Patent application number | Description | Published |
20140097007 | WIRING SUBSTRATE AND METHOD FOR PRODUCING THE SAME - Embodiments of the present wiring substrate include a stacked body including one or more insulation layers and one or more conductive layers, wherein the wiring substrate has a plurality of connection terminals formed on the stacked body, each connection terminal has a top surface whose area is smaller than that of each of opposite side surfaces thereof, and a filling member provided in a filling manner between the connection terminals. The top surface of each connection terminal has an area larger than that of a portion of each side surfaces portion exposed from the filling member, and a bonding layer containing a solder is formed on the top surface. | 04-10-2014 |
20140301054 | WIRING BOARD FOR HAVING LIGHT EMITTING ELEMENT MOUNTED THEREON - To provide a light emitting element mounting wiring substrate having a light emitting element mounting section on a substrate main body having a front surface and a back surface, and a confined component electrically connected to the light emitting element, such that the confine component does not obstruct the optical path of the light emitted from the light emitting element, resulting in uniform distribution of light intensity. The light emitting element mounting wiring substrate ( | 10-09-2014 |
20140318846 | WIRING SUBSTRATE AND METHOD FOR PRODUCING WIRING SUBSTRATE - A wiring substrate includes a layered structure including one or more insulating layers and one or more conductor layers; a plurality of connection terminals formed on the layered structure; a first resin layer formed on the layered structure and having (defining) a plurality of first openings through which the connection terminals are respectively exposed; and a second resin layer formed on the first resin layer and having (defining) a plurality of second openings through which the connection terminals are respectively exposed and which are smaller in opening diameter than the first openings, wherein the second resin layer has, around each of the second openings, an inclined surface which is formed such that the distance between the inclined surface and the layered structure decreases toward the second opening. | 10-30-2014 |
20150208501 | WIRING BOARD AND METHOD FOR MANUFACTURING SAME - To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layer | 07-23-2015 |
20150216059 | WIRING BOARD AND MANUFACTURING METHOD OF THE SAME - To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate that configures this wiring board includes multiple connection terminal portions and wiring conductors as a conductor layer of the outermost layer. The wiring conductors are arranged at predetermined positions, passing through between multiple connection terminal portions for flip-chip mounting a semiconductor chip. A resin insulating layer of the outermost layer of the laminate has a dam portion and a reinforcement portion. The dam portion covers the wiring conductors. The reinforcement portion is formed, between the wiring conductor and the connection terminal portion that is adjacent to the wiring conductor, lower than a height of the dam portion. The reinforcement portion is concatenated with a side surface of the dam portion. | 07-30-2015 |
20150313015 | WIRING BOARD - Provided is a wiring substrate which allows connection terminals to be disposed at high density, can increase the degree of freedom of wiring layout, and can enhance the reliability of connection of the connection terminals. A wiring substrate of the present invention includes a laminate which includes one or more insulating layers and one or more conductor layers laminated together; a wiring formed on the laminate; a columnar connection terminal which is formed directly on the wiring and is in contact with at least one of opposite side surfaces of the wiring; and a solder resist layer which covers the wiring and which exposes at least a portion of the connection terminal. The width of the wiring at a position at which the connection terminal is formed is smaller than the length of the connection terminal in the width direction. | 10-29-2015 |
20150357277 | WIRING SUBSTRATE - To provide a wiring substrate which can reliably prevent progress of cracking in a solder bump, and which exhibits improved reliability. The wiring substrate | 12-10-2015 |
20160095216 | CIRCUIT BOARD - A circuit board is provided that includes an outermost conductor layer including a plurality of terminals for flip-chip bonding and an outermost resin insulating layer defining a first opening and a second opening in an electronic-component mounting region. One of a power supply terminal and a ground terminal is exposed in the first opening. A plurality of signal terminals are exposed in the second opening. The resin insulating layer includes a reinforcing portion that defines an inner bottom surface of the second opening. A height of a portion of the terminal exposed in the first opening, the portion projecting from an inner bottom surface of the first opening, is greater than a height of portions of the terminals exposed in the second opening, the portions projecting from the inner bottom surface of the second opening. | 03-31-2016 |