Patent application number | Description | Published |
20090159313 | CURABLE EPOXY RESIN COMPOSITION AND LAMINATES MADE THEREFROM - A curable halogen-containing epoxy resin composition comprising: (a) at least one epoxy resin; (b) at least one hardener; wherein the hardener is a compound containing a phenolic hydroxyl functionality or a compound capable of generating a phenolic hydroxyl functionality upon heating; (c) a catalytic amount of a nitrogen-containing catalyst; (d) a non-nitrogen containing catalyst adjuvant compound capable of reducing the concentration of the nitrogen-containing catalyst; wherein at least one of the above components (a)-(d) is halogenated or wherein the resin composition includes (e) a halogenated flame retardant compound. The stroke cure gel time of the resin composition is maintained from 90 seconds to 600 seconds when measured at | 06-25-2009 |
20090321117 | A CURABLE EPOXY RESIN COMPOSITION HAVING A MIXED CATALYST SYSTEM AND LAMINATES MADE THEREFROM - A curable halogen-containing epoxy resin composition comprising: (a) at least one epoxy resin; (b) at least one hardener; wherein the hardener is a compound containing a phenolic hydroxyl functionality or a compound capable of generating a phenolic hydroxyl functionality upon heating; and (c) a catalytic amount of a catalyst system comprising a combination of: (i) at least a first catalyst compound comprising at least one nitrogen-containing catalyst compound; and (ii) at least a second catalyst compound comprising at least one phosphorus-containing catalyst compound; wherein at least one or more of the above components (a)-(c) is halogenated or contains halogen; or if none of the above components are halogenated wherein the resin composition includes (d) a halogenated or halogen-containing flame retardant compound that does not contain nitrogen. The stroke cure gel time of the resin composition is maintained from 90 seconds to 600 seconds when measured at 170° C.; and the cured product formed by curing the curable epoxy resin composition contains well-balanced properties. The composition may be used to obtain a prepreg or a metal-coated foil, or a laminate by laminating the above prepreg and/or the above metal-coated foil. The laminate shows a combination of superior glass transition temperature, decomposition temperature, time to delamination at 288° C., adhesion to copper foil, and excellent flame retardancy. | 12-31-2009 |
20100068958 | CURABLE EPOXY RESIN COMPOSITIONS HAVING IMPROVED ADHESION TO METAL SUBSTRATES AND PROCESSES FOR MAKING AND USING THE SAME - Thermosettable compositions are described having improved adhesion to metal substrates when cured comprising (a) at least one curable epoxy resin; (b) at least one hardener, each hardener having less than 1 primary amine group per molecule and not more than 1 secondary amine group per molecule, the hardener(s) comprising at least one polyhydroxy hydrocarbon, hydrocarbon capable of generating multiple hydroxy groups per molecule during curing of the thermosettable material, or poly(acid anhydride)hydrocarbon other than a blend of (1) a copolymer of an ethylenically unsaturated anhydride and a vinyl compound and (2) a copolymer of an ethylenically unsaturated anhydride and an elastomer, and (c) at least one triblock copolymer comprising at least one elastomeric block and at least one acrylic block. Processes for making a coated article, a fiber-reinforced composite article, prepregs and laminates using the thermosettable compositions are also described, which are useful for making coated articles, fiber-reinforced composites, prepregs, laminates and printed wiring boards. | 03-18-2010 |
20100193725 | THERMOSET DAMPENER MATERIAL - Thermoset compositions useful for dampening vibrations at elevated temperatures are disclosed. The thermoset compositions may have a glass transition temperature of 1500 C or greater, a tan δ peak of 0.2 or greater, and a tan δ peak width measured at half-height larger than about 400 C, each as measured by dynamic mechanical thermal analysis (DMTA) at a frequency of 1 Hz. The thermoset compositions may be used to dampen vibrations at temperatures in excess of 100° C. | 08-05-2010 |
20100311891 | THERMOSETTING COMPOSITIONS COMPRISING SILICONE POLYETHERS, THEIR MANUFACTURE, AND USES - Thermosetting compositions comprising (a) at least a first thermosetting resin, and (b) at least one silicone polyether, methods of making such thermosetting compositions, and thermoset products made from the compositions. | 12-09-2010 |
20110037028 | FLAME RETARDANT COMPOSITION - A curable epoxy resin composition comprising at least one oxazolidone-modified epoxy resin which is the reaction product of an epoxy resin and an isocyanate, at least one maleimide, at least one cyanate ester, and optionally at least one non-oxazolidone containing epoxy resin, wherein at least one component of the composition comprises halogen or phosphorous to provide flame retardancy to the cured composition, a method of making the composition and methods of making a prepreg and an electrical laminate using the composition. | 02-17-2011 |
20110077328 | USE OF FILLER THAT UNDERGOES ENDOTHERMIC PHASE TRANSITION TO LOWER THE REACTION EXOTHERM OF EPOXY BASED COMPOSITIONS - Disclosed are curable epoxy-based resins having a lower peak exotherm during cure, as well as thermoset resins and epoxy-based parts formed from the curable epoxy-based compositions. The epoxy-based compositions having a lower peak exotherm during cure may include: at least one epoxy resin, at least one hardener, and at least one endothermic transition additive. The thermoset resin may include the reaction product of the curable epoxy-based resins having a lower peak exotherm during cure, which may be useful when forming large epoxy-based parts, such as those including 200 grams or more of the thermoset resin. Also disclosed is a process for forming curable epoxy-based resins having a lower peak exotherm during cure, including: admixing at least one epoxy resin; at least one hardener; and at least one endothermic transition additive; to form a curable composition. The resulting curable composition may then be thermally cured at a temperature of at least 60° C. to form a thermoset resin. | 03-31-2011 |
Patent application number | Description | Published |
20100281964 | DEVICE AND METHOD FOR ASSESSING THE MACHINABILITY OF LAMINATES - A device and method for assessing the machinability, particularly the drillability, of epoxy resin laminates by reproducible indentation and analysis of the delamination area of a laminate sample thus provoked. | 11-11-2010 |
20110009527 | THERMOSETTING COMPOSITIONS COMPRISING SILICONE POLYETHERS, THEIR MANUFACTURE, AND USES - Thermosetting compositions comprising a) at least a first thermosetting resin, b) at least one silicone polyether, and c) at least one filler or fibrous reinforcement, methods of making such thermosetting compositions, and thermoset products made from the compositions. | 01-13-2011 |
20110257299 | METAL STABILIZERS FOR EPOXY RESINS - A composition comprising: a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, wherein the composition is prepared from a halogen-containing compound is disclosed. | 10-20-2011 |
20110263754 | METALLIC COMPOUNDS IN NON-BROMINATED FLAME RETARDANT EPOXY RESINS - A composition comprising a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the Group 11-13 metals and combinations thereof, and wherein said composition contains a non-halogen flame retardant is disclosed. | 10-27-2011 |
20110319515 | DIVINYLARENE DIOXIDE RESIN COMPOSITIONS - A curable divinylarene dioxide resin composition including (a) at least one divinylarene dioxide, (b) at least one cationic photoinitiator, and (c) optionally, at least one pigment material; a process for making the curable divinylarene dioxide resin composition; and a cured divinylarene dioxide resin composition made therefrom. The cured product made from the above curable divinylarene dioxide resin composition offers improved properties and are useful for various applications including ink formulations. | 12-29-2011 |
20110319523 | THERMOSETTABLE COMPOSITION CONTAINING A COMBINATION OF AN AMPHIPHILIC BLOCK COPOLYMER AND A POLYOL AND A THERMOSET PRODUCT THEREFROM - A thermosettable composition including (a) at least an amphophilic block copolymer, (b) at least a polyol, (c) at least an epoxy resin containing an average at least 2 oxirane rings per molecule, (d) at least an anhydride hardener containing an average at least 1 anhydride ring per molecule, and (e) at least a catalyst; and a thermoset product prepared from said thermosettable composition. | 12-29-2011 |
20120041170 | REACTIVE INORGANIC CLUSTERS - Storage-stable reactive inorganic clusters and a process for preparing such storage-stable reactive inorganic clusters (e.g., silica structures) having, for example, reactive amino groups. The storage-stable reactive inorganic clusters may be used as a curing agent for thermosetting resin compositions such as epoxy resins. | 02-16-2012 |
20120046391 | ANISOTROPIC COMPOSITE - A thermosettable composition including: (a) at least one thermosetting resin; (b) at least one curing agent for the at least one thermosetting resin; (c) at least one high aspect ratio filler; wherein the aspect ratio of the filler is higher than 5:1; and (d) optionally, at least one catalyst for polymerization, including homopolymerization, of the at least one thermosetting resin; or optionally, at least one catalyst for a reaction between the at least one thermosetting resin and the at least one curing agent. | 02-23-2012 |
20120136092 | THERMOSETTABLE RESIN COMPOSITIONS - A reactive thermosettable resin composition including (a) at least one thermosetting resin; (b) at least one curing agent, and (c) optionally, at least one catalyst; wherein the curing agent (b) comprises a reactive inorganic cluster; and wherein the clusters are storage-stable inorganic clusters with reactive functional groups, such as amino groups; a process for preparing a thermoset product from the thermosettable composition. A composition of the reactive clusters as a curing agent and a thermosetting resin may be used to prepare thermoset products with improved thermo-mechanical behavior. | 05-31-2012 |
20120196955 | ANISOTROPIC COMPOSITE - A thermosettable composition including: (a) at least one thermosetting resin; (b) at least one curing agent for the at least one thermosetting resin; (c) at least one high aspect ratio filler; wherein the aspect ratio of the filler is higher than 5:1; and (d) optionally, at least one catalyst for polymerization, including homopolymerization, of the at least one thermosetting resin; or optionally, at least one catalyst for a reaction between the at least one thermosetting resin and the at least one curing agent. | 08-02-2012 |
20120283356 | THERMOSETTABLE RESIN COMPOSITIONS - A reactive thermosettable resin composition including (a) at least one thermosetting resin; (b) at least one curing agent, and (c) optionally, at least one catalyst; wherein the curing agent (b) comprises a reactive inorganic cluster; and wherein the clusters are storage-stable inorganic clusters with reactive functional groups, such as amino groups; a process for preparing a thermoset product from the thermosettable composition. A composition of the reactive clusters as a curing agent and a thermosetting resin may be used to prepare thermoset products with improved thermo-mechanical behavior. | 11-08-2012 |
20130090407 | CURABLE RESIN COMPOSITIONS - A photocationically-curable composition including (a) at least one divinylarene dioxide, (b) at least one cationic photoinitiator, and (c) at least one cyclic ester compound; a process for making the curable composition; and a cured product made therefrom. The cured product made from the above curable composition offers improved properties and are useful for various applications including ink formulations. | 04-11-2013 |
20130178558 | THERMOSET DAMPENER MATERIAL - Thermoset compositions useful for dampening vibrations at elevated temperatures are disclosed. The thermoset compositions may have a glass transition temperature of 150° C. or greater, a tan δ peak of 0.2 or greater, and a tan δ peak width measured at half-height larger than about 40° C., as measured by dynamic thermo-mechanical analysis (DMTA) at a frequency of 1 Hz. The thermoset compositions may be used to dampen vibrations at temperatures in excess of 100° C. | 07-11-2013 |
20140186536 | CURABLE RESIN COMPOSITIONS - A curable epoxy resin composition including (a) at least one epoxy resin; and (b) at least one hardener; wherein the curable epoxy resin composition has at least two exotherm peaks representing at least two distinct chemical reactions and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable epoxy resin composition of being B-staged. | 07-03-2014 |
20140212582 | CURABLE RESIN COMPOSITIONS - A solvent-free curable epoxy resin composition including (a) at least one divinylarene dioxide; and (b) at least one hardener; wherein the solvent-free curable epoxy resin composition is substantially free of solvent and has at least two exotherm peaks and wherein the exothermic peak difference of the two exotherm peaks is sufficient to allow the curable solvent-free epoxy resin composition of being B-staged. | 07-31-2014 |
20140316068 | BIMODAL TOUGHENING AGENTS FOR THERMOSETTABLE EPOXY RESIN COMPOSITIONS - A bimodal toughening agent comprising a) a first preformed coreshell toughening agent and b) a second preformed coreshell toughening agent wherein the second preformed coreshell toughening agent has a particle size of at least two times larger than that of the first preformed coreshell toughening agent, and the use of the bimodal toughening agent in a thermosettable epoxy resin composition, is disclosed. | 10-23-2014 |