Patent application number | Description | Published |
20160064977 | USB CHARGER, MOBILE TERMINAL AND CHARGING METHOD THEREOF - A USB charger, a mobile terminal, and a charging method are provided. The USB charger for charging a mobile terminal, includes a first logic control unit through which bidirectional communication is established between the USB charger and the mobile terminal, wherein the first logic control unit is configured to: send, to the mobile terminal, a first signal which includes a maximum output capability of the USB charger; receive, from the mobile terminal, a second signal which indicates magnitude of a voltage requested by the mobile terminal; and adjust a voltage output from the USB charger to be consistent with the voltage requested by the mobile terminal. Accordingly, the USB charger and the mobile terminal can communicate with each other through a single signal wire. Thus, the voltage output from the USB charger can be intelligently controlled, so as to charge the mobile terminal in a fast, safe, and simply way. | 03-03-2016 |
20160064978 | USB CHARGER, MOBILE TERMINAL AND CHARGING METHOD THEREOF - A USB charger, a mobile terminal, and a charging method are provided. The USB charger for charging a mobile terminal, includes a first logic control unit through which bidirectional communication is established between the USB charger and the mobile terminal, wherein the first logic control unit is configured to: send, to the mobile terminal, a first signal which indicates a maximum output capability of the USB charger; receive, from the mobile terminal, a second signal which indicates magnitude of a voltage requested by the mobile terminal; adjust a voltage output from the USB charger to be consistent with the voltage requested by the mobile terminal; and transmit a clock signal between the mobile terminal. Accordingly, the USB charger and the mobile terminal can communicate through two single signal wires by way of pulse signals. Thus, the mobile terminal is charged in a fast, safe, and simply way. | 03-03-2016 |
Patent application number | Description | Published |
20110166861 | METHOD AND APPARATUS FOR SYNTHESIZING A SPEECH WITH INFORMATION - According to one embodiment, an apparatus for synthesizing a speech, comprises an inputting unit configured to input a text sentence, a text analysis unit configured to analyze the text sentence so as to extract linguistic information, a parameter generation unit configured to generate a speech parameter by using the linguistic information and a pre-trained statistical parameter model, an embedding unit configured to embed information into the speech parameter, and a speech synthesis unit configured to synthesize the speech parameter with the information embedded by the embedding unit into a speech with the information. | 07-07-2011 |
20110320199 | METHOD AND APPARATUS FOR FUSING VOICED PHONEME UNITS IN TEXT-TO-SPEECH - According to one embodiment, an apparatus for fusing voiced phoneme units in Text-To-Speech, includes a reference unit selection module configured to select a reference unit from the plurality of units based on pitch cycle information of the each unit and the number of pitch cycles of the target segment. The apparatus includes a template creation module configured to create a template based on the reference unit selected by the reference unit selection module and the number of pitch cycles of the target segment, wherein the number of pitch cycles of the template is same with that of pitch cycles of the target segment. The apparatus includes a pitch cycle alignment module configured to align pitch cycles of each unit of the plurality of units except the reference unit with pitch cycles of the template by using a dynamic programming algorithm. | 12-29-2011 |
20130262105 | DYNAMIC LONG-DISTANCE DEPENDENCY WITH CONDITIONAL RANDOM FIELDS - Dynamic features are utilized with CRFs to handle long-distance dependencies of output labels. The dynamic features present a probability distribution involved in explicit distance from/to a special output label that is pre-defined according to each application scenario. Besides the number of units in the segment (from the previous special output label to the current unit), the dynamic features may also include the sum of any basic features of units in the segment. Since the added dynamic features are involved in the distance from the previous specific label, the searching lattice associated with Viterbi searching is expanded to distinguish the nodes with various distances. The dynamic features may be used in a variety of different applications, such as Natural Language Processing, Text-To-Speech and Automatic Speech Recognition. For example, the dynamic features may be used to assist in prosodic break and pause prediction. | 10-03-2013 |
20150243275 | VOICE FONT SPEAKER AND PROSODY INTERPOLATION - Multi-voice font interpolation is provided. A multi-voice font interpolation engine allows the production of computer generated speech with a wide variety of speaker characteristics and/or prosody by interpolating speaker characteristics and prosody from existing fonts. Using prediction models from multiple voice fonts, the multi-voice font interpolation engine predicts values for the parameters that influence speaker characteristics and/or prosody for the phoneme sequence obtained from the text to spoken. For each parameter, additional parameter values are generated by a weighted interpolation from the predicted values. Modifying an existing voice font with the interpolated parameters changes the style and/or emotion of the speech while retaining the base sound qualities of the original voice. The multi-voice font interpolation engine allows the speaker characteristics and/or prosody to be transplanted from one voice font to another or entirely new speaker characteristics and/or prosody to be generated for an existing voice font. | 08-27-2015 |
20160078859 | TEXT-TO-SPEECH WITH EMOTIONAL CONTENT - Techniques for converting text to speech having emotional content. In an aspect, an emotionally neutral acoustic trajectory is predicted for a script using a neutral model, and an emotion-specific acoustic trajectory adjustment is independently predicted using an emotion-specific model. The neutral trajectory and emotion-specific adjustments are combined to generate a transformed speech output having emotional content. In another aspect, state parameters of a statistical parametric model for neutral voice are transformed by emotion-specific factors that vary across contexts and states. The emotion-dependent adjustment factors may be clustered and stored using an emotion-specific decision tree or other clustering scheme distinct from a decision tree used for the neutral voice model. | 03-17-2016 |
Patent application number | Description | Published |
20100140810 | CHIP PACKAGE WITH COPLANARITY CONTROLLING FEATURE - A chip package includes a substrate, an integrated circuit proximate a top surface of the substrate, and a cap comprising encapsulant that encapsulates the integrated circuit on at least a portion of the top surface of the substrate. The chip package further includes at least one extension feature positioned on at least a portion of the top surface of the substrate. The at least one extension feature also comprises the encapsulant and extends from the cap to a perimeter of the substrate. | 06-10-2010 |
20100148347 | CHIP SCALE PACKAGE STRUCTURE WITH CAN ATTACHMENT - A chip scale package (CSP) device includes a CSP having a semiconductor die electrically coupled to a plurality of solder balls. A can having an inside top surface and one or more side walls defines a chamber. The CSP is housed in the chamber and is attached to the inside top surface of the can. A printed circuit board is attached to the solder balls and to the one or more side walls to provide support to the CSP and to the can. The CSP may be a Wafer-Level CSP. The can may be built from a metallic substance or from a non-metallic substance. The can provides stress relief to the CSP during a drop test and during a thermal cycle test. | 06-17-2010 |
20100148363 | STEP CAVITY FOR ENHANCED DROP TEST PERFORMANCE IN BALL GRID ARRAY PACKAGE - A ball grid array (BGA) package includes a substrate layer having first and second sides. A semiconductor chip is attached to the first side of the substrate layer by a dielectric adhesive layer. A plurality of solder balls are attached to the second side of the substrate layer. The solder balls may be set out by rows and columns. A plurality of wires electrically connect the semiconductor chip to the solder balls. A layer of encapsulating compound is deposited over the semiconductor chip. A step cavity of a selected depth and shape is formed in the layer of encapsulating compound at or near the edge or periphery of the layer of encapsulating compound. The step cavity is separated from the solder balls by the substrate layer but spans over a plurality of selected solder balls. | 06-17-2010 |
20100297813 | Semiconductor package with position member - The present disclosure provides a very thin semiconductor package including a leadframe with a die-attach pad and a plurality of lead terminals, a die attached to the die-attach pad and electrically connected to the lead terminals via bonding wires, a position member disposed upon the die and/or die-attach pad, and a molding material encapsulating the leadframe, the die, and the position member together to form the semiconductor package. The method for manufacturing a very thin semiconductor package includes disposing a first position member on one side of the die-attach pad of a leadframe, attaching a die onto the opposite side of the die-attach pad, optionally disposing a second position member on top of the die, electrically connecting the die to the lead terminals of the leadframe, and encapsulating the leadframe, the die, and the position member(s) together to form the very thin semiconductor package. | 11-25-2010 |
20100327421 | IC PACKAGE DESIGN WITH STRESS RELIEF FEATURE - A protective structure is provided on a substrate to which a semiconductor die is attached. The protective structure surrounds the die and reduces the thermo-mechanical stresses to which the die is subject. The die is protected against cracking, warping, and delamination. | 12-30-2010 |
20110018125 | SEMICONDUCTOR PACKAGE WITH A STIFFENING MEMBER SUPPORTING A THERMAL HEAT SPREADER - A semiconductor package includes a substrate board and a semiconductor die attached to a top surface of that substrate board. A heat spreader is provided over the semiconductor die. A stiffening ring is positioned surrounding the semiconductor die, the stiffening ring being attached to the top surface of the substrate board and attached to a bottom surface of the plate portion of the heat spreader. Space is left on the board outside of the stiffening ring to support the installation of passive components to the substrate board. An external ring may be included, with that external ring being interconnected to the stiffening ring by a set of tie bars. Alternatively, the heat spreader includes an integrally formed peripheral sidewall portion. | 01-27-2011 |
20110156240 | RELIABLE LARGE DIE FAN-OUT WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE - A fan-out wafer level package includes a semiconductor die with contact pads positioned on a top surface. A fan-in redistribution layer positioned over the die includes contact pads in electrical communication with the first contact pads of the die. A buffer layer positioned over the fan-in layer includes a plurality of vias, in electrical contact with the contact pads of the fan-in layer. A fan-in redistribution layer is positioned over the buffer layer and includes contact pads on a surface opposite the buffer layer, in electrical communication with the vias. The semiconductor die, fan-in layer, and buffer layer are encapsulated in a molding com-pound layer. Solder contacts, for electrically connecting the semiconductor device to a electronic circuit board, are positioned on contact pads of the fan-out layer. The buffer layer has a substantial thickness, to reduce and distribute shear stresses resulting from thermal mismatch of coefficients of thermal expansion of the semiconductor die and a circuit board. | 06-30-2011 |
20110156250 | FLIP-CHIP FAN-OUT WAFER LEVEL PACKAGE FOR PACKAGE-ON-PACKAGE APPLICATIONS, AND METHOD OF MANUFACTURE - A flip-chip fan-out wafer level package for package-on-package applications includes a semiconductor die with solder bumps on an upper surface in a flip chip configuration. The die is inverted, with an upper surface facing an upper side of a redistribution layer, with the solder bumps in electrical contact with respective chip contact pads of the redistribution layer. The redistribution layer includes conductive traces that place each of the solder bumps in electrical contact with one or both of one of a plurality of upper redistribution contact pads and one of a plurality of lower redistribution contact pads. Each of the plurality of upper redistribution contact pads has an upper solder ball in electrical contact therewith. The die and the upper solder balls are at least partially encapsulated in a layer of mold compound positioned on the upper surface of the redistribution layer, and whose lateral dimensions are defined by the lateral dimensions of the redistribution layer. The layer of mold compound has a back-ground surface at which a portion of each of the upper solder balls is exposed, for electrical contact with an upper package. Each of the lower redistribution contact pads has a lower solder ball a coupled thereto. | 06-30-2011 |
20110157452 | FAN-OUT WAFER LEVEL PACKAGE FOR AN OPTICAL SENSOR AND METHOD OF MANUFACTURE THEREOF - An optical sensor package has a transparent substrate with a redistribution layer formed on a face thereof, which includes a window and a plurality of electrically conductive traces. A semiconductor substrate, including an optical sensor and a plurality of contact terminals on a face thereof, is positioned on the transparent substrate in a face-to-face arrangement, with the optical sensor directly opposite the window, and with each of the contact terminals electrically coupled to a respective one of the electrically conductive terminals. The transparent substrate has larger overall dimensions than the semiconductor substrate, so that one or more edges of the transparent substrate extend beyond the corresponding edges of the semiconductor substrate. A plurality of solder balls are positioned on the face of the transparent substrate, each in electrical contact with a respective one of the electrically conductive terminals. The solder balls and the semiconductor substrate are at least partially encapsulated in an encapsulating layer formed on the face of the transparent substrate, which has been planarized to expose upper portions of the solder balls, as contact pads of the optical sensor package. | 06-30-2011 |
20120074592 | WAFER-LEVEL PACKAGING METHOD USING COMPOSITE MATERIAL AS A BASE - An electronic package that includes a composite material base. In one embodiment the electronic package is an expanded wafer-level package. The composite material base is composed of woven strands and polymer material. In one embodiment the composite material base is composed of woven fiberglass strands and an epoxy material. In various embodiments the package includes an electronic circuitry layer on one or another face of the composite material base. In other embodiments conductive vias connect the circuitry layers, including a redistribution layer. In yet another embodiment an electronic package is mounted on the composite material base and electrically couples to the circuit of the expanded wafer-level package. The package having the composite material base is mechanically stronger and can be made thinner than a package that relies on an encapsulant material for structure, and resists cracking. | 03-29-2012 |
20120105713 | LOW PROFILE CHIP SCALE MODULE AND METHOD OF PRODUCING THE SAME - A low profile chip scale module and method of making of the same. The low profile chip scale module includes embedded SMD and integrated EM shielding. An adhesive layer is arranged on a substrate, e.g., chip carrier. Dies and SMDs are arranged on the adhesive layer. An etched frame and molding is attached to the substrate. Inputs/outputs (I/O) are formed and the substrate is coated with a dielectric material. Metal lines and connections among bond pads are formed and another layer of dielectric material is applied as a protective layer. The substrate is cut into various predetermined sizes and a lens is attached to form the chip scale module. | 05-03-2012 |
20120162788 | LENS ALIGNMENT APPARATUS AND METHOD - Lens alignment apparatuses, methods and optical devices are disclosed. In accordance with various embodiments, a lens alignment apparatus may include at least one lens element positioned in a lens body. A lens alignment interface coupled to the lens element may be configured to permit the lens element to be angularly deflected relative to an axis of symmetry of the lens body. In other embodiments, a method of improving the resolution of an optical device may include translating a lens along an optical axis to maximize resolution at a first location, and determining a resolution in a second location in the imaging plane. The resolution in the second location may be improved by angularly deflecting the lens, and the position of the lens may then be fixed. | 06-28-2012 |
20120168888 | IMAGE SENSOR CIRCUIT, SYSTEM, AND METHOD - A process of forming optical sensors includes sealing an imaging portion of each of a plurality of optical sensors on a sensor wafer with a transparent material. The operation of sealing leaves a bonding portion of each of the optical sensors exposed. The process further includes cutting the wafer into a plurality of image sensor dies after sealing the optical sensors such that each image sensor die includes one of the optical sensors sealed with a corresponding portion of the transparent material. | 07-05-2012 |
20120178213 | CHIP SCALE PACKAGE STRUCTURE WITH CAN ATTACHMENT - A chip scale package (CSP) device includes a CSP having a semiconductor die electrically coupled to a plurality of solder balls. A can having an inside top surface and one or more side walls defines a chamber. The CSP is housed in the chamber and is attached to the inside top surface of the can. A printed circuit board is attached to the solder balls and to the one or more side walls to provide support to the CSP and to the can. The CSP may be a Wafer-Level CSP. The can may be built from a metallic substance or from a non-metallic substance. The can provides stress relief to the CSP during a drop test and during a thermal cycle test. | 07-12-2012 |
20130170164 | ADHESIVE DAM - On a circuit substrate on which an adhesive is used to couple electronic or structural components to the substrate, an adhesive dam is positioned to prevent the adhesive from interfering with the operation of the circuit. A contact pad can be provided at a selected location and with a selected shape, and solder deposited on the pad, then reflowed to form the dam. The dam can be a structure soldered to a contact pad, or the dam can be supported at its ends by another structure of the device, so that, at the location where it functions to contain the adhesive, it is not attached to the substrate. | 07-04-2013 |
Patent application number | Description | Published |
20130009326 | MANUFACTURING METHOD OF CHIP PACKAGE WITH COPLANARITY CONTROLLING FEATURE - A chip package includes a substrate, an integrated circuit proximate a top surface of the substrate, and a cap comprising encapsulant that encapsulates the integrated circuit on at least a portion of the top surface of the substrate. The chip package further includes at least one extension feature positioned on at least a portion of the top surface of the substrate. The at least one extension feature also comprises the encapsulant and extends from the cap to a perimeter of the substrate. | 01-10-2013 |
20130320471 | WAFER LEVEL OPTICAL SENSOR PACKAGE AND LOW PROFILE CAMERA MODULE, AND METHOD OF MANUFACTURE - A wafer-level camera sensor package includes a semiconductor substrate with an optical sensor on a front surface. Through-silicon-vias (TSV) extend through the substrate and provide I/O contact with the sensor from the back side of the substrate. A glass cover is positioned over the front surface, and the cover and substrate are embedded in a molding compound layer (MCL), the front surface of the MCL lying coplanar with the front of the cover, and the back surface lying coplanar with the back of the substrate. Surface-mount devices, electromagnetic shielding, and through-wafer-connectors can be embedded in the MCL. A redistribution layer on the back surface of the MCL includes bottom contact pads for mounting the package, and conductive traces interconnecting the contact pads, TSVs, surface-mount devices, shielding, and through-wafer-connectors. Anisotropic conductive adhesive is positioned on the front of the MCL for physically and electrically attaching a lens array. | 12-05-2013 |
20140092297 | IMAGING DEVICE WITH ADHESIVE FILLING OPENINGS AND RELATED METHODS - An imaging device may include a housing, an image sensor IC in the housing, a lens adjacent the image sensor IC, and a cap over the lens and having an adhesive filling opening therein. The cap, the housing, and the lens may define an adhesive receiving cavity therein and in communication with the adhesive filling opening. The imaging device may also include adhesive material within the adhesive receiving cavity touching the cap, the housing, and the lens. | 04-03-2014 |
20140184809 | IMAGE SENSOR DEVICE WITH ALIGNED IR FILTER AND DIELECTRIC LAYER AND RELATED METHODS - An image sensor device may include an interconnect layer, an image sensor IC adjacent the interconnect layer and having an image sensing surface, and a dielectric layer adjacent the image sensor IC and having an opening therein aligned with the image sensing surface. The image sensor device may also include an IR filter adjacent and aligned with the image sensing surface, and an encapsulation material adjacent the dielectric layer and laterally surrounding the IR filter. | 07-03-2014 |
20140319548 | PROXIMITY DETECTOR DEVICE WITH INTERCONNECT LAYERS AND RELATED METHODS - A proximity detector device may include a first interconnect layer including a first dielectric layer, and first electrically conductive traces carried thereby, an IC layer above the first interconnect layer and having an image sensor IC, and a light source IC laterally spaced from the image sensor IC. The proximity detector device may include a second interconnect layer above the IC layer and having a second dielectric layer, and second electrically conductive traces carried thereby. The second interconnect layer may have first and second openings therein respectively aligned with the image sensor IC and the light source IC. Each of the image sensor IC and the light source IC may be coupled to the first and second electrically conductive traces. The proximity detector device may include a lens assembly above the second interconnect layer and having first and second lenses respectively aligned with the first and second openings. | 10-30-2014 |
20150029384 | IMAGE DETECTOR WITH LENS ASSEMBLY AND RELATED METHODS - An electronic device may include a substrate, an image sensor IC over the substrate, and a lens assembly above the substrate. The lens assembly may include a spacer above the substrate, a first adhesive layer over the spacer, a lens aligned with the image sensor IC and over the first adhesive layer, a second adhesive layer surrounding a peripheral surface of the lens and the first adhesive layer, and a baffle over the lens and the second adhesive layer. | 01-29-2015 |
20150145110 | LEADLESS SURFACE MOUNT ASSEMBLY PACKAGE AND METHOD OF MANUFACTURING THE SAME - Embodiments of the present disclosure relate to a leadless surface mount assembly package, an electronic device, and a method for forming a surface mount assembly package, which package comprising: a first lead; a second lead; a chip fixed on an upper surface of the first lead; a clip coupled to the second lead, a lower surface of the clip being fixed to an upper surface of the chip. The surface mount assembly package further comprises a molding compound for molding the first lead, the second lead, the chip, and the clip, wherein ends of the first lead and the second lead are only exposed from the molding compound, without outward extending from the molding compound. By using the embodiments of the present disclosure, costs can be saved and processing flow can be simplified, and a new-model leadless surface mount assembly package is obtained. | 05-28-2015 |
20150155215 | ELECTRONIC DEVICE WITH FIRST AND SECOND CONTACT PADS AND RELATED METHODS - An electronic device may include leads, an IC having first and second bond pads, and an encapsulation material adjacent the leads and the IC so the leads extend to a bottom surface of the encapsulation material defining first contact pads. The electronic device may include bond wires between the first bond pads and corresponding ones of the leads, and conductors extending from corresponding ones of the second bond pads to the bottom surface of the encapsulation material defining second contact pads. | 06-04-2015 |
20150183637 | COMPACT ELECTRONIC PACKAGE WITH MEMS IC AND RELATED METHODS - An electronic device may include first and second laterally spaced apart interconnect substrates defining a slotted opening, and a first IC in the slotted opening and electrically coupled to one or more of the first and second interconnect substrates. The electronic device may include a first other IC over the first IC and electrically coupled to one or more of the first and second interconnect substrates, and encapsulation material over the first and second interconnect substrates, the first IC, and the first other IC. | 07-02-2015 |
20150380454 | CAMERA MODULE AND METHOD OF MANUFACTURING THE SAME - Embodiments of the present invention provide a camera module and a method of manufacturing the same, the camera module comprising a sensor assembly, at least one semiconductor substrate, and a molding compound; wherein the sensor assembly comprises a semiconductor die, a sensor circuit disposed on the top surface of the semiconductor die, and a transparent cover coupled to the semiconductor die over the top surface of the semiconductor die; wherein each semiconductor substrate is disposed around the sensor assembly in a horizontal direction; and wherein the molding compound is filled between each semiconductor substrate and the sensor assembly. | 12-31-2015 |
20160104656 | ELECTRONIC DEVICE WITH REDISTRIBUTION LAYER AND STIFFENERS AND RELATED METHODS - An electronic device may include an integrated circuit (IC), electrically conductive connectors coupled to the IC, and a heat sink layer adjacent the IC and opposite the electrically conductive connectors. The electronic device may include an encapsulation material surrounding the IC and the electrically conductive connectors, a redistribution layer having electrically conductive traces coupled to the electrically conductive connectors, a stiffener between the heat sink layer and the redistribution layer, and a fan-out component between the heat sink layer and the redistribution layer and being in the encapsulation material. | 04-14-2016 |
20160104737 | IMAGE SENSOR DEVICE WITH FLEXIBLE INTERCONNECT LAYER AND RELATED METHODS - An image sensor device may include an interconnect layer having an opening extending therethrough, an image sensor IC within the opening and having an image sensing surface, and an IR filter aligned with the image sensing surface. The image sensor device may include an encapsulation material laterally surrounding the image sensor IC and filling the opening, and a flexible interconnect layer coupled to the interconnect layer opposite the image sensing surface. | 04-14-2016 |
20160104738 | IMAGE SENSING DEVICE WITH INTERCONNECT LAYER GAP AND RELATED METHODS - An image sensing device may include an interconnect layer, an image sensor IC coupled to the interconnect layer and having an image sensing surface, and an IR filter aligned with the image sensing surface opposite the interconnect layer. The image sensing device may include a flexible interconnect layer aligned with the interconnect layer and having a flexible substrate extending laterally outwardly from the interconnect layer, and electrically conductive traces on the flexible substrate. The image sensing device may also include solder bodies coupling the interconnect layer and the flexible interconnect layer and also defining a gap between the interconnect layer and the flexible interconnect layer. | 04-14-2016 |
Patent application number | Description | Published |
20120280761 | Impedance matching component - The present disclosure discloses an impedance matching component disposed between a first medium and a second medium, which is formed by stacking a plurality of homogeneous metamaterial sheet layers in a direction perpendicular to surfaces thereof. Each of the metamaterial sheet layers comprises a substrate and a plurality of man-made microstructures attached thereon. A first and last metamaterial sheet layers have impedances identical to those of the first and second media respectively. The man-made microstructures attached on the first metamaterial sheet layer have a first pattern, the man-made microstructures attached on the last metamaterial sheet layer have a second pattern, and the man-made microstructures attached on intermediate ones of the metamaterial sheet layers have patterns that are combinations of the first and second patterns, with the first pattern becoming smaller continuously and the second pattern becoming larger continuously in the stacking direction of the metamaterial sheet layers. | 11-08-2012 |
20120327666 | METAMATERIAL FOR DEFLECTING ELECTROMAGNETIC WAVE - The present embodiment relates to a metamaterial for deflecting electromagnetic wave, includes a functional layer made up by at least one metamaterial sheet layer, each of the metamaterial sheet layers including a substrate and a number of artificial microstructures attached onto the substrate. The functional layer is divided into several strip-like regions. The refractive indices in all the strip-like regions continually increase along the same direction and there are at least two adjacent first and second regions, wherein,the refractive indices in the first region continually increase from n | 12-27-2012 |
20130049887 | Electromagnetically transparent metamaterial - The present disclosure relates to an electromagnetically transparent metamaterial, which comprises a substrate and a plurality of man-made metal microstructures arranged periodically inside the substrate. When an electromagnetic wave propagates through the metamaterial, each of the man-made metal microstructures is equivalent to two identical two-dimensional (2D) circuits, which are placed respectively in a direction perpendicular to an incident direction of the electromagnetic wave and in a direction parallel to the incident direction of the electromagnetic wave, and each of which comprises an inductor branch and two identical capacitor branches that are symmetrically connected in parallel with the inductor branch. The 2D circuits are associated with a waveband of the electromagnetic wave so that both a dielectric constant and a magnetic permeability of the metamaterial are substantially 1 when the electromagnetic wave propagates through the metamaterial. | 02-28-2013 |
20130049903 | ARTIFICIAL MICROSTRUCTURE AND METAMATERIAL WITH THE SAME - An artificial microstructure made of conductive wires includes a split resonant ring with a split, and two curves. The two curves respectively start from first end and the second end of the split resonant ring and curvedly extend inside the split resonant ring, where the two curves do not intersect with each other, and do not intersect with the split resonant ring. | 02-28-2013 |
20130089715 | ARTIFICIAL ELECTROMAGNETIC MATERIAL - An artificial electromagnetic material is provided. The artificial electromagnetic material includes at least one material sheet. Each material sheet includes a laminary substrate and a plurality of artificial microstructures attached to the substrate. The substrate is made from transparent material. Because the substrate is made from transparent material, therefore the artificial electromagnetic material is capable of generating responses to visible light wave and convergence, divergence, deflection of visible light wave and so on can be achieved. | 04-11-2013 |
20130098673 | Metamaterial for deflecting an electromagnetic wave - A metamaterial for deflecting an electromagnetic wave is disclosed, which comprises a functional layer. The functional layer comprises a plurality of sheet layers parallel to each other, and each of the sheet layers comprises a sheet-like substrate and a plurality of man-made microstructures arranged in an array on the sheet-like substrate. The sheet-like substrate comprises a plurality of unit blocks, and each of the man-made microstructures and a corresponding one of the unit blocks occupied thereby form a unit cell. Refractive indices of the unit cells arranged in a first direction in each of the sheet layers decrease gradually. Each of the unit cells has an anisotropic electromagnetic parameter. Through use of the metamaterial of the present disclosure, deflection of the electromagnetic wave can be achieved. | 04-25-2013 |
20130108856 | ARTIFICIAL MICROSTRUCTURE AND ARTIFICIAL ELECTROMAGNETIC MATERIAL USING THE SAME | 05-02-2013 |
20130154901 | ARTIFICIAL MICROSTRUCTURE AND METAMATERIAL USING THE SAME - The present invention provides an artificial microstructure including a first metal wire, a second metal wire parallel to the first metal wire, at least one first metal wire branch and at least one second metal wire branch. The at least one first metal wire branch and the at least one second metal wire branch are distributed in an interlacement arrangement. One end of the at least one first metal wire branch is connected to the first metal wire; the other end is a free end facing towards the second metal wire. One end of the at least one second metal wire branch is connected to the second metal wire, and the other end of the at least one second metal wire is a free end facing towards the first metal wire. The present invention also discloses a metamaterial with the artificial microstructures. | 06-20-2013 |
20130154902 | ARTIFICIAL ELECTROMAGNETIC MATERIAL - An artificial electromagnetic material includes at least one material sheet. Each material sheet includes a substrate and a plurality of artificial microstructures attached to the substrate. Each substrate is virtually divided into multiple of substrate units arranged into an array. A pair of artificial microstructures is attached to each substrate. The pair of artificial microstructures includes a first artificial microstructure and a second artificial microstructure with different shapes. The dielectric constant of artificial electromagnetic materials gradually increases from zero in a certain frequency range, therefore the material has a low dielectric constant in the certain frequency range and can meet some needs of special situation. | 06-20-2013 |
20130164508 | ARTIFICIAL MICROSTRUCTURE AND ARTIFICIAL ELECTROMAGNETIC MATERIAL USING THE SAME - An artificial microstructure comprises two “I” shaped metal wire structures. The two “I” shaped metal wire structures are separated to each other. The present invention also discloses an artificial electromagnetic material using the artificial microstructures. The artificial electromagnetic material has high resonance frequency, wide effective frequency band and has a wide application range. | 06-27-2013 |
20140011002 | ARTIFICIAL MICROSTRUCTURE AND ARTIFICIAL ELECTROMAGNETIC MATERIAL USING THE SAME - An artificial microstructure used in artificial electromagnetic material includes a first line segment and a second line segment. The second line segment is perpendicular to the first line segment. The first line segment and the second line segment intersect with each other to form a cross-type structure. The present disclosure further relates to an artificial electromagnetic material using the artificial microstructure. | 01-09-2014 |
20140043124 | ARTIFICIAL ELECTROMAGNETIC MATERIAL - The present invention provides an artificial electromagnetic material, comprising at least one material sheet layer; wherein each material sheet layer is provided with a first substrate and a second substrate which are oppositely arranged; and a plurality of artificial microstructures are attached on a surface, facing the second substrate, of the first substrate. The first substrate and the second substrate on both sides of the artificial microstructure are in such tight contact therewith that the number of electric field lines passing through the substrates is increased and the equivalent permittivity of the artificial electromagnetic material is effectively improved. | 02-13-2014 |
20140111365 | ARTIFICIAL MICROSTRUCTURE AND ARTIFICIAL ELECTROMAGNETIC MATERIAL USING THE SAME - The present invention provides an artificial microstructure. The artificial microstructure includes at least three split rings. The at least three split rings surround and embed in turn. Each split ring is formed by a wire which is made of conductive material, with two terminals of the wire towards each other to form an opening of the corresponding split ring. The present invention also provides an artificial electromagnetic material using the artificial microstructure. The artificial electromagnetic material with the artificial microstructure can achieve the function of broadband wave-absorbing. | 04-24-2014 |
20140246608 | WAVE-ABSORBING METAMATERIAL - The present invention relates to a wave-absorbing metamaterial, comprising a substrate which is provided with two opposite lateral surfaces, wherein a plurality of periodically arranged artificial metal microstructures are attached on at least one of the two opposite lateral surfaces; when an electromagnetic wave having an incident direction vertical to the two opposite lateral surfaces of the substrate is transmitted to the wave-absorbing metamaterial, a relative permittivity of the metamaterial is substantially equal to a relative magnetic conductivity of the metamaterial. A wave-absorbing principle different from that of a conventional wave-absorbing material is employed on the wave-absorbing metamaterial; an ideal wave-absorbing effect is achieved by periodically arranging various artificial metal microstructures on the substrate and adjusting the artificial metal microstructures; and the wave-absorbing metamaterial has the advantages of minor weight, small thickness and simply adjustable electromagnetic parameters. | 09-04-2014 |
20150071439 | Visible-light communication-based encryption, decryption and encryption/decryption method and system - Embodiments of the present invention provide a method and system of encryption, decryption, and encryption and decryption based on visible light communication. A transmit end performs a logical operation on an original data signal and a pseudocode signal varying with a unit interval to obtain a scrambling code signal, and sends the scrambling code signal in a form of a visible light signal. A receive end receives the visible light signal sent by the transmit end, and converts the visible light signal into a digital signal; and decodes the digital signal and a pseudocode signal varying with a unit interval, so as to obtain the original data signal. The visible light signal transmitted between the transmit end and the receive end is not original data, but a scrambling code signal varying with a unit interval, thereby improving security of the photonic Internet of Things. | 03-12-2015 |
20150146871 | VISIBLE LIGHT ENCRYPTION METHOD, DECRYPTION METHOD, COMMUNICATION DEVICE AND COMMUNICATION SYSTEM - The present invention discloses a visible light encryption method, a decryption method, a communication device and a communication system. The method includes: receiving a visible light signal from a transmit end, where the visible light signal is encrypted at the transmit end by using a key; and obtaining the key, and decrypting the visible light signal according to the key, where the obtaining the key includes: obtaining a key corresponding to a state of a state machine of a receive end; or, obtaining indication information according to the visible light signal and obtaining the key according to the indication information, where the indication information is used to obtain the key. The present invention solves a problem of decryption failure in visible light encryption and decryption, and improves accuracy of decryption. | 05-28-2015 |
20150155936 | HANDSHAKE SYNCHRONIZATION METHOD AND SYSTEM BASED ON VISIBLE LIGHT COMMUNICATION - A handshake synchronization method and system based on visible light communication are provided. The method includes: connecting, by a transmitting end, in which a state machine varies with unit time, to a receiving end, the status of a state machine of the receiving end being synchronized with the status of the state machine of the transmitting end; using, by the transmitting end, a pseudocode signal which varies with unit time, to scramble an original signal and a pilot optical signal, and sending, in the form of a visible light signal, the scrambled signal obtained by scrambling; and receiving, by the receiving end, the visible light signal, identifying the scrambled signal of the current period of time by using a pilot optical signal, and decrypting the original signal according to the scrambled signal. Since a visible light signal which is transmitted between a transmitting end and a receiving end is not an original signal, the security of a photonic Internet of Things is improved. | 06-04-2015 |
20150162984 | OPTICAL SIGNAL PROCESSING APPARATUS AND DECODING METHOD FOR OPTICAL SIGNAL RECEPTION CONTROL DEVICE - The present invention provides an optical signal processing device and a decoding method for an optical signal reception control device. The optical signal processing device includes one of the following: a power control apparatus, where the power control apparatus is configured to control power-on and power-off of a power supply according to an optical signal, or, a clock apparatus, where the clock apparatus is configured to store time of opening and closing a door; or, a charging apparatus, where the charging apparatus is configured to charge an optical signal transmitting apparatus. The present invention can control power-on and power-off of a power supply automatically and save electric energy effectively. | 06-11-2015 |
20150188633 | LIGHT SIGNAL-BASED INFORMATION PROCESSING METHOD AND DEVICE - The present invention discloses a light signal-based information processing method and device. The method includes: receiving trigger information; extracting corresponding information according to the trigger information; sending the extracted information in a form of a visible light signal, or receiving a visible light signal; obtaining modification of user information and user information according to the visible light signal; and modifying stored user list information according to the modification of user information and the user information, so that an authorization information list of a light signal receiving device can be modified conveniently no matter whether the light signal receiving device is fixed in a specific system. | 07-02-2015 |
20150349886 | HANDSHAKE SYNCHRONIZATION METHOD AND SYSTEM BASED ON VISIBLE LIGHT COMMUNICATION - A handshake synchronization restoration method and system based on visible light communication are provided. The method includes: after a transmitting end in which a state machine varies with unit time is powered on again, transmitting in the form of a visible light signal, to a receive and control system, a status reset signal which varies with unit time, wherein the receive and control system comprises one or multiple receiving ends; and receiving, by the receive and control system, the visible light signal, and when it is determined that the received visible light signal is a status reset signal, adjusting status of a state machine of a receiving end to a state indicated by the status reset signal. Status synchronization with the transmitting end is restored, avoiding a case in which the transmitting end is asynchronous with the receiving end after encountering power outage and being powered on again. | 12-03-2015 |
20150380830 | ARTIFICIAL MICROSTRUCTURE AND ARTIFICIAL ELECTROMAGNETIC MATERIAL USING THE SAME - The present invention provides an artificial microstructure. The artificial microstructure includes at least three split rings. The at least three split rings surround and embed in turn. Each split ring is formed by a wire which is made of conductive material, with two terminals of the wire towards each other to form an opening of the corresponding split ring. The present invention also provides an artificial electromagnetic material using the artificial microstructure. The artificial electromagnetic material with the artificial microstructure can achieve the function of broadband wave-absorbing. | 12-31-2015 |
Patent application number | Description | Published |
20150370696 | METHOD AND APPARATUS FOR DISPLAYING PC REAL BROWSING EFFECT FOR MOBILE PHONE INTERFACE - The present invention relates to the field of displaying a mobile phone interface, and particularly to a method and apparatus for displaying a PC real browsing effect for a mobile phone interface, comprise: a step and device for displaying applications and master keys of a the main interface of the mobile phone on the PC user interface; a step and device for detecting a predefined user action made by a user on the PC user interface, wherein the predefined user action comprises a first predefined user action and a second predefined user action, a step and device for, upon detecting that the first predefined user action is associated with any one of the applications, displaying an application interface of the application or an application interface of a lower level on the PC user interface. | 12-24-2015 |
20150371081 | INFORMATION PROCESSING METHOD FOR ELECTRONIC DEVICE WITH FACIAL RECOGNITION FUNCTION - The present invention discloses an information processing method for an electronic device with a facial recognition function, an information processing device for an electronic device with a facial recognition function, and an information processing method for an electronic device with an iris recognition function. The present invention detects a face or iris of an operating user, and determines whether it matches the facial image or iris image which is stored in the electronic device in advance. If it is determined that the face of the user who is operating the electronic device does not match the facial image stored in the electronic device, the user interface of the electronic device is switched to a user preset state. The present invention can effectively protect user's privacy. | 12-24-2015 |
20150371284 | METHOD FOR PROMOTING PLATFORM BASED ON USER BEHAVIOR ANALYSIS - The invention discloses a method for promoting a platform based on user behavior analysis. A promotion platform comprises a self-service factory sharing and planning module, a producing and making module, and a promotion information statistical module. By means of the self-service factory sharing and planning module, a user applies for and obtains by self-service a personalized promotion code to become a promoter, the promoter shares the obtained personalized promotion code in the form of a hyperlink or a two-dimensional code with personalized icon on a third party network platform by means of a one-touch sharing module, the user enters the producing and making module of the promotion platform by clicking the hyperlink or scanning the two-dimensional code with personalized icon. | 12-24-2015 |
20150378329 | METHOD FOR CONTROLLING ELECTRONIC DEVICE INTERFACE WITH BREATHING CHARACTERISTICS - The present invention provide a method for controlling an electronic device interface with breathing characteristics, comprising: detecting the breathing characteristics of a user who is operating an electronic device; in case the electronic device screen is displaying a first interface of a first group of interfaces for the first application, upon detecting that said breathing characteristics matches a first predefined breathing characteristics, replacing the first interface with a second interface of the first group of interfaces; upon detecting that said breathing characteristics matches a second predefined breathing characteristics, replacing the first interface with a third interface of the first group of interfaces. In the present invention, healthy breathing and operations of an electronic device are combined, so that the user can do breathing exercise during operating the electronic device. The dirty air in the body is discharged by breathing deeply. | 12-31-2015 |
20150379030 | PLATFORM INTEGRATING METHOD AND SYSTEM FOR ADAPTING THIRD-PARTY WEB PAGE IN APPLICATION - The invention discloses a platform integrating method for adapting a third-party web page in an application, comprising a first step of embedding a control for browsing the web page in a client of the application; a second step of establishing a correlation between the control and a custom module of an application generation platform; and a third step of receiving by a custom module a command input for adapting the third-party web page, thereby enabling the client to access the third-party web page by using the control. The invention further discloses a platform integrating system for adapting a third-party web page in an application, comprising: a client, in which a control for browsing the web page and an application are embedded; an application generation platform, which is used for generating an application, and in which a custom module correlated with the control is provided. | 12-31-2015 |
20160026366 | METHOD AND SYSTEM FOR CUSTOMIZING MOBILE TERMINAL APPLICATION - The invention discloses a method and system for customizing a mobile terminal application, comprising: providing in advance several types of application templates in an application generation platform; when a certain type of application template is selected by a user, displaying initially by the application generation platform according to the application template selected by the user; configuring the resource information in the application template, and transferring the configured resource information to a first and a second server of different service types respectively, wherein the first server and second server convert the configured resource information into characteristic files which are compatible with the type of server and correspond with the type of the selected application template, copy the selected application template, analyze the characteristic file that corresponds with the type of application template. | 01-28-2016 |
20160063540 | METHOD FOR REVENUE GENERATION AND REVENUE SHARING FROM A MOBILE APPLICATION - A method to share revenue from advertisements in a mobile application comprises receiving a first indication wirelessly over the Internet from the mobile application of a user denoting a viewing of an advertisement, attributing the viewing to the user of the mobile application, tracking a first revenue generated based on the viewing of the advertisement, identifying an advertiser whose advertisement has been viewed by the user, associating a payment obligation to the advertiser with the first revenue, and determining the first revenue to be shared with the user at a first predetermined rate. | 03-03-2016 |
Patent application number | Description | Published |
20120026577 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A display device includes an active element array substrate, a display layer and a transparent shock absorption layer. The display layer is disposed on the active element array substrate. The transparent shock absorption layer is disposed on the display layer. The transparent shock absorption layer is formed by curing liquid adhesive material. A manufacturing method of display device is also provided. | 02-02-2012 |
20120212888 | DISPLAY APPARATUS - A display apparatus includes a display panel, at least one anisotropic conductive adhesive and at least one chip. The display panel has a peripheral circuit region, and the anisotropic conductive adhesive is adhered in the peripheral circuit region. The chip is disposed on the anisotropic conductive adhesive, and the chip has an electric coupling region on a surface facing the anisotropic conductive adhesive. The electric coupling region is equipped with a plurality of electric coupling parts, and the electric coupling parts are electrically coupled to the peripheral circuit region by the anisotropic conductive adhesive. An interval is existed between a boundary of the electric coupling region and a boundary of the chip, and the electric coupling region is located in a bonding region of the anisotropic conductive adhesive. The bonding region of the anisotropic conductive adhesive is located in the boundary of the chip. The display apparatus has better reliability. | 08-23-2012 |
20130258447 | ELECTRONIC INK DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing an electronic ink display device is provided, which includes the steps of: forming an electronic ink layer on an driving substrate; forming a front protective layer and a back protective layer covering outside of the electronic ink layer and outside of the driving substrate separately, in which a dimension of the front protective layer is greater than that of the back protective layer; and filling an sealant covering and surrounding sidewall of the electronic ink layer and sidewall of the driving substrate. An electronic ink display device is also provided. | 10-03-2013 |
20140192491 | CIRCUIT SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING THEREOF - The invention provides a circuit substrate structure and a method for manufacturing thereof. The circuit substrate structure includes a substrate, a pixel array layer, a display unit, a peripheral circuit layer, at least one integrated circuit chip, a flexible printed circuit board, at least one flattening material layer and a passivation layer. In the circuit substrate structure, the flattening material layer is positioned on the peripheral circuit layer, and possesses at least one opening corresponded to and around the integrated circuit chip. By positioning the flattening material layer, the circuit substrate structure possesses a flat surface, and prevents producing air bubbles, so as to enhance the reliability of the display device. | 07-10-2014 |
20150092263 | ELECTRONIC INK DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing an electronic ink display device is provided, which includes the steps of: forming an electronic ink layer on an driving substrate; forming a front protective layer and a back protective layer covering outside of the electronic ink layer and outside of the driving substrate separately, in which a dimension of the front protective layer is greater than that of the back protective layer; and filling an sealant covering and surrounding sidewall of the electronic ink layer and sidewall of the driving substrate. An electronic ink display device is also provided. | 04-02-2015 |
20150146388 | FLEXIBLE DISPLAY APPARATUS - A flexible display apparatus includes a flexible display unit, a flexible film and a molding compound. The flexible display unit has a first region and a second region surrounding the first region, and the flexible film is disposed on the flexible display unit and at least located within the first region. The flexible film has a circumferential surface and at least one accommodating groove, the accommodating groove is sunken from the circumferential surface, and the flexible film exposes the second region of the flexible display unit. The molding compound is disposed on the flexible display unit, covers the circumferential surface and the second region exposed by the flexible film and fills the accommodating groove. A thickness of the molding compound filling the accommodating groove is the same as the thickness of the flexible film. | 05-28-2015 |
20160052252 | PEELING PROCESS OF SUBSTRATE - A peeling process of substrate used for peeling a first substrate and a second substrate bonded to each other is provided. The first substrate has a first bonding surface, and the second substrate has a second bonding surface and a back surface, wherein the first bonding surface and the second bonding surface are bonded to each other. In the peeling process of substrate, a light beam is incident through the back surface of the second substrate at a first incident angle and illuminates the first bonding surface and the second bonding surface, wherein the first incident angle is smaller than 90 degree and larger than 0 degree. Thereafter, the second substrate is peeled off from the first substrate. | 02-25-2016 |
Patent application number | Description | Published |
20130067006 | Information Combining Method, Terminal, and IM System - Embodiments of the present invention provide an information combining method, a terminal and an Instant Messaging (IM) system. The method includes: receiving, by a terminal, original tips, and the original tips comprise a tag; parsing, by the terminal, the tag, replacing the tag in the original tips with corresponding terminal information, and generating final tips; displaying, by the terminal, the final tips. The information combining method, terminal and IM system provided by the present invention achieve the tips' generation in terminal, thereby simplifying the process for the server to issue tips to the terminal, and then enhancing the efficiency of the server, saving resources. In addition, it promotes the enrichment of content of the tips, and enhances the user experience. | 03-14-2013 |
20130067453 | METHOD AND SYSTEM FOR OBTAINING A DYNAMIC UPDATE IN INSTANT MESSAGING SOFTWARE AND COMPUTER STORAGE MEDIUM THEREFOR - A method, system and a non-transitory computer storage medium for obtaining a dynamic update in instant messaging software. The method includes obtaining update manner modification parameters and real-time user interaction data; generating a corresponding update manner according to the update manner modification parameters and the real-time user interaction data; and obtaining corresponding updated information according to the update manner. With the above-mentioned steps, according to the habit of a user, the update manner of the dynamic modification allows the updated information to be obtained in a timely manner and reduce the pressure on bandwidth. It results in a balance between the bandwidth cost and the timeliness, which greatly saves the network bandwidth and improves the experience of user. | 03-14-2013 |
20140052801 | METHOD FOR TRANSMITTING MESSAGES IN INSTANT MESSAGING, CLIENT AND STORAGE MEDIUM THEREOF - A method for transmitting messages in instant messaging, an instant messaging client, and a storage medium. An instant messaging client receives a conversation message including text content from a remote instant messaging client. The conversation message includes a font sign of an individualized font. The instant messaging client receives the font sign from the conversation message. The instant messaging client calls a profile of the individualized font corresponding to the font sign according to the font sign. The instant messaging client makes a composition of the individualized font profile with the text content contained in the conversation message, and displays the composition. The individualized fonts could be dynamically composed according to the text contents of the conversation message and the individualized font profile corresponding to the font sign. | 02-20-2014 |