Liu, Jhongli City
Cheng-Yi Liu, Jhongli City TW
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20080283503 | Method of Processing Nature Pattern on Expitaxial Substrate - A method of processing nature pattern on expitaxial substrate, unlike the conventional method of processing regular pattern on expitaxial substrate (such as sapphire substrate) by lithography, wet etches a sapphire substrate directly to obtain a nature pattern, so as to simplify the fabrication process. Compared with the conventional way of processing pattern sapphire, the nature pattern sapphire substrate produced by the method can avoid voids between the interface of sapphire and GaN and apply this technology to a wired bond LED structure to increase the sidewall light extraction and improve the texture of the sapphire surface of a flip chip LED structure. In addition, this method also can be applied to a thin-GaN LED for achieving the surface texture after the sapphire is removed by laser. | 11-20-2008 |
20090146166 | Structure Applying Optical Limit Guide Layer - A structure applying an optical wave guide layer includes an incident light source and at least one optical wave guide layer. The structure can be in any geometric shape such as a planar, hemispherical or conical shape. The geometric structure is designed for collecting and guiding the incident light source in specific directions. The light can be guided by a combination of materials having different optical properties. The incident angle of the collected light is controlled and the materials are selected to effectively overcome a drawback of the prior art that a portion of the light of some optical components cannot be extracted by a light extraction method. | 06-11-2009 |
20110186884 | LED Reflective Structure and Method of Fabricating the Same - A reflective structure is fabricated for a light emitting diode (LED). An ohmic contact layer of the LED is made into a netlike structure. Thus, a current is evenly distributed and a low contact resistance is remained. Furthermore, the reflective layer directly reflects light through holes of the netlike structure on emitting light. Thus, a reflectivity of the LED is enhanced. | 08-04-2011 |
Chen-Yu Liu, Jhongli City CN
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20120013573 | PRESSURE SENSITIVE TOUCH CONTROL DEVICE - A pressure detectable touch device includes a first substrate, a conductive layer formed on the first substrate, a second substrate, a first electrode pattern, a second electrode pattern, and a microprocessor. When a user touches a touch operation surface of the touch device in such an extent that the conductive layer and the first electrode pattern are not put into physical contact with each other, the touch device is set in a capacitive touch position detection mode. When the user forcibly depresses the touch operation surface of the touch device or carries out a hand writing input operation on the touch operation surface of the touch device, the conductive layer is caused to physically engage the first electrode pattern, setting the touch device in a resistive touch position detection mode. | 01-19-2012 |
20120127099 | CAPACITIVE TOUCH CIRCUIT PATTERN AND MANUFACTURING METHOD THEREOF - The present disclosure relates to a touch circuit pattern and a manufacturing method thereof. A capacitive touch circuit pattern in the present disclosure comprises a substrate, wherein at least two adjacent transparent first-axis electrode blocks, a transparent first-axis conductive wire, and at least two adjacent transparent second-axis electrode blocks are formed on the substrate. The first-axis conductive wire is formed between the two adjacent first-axis electrode blocks to connect the two adjacent first-axis electrode blocks and the two adjacent second-axis electrode blocks, respectively, at two sides of the first-axis conductive wire. The capacitive touch circuit pattern further comprises of a metal second-axis conductive wire, which stretches across the first-axis conductive wire and connects the two adjacent second-axis electrode blocks. | 05-24-2012 |
Chun-Fu Liu, Jhongli City TW
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20100090615 | Dimming circuit for controlling luminance of light source and the method for controlling luminance - The present invention provides a dimming circuit for controlling the luminance of a light source and the method for controlling luminance. The dimming circuit comprises an inverter circuit and a driving circuit. The inverter circuit is electrically coupled to a light source to be controlled, to convert a direct current (DC) power input into an alternating current (AC) power. The inverter circuit comprises a transformer, a capacitor connected in parallel to the transformer, a plurality of switches located at both ends of the capacitor, and an oscillating circuit electrically connected to both ends of the transformer. The driving circuit is electrically connected to the inverter circuit, for regulating the AC voltage to control the time period that the light source is turned on. As the input of DC voltage into the transformer is stopped, the driving circuit opens the plurality of switches in the inverter circuit, forming electrical isolation between the capacitor and the transformer, which prevents voltage oscillation and stores the energy into the capacitor. | 04-15-2010 |
Chun-Min Liu, Jhongli City TW
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20110087065 | Artificial Insemination Device - An artificial insemination device includes a catheter, a widening tip connected to one end of the catheter for being introduced into the genital system of a female animal, and a check valve connected between the catheter and the widening tip and having a stopper supported on a spring between a first stop wall and a second stop wall for controlling the passage in the second stop wall for allowing the injected semen to pass out of the semen outlet in the first stop wall and prohibiting the injected semen from flowing backwards | 04-14-2011 |
Chun-Nan Liu, Jhongli City TW
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20090063160 | Configurable common filterbank processor applicable for various audio standards and processing method thereof - A configurable common filterbank processor applicable for various audio standards and its processing method. Inverse modified discrete cosine transform (IMDCT) and window and overlap-add (WOA) decoding operations required by AC-3 and AAC, and IMDC, WOA, and matrixing decoding operations required by MP3 are divided into several different modes, and a quick algorithm is provided for expediting the operation of these modes, and a hardware architecture is designed universally for these modes, so that the hardware architecture can be applicable for the decoding operations of three different audio standards, respectively AC-3, AAC and MP3, to expand the scope of applicability of a decoder. | 03-05-2009 |
Hsing-Chuang Liu, Jhongli City TW
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20090063160 | Configurable common filterbank processor applicable for various audio standards and processing method thereof - A configurable common filterbank processor applicable for various audio standards and its processing method. Inverse modified discrete cosine transform (IMDCT) and window and overlap-add (WOA) decoding operations required by AC-3 and AAC, and IMDC, WOA, and matrixing decoding operations required by MP3 are divided into several different modes, and a quick algorithm is provided for expediting the operation of these modes, and a hardware architecture is designed universally for these modes, so that the hardware architecture can be applicable for the decoding operations of three different audio standards, respectively AC-3, AAC and MP3, to expand the scope of applicability of a decoder. | 03-05-2009 |
Hsiu-Feng Liu, Jhongli City TW
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20090297877 | Extreme low resistivity light attenuation anti-reflection coating structure in order to increase transmittance of blue light and method for manufacturing the same - An extreme low resistivity light attenuation anti-reflection coating structure in order to increase transmittance of blue light, includes a substrate and a coating module. The coating module is formed on a front surface of the substrate and composed of a plurality of silicon carbide compound coating layers, a plurality of Al-based oxide coating layers and a plurality of metal coating layers that are alternately stacked onto each other. | 12-03-2009 |
20090297878 | Extreme low resistivity light attenuation anti-reflection coating structure in order to increase transmittance of blue light and method for maufacturing the same - An extreme low resistivity light attenuation anti-reflection coating structure in order to increase transmittance of blue light. The coating structure includes a substrate and a coating module. The coating module is formed on a front surface of the substrate and composed of a plurality of mixture coating layers, a plurality of Al-based oxide coating layers and a plurality of metal coating layers that are alternately stacked onto each other. Each mixture coating layer is composed of silicon carbide compound and Ti-based oxide. | 12-03-2009 |
20100233388 | MULTILAYER FILM STRUCTURE FOR INCREASING TRANSMITTANCE AND METHOD FOR MANUFACTURING THE SAME - A multilayer film structure for increasing transmittance includes a transparent substrate and a multifunctional film module. The multifunctional film module is formed on a front surface of the transparent substrate and composed of a plurality of dielectric layers and a plurality of metal layers. The dielectric layers and the metal layers are alternately stacked onto each other, and each metal layer is formed by mixing at least two metals. Each dielectric layer is a silicon carbide compound layer that is SiC, and each metal layer is formed by mixing Ag and Cu. | 09-16-2010 |
20110026125 | Transparent conductive film structure and display device - A transparent conductive film structure includes, a substrate and a multi-layer film formed on the substrate. The multi-layer film includes a reflection-matching layer and a transparent conductive layer. The reflection matching layer is applied to reduce the reflection index difference of the etched portion and the non-etched portion. Therefore, the etched traces cannot be observed by the users so that the image quality of the transparent conductive film structure is improved. | 02-03-2011 |
20110027561 | Optical film structure and display device - An optical film structure includes a substrate and a multi-film structure formed on the substrate. The multi-film structure includes a first refraction-matching layer, a second refraction-matching layer and a third layer. The refraction matching effect of the first and the second refraction-matching layers is produced to lead a phase reversal so as to interfere the incident light and the reflecting light. Therefore, the etched traces cannot be observed by the users so that the image quality of the optical film structure is improved | 02-03-2011 |
Hsueh-Hsing Liu, Jhongli City TW
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20100068872 | Method for Fabricating Single-Crystalline Substrate Containing Gallium Nitride - The present invention provides a method for fabricating a single-crystalline substrate containing gallium nitride (GaN) comprising the following steps. First, form a plurality of island containing GaN on a host substrate. Next, use the plurality of islands containing GaN as a mask to etch the substrate and form an uneven host substrate. Then, perform epitaxy on the uneven host substrate to make the islands containing GaN grow in size and merge into a continuous single-crystalline film containing GaN. Finally, separate the single-crystalline film containing GaN from the uneven host substrate to obtain the single-crystalline substrate containing GaN. According to the present invention, process time can be saved and yield can be improved. | 03-18-2010 |
Jia-Wei Liu, Jhongli City TW
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20110150153 | Apparatus and Method for Inter-Carrier Interference Cancellation - A method for inter-carrier interference cancellation is provided. A time-domain received signal is detected to obtain information of an inter-symbol interference free region. Multiple cyclic useful symbols are obtained from the time-domain received signal according to the information of the inter-symbol interference free region and a set of multi-step windowing coefficients is generated. Adjusted cyclic useful symbols are obtained by multiplying the cyclic useful symbols by the set of multi-step windowing coefficients, respectively, and then combined in a time domain to obtain a time-domain combination signal. The inter-carrier interference of each of sub-carriers of the time-domain combination signal is centralized on neighboring D sub-carriers. The time-domain combination signal is transformed into a frequency-domain received signal. The frequency-domain received signal and its corresponding channel response matrix are divided into overlapped signal blocks according to D. Successive inter-carrier interference cancellation is performed on each signal block in parallel to obtain estimation data. | 06-23-2011 |
20120121002 | Receiver and Signal Receiving Method Thereof - A signal receiving method of a receiver includes following steps. Multiple time-domain received signals are transformed into multiple frequency-domain received signals, and channel response matrices corresponding to the frequency-domain received signals are estimated. The frequency-domain received signals are STBC decoded and multiple original combination signals are obtained based on the corresponding channel response matrices. The frequency-domain received signals are rearranged, and the rearranged frequency-domain received signals are STBC decoded and multiple rearrangement combination signals are obtained based on the corresponding channel response matrices. The original combination signals and the rearrangement combination signals are randomly chosen and summed to obtain multiple complex signals. The complex signal with minimum interference power is selected and then the selected signal is used to cancel interference and compensate the channel effect to obtain the detected data. | 05-17-2012 |
Shiu-Feng Liu, Jhongli City TW
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20090176057 | Coating structure with an anti-reflection function and an anti-electromagnetic wave function - A coating structure with an anti-reflection function and an anti-electromagnetic wave function, including an anti-reflection coating structure, an anti-electromagnetic wave coating structure, a third transparent substrate, and two adhesive layers respectively disposed between the anti-reflection coating structure and the third transparent substrate and between the third transparent substrate and the anti-electromagnetic wave coating structure. The anti-reflection coating structure has a first transparent substrate and an anti-reflection coating module formed on the first transparent substrate. The anti-electromagnetic wave coating structure has a second transparent substrate and an anti-electromagnetic wave coating module formed on the second transparent substrate. The third transparent substrate is disposed between the anti-reflection coating structure and the anti-electromagnetic wave coating structure. | 07-09-2009 |
Tsang-Yu Liu, Jhongli City TW
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20130020693 | CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME - A chip package structure and a method for forming the chip package structure are disclosed. At least a block is formed on a surface of a cover, the cover is mounted on a substrate having a sensing device formed thereon for covering the sensing device, and the block is disposed between the cover and the sensing device. In the present invention, the block is mounted on the cover, there is no need to etch the cover to form a protruding portion, and thus the method of the present invention is simple and has low cost. | 01-24-2013 |
20130168784 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package includes: a chip having a first portion and a second portion disposed on the first portion, wherein the second portion has at least a through hole therein for exposing a portion of the first portion, and the first portion and/or the second portion has a MEMS; and an etch stop layer formed between the first portion and the second portion and partially exposed through the through hole of the second portion. The invention allows an electronic element to be received in the through hole so as for the semiconductor package to have integrated functions of the MEMS and the electronic element. Therefore, the need to dispose the electronic element on a circuit board as in the prior art can be eliminated, thereby saving space on the circuit board. | 07-04-2013 |
20130168868 | SEMICONDUCTOR STACK STRUCTURE AND FABRICATION METHOD THEREOF - A fabrication method of a semiconductor stack structure mainly includes: singulating a wafer of a first specification into a plurality of chips; rearranging the chips into a second specification of a wafer so as to stack the chips on a substrate of the second specification through a plurality of blocks; forming a redistribution layer on the chips; and performing a cutting process to obtain a plurality of semiconductor stack structures. Therefore, the present invention allows a wafer of a new specification to be processed by using conventional equipment without the need of new factory buildings or equipment. As such, chip packages can be timely supplied to meet the replacement speed of electronic products. | 07-04-2013 |
Wei-Sheng Liu, Jhongli City TW
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20080258132 | QUANTUM DOT OPTOELECTRONIC DEVICE HAVING AN SB-CONTAINING OVERGROWN LAYER - A quantum dot optoelectronic device has an overgrown layer containing antimony (Sb). The optical characteristics and thermal stability of the optoelectronic device are thus greatly enhanced due to the improved crystal quality and carrier confinement of the quantum dot structure. | 10-23-2008 |
Ying-Chieh Liu, Jhongli City TW
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20100061099 | LED device having a humidity sensor - A light emitting diode (LED) device having a humidity sensor includes an LED portion, a humidity sensor and an external device. This LED portion has a base, a boning layer, an LED chip, and a sealing portion. The LED ship is adhered on the base by the bonding layer. The sealing portion encloses the LED chip. This humidity sensor has a transmission element. This humidity sensor is to detect humidity condition in the LED portion. The external device is to monitor humidity condition and variation in the LED portion. It can monitor the internal condition in the LED portion and is possible to detect both the temperature and humidity simultaneously. | 03-11-2010 |
Ying-Hung Liu, Jhongli City TW
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20100181927 | MULTI-LAMP DRIVING CIRCUIT - A multi-lamp driving circuit includes a power supply, a booster converter including a first winding and a second winding, a plurality of current balance circuits and a plurality of balance converters. The first winding of the booster converter is coupled to the power supply. Each of the current balance circuits includes a plurality of current balance sub-circuits each including a capacitor and a lamp connected in series. One end of each of the current balance sub-circuits is connected to one end of the second winding of the booster converter. A first winding of each of the balance converters is electrically connected between the other end of the second winding of the booster converter and the other end of the current balance sub-circuits of corresponding current balance circuits. Second windings of the balance converters are connected in series. | 07-22-2010 |
Yu-Cheng Liu, Jhongli City TW
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20130109204 | SOCKET AND POWER ADAPTER EMPLOYING SAME | 05-02-2013 |
Yu-Lun Liu, Jhongli City TW
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20110012024 | Method for Preparing Ion Source From Nanoparticles - A method for preparing an ion source from nanoparticles is provided. The method includes the steps of: providing nanoparticles, vaporizing the nanoparticles from a solid state to a gaseous state, and ionizing the gas to form the ion source. The ion source is prepared by placing solid nanoparticles in a stainless tube, heating and vaporizing the solid nanoparticles into a gaseous state, and ionizing the gas. The gas can be formed at a lower heating temperature than when solid lumps are used because solid nanoparticles have a lower melting point than solid lumps. Thus, the heating temperature is lowered, and the preparing time of the ion source is shortened. Besides, under the same temperature, an ion source prepared from nanoparticles provides higher vapor pressure and allows a higher implantation dose than when the ion source is prepared from solid lumps, thus expanding the applicability of ion implantation technology. | 01-20-2011 |