Patent application number | Description | Published |
20090137110 | LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE - The invention provides a new method and chip scale package is provided. The inventions starts with a substrate over which a contact point is provided, the contact point is exposed through an opening created in the layer of passivation and a layer of polymer or elastomer. A barrier/seed layer is deposited, a first photoresist mask is created exposing the barrier/seed layer where this layer overlies the contact pad and, contiguous therewith, over a surface area that is adjacent to the contact pad and emanating in one direction from the contact pad. The exposed surface of the barrier/seed layer is electroplated for the creation of interconnect traces. The first photoresist mask is removed from the surface of the barrier/seed layer. A second photoresist mask, defining the solder bump, is created exposing the surface area of the barrier/seed layer that is adjacent to the contact pad and emanating in one direction from the contact pad. The solder bump is created in accordance with the second photoresist mask, the second photoresist mask is removed from the surface of the barrier/seed layer, exposing the electroplating and the barrier/seed layer with the metal plating overlying the barrier/seed layer. The exposed barrier/seed layer is etched in accordance with the pattern formed by the electroplating, reflow of the solder bump is optionally performed. | 05-28-2009 |
20100038803 | LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE - The invention provides a new method and chip scale package is provided. The inventions starts with a substrate over which a contact point is provided, the contact point is exposed through an opening created in the layer of passivation and a layer of polymer or elastomer. A barrier/seed layer is deposited, a first photoresist mask is created exposing the barrier/seed layer where this layer overlies the contact pad and, contiguous therewith, over a surface area that is adjacent to the contact pad and emanating in one direction from the contact pad. The exposed surface of the barrier/seed layer is electroplated for the creation of interconnect traces. The first photoresist mask is removed from the surface of the barrier/seed layer. A second photoresist mask, defining the solder bump, is created exposing the surface area of the barrier/seed layer that is adjacent to the contact pad and emanating in one direction from the contact pad. The solder bump is created in accordance with the second photoresist mask, the second photoresist mask is removed from the surface of the barrier/seed layer, exposing the electroplating and the barrier/seed layer with the metal plating overlying the barrier/seed layer. The exposed barrier/seed layer is etched in accordance with the pattern formed by the electroplating, reflow of the solder bump is optionally performed. | 02-18-2010 |
20100068846 | Package structure and fabrication method thereof - A package structure and fabrication method thereof. The structure includes a substrate having a terminal, a chip overlying the substrate, the chip having an active surface, having a center region and periphery region, the periphery region having an electrode thereon, a patterned cover plate overlying the chip and exposing the electrode, a conductive material electrically connecting the electrode and terminal, and an encapsulant covering the terminal, conductive material, and electrode, but exposing the cover plate overlying the center region of the chip. | 03-18-2010 |
Patent application number | Description | Published |
20130256915 | PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package includes a packaging substrate having a die attach area, a plurality of flow-guiding blocks disposed around an outer periphery of the die attach area, a first semiconductor element mounted on the die attach area, a second semiconductor element mounted on the first semiconductor element, and an underfill formed between the packaging substrate and the second semiconductor element. During filling of the underfill between the packaging substrate and the second semiconductor element, the flow-guiding blocks can guide a portion of the underfill to flow between the first semiconductor element and the second semiconductor element such that only one dispensing process is required for the underfill to completely encapsulate all conductive bumps used for flip-chip interconnection, thereby simplifying the fabrication process and improving the production efficiency. | 10-03-2013 |
20140008787 | CONDUCTIVE BUMP STRUCTURE AND METHOD OF FABRICATING A SEMICONDUCTOR STRUCTURE - A conductive bump structure used to be formed on a substrate having a plurality of bonding pads. The conductive bump structure includes a first metal layer formed on the bonding pads, a second metal layer formed on the first metal layer, and a third metal layer formed on the second metal layer. The second metal layer has a second melting point higher than a third melting point of the third metal layer. Therefore, a thermal compression bonding process is allowed to be performed to the third metal layer first so as to bond the substrate to another substrate, and then a reflow process can be performed to melt the second metal layer and the third metal layer into each other so as to form an alloy portion, thus avoiding cracking of the substrate. | 01-09-2014 |
20140008819 | SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE AND METHODS OF FABRICATING THE SAME - A substrate structure is provided, including a substrate and a strengthening member bonded to a surface of the substrate. The strengthening member has a CTE (Coefficient of Thermal Expansion) less than that of the substrate so as to effectively prevent warpage from occurring to the substrate structure. | 01-09-2014 |
20140027926 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package is provided, including: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top side of the interposer; a semiconductor element disposed on the top side of the interposer; and an adhesive formed between the interposer and the semiconductor element. By encapsulating the interposer with the encapsulant, warpage of the interposer is avoided and a planar surface is provided for the semiconductor element to be disposed thereon, thereby improving the reliability of electrical connection between the interposer and the semiconductor element. | 01-30-2014 |
20140070424 | SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE, AND INTERPOSER STRUCTURE OF THE SEMICONDUCTOR PACKAGE - A method of fabricating a semiconductor package is provided, including: cutting a substrate into a plurality of interposers; disposing the interposers in a plurality of openings of a carrier, wherein the openings are spaced from one another by a distance; forming a first encapsulant to encapsulate the interposers; removing the carrier; and disposing at least a semiconductor element on each of the interposers. By cutting the substrate first, good interposers can be selected and rearranged such that finished packages can be prevented from being wasted due to inferior interposers. | 03-13-2014 |
20140077387 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A fabrication method of a semiconductor package is provided, which includes the steps of: cutting a substrate into a plurality of interposers; disposing the interposers on a carrier, wherein the interposers are spaced from one another by a distance; disposing at least a semiconductor element on each of the interposers; forming an encapsulant to encapsulate the interposers and the semiconductor elements; and removing the carrier. Therefore, by cutting the substrate first, good interposers can be selected and rearranged such that finished packages can be prevented from being wasted due to inferior interposers. | 03-20-2014 |
20140084455 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is provided, which includes: a semiconductor substrate having opposite first and second surfaces; an adhesive layer formed on the first surface of the semiconductor substrate; at least a semiconductor chip disposed on the adhesive layer; an encapsulant formed on the adhesive layer for encapsulating the semiconductor chip; and a plurality of conductive posts penetrating the first and second surfaces of the semiconductor substrate and the adhesive layer and electrically connected to the semiconductor chip, thereby effectively reducing the fabrication cost, shortening the fabrication time and improving the product reliability. | 03-27-2014 |
20140084484 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is provided, which includes: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top surface of the interposer; a redistribution layer formed on the encapsulant and the top surface of the interposer; and at least a semiconductor element disposed on the redistribution layer. The top surface of the interposer is flush with a surface of the encapsulant so as for the redistribution layer to have a planar surface for disposing the semiconductor element, thereby preventing warpage of the interposer and improving the reliability of electrical connection between the redistribution layer and the semiconductor element. | 03-27-2014 |
20140127838 | METHOD OF TESTING A SEMICONDUCTOR PACKAGE - A method of testing a semiconductor package is provided, including: disposing at least an interposer on a top surface of an adhesive layer, the interposer having a first surface and a second surface opposite to the first surface, a plurality of conductive elements disposed between the second surface of the interposer and the adhesive layer; disposing at least a semiconductor chip on the first surface of the interposer, and performing an electrical test on the semiconductor chip via the conductive elements, wherein if there are a plurality of semiconductor chips that are disposed on the first surface of the interposer, the step of disposing the semiconductor chip and performing the electrical test on the semiconductor chip is iterated; and removing the adhesive layer. By using the method, the fabrication cost and equipment cost of the semiconductor package are reduced, and product yield is increased. | 05-08-2014 |
20140127864 | METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE - A method of fabricating a semiconductor package is provided, including providing an interposer having a plurality of conductive elements, disposing the interposer on a carrier having a plurality of recessed portions for the conductive elements to be received therein such that the interposer is coupled to the carrier, attaching the semiconductor element to the interposer, and removing the carrier. Coupling the interposer to the carrier prevents the conductive elements from displacement under pressure. Therefore, the conductive elements will not be in poor or no electrical contact with the interposer. | 05-08-2014 |
20140138791 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is provided. The semiconductor package includes a semiconductor chip having opposite first and second surfaces; an RDL structure formed on the first surface of the semiconductor chip and having opposite third and fourth surfaces and a plurality of first conductive through holes penetrating the third and fourth surfaces thereof, wherein the RDL structure is formed on the semiconductor chip through the fourth surface thereof and electrically connected to the semiconductor chip through a plurality of first conductive elements, and the third surface of the RDL structure has a redistribution layer formed thereon; a plurality of conductive bumps formed on the redistribution layer; and an encapsulant formed on the first surface of the semiconductor chip for encapsulating the RDL structure, wherein the conductive bumps are embedded in and exposed from the encapsulant. The invention effectively prevents warpage of the semiconductor package and improves the electrical connection significantly. | 05-22-2014 |
20140191386 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is provided. The semiconductor package includes a substrate; a semiconductor element having opposite active and inactive surfaces and disposed on the substrate via the active surface thereof, wherein the inactive surface of the semiconductor element is roughened; a thermally conductive layer bonded to the inactive surface of the semiconductor element; and a heat sink disposed on the thermally conductive layer. The roughened inactive surface facilitates the bonding between the semiconductor element and the thermally conductive layer so as to eliminate the need to perform a gold coating process and the use of a flux and consequently reduce the formation of voids in the thermally conductive layer. | 07-10-2014 |
20140264928 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A fabrication method of a semiconductor package is disclosed, which includes the steps of: disposing a plurality of first semiconductor elements on an interposer; forming a first encapsulant on the interposer for encapsulating the first semiconductor elements; disposing a plurality of second semiconductor elements on the first semiconductor elements; forming a second encapsulant on the first semiconductor elements and the first encapsulant for encapsulating the second semiconductor elements; and thinning the interposer, thereby reducing the overall stack thickness and preventing warpage of the interposer. | 09-18-2014 |
Patent application number | Description | Published |
20090060713 | DIRECTION-SWITCHABLE PNEUMATIC CYLINDER - A direction-switchable pneumatic cylinder includes: a cylinder body with two intakes, several exhaustion ports and a rotary shaft; and a predetermined number of movable wheels and fixed wheels arranged in the cylinder body and interlaced with each other. Each of the movable wheels and fixed wheels is formed with several vents concentrically arranged into an inner circle and an outer circle. The rotary shaft is fitted through the movable wheels and fixed wheels. The fixed wheels are not rotatable, while the movable wheels are synchronously rotatably with the rotary shaft. The outer circles of vents of the fixed wheels and the movable wheels are aligned with one intake, while the inner circles of vents of the fixed wheels and the movable wheels are aligned with the other intake. When high-pressure gas is guided into the pneumatic cylinder from one intake, the airflow will flow through the outer circles of vents to drive the movable wheels and the rotary shaft in one direction. When high-pressure gas is guided into the pneumatic cylinder from the other intake, the airflow will flow through the inner circles of vents to drive the movable wheels and the rotary shaft in another direction. | 03-05-2009 |
20090142998 | GRINDER WITH EASILY REPLACING GRINDING TOOL - A grinder has a main body formed with a shaft chamber and a rotary shaft rotatably mounted in the shaft chamber. One end of the rotary shaft outward protrudes from the main body for installing a grinding tool thereon. A passage and a slide way are formed in the main body. One end of the passage communicates with the shaft chamber. A front end of the slide way communicates with the passage. A chucking button is disposed in the passage. A link is movably arranged in the slide way. An activation switch is mounted on the main body for controlling the operation of the grinder. When the grinder is not activated, the chucking button can be pressed to chuck the rotary shaft for easy replacement of a grinding tool. When the activation switch is switched on to activate the grinder, the link is chucked in the chucking button to prevent the chucking button from being pressed. Accordingly, when the grinder operates, the chucking button cannot chuck the rotary shaft so as to ensure safety. When the rotary shaft is chucked by the chucking button, the activation switch cannot be switched on. | 06-04-2009 |
20110230125 | INSTALLATION/UNINSTALLATION STRUCTURE FOR TOOLING DISK OF A GRINDING TOOL - An installation/uninstallation structure for tooling disk of a grinding tool includes a rotary shaft mounted in the grinding tool and a securing assembly including a securing seat, a shift plate and a securing member. The securing member is movably mounted in the securing seat. The shift plate is pivotally disposed on the securing seat for driving the securing member. In use, the securing assembly is fitted around a rear end of the rotary shaft, when the shift plate is shifted to a locking position, the securing member is latched with the rotary shaft to secure the securing assembly to the rotary shaft for fixing the tooling disk. When the shift plate is shifted to an unlocking position, the securing member is unlatched from the rotary shaft, permitting a user to detach the securing assembly from the rotary shaft for taking off the tooling disk without using any tool. | 09-22-2011 |
Patent application number | Description | Published |
20090056600 | FURNACE - A furnace includes: a furnace housing defining a combustion chamber therein, the combustion chamber having a round cross-section, the furnace housing being formed with at least two air inlets that are in fluid communication with the combustion chamber and that are angularly displaced from each other; and an air pipeline including at least two branch pipes, each of which is connected to a respective one of the air inlets of the furnace housing and each of which extends in a tangential direction relative to the cross-section of the combustion chamber. | 03-05-2009 |
20090056601 | FURNACE - A furnace includes: a furnace housing defining a combustion chamber therein and having a top end section that is provided with an emergent stack which defines a gas-releasing channel in fluid communication with said combustion chamber; and a safety valve mounted in the gas-releasing channel and including a shaft that is secured to the emergent stack, and opposite first and second covering plates that are pivoted to the shaft so as to be rotatable relative to the shaft for closing and opening the gas-releasing channel. | 03-05-2009 |
20090056694 | FURNACE - A furnace includes: a furnace housing; a perforated tray mounted in the furnace housing; and a stirring rod disposed rotatably on the perforated tray. The stirring rod has top and bottom ends, two opposite lateral ends, a middle portion, and opposite first and second portions, each of which extends from the middle portion to a respective one of the lateral ends. Each of the first and second portions has an inclined face that extends between the top and bottom ends of the stirring rod from the respective one of the lateral ends toward the middle portion of the stirring rod, that is inclined relative to the perforated tray, and that faces toward the perforated tray. | 03-05-2009 |
20090056705 | COMBUSTION SYSTEM - A combustion system includes: a furnace housing defining a combustion chamber therein and having a gas outlet in fluid communication with the combustion chamber; a plenum housing surrounding and cooperating with the furnace housing to define a plenum chamber therebetween, and having an air inlet and an air outlet which are in fluid communication with the plenum chamber; and a heat exchanger housing disposed outwardly of the plenum housing and having an air inlet in fluid communication with the air outlet of the plenum housing, an air outlet, a gas inlet in fluid communication with the gas outlet of the furnace housing, and a gas outlet. | 03-05-2009 |
20090056923 | COMBUSTION SYSTEM - A combustion system includes: a furnace housing; a heat exchanger including a heat exchanger housing and a tube-bundled structure that has a plurality of exhaust tubes, upper and lower plates, and an end cap, top ends of the exhaust tubes being fixed to the upper plate, bottom ends of the exhaust tubes being fixed to the lower plate, the upper plate being fixed to a top end of the heat exchanger housing, the exhaust tubes being thermally expandable in a downward direction; and a manifold interconnecting a gas outlet of the furnace housing and a gas inlet of the heat exchanger housing. | 03-05-2009 |
20090057350 | FEED HOPPER SYSTEM - A feed hopper system includes: a hopper defining a chamber, the chamber having a lower portion; a stirring member; and a rotary feeding member disposed below the stirring member, mounted rotatably in the lower portion of the chamber of the hopper, and including a rotor that has first and second axial end portions. The rotary feeding member further includes a plurality of angularly spaced apart first blades that radiate from the first axial end portion of the rotor, and a plurality of angularly spaced apart second blades that radiate from the second axial end portion of the rotor. The first and second blades are alternately disposed. | 03-05-2009 |
Patent application number | Description | Published |
20080264502 | Water inlet device for a faucet - A water inlet device for a faucet includes a valve seat, a connecting pipe, and a plurality of locking screws. The valve seat includes a surrounding wall having a plurality of protrusions, each of the protrusions being provided with a respective screw hole, a base wall cooperating with the surrounding wall to define a valve space, and a branch pipe extending from the surrounding wall. The connecting pipe has a positioning plate portion disposed to abut against the base wall of the valve seat and formed with a plurality of fastener holes, a guide pipe portion, and an inner hole in spatial communication with the valve space in the valve seat. The locking screws extend respectively through the fastener holes in the positioning plate portion of the connecting pipe and engage threadedly and respectively the screw holes in the protrusions of the surrounding wall of the valve seat. | 10-30-2008 |
20080289697 | Water inlet device for mounting a valve body on a deck - A water inlet device is adapted for mounting a valve body on top of a deck, and includes a fixing unit and a connecting unit including a connecting component that is adapted to be secured to the valve body, and a coupling unit. The coupling unit includes first and second coupling components provided respectively on the fixing unit and the connecting component, and permits rotation of the connecting component relative to the fixing unit between a first position, where the connecting component is separable from the fixing unit, and a second position, where the connecting component is non-separable. One of the first and second coupling components is in a form of a slot having a circumferentially extending segment and a vertically extending segment. The other one is in a form of a protrusion that is extendible into and removable from the slot, when the connecting component is at the first position. | 11-27-2008 |
20080289698 | Water inlet device for mounting a valve body on a deck background of the invention - A water inlet device is adapted for mounting a valve body that is formed with a water inlet hole on top of a deck. The water inlet device includes a fixing unit adapted to be secured to the deck and formed with a water supply hole, a connecting unit, and a switch unit. The connecting unit includes a connecting component adapted to be secured to the valve body, and a coupling unit that permits rotation of the connecting component relative to the fixing unit between a first position, where the connecting component is separable from the fixing unit, and a second position, where the connecting component is non-separable. The switch unit is retained rotatably on the fixing unit, is coupled co-rotatably and separably to the connecting component, and blocks the water supply hole when the connecting component is at the first position. | 11-27-2008 |
20080289701 | Water inlet device for mounting a valve body on a deck - A water inlet device is adapted for mounting a valve body that is formed with a water inlet hole on top of a deck, is adapted to be connected to a water inlet pipe, and includes a fixing unit and a connecting unit. The fixing unit is adapted to be secured to the deck, and is formed with a water supply hole corresponding in position to the water inlet hole in the valve body and adapted for connection to the water inlet pipe. The connecting unit is adapted to couple the valve body to the fixing unit, and includes a connecting component adapted to be secured to the valve body and formed with a guide hole to fluidly communicate the water inlet hole in the valve body and the water supply hole in the fixing unit, and a positioning unit for connecting separably the connecting component to the fixing unit. | 11-27-2008 |
20090078325 | Water outlet device for a plastic faucet - A water outlet device includes a first pipe component having opposite first and second end portions and a first internal wall surface, a second pipe component having a third end portion and a second external wall surface, and a leakproofing component clamped between the pipe components. One of the first and third end portions is formed with a plurality of slits for imparting resiliency thereto in radial directions. One of the first internal wall surface at the first end portion and the second external wall surface at the second end portion is formed with an engaging hole, and the other one is formed with an engaging protrusion having an inclined guide surface. The third end portion is insertable fittingly into the first end portion to engage the engaging protrusion in the engaging hole. At least one of the first and second pipe components is an angled pipe component. | 03-26-2009 |
20100101017 | EASY MAINTENANCE SENSING TYPE AUTOMATIC FAUCET - A faucet includes a mounting unit and a valve unit. The mounting unit includes a fixed seat and a rotatable seat rotatable relative to the fixed seat. The fixed seat is formed with a plurality of inverted L-shaped retaining hooks. The valve unit includes a housing, a coupling member disposed in the housing, a valve seat, an electromagnetic valve, and an infrared sensor. The coupling member includes a plurality of L-shaped retaining grooves engaging respectively the retaining hooks. The retaining hooks can be removed from the retaining grooves to allow for maintenance and replacement of the valve unit. | 04-29-2010 |
20110061747 | FAUCET DEVICE - A faucet device includes a fixing unit having a water supply hole and a locking groove, a valve unit coupled separably to the fixing unit, a positioning unit, and a locking unit. The valve unit is movable between a first position to be connected to the fixing unit, and a second position to be separated from the fixing unit. The valve unit is rotatable relative to the fixing unit so as to be secured to the fixing unit by the positioning unit and to unblock the water supply hole, and is further rotatable reversely so as to be separable from the fixing unit and to block the water supply hole. The locking unit includes a locking component that is biased resiliently to engage the locking groove, and that is moved by the valve unit to be disengaged from the locking groove during movement of the valve unit from the second position to the first position. | 03-17-2011 |
20110272938 | FAST CONNECTING TUBE MODULE - A connecting tube module includes first and second tube members and a leakproofing member. The first tube member has an inner wall surface that is formed with a lock groove extending in a circumferential direction, and a slide groove extending parallel to a tube axis. The lock groove has an entrance end corresponding in location to the slide groove in a direction of the tube axis and a lock end opposite to the entrance end along the circumferential direction. The second tube member has an outer wall surface provided with a protruding block. The leakproofing member is disposed between the inner wall surface and the outer wall surface. When the second tube member is inserted into the first tube member, the protruding block slides along the slide groove into the entrance end and is disposed at the lock end upon relative rotation of the first and second tube members in the circumferential direction. | 11-10-2011 |
Patent application number | Description | Published |
20080197040 | Portable and Stackable Plastic Multipurpose Container - Portable and stackable multipurpose containers are disclosed. The containers have an oval base and an oval top in communication with sides of the wall extending perpendicularly from the base. The oval top is slidably positioned to open from both sides, which are perpendicular to the oval sides; the top is slidable. The multipurpose container is adapted for storing nails, screws, and similar items useful to craftsmen. | 08-21-2008 |
20100065519 | Tool Storage Device - A tool device is disclosed to include a hollow upright pivot shaft, coupling rings rotatably mounted on the hollow upright pivot shaft at different elevations, and support arms respectively coupled to the coupling rings and turnable with the respective coupling rings about the hollow upright pivot shaft, each support arm having a plurality of open receiving chambers respectively vertically cut through the top and bottom walls thereof for holding hand tools, each open receiving chamber having a front opening, a top opening connected to the top open side of the front opening, and a bottom opening. | 03-18-2010 |
20110036790 | VERTICAL TOOL STORAGE DEVICE - Disclosed is a vertical tool rack storage device which includes a hollow upright pivot shaft, a plurality of flat tool racks for holding tool bits and parts, and a plurality of connectors for pivotally coupling the flat tool racks to the hollow upright pivot shaft for enabling the tool racks to be arranged in a stack and individually turnable about the hollow upright pivot shaft. | 02-17-2011 |