Patent application number | Description | Published |
20110167998 | BALLISTIC-RESISTANT PANEL INCLUDING HIGH MODULUS ULTRA HIGH MOLECULAR WEIGHT POLYETHYLENE TAPE - A ballistic-resistant panel in which the entire panel or a strike-face portion thereof is formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape can be in the form of cross-plied laminated layers of tape strips or a woven fabric of tape strips. The strips of UHMWPE tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the cross-plied layers of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention. | 07-14-2011 |
20110197327 | CUSTOMIZABLE MILITARY HELMET SYSTEM - A helmet system that enables a user of the helmet system to customize the helmet system according to personal taste, a task at hand, responsibilities within a tactical group (e.g., communications, command, etc.), and/or according to other parameters. The customization of the helmet system may include a customization of electronics modules carried on the helmet system that optionally provide communications, environment detection, health or biometrics monitoring, power, information transmission/reception, information processing, and/or other functionalities. The customization of the helmet system may include a customization of structural components that enable the user to balance the structural protection provided to the user against other considerations. The other considerations may include, for example, weight, form factor, comfort, and/or other considerations. | 08-18-2011 |
20120266744 | Ballistic-resistant panel including high modulus ultra high molecular weight polyethylene tape - A ballistic-resistant panel in which the entire panel or a strike-face portion thereof is formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape can be in the form of cross-plied laminated layers of tape strips or a woven fabric of tape strips. The strips of UHMWPE tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the cross-plied layers of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention. | 10-25-2012 |
Patent application number | Description | Published |
20090174042 | RADIO FREQUENCY OVER-MOLDED LEADFRAME PACKAGE - An over-molded leadframe (e.g., a Quad Flat No-lead (QFN)) package capable of operating at frequencies in the range of about five gigahertz (GHz) to about 300 GHz and a method of making the over-molded leadframe package are disclosed. The over-molded leadframe package includes a capacitance lead configured to substantially reduce and/or offset the inductance created by one or more wirebonds used to connect an integrated circuit (IC) chip on the package to an input/output (I/O) lead. The IC chip is connected to the capacitance lead via one or more wirebonds, and the capacitance lead is then connected to the I/O lead via at least a second wirebond. Thus, inductance created by the one or more wirebonds on the package is substantially reduced and/or offset by the capacitance lead prior to a signal being output by the package and/or received by the IC chip. | 07-09-2009 |
20090206473 | System and Method for Integrated Waveguide Packaging - A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit (MMIC). The package may be assembled in panel form incorporating parallel manufacturing techniques. | 08-20-2009 |
20100117766 | CAPACITIVELY LOADED SPURLINE FILTER - In an exemplary embodiment, a spurline filter comprises a capacitive element connected to a spur and either a through-line of the spurline filter or ground. In another embodiment, multiple capacitive elements are connected to the spur. In an exemplary embodiment, the capacitively loaded spurline filter provides a band rejection frequency response similar to the band rejection frequency response of a similar spurline filter that does not comprise at least one capacitive element but the capacitively loaded spurline filter has half the layout area or less. In an exemplary embodiment, the spurline filter comprises capacitive elements, where the capacitive elements are configured to reduce the resonant frequency of the filter. | 05-13-2010 |
20110250861 | HIGHLY INTEGRATED, HIGH FREQUENCY, HIGH POWER OPERATION MMIC - A system and method for high frequency, high power operation communication systems is provided. More particularly, a system and method for a single system-on-chip system monolithic microwave integrated circuit that provides both high-frequency performance at a low cost is provided. | 10-13-2011 |
20120139099 | SYSTEM AND METHOD FOR INTEGRATED WAVEGUIDE PACKAGING - A millimeter wave integrated waveguide interface package device may comprise: (1) a package comprising a printed wiring board (PWB) and a monolithic microwave integrate circuit (MMIC), wherein the MMIC is in communication with the PWB; and (2) a waveguide interface integrated with the package. The package may be adapted to operate at high frequency and high power, where high frequency includes frequencies greater than about 5 GHz, and high power includes power greater than about 0.5 W. | 06-07-2012 |
20140049307 | CIRCUITS AND METHODS FOR SHARING BIAS CURRENT - The present disclosure includes systems and methods for sharing bias current. In one embodiment, shared bias current passes through a first level device to one or more second level devices along a bias current path. Multiple active devices may share bias current along a bias current path and process signal along the same or different signal paths. In one embodiment, bias current from one device is split among multiple devices. In another embodiment, bias current is combined from multiple devices into a device. Embodiments may include an interstage circuit along a signal path that improves stability of the circuit. | 02-20-2014 |
20140183710 | LEADFRAME PACKAGE WITH INTEGRATED PARTIAL WAVEGUIDE INTERFACE - A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers. | 07-03-2014 |