The first notch portion and the second notch portion are opposite to each other. The side surface has a first depression connecting the first notch portion and the second notch portion to each other. | 04-19-2012 |
20120112209 | SILICON CARBIDE SUBSTRATE FABRICATION METHOD, SEMICONDUCTOR DEVICE FABRICATION METHOD, SILICON CARBIDE SUBSTRATE, AND SEMICONDUCTOR DEVICE - A method of fabricating a silicon carbide substrate that can reduce the fabrication cost of a semiconductor device employing the silicon carbide substrate includes the steps of: preparing a SiC substrate made of single crystal silicon carbide; arranging a base substrate in a vessel so as to face one main face of the SiC substrate; forming a base layer made of silicon carbide so as to contact one main face of the SiC substrate by heating a base substrate to a temperature range greater than or equal to a sublimation temperature of silicon carbide constituting the base substrate. In the step of forming a base layer, a silicon generation source made of a substance including silicon is arranged in the vessel, in addition to the SiC substrate and the base substrate. | 05-10-2012 |
Patent application number | Description | Published |
20130201400 | COMMUNICATION TERMINAL AND WARNING INFORMATION RETRIEVAL METHOD - A communication terminal includes a receiver that receives a one-segment signal from a broadcasting station among plural broadcasting stations that provide terrestrial digital broadcasting, an output unit that outputs the one-segment signal received by the receiver to a user; a channel search unit that searches for a specific broadcasting station that transmits the one-segment signal including an auxiliary information signal which is likely to include warning information, among the one-segment signals which are transmitted from the corresponding broadcasting stations, and a determination unit that determines, subsequent to termination of viewing with respect to the broadcasting station which is selected by the user, whether the auxiliary information signal included in the one-segment signal received from the specific broadcasting station by the receiver includes the warning information. When the auxiliary information signal includes the warning information, the output unit outputs the warning information to the user. | 08-08-2013 |
20130225115 | COMMUNICATION TERMINAL AND INFORMATION PROVIDING METHOD - A communication terminal includes a receiver for receiving a communication signal including urgent warning information, a current location information retrieving unit that retrieves location information regarding a current location of a user, a storage unit that stores information regarding a registered point specified by the user or a communication system, a processing unit that calculates a distance between the current location and the registered point, in response to receiving by the receiving unit of the communication signal, and an information providing unit that provides to-be-provided information including, at least, the distance to the user. | 08-29-2013 |
20130309995 | COMMUNICATION TERMINAL AND WARNING INFORMATION OBTAINING METHOD - A communication terminal includes: a first receiving unit configured to receive a communication signal in a first communication system; a second receiving unit configured to receive a communication signal in a second communication system; a position information obtaining unit configured to obtain position information of a user; a mode determination unit configured to activate the second receiving unit if the position information obtaining unit obtains position information of the user in a case where the first receiving unit cannot receive a communication signal; and a user interface unit configured to provide the user with warning information extracted from the communication signal received by the second receiving unit. | 11-21-2013 |
20140220926 | COMMUNICATION TERMINAL AND WARNING INFORMATION OBTAINING METHOD - A communication terminal includes a first receiving unit configured to receive communication signals in a first communication system, a second receiving unit configured to receive communication signals in a second communication system, a monitoring mode selection unit configured to select a monitoring mode from a plurality of the monitoring modes with different cycles for activating the second receiving unit, an activation control unit configured to activate the second receiving unit according to the monitoring mode selected by the monitoring mode selection unit in the case where the first receiving unit receives communication signals including first warning information, and an interface unit configured to provide second warning information extracted from communication signals received by the second receiving unit. | 08-07-2014 |
20140223496 | MOBILE COMMUNICATION TERMINAL, MOBILE COMMUNICATION METHOD, MOBILE COMMUNICATION PROGRAM, AND RECORDING MEDIUM - A mobile communication terminal for receiving broadcasting waves of television broadcasting, the mobile communication terminal including a graph displaying unit configured to display a graph that has at least an axis of an azimuth direction in which the mobile communication terminal is facing and an axis of a reception level of the broadcasting waves at the azimuth direction and that shows the reception level currently being detected and the reception level detected in the past such that the reception level currently being detected is plotted in the central part of a screen of the mobile communication terminal, and a graph updating unit configured to update the graph according to a change of the azimuth direction in which the mobile communication terminal is facing or according to a change of the reception level. | 08-07-2014 |
20140349715 | MOBILE COMMUNICATION TERMINAL, MOBILE COMMUNICATION METHOD, MOBILE COMMUNICATION PROGRAM AND RECORDING MEDIUM - A mobile communication terminal including an antenna for receiving broadcasting waves of television broadcasting and being capable of detecting its own current location and an azimuth direction is provided, the mobile communication terminal including a broadcasting station location retaining unit configured to retain location information of a broadcasting station that transmits the broadcasting waves, a best azimuth direction calculating unit configured to, using the detected azimuth direction, calculate a best azimuth direction in which the mobile communication terminal can receive the broadcasting waves the best, an azimuth direction displaying unit configured to display a location of the broadcasting station and the best azimuth direction in the detected current location, and an azimuth direction display updating unit configured to update as needed the display by the azimuth direction displaying unit in accordance with a change of the azimuth direction of the mobile communication terminal. | 11-27-2014 |
20150026780 | HOST PROVIDING SYSTEM AND COMMUNICATION CONTROL METHOD - A host providing system includes a physical host network switch which determines permission and non-permission of communication on the basis of whether or not information pieces indicating users correlated with information indicating a transmission source and information indicating a transmission destination included in communication data from a physical instance match each other, and controls the communication data on the basis of a determination result. Accordingly, since only communication between instances of the same user is permitted, and thus communication from a physical instance is appropriately controlled, it is possible to ensure security in the system. | 01-22-2015 |
20150317174 | HOST PROVIDING SYSTEM AND HOST PROVIDING METHOD - A host providing system includes a physical host managing node which controls one or more physical servers and can manage a usage state of a physical host formed in the physical server, and thus the physical server for forming a physical host can be controlled in the system. In addition, a single physical host managing node is selected depending on instance type information included in an instance starting request from a user terminal, and the instance starting request is sent to the selected physical host managing node. Accordingly, it is possible to provide a physical instance complying with a user's request as a physical host. | 11-05-2015 |