Patent application number | Description | Published |
20120162960 | LIGHT-UNIFORMING ANTI-GLARING STRUCTURE AND LIGHT-EMITTING DEVICE - A light-uniforming anti-glaring structure includes a light-polarizing reflection unit and a light-polarizing position adjusting unit. The light-polarizing reflection unit includes a multilayer reflector composed of a plurality of inter-stacked polymer films. One of the inter-stacked polymer films is a birefringence material layer that conforms to the condition of NX≠NY≠NZ, wherein NX is the index of refraction of light at X direction, NY is the index of refraction of light at Y direction, and NZ is the index of refraction of light at Z direction. The light-polarizing position adjusting unit is coupled with the light-polarizing reflection unit for adjusting the position of the light-polarizing reflection unit. | 06-28-2012 |
20130077165 | VEHICLE DISPLAY MIRROR AND METHOD OF MANUFACTURING THE SAME - A vehicle display mirror includes a light-polarizing reflection unit and an image display unit. The light-polarizing reflection unit includes at least one multilayer reflector composed of a plurality of inter-stacked polymer films, and at least one of the inter-stacked polymer films is a birefringence material layer that conforms to the condition of NX≠NY≠NZ, wherein NX is the index of refraction of light at X direction, NY is the index of refraction of light at Y direction, and NZ is the index of refraction of light at Z direction. The image display unit includes at least one image display screen, and the multilayer reflector is disposed on the image display screen, thus the vehicle display mirror of the instant disclosure can be used as a rear-view mirror of the vehicle and provide a clear displayed screen for user in the vehicle. | 03-28-2013 |
20130107354 | MULTILAYER LIGHT-REFLECTING FILM AND METHOD FOR MANUFACTURING THE SAME | 05-02-2013 |
20130292871 | FEEDBLOCK MULTIPLIER WITH THICKNESS GRADIENT VARIATION, FEEDBLOCK SYSTEM, METHOD, AND RELATED MULTILAYER STRUCTURE - Disclosed are a feedblock multiplier with thickness gradient variation, a feedblock system, a method, and multilayer structure made by the method. The feedblock multiplier combines the functionalities of feedblock and multiplier conventionally used for producing the multilayer structure. The feedblock multiplier includes an input section for feeding fluid materials. A feedblock section is included for dividing the fluid delivered into multiple channels correspondingly. The fluids in the channels are segmented into two or more fluid segments by a segmenting section. The each fluid segment is delivered through corresponding channel-conversion section with thickness-gradient variation in the feedblock multiplier. Each channel-conversion section includes multiple channels with configurable positions. The fluids are then combined in a multiplier section for producing the multilayer structure with overlapped layers. The multilayer structure is outputted from an extruding section. | 11-07-2013 |
20130314788 | REFLECTIVE OPTICAL FILM AND METHOD OF MANUFACTURING THE SAME, AND IMAGE DISPLAY DEVICE - A reflective optical film includes a reflective light-polarizing unit including a multilayer reflective sheet composed of a plurality of polymer films stacked on top of one another. Each polymer film has a thickness, every two adjacent polymer films are two different materials, and the thicknesses of the polymer films are gradually decreased from two outmost sides of the multilayer reflective sheet to a middle of the multilayer reflective sheet. At least one of the polymer films is a birefringence material layer that conforms to the condition of NX≠NY≠NZ, where NX is the index of refraction of light at X direction of the multilayer reflective sheet, NY is the index of refraction of light at Y direction of the multilayer reflective sheet, and NZ is the index of refraction of light at Z direction of the multilayer reflective sheet. | 11-28-2013 |
20140111851 | APPARATUS MOUNTED WITH HEAT-INSULATION LIGHT-GUIDE FILM - The disclosure is related to an apparatus mounted with a heat-insulation light-guide film. The apparatus is a support with carriers capable of adjusting the received light quantity. The carrier is such as the slat of a shutter device and whose angle is adjustable. The heat-insulation light-guide film is exemplarily mounted on the slat, and which is made of a multilayer membrane and a surface textural layer in combination. The multilayer membrane includes multiple films and the adjacent layers are with different indexes of refraction. The materials and thicknesses of the membrane are configured to specify an optical band of light to be reflected. The surface textural layer is for guiding an incident light directed to the structure. The apparatus is as required to adjust the angle of the light hitting the film, and is applicable to a window for uses of heat-insulation, anti-glare, and illumination. | 04-24-2014 |
20140176859 | WIDE-COLOR GAMUT FILM, DISPLAY APPARATUS WITH THE WIDE-COLOR GAMUT FILM, AND METHOD FOR MANUFACTURING THE FILM - Disclosed are a wide-color gamut film and its applications. While the wide-color gamut film is manufactured, the method firstly confirms the type of the backlight. The film is designed to filter some specified frequency bands, especially the bands adjacent to the frequencies of red, green and blue lights. The parameters are referred to decide an overall thickness and an overall refractive index, and prepare a plurality of high-polymeric thin films. A wide-color gamut film is formed by assembling the thin films according to the configuration. The invention also relates to a display using the wide-color gamut film. The film is disposed between a panel module and a backlight module of the display. The film serves to reduce or filter out the light transmittance within the determined bands. The wide-color gamut film is provided for improving the crosstalk phenomenon among the frequency bands of the backlight. | 06-26-2014 |
Patent application number | Description | Published |
20120188175 | Single Finger Gesture Determination Method, Touch Control Chip, Touch Control System and Computer System - A single finger gesture determination method is disclosed. The single touch gesture determination method includes steps of detecting one or more trigger signals, determining respective categories under a plurality of gesture groups to which the one or more trigger signals belong according to the one or more trigger signals, and deciding a finger gesture represented by the one or more trigger signals according to the determined respective categories under the plurality of gesture groups. | 07-26-2012 |
20120223895 | Single-Finger and Multi-Touch Gesture Determination Method, Touch Control Chip, Touch Control System and Computer System - A single-finger and multi-touch gesture determination method is disclosed. The single touch and multi-touch gesture determination method includes steps of: for each of one or more touch points, judging a respective category under a first group to which the touch point belongs, according to an initial position of the touch point; for each of the one or more touch points, judging a respective category under a second group to which the touch point belongs, according to a moving pattern of the touch point, wherein the moving pattern is respectively defined in the judged category under the first group to which the touch point belongs; and determining a gesture represented by the one or more touch points according to the judged categories under the second group respectively to which the one or more touch points belong. | 09-06-2012 |
20120294401 | METHOD OF CALIBRATING SIGNAL SKEWS IN MIPI AND RELATED TRANSMISSION SYSTEM - In calibration mode, a clock signal and a data signal are respectively transmitted via a clock lane and a data lane of an MIPI. A test clock signal is provided by adjusting the phase of the clock signal, and a test data signal is provided by adjusting the phase of the data signal. By latching the test data signal according to the test clock signal, a latched data may be acquired for determining an optimized phase relationship corresponding to the clock lane and the data lane. When transmitting the clock signal and the data signal in normal mode, the signal delays of the clock lane and the data lane may be adjusted according to the optimized phase relationship. | 11-22-2012 |
20120313871 | TOUCH PANEL AND DISPLAY APPARATUS - A touch panel and a display apparatus are provided. The touch panel includes a substrate, first sensing lines, second sensing lines, first extending portions, second extending portions, and insulation pads. The first sensing lines are disposed on the substrate in parallel with a first direction. The second sensing lines are disposed on the substrate in parallel with a second direction. The first sensing lines intersect the second sensing lines to define meshes. The first extending portions are connected to the first sensing lines and extended toward the meshes. The second extending portions are connected to the second sensing lines and extended toward the meshes. The first extending portions and the second extending portions are distributed next to each other in the meshes. The insulation pads are disposed at where the first sensing lines intersect the second sensing lines to insulate the first sensing lines from the second sensing lines. | 12-13-2012 |
20120314392 | CAPACITOR ARRAY SUBSTRATE - A capacitor array substrate includes a substrate, first traces, second traces, capacitors, connecting lines, and signal lines. The substrate has a first, a second, and a third side. The first side is connected with the second and the third side. The first traces are disposed on the substrate in parallel and are not vertical or parallel to the first side. The second traces are disposed on the substrate in parallel. The capacitors are disposed on the substrate at intersections of the first and the second traces and are connected to the first and the second traces. The connecting lines are disposed on the second and the third side of the substrate. Each connecting line is connected to a first and a second trace. The signal lines are disposed on the substrate. Each signal line is connected to a first or a second trace and transmits signals from the first side. | 12-13-2012 |
20120319967 | SINGLE FPC BOARD FOR CONNECTING MULTIPLE MODULES AND TOUCH SENSITIVE DISPLAY MODULE USING THE SAME - A single flexible printed circuit (FPC) board for connecting multiple modules including a thin film is provided. The thin film has a first module connecting portion, a second module connecting portion and a third module connecting portion. The first module connecting portion is located on a first side of the thin film. The second module connecting portion and the third module connecting portion are located on a second side of the thin film. The first side is opposite to the second side. At least one first line is disposed between the first module connecting portion and the second module connecting portion. At least one second line is disposed between the first module connecting portion and the third module connecting portion. | 12-20-2012 |
20130044088 | DATA TRANSMISSION METHOD AND DISPLAY DRIVING SYSTEM - A data transmission method applied in a display, which includes a display panel, is provided. The data transmission method includes the following steps of: providing a host controller and n display drivers, n is a natural number greater than 1; providing a communication link under mobile industry processor interface (MIPI), connecting the host controller to the n display drivers; determining n virtual channel values Vc1-Vcn corresponding to the respective n display drivers; employing the host controller for providing a command with a virtual channel parameter through the communication link under MIPI; when the virtual channel parameter corresponds to an i | 02-21-2013 |
20130044089 | DATA TRANSMISSION METHOD AND DISPLAY DRIVING SYSTEM - A data transmission method applied in a display, which includes a display panel, is provided. The data transmission method includes the following steps of: providing a host controller and n display drivers, n is a natural number greater than 1; providing a communication link under mobile industry processor interface (MIPI), connecting the host controller to the n display drivers; determining n virtual channel values Vc | 02-21-2013 |
20140002115 | CAPACITANCE SENSING METHOD | 01-02-2014 |
20150022744 | SINGLE FPC BOARD FOR CONNECTING MULTIPLE MODULES AND TOUCH SENSITIVE DISPLAY MODULE USING THE SAME - A single flexible printed circuit (FPC) board for connecting multiple modules including a thin film is provided. The thin film has a first module connecting portion, a second module connecting portion and a third module connecting portion. The first module connecting portion is located on a first side of the thin film. The second module connecting portion and the third module connecting portion are located on a second side of the thin film. The first side is opposite to the second side. At least one first line is disposed between the first module connecting portion and the second module connecting portion. At least one second line is disposed between the first module connecting portion and the third module connecting portion. | 01-22-2015 |
Patent application number | Description | Published |
20120006951 | ONE-PIECE SUPPORT STAND - A one-piece support stand is provided for slantingly supporting an object on a work surface, and the support stand includes a central folding line for dividing the support stand into a left support panel and a right support panel interconnected with each other, and each of the support panels being substantially in a triangular shape and having a bottom edge and a bevel edge, and an inverted hook portion being formed at an intersection of the bottom edge and the bevel edge and bent towards the bevel edge, wherein the support stand is erected on the work surface by means of setting an included angle between the two bottom edges, and the two bevel edges and the two inverted hook portions being provided for supporting the object. The support stand features of a firm support, a foldable design, a convenient carry, a simple manufacturing procedure and a low manufacturing cost. | 01-12-2012 |
20120006962 | SUPPORTING STAND WITH ANGLE ADJUSTMENT FUNCTION - A supporting stand with an angle adjustment function includes two plates and an angle-adjusting means. The angle-adjusting means includes a locking ring, two protruding rings and an adjusting rod. The locking ring is provided on one plate and has axial grooves. The two protruding rings are provided on the other plate. The locking ring is coaxially disposed between the two protruding rings. One of the protruding rings is provided with a restricting slot aligned with the axial grooves. The adjusting rod penetrates the two protruding rings and the locking ring. The adjusting rod is formed with an engaging key engaged with one axial groove and the restricting slot. When the engaging key is removed from the axial groove, the two plates rotate relative to each other by using the adjusting rod as the center of rotation, thereby adjusting the inclination angle of the supported object. | 01-12-2012 |
20120024619 | PROTECTIVE SLEEVE HAVING AN EXTERNAL SOUND-AMPLIFYING MEMBER - A protective sleeve having an external sound-amplifying member is configured to cover a portable electronic product having an audio port, and it includes a covering element covering the portable electronic product and a sound-amplifying member. A surface of the covering element is provided with a connecting hole in communication with the audio port. The sound-amplifying member is hollow and connected to the outside of the covering element. One end of the sound-amplifying member is formed into an insertion section inserted into the connecting hole, and the other end thereof is formed into a sound-amplifying section. The sound of the portable electronic product is emitted from the audio port and amplified through the sound-amplifying member and the sound-amplifying section. By this structure, an external loud speaker is unnecessary, and the protective sleeve itself can generate a sufficient sound-amplifying effect, thereby increasing the functionality and practicability of the protective sleeve. | 02-02-2012 |
20120027237 | PROTECTIVE SLEEVE HAVING A BUILT-IN SOUND-AMPLIFYING CHANNEL - A protective sleeve having a built-in sound-amplifying channel is configured to cover a portable electronic product having an audio port. The protective sleeve includes an accommodating portion and a sound-amplifying channel. The accommodating portion is provided in the protective sleeve for allowing the portable electronic product to be accommodated therein. The sound-amplifying channel is formed in the protective sleeve. One end of the sound-amplifying channel is connected to the audio port, and the other end thereof protrudes from the protective sleeve to form a sound-amplifying section. The sound of the portable electronic product is emitted from the audio port and amplified through the sound-amplifying channel and the sound-amplifying section. Thus, an external loud speaker is unnecessary, and the protective sleeve itself can generate a good sound-amplifying effect, thereby increasing the functionality and practicability thereof greatly. | 02-02-2012 |
Patent application number | Description | Published |
20120137518 | METHOD FOR ASSEMBLING FINS-TYPE HEAT SINK - A method for assembling a fins-type heat sink includes providing a heat sink, a presser and a plurality of caps, the heat sink having a heat pipe and a plurality of fins disposed on the heat pipe, the presser being provided with through-holes allowing the distal ends of the heat pipe to be inserted therein, a periphery of each through-hole being provided with an annular neck, the presser being provided with notches that are arranged circumferentially outside the annular neck; (b) covering the caps on the annular necks of the presser respectively, each caps extending downwards to form protruding flaps penetrating the notches; (c) disposing a plate-like die on the topmost fin of the heat sink; (d) inserting a distal end of the heat pipe through the through-hole of the presser to abut inside the cap, while folding the flaps outwards via the plate-like die. | 06-07-2012 |
20120160458 | COOLER HAVING GROUND HEATED PLANE FOR COOLING HEATING ELECTRONIC COMPONENT - A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element. | 06-28-2012 |
20120276822 | APPARATUS FOR GRINDING HEATED PLANE OF COOLER - A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element. | 11-01-2012 |
20130094201 | Heat Dissipating Structure Of LED Circuit Board And LED Lamp Tube Comprised Thereof - A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board. The LED circuit board covered by the coating layer is placed in an LED lamp tube to provide good heat dissipation effect. | 04-18-2013 |
20130098584 | HEAT CONDUCTING STRUCTURE WITH COPLANAR HEATED PORTION, MANUFACTURING METHOD THEREOF, AND HEAT SINK THEREWITH - A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold ( | 04-25-2013 |
20130105134 | HEAT-DISSIPATING FIN CAPABLE OF INCREASING HEAT-DISSIPATING AREA | 05-02-2013 |
20130118716 | HEAT SINK HAVING HEAT-DISSIPATING FINS CAPABLE OF INCREASING HEAT-DISSIPATING AREA - A heat sink having heat-dissipating fins capable of increasing heat-dissipating area-includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink. | 05-16-2013 |
20130126129 | HEAT-DISSIPATING FINS - The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of a heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved. | 05-23-2013 |
20130126130 | HEAT SINK OF A LARGE AREA - The present invention relates to a heat sink of a large area, in which a heat-dissipating body is further provided in its limited space. The method for manufacturing a fin includes the steps of providing a fin, cutting the fin to form a foldable piece thereon, folding back the foldable piece to be overlapped on the fin and form an accommodating hole, and punching the folded piece and the fin to form two overlapped through-holes. The fin, the heat-dissipating body and heat pipes are assembled together to obtain the heat sink. Since the fins and the heat-dissipating body dissipate the heat of a heat-generating element simultaneously, the heat-dissipating efficiency of the heat sink can be improved. | 05-23-2013 |
20140041838 | HEAT PIPE ASSEMBLY AND HEAT DISSIPATION DEVICE HAVING THE SAME - A heat pipe assembly includes a number of heat pipes and a fixing seat. Each of the heat pipes includes an evaporating section and at least a condensing section. A bottom of the evaporating section of each of the heat pipes is flat and has a flat heat absorbing surface. The evaporating sections of each of the heat pipes are parallel to and adjoin with each other, whereby the flat heat absorbing surfaces of the evaporating sections of the heat pipes being coplanar and adjoining with each other. A top surface of the evaporating section of each of the heat pipes has a top edge. The fixing seat, as a molded one-piece member, combines with the top edge of the evaporating section of each of the heat pipes, whereby the heat absorbing surfaces of the evaporating sections of the heat pipes are coplanar and adjoin with each other. | 02-13-2014 |
Patent application number | Description | Published |
20120172737 | Measurement Device, Measurement System and Data Processing Method for Physiological signal - A measurement device for measuring a physiological signal of a testee includes a sensing unit for sensing physiological activities of the testee to generate the physiological signal, a data transmission unit for transmitting data to a host, a storage unit for storing data, and a control unit for deciding to use the data transmission unit to transmit the physiological signal to the host or to use the storage unit to store the physiological signal according to a connection status between the data transmission unit and the host. | 07-05-2012 |
20120245480 | ELECTROCARDIOGRAM SIGNAL SENSING MODULE, APPARATUS AND COMPUTER TO BE INTEGRATED THEREWITH - An electrocardiogram (ECG) signal sensing module is provide. The ECG signal sensing module includes at least one touchpad button, for producing a press signal when being pressed; at least one sensing electrode, mounted on the at least one touchpad button and moving in unison with the at least one touchpad button, for measuring the voltage on the portion thereof touched by a user; an electrocardiogram signal processor, coupled to the at least one sensing electrode, for processing the voltage on the at least one sensing electrode and producing an ECG signal; and a transmission interface, coupled to the at least one touchpad button and the electrocardiogram signal processor, for outputting the press signal and the ECG signal to a computer. | 09-27-2012 |
20130104632 | BIOCHIP | 05-02-2013 |
20130126597 | BIOCHIP DETECTING DEVICE AND BIOCHIP DETECTING METHOD - A biochip detecting device for detecting a biochip which has identifying information is provided. The biochip detecting device has a controller, a reader, a storage medium and a detecting module. The reader reading the identifying information, the storage medium saving a detecting information, and the detecting module detecting the biochip are electrically connected to the controller. The controller is suitable for determining the record of the identifying information in the detecting information and modifying the setting of the detecting module automatically according to the identifying information. A biochip detecting method is further provided. A biochip detecting device is used to read identifying information of the biochip to determine whether the biochip could be detected. Besides, the setting of a detecting module is automatically adjusted by a controller. The time for adjusting the setting of the detecting module is saved and the possibility of setup mistake could be reduced. | 05-23-2013 |
20130176129 | DROWSINESS DETECTION METHOD AND ASSOCIATED DEVICE - A drowsiness detection method for detecting drowsiness of a detection target is provided. The method includes a data collecting process including steps of: detecting physiological symptom information of the detection target; determining whether the detection target satisfies a predetermined drowsiness threshold condition according to the physiological symptom information; when the detection target satisfies the predetermined drowsiness threshold condition, triggering a stimulation event on the detection target; determining whether a response event is received from the detection target in response to the stimulation event; when the response event is not received, determining whether the stimulation event satisfies a threshold strength condition; and recording the physiological symptom information as a corresponding drowsiness detection condition of the detection target when the stimulation event satisfies the threshold strength condition. | 07-11-2013 |
20130200141 | Biochip Measuring System and Biochip Measuring Apparatus and Biochip and Stamp Marking and Identification Method - The present invention discloses a biochip measuring system. The cytometer system includes a biochip and a biochip measuring apparatus. The biochip includes a substrate, for carrying bio-molecule droplet, and a stamp marking area, for receiving or displaying a stamp for identifying whether the biochip is used. The biochip measuring apparatus includes a controller, a driver circuit, a driver interface, a light, a light detector, and a stamp marking unit, for marking the stamp on the stamp marking area of the biochip after the biochip measuring apparatus completes measurement of the biochip. | 08-08-2013 |
20130207804 | DRIVER DROWSINESS PREDICTION SYSTEM AND METHOD THEREOF - A driver drowsiness prediction system includes a vital signal detection unit, a control unit and a network bridge module. The vital signal detection unit detects vital signals of a driver. The control unit receives the driver's vital signs, and stores at least a feature signal. The feature signal represents the vital signal pattern of losing consciousness. The control unit continuously compares the detected vital signal with the feature signal. When the vital signal is similar to the feature signal, the control unit issues a pre-alarming command. The network bridge module receives the pre-alarming command and is triggered to perform a network connection process. The network bridge module logs into a pre-determined social website according to a login script, and then sends a pre-alarming message thereon, wherein the pre-alarming message includes an event indicating the driver is near unconsciousness. | 08-15-2013 |
20140285445 | PORTABLE DEVICE AND OPERATING METHOD THEREOF - An operating method for a portable device is provided, wherein the portable device has a touch sensing unit and a display unit coupled to the touch sensing unit. The display unit displays an icon menu comprising a plurality of icons. In the operating method, the touch sensing unit senses a touch action to generate a sensing signal. The sensing signal is analyzed to determine whether the touch action is a holding action. When the touch action is determined to be the holding action, a mis-touch recovering operation is performed on the icon corresponding to a contact region touched by the touch action. When it is determined that the touch action is not the holding action, a function corresponding to the icon corresponding to a contact region touched by the touch action is executed. | 09-25-2014 |
Patent application number | Description | Published |
20110298000 | CHIP PACKAGE - According to an embodiment of the invention, a chip package is provided, which includes: a substrate having a first surface and a second surface; an optical device between the first surface and the second surface of the substrate; a protection layer formed on the second surface of the substrate, wherein the protection layer has at least an opening; at least a conducting bump formed in the opening of the protection layer and electrically connected to the optical device; and a light shielding layer formed on the protection layer, wherein the light shielding layer is further extended onto a sidewall of the opening of the protection layer. | 12-08-2011 |
20130001621 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a light shielding layer disposed on the second surface of the substrate and directly contacting with the conducting layer, wherein the light shielding layer has a light shielding rate of more than about 80% and has at least an opening exposing the conducting layer; and a conducting bump disposed in the opening of the light shielding layer to electrically contact with the conducting layer, wherein all together the light shielding layer and the conducting bump substantially and completely cover the second surface of the substrate. | 01-03-2013 |
20130026523 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a first light shielding layer disposed on the second surface of the substrate; and a second light shielding layer disposed on the first light shielding layer and directly contacting with the first light shielding layer, wherein a contact interface is between the first light shielding layer and the second light shielding layer. | 01-31-2013 |
20130045549 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a method for forming a chip package which includes: providing a substrate having a first surface and a second surface, wherein at least one optoelectronic device is formed in the substrate; forming an insulating layer on the substrate; forming a conducting layer on the insulating layer on the substrate, wherein the conducting layer is electrically connected to the at least one optoelectronic device; and spraying a solution of light shielding material on the second surface of the substrate to form a light shielding layer on the second surface of the substrate. | 02-21-2013 |
20130307137 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - Embodiments of the present invention provide a chip package including: a semiconductor substrate having a first surface and a second surface; a device region formed in the semiconductor substrate; a dielectric layer disposed on the first surface; and a conducting pad structure disposed in the dielectric layer and electrically connected to the device region; a cover substrate disposed between the chip and the cover substrate, wherein the spacer layer, a cavity is created an surrounded by the chip and the cover substrate on the device region, and the spacer layer is in direct contact with the chip without any adhesion glue disposed between the chip and the spacer layer. | 11-21-2013 |
20130341747 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes: a chip including: a semiconductor substrate having a first surface; a device region formed in the semiconductor substrate; and a plurality of micro-lenses on the first surface and the device region; a cover substrate disposed on the chip, wherein the cover substrate is a transparent substrate; a spacer layer disposed between the chip and the cover substrate, wherein the spacer layer, the chip, and the cover substrate collectively surround a cavity in the device region; and at least one main lens on the cover substrate and in the cavity, wherein a width of the main lens is greater than that of each of the micro-lenses. | 12-26-2013 |
Patent application number | Description | Published |
20120216996 | THERMAL MODULE AND METHOD OF MANUFACTURING SAME - A thermal module and a method of manufacturing same are disclosed. The thermal module includes a radiating fin assembly and a base. The base has a bottom and a plurality of slot vertically extending through the base in a thickness direction thereof. The radiating fin assembly includes a plurality of radiating fins, each of which has a heat-dissipation end and a heat-absorption end. The heat-absorption ends are correspondingly extended through the slots and bent to bear on the bottom for contacting with a heat-producing element. Heat produced by the heat-producing element is absorbed by the heat-absorption ends and directly transferred from the heat-absorption ends to the heat-dissipation ends without the problem of thermal resistance. Therefore, upgraded heat transfer efficiency and excellent heat dissipation effect can be achieved with the thermal module. | 08-30-2012 |
20120261105 | LED HEAT SINK AND MANUFACTURING METHOD THEREOF - An LED heat sink and a manufacturing method thereof are disclosed. The LED heat sink includes a main body having a heat receiving section and an extended heat transfer section. The heat transfer section is externally provided with a plurality of receiving grooves for correspondingly connecting with a plurality of radiating fins. The LED heat sink manufacturing method includes the steps of molding a main body using a half-molten metal material and cooling the main body, so that the cooled main body is connected with a plurality of radiating fins to form an integral unit. With the LED heat sink manufacturing method, it is able to manufacture an LED heat sink having a relatively complicated radiating fin structure or being formed of two or more types of materials, and to largely reduce the time, labor and material costs of the LED heat sink. | 10-18-2012 |
20120314427 | LED HEAT SINK AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a LED heat sink and a method for manufacturing the same. According to the inventive method, ends of heat-dissipating fins are melted and combined with heat-conducting body by point discharge, thereby forming the LED heat sink. The LED heat sink includes the heat-conducting body and the heat-dissipating fins. The heat-conducting body has a heated portion and a heat-conducting portion. The heat-conducting portion is connected to the heat-dissipating fins. By this method, a heat sink of a complicated structure can be manufactured with multiple materials. Further, the working hours and production cost are reduced greatly. | 12-13-2012 |
20130202352 | FASTENING STRUCTURE FOR THERMAL MODULE - A fastening structure is provided for fastening a thermal module to a mainboard, and includes a main body having at least one elastic press portion, a fastening portion, and an insertion unit. The fastening portion is provided on an end of the main body and the insertion unit is outward extended from another opposite end of the main body. The elastic press portion is provided on the main body and located between the insertion unit and the fastening portion, and a flexible space is defined between the elastic press portion and the main body. With these arrangements, the fastening structure can be quickly assembled to the thermal module without the need of welding and can therefore be conveniently separated therefrom whenever reworking is necessary. | 08-08-2013 |
20130248145 | HEAT DISSIPATION DEVICE AND METHOD OF MANUFACTURING SAME - A heat dissipation device includes a mounting bracket and a thermal module. The mounting bracket has at least one retaining hole and a mounting section, and the thermal module includes a plurality of radiating fins, to which the mounting bracket is connected. On the radiating fins, at least one engaging zone is provided for correspondingly engaging with the mounting bracket, and at least one locking portion is formed for correspondingly engaging with the retaining hole. With the above structural design, the mounting bracket can be more firmly and stably connected to the thermal module and be more accurately located on the radiating fins without the need of welding, so that the manufacturing cost for welding is saved. A method of manufacturing the heat dissipation device is also disclosed. | 09-26-2013 |
20130277031 | HEAT-DISSIPATION UNIT AND METHOD OF MANUFACTURING SAME - A heat-dissipation unit includes a base and a plurality of radiating fins. The base has a plurality of grooves formed thereon, and each of the grooves has an open top and closed bottom. The radiating fins respectively have a heat-radiating zone and a bent zone. When a pressure is applied onto the bent zones, the bent zones respectively form an assembling section in the grooves to tightly fit therein. With the above arrangements, the radiating fins can be firmly locked to the base without the need of welding, so that the manufacturing cost is reduced and the problem of a damaged base due to assembling can be avoided. A method of manufacturing the above-described heat-dissipation unit is also disclosed. | 10-24-2013 |
20130299154 | THERMAL MODULE AND MANUFACTURING METHOD THEREOF - A thermal module and a manufacturing method thereof. The thermal module includes a radiating fin assembly and a base seat. The radiating fin assembly has at least one folded edge on one side. The folded edge has at least one connection section. The base seat has at least one fixing section corresponding to the connection section. The fixing section is latched with the folded edge. A pressure is applied to the fixing section to plastically deform the fixing section and press the fixing section against the folded edge so as to securely connect the radiating fin assembly with the base seat. The thermal module can be assembled without welding so that the working time is shortened and the manufacturing cost is lowered. | 11-14-2013 |
20140026417 | METHOD OF ASSEMBLING THERMAL MODULE - A method of assembling thermal module includes steps of providing a first heat dissipation member and a second heat dissipation member, and aiming a section of the first heat dissipation member at a section of the second heat dissipation member, which section of the first heat dissipation member is to be assembled with the section of the second heat dissipation member and driving the first heat dissipation member to connect with the second heat dissipation member by means of striking the first heat dissipation member into the second heat dissipation member. By means of the method, the thermal module can be assembled at higher efficiency. Moreover, the manufacturing process of the thermal module is simplified. | 01-30-2014 |
20140034277 | HEAT SINK STRUCTURE AND METHOD OF MANUFACTURING SAME - A heat sink structure and a method of manufacturing same are disclosed. The heat sink structure includes a main body and a plurality of radiating fins. The main body has a plurality of coupling flutes circumferentially spaced along an outer surface thereof and longitudinally extended from a first end to a second thereof. The radiating fins respectively have a bent section integrally located between a first and a second heat radiating section. To quickly assemble the radiating fins to the main body, the radiating fins are disposed in a forming mold, and the main body is mechanically driven into the forming mold at a high speed, so that the bent sections of the radiating fins are longitudinally forced into the coupling flutes from the first to the second end of the main body to thereby tightly connect the radiating fins to the main body. | 02-06-2014 |
20140034278 | HEAT SINK STRUCTURE AND MANUFACTURING METHOD THEREOF - A heat sink structure and a manufacturing method thereof. The heat sink includes a main body having multiple main body connection sections and multiple radiating fins each having a connection section. The main body has a first end and a second end. The first and second ends define a longitudinal direction. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the connection sections of the radiating fins placed in the mold are high-speed thrust into the main body connection sections and moved in the longitudinal direction to the second end of the main body to tightly integrally connect with the main body. | 02-06-2014 |
20140034279 | HEAT SINK STRUCTURE AND MANUFACTURING METHOD THEREOF - A heat sink structure and a manufacturing method thereof. The heat sink includes a main body and multiple radiating fins each having a folded root section. The main body has multiple connection channels formed on a circumference of the main body. | 02-06-2014 |
20140034280 | HEAT-DISSIPATING DEVICE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a heat-dissipating device and a method for manufacturing the same. The heat-dissipating device includes a base and a first heat-dissipating fin. The outer periphery of the base has a trough. The first heat-dissipating fin has a first heat-dissipating portion, a first end and a second end. The first end and the second end are disposed in the trough. By a machining process, both ends of the first heat-dissipating fin are pressed into the trough of the base at a high speed, so that the base can be combined with the first heat-dissipating fin rapidly. In this way, the manufacture cost is reduced and the heat-dissipating efficiency is increased. | 02-06-2014 |
20140068941 | RADIATING FIN, THERMAL MODULE FORMED WITH THE SAME, AND METHOD OF MANUFACTURING THE SAME - A radiating fin and a method of manufacturing the same are disclosed. The radiating fin includes a main body having a first side and an opposite second side, and being provided with at least one through hole to extend between the first and the second side for a heat pipe to extend therethrough; and at least one extension being formed on at least one of the first and the second side of the main body to locate around the at least one through hole and axially project from the main body. The extension is crimped to form a plurality of circumferentially alternate ridge portions and valley portions for tightly pressing against an outer surface of the heat pipe, so as to firmly bind the radiating fin to the heat pipe. A thermal module can be formed by sequentially binding a plurality of the radiating fins to the heat pipe. | 03-13-2014 |
20140090795 | LED HEAT SINK AND MANUFACTURING METHOD THEREOF - An LED heat sink and a manufacturing method thereof are disclosed. The LED heat sink includes a main body having a heat receiving section and an extended heat transfer section. The heat transfer section is externally provided with a plurality of receiving grooves for correspondingly connecting with a plurality of radiating fins. The LED heat sink manufacturing method includes the steps of molding a main body using a half-molten metal material and cooling the main body, so that the cooled main body is connected with a plurality of radiating fins to form an integral unit. With the LED heat sink manufacturing method, it is able to manufacture an LED heat sink having a relatively complicated radiating fin structure or being formed of two or more types of materials, and to largely reduce the time, labor and material costs of the LED heat sink. | 04-03-2014 |
20140248078 | FASTENING STRUCTURE FOR THERMAL MODULE - A fastening structure is provided for fastening a thermal module to a mainboard, and includes a main body having at least one elastic press portion, a fastening portion, and an insertion unit. The fastening portion is provided on an end of the main body and the insertion unit is outward extended from another opposite end of the main body. The elastic press portion is provided on the main body and located between the insertion unit and the fastening portion, and a flexible space is defined between the elastic press portion and the main body. With these arrangements, the fastening structure can be quickly assembled to the thermal module without the need of welding and can therefore be conveniently separated therefrom whenever reworking is necessary. | 09-04-2014 |
20140248079 | FASTENING STRUCTURE FOR THERMAL MODULE - A fastening structure is provided for fastening a thermal module to a mainboard, and includes a main body having at least one elastic press portion, a fastening portion, and an insertion unit. The fastening portion is provided on an end of the main body and the insertion unit is outward extended from another opposite end of the main body. The elastic press portion is provided on the main body and located between the insertion unit and the fastening portion, and a flexible space is defined between the elastic press portion and the main body. With these arrangements, the fastening structure can be quickly assembled to the thermal module without the need of welding and can therefore be conveniently separated therefrom whenever reworking is necessary. | 09-04-2014 |
20140248080 | FASTENING STRUCTURE FOR THERMAL MODULE - A fastening structure is provided for fastening a thermal module to a mainboard, and includes a main body having at least one elastic press portion, a fastening portion, and an insertion unit. The fastening portion is provided on an end of the main body and the insertion unit is outward extended from another opposite end of the main body. The elastic press portion is provided on the main body and located between the insertion unit and the fastening portion, and a flexible space is defined between the elastic press portion and the main body. With these arrangements, the fastening structure can be quickly assembled to the thermal module without the need of welding and can therefore be conveniently separated therefrom whenever reworking is necessary. | 09-04-2014 |
20140317928 | HEAT-DISSIPATION UNIT AND METHOD OF MANUFACTURING SAME - A heat-dissipation unit includes a base and a plurality of radiating fins. The base has a plurality of grooves formed thereon, and each of the grooves has an open top and closed bottom. The radiating fins respectively have a heat-radiating zone and a bent zone. When a pressure is applied onto the bent zones, the bent zones respectively form an assembling section in the grooves to tightly fit therein. With the above arrangements, the radiating fins can be firmly locked to the base without the need of welding, so that the manufacturing cost is reduced and the problem of a damaged base due to assembling can be avoided. A method of manufacturing the above-described heat-dissipation unit is also disclosed. | 10-30-2014 |
20140352150 | HEAT SINK STRUCTURE AND MANUFACTURING METHOD THEREOF - A heat sink structure and a manufacturing method thereof. The heat sink includes a main body and multiple radiating fins each having a folded root section. The main body has multiple connection channels formed on a circumference of the main body. The multiple radiating fins are placed in a mold. A mechanical processing measure is used to high-speed impact the main body so as to thrust the main body into the mold. Accordingly, the folded root sections of the radiating fins are relatively high-speed thrust into the connection channels of the main body to tightly integrally connect with the main body. | 12-04-2014 |
20140352919 | THERMAL MODULE CONNECTION STRUCTURE - A thermal module connection structure providing a substrate, a heat generation unit disposed on the substrate, includes: a heat dissipation unit disposed on the heat generation unit, a protrusion section outward extending from each of two sides of the heat dissipation unit; and a locating assembly including a first locating member and a second locating member mounted on two sides of the heat generation unit, which sides are free from the protrusion sections. A carrier member is disposed at each of two ends of the first locating member. The protrusion sections of the heat dissipation unit are positioned on the carrier members. One end of the carrier member is pivotally connected with the first locating member, while the other end is latched with the second locating member. The carrier member has a press member for pressing the protrusion section against the carrier member to fix the heat dissipation unit. | 12-04-2014 |
20150052731 | HEAT SINK STRUCTURE AND METHOD OF MANUFACTURING SAME - A heat sink structure and a method of manufacturing same are disclosed. The heat sink structure includes a main body and a plurality of radiating fins. The main body has a plurality of coupling flutes circumferentially spaced along an outer surface thereof and longitudinally extended from a first end to a second thereof. The radiating fins respectively have a bent section integrally located between a first and a second heat radiating section. To quickly assemble the radiating fins to the main body, the radiating fins are disposed in a forming mold, and the main body is mechanically driven into the forming mold at a high speed, so that the bent sections of the radiating fins are longitudinally forced into the coupling flutes from the first to the second end of the main body to thereby tightly connect the radiating fins to the main body. | 02-26-2015 |
20150052755 | HEAT-DISSIPATING DEVICE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a heat-dissipating device and a method for manufacturing the same. The heat-dissipating device includes a base and a first heat-dissipating fin. The outer periphery of the base has a trough. The first heat-dissipating fin has a first heat-dissipating portion, a first end and a second end. The first end and the second end are disposed in the trough. By a machining process, both ends of the first heat-dissipating fin are pressed into the trough of the base at a high speed, so that the base can be combined with the first heat-dissipating fin rapidly. In this way, the manufacture cost is reduced and the heat-dissipating efficiency is increased. | 02-26-2015 |
Patent application number | Description | Published |
20120224276 | COLOR FILTER ARRAY AND MANUFACTURING METHOD THEREOF - A color filter array and a manufacturing method thereof are provided. The color filter array includes a substrate, a light shielding structure and a plurality of color filter patterns. The substrate has a plurality of unit regions. The light shielding structure is disposed on the substrate and has a plurality of openings exposing the unit regions, and at least one sidewall of each of the openings of the light shielding structure has a plurality recess patterns. The color filter patterns are respectively disposed in the openings of the light shielding structure. | 09-06-2012 |
20130038958 | COLOR FILTER ARRAY AND MANUFACTURING METHOD THEREOF - A color filter array includes a substrate, a light shielding layer, and color filter patterns. The light shielding layer is on the substrate and has openings exposing a surface of the substrate. Besides, the light shielding layer has a height H. The color filter patterns are located in the openings of the light shielding layer. Each color filter pattern has the maximum film thickness Lc and the minimum film thickness Ls, and the difference between the maximum film thickness Lc and the minimum film thickness Ls is ΔL. The maximum film thickness Lc of each color filter pattern satisfies (m×H)02-14-2013 | |
20130120683 | PIXEL STRUCTURE AND DISPLAY PANEL - A pixel structure including a substrate, at least one switch, at least one color filter, a passivation layer and at least one pixel electrode is provided. The substrate has at least one sub-area. The switch is disposed on the sub-area and has an gate insulator that covers the sub-area of the substrate. The switch is electrically connected to a scan line and a data line. The color filter is disposed on the gate insulator, wherein the color filter is in contact with the switch and the gate insulator. A contact via is formed in the color filter and the gate insulator such that a part of the switch is exposed thereby. The pixel electrode is disposed on the passivation layer and electrically connected to the switch through the contact via. A display panel including the above-mentioned pixel structure is also provided. | 05-16-2013 |
20130128548 | COLOR FILTER ARRAY ON PIXEL ARRAY SUBSTRATE AND DISPLAY PANEL - A color filter array on pixel array substrate includes a substrate, an active device array, a wavelength converting layer, a first passivation layer, a second passivation layer, a color filter array, and a pixel electrode layer. The active device array is disposed on the substrate. The wavelength converting layer is disposed on the active device array and includes at least one first wavelength converting pattern. The first passivation layer is disposed on the wavelength converting layer and the active device array and covers the first wavelength converting pattern and the active device array. The color filter array is disposed on the first passivation layer and includes a plurality of first, second, and third color filter patterns disposed alternately. The first wavelength converting pattern is disposed corresponding to one first color filter pattern. The second passivation layer and the pixel electrode layer are sequentially disposed on the color filter array. | 05-23-2013 |
Patent application number | Description | Published |
20120098680 | INPUT DEVICE WITH GHOST KEY SUPPRESSION - An input device with ghost key suppression includes a switch module, a comparator, an exchange unit, a bias voltage resistor, and a processing module. The switch module includes a plurality of strobe lines, a plurality of sense lines, and a plurality of switch units. Each of the switch units has a switch and a resistor connected in series between a corresponding one of the strobe lines and a corresponding one of the sense lines. The comparator is configured for comparing a signal received at an input end thereof with a reference signal for generating the comparison signal. The exchange unit is electrically connected to the sense lines and the comparator, and is operable in response to a control input for making and breaking electrical connection between each of the sense lines and the input end of the comparator. The processing module controls operation of the switch module and the exchange unit based on the comparison signal. | 04-26-2012 |
20120187959 | Position Detecting Device - A position detecting device includes: a position indicator operable to resonate at a first frequency, upon receipt of an excitation signal, to oscillate at a second frequency different from the first frequency so as to generate an oscillation signal, and to transmit the oscillation signal thus generated; and a position detector operable to generate the excitation signal and to transmit the excitation signal to the position indicator, and configured to perform band pass filtering and amplitude detection upon the oscillation signal received thereby for generating a processed signal, and to obtain information corresponding to position of the position indicator relative to the position detector based on the processed signal. A frequency range of the band pass filtering includes the second frequency and excludes the first frequency. | 07-26-2012 |
20120223917 | Position Indicator - A position indicator is for use with a wireless platform operable to wirelessly transmit an excitation signal and to determine position of the position indicator relative to the wireless platform according to an oscillation signal received by the wireless platform. The position indicator includes: a working unit disposed in a casing unit, and operable to receive the excitation signal via a receiver coil, to generate the oscillation signal from the excitation signal, and to wirelessly transmit the oscillation signal via a transmitter coil; and a trigger unit disposed in the receiving space, and including a core part having first and second sections that correspond respectively in position to the transmitter and receiver coils, the first section of the core part having a varying permeability value, the second section of the core part having a substantially non-varying permeability value. | 09-06-2012 |
20150015527 | POSITION DETECTING METHOD AND SYSTEM - A position detecting method includes: transmitting to a position indicator a first excitation signal that has a variable frequency and then receiving a first response signal therefrom, via a target antenna unit including a target antenna; determining, based on the first response signal, a target frequency of the first excitation signal at which the first response signal has a maximum energy level; continuously transmitting to the position indicator a second excitation signal that has the target frequency and then receiving a second response signal from the position indicator, via a group of antenna units including the target antenna unit individually and successively; and obtaining position information corresponding to the position indicator based on the second response signal. | 01-15-2015 |
Patent application number | Description | Published |
20110278701 | Scribe line structure for wafer dicing - The scribe line structure for wafer dicing according to the present invention includes a plurality of metal structures arranged up-and-down on a substrate in a dielectric layer, and an upper one of the metal structures has a lower metal density than a lower one of the metal structures. In another aspect, the scribe line structure for wafer dicing includes a plurality of metal structures arranged up-and-down on a substrate in a dielectric layer, and each of the metal structures has a lower metal density on a dicing path for the wafer dicing than not on the dicing path. The scribe line structure can effectively avoid interlayer delamination or peeling issue caused by a dicing process, especially on a low-k/Cu wafer. | 11-17-2011 |
20130119532 | Bumps for Chip Scale Packaging - A chip scale semiconductor device comprises a semiconductor die, a first bump and a second bump. The first bump having a first diameter and a first height is formed on an outer region of the semiconductor die. A second bump having a second diameter and a second height is formed on an inner region of the semiconductor die. The second diameter is greater than the first diameter while the second height is the same as the first height. By changing the shape of the bump, the stress and strain can be redistributed through the bump. As a result, the thermal cycling reliability of the chip scale semiconductor device is improved. | 05-16-2013 |
20130127040 | DIE CARRIER FOR PACKAGE ON PACKAGE ASSEMBLY - A package-on-package arrangement for maintaining die alignment during a reflow operation is provided. A first top die has a first arrangement of solder bumps. A bottom package has a first electrical arrangement to electrically connect to the first arrangement of solder bumps. A die carrier has a plurality of mounting regions defined on its bottom surface, wherein the first top die is adhered to the die carrier at a first of the plurality of mounting regions. One of a second top die and a dummy die having a second arrangement of solder bumps is also fixed to the die carrier at a second of the plurality of mounting regions of the die carrier. The first and second arrangements of solder bumps are symmetric to one another, therein balancing a surface tension during a reflow operation, and generally fixing an orientation of the die carrier with respect to the bottom package. | 05-23-2013 |
20130127045 | MECHANISMS FOR FORMING FINE-PITCH COPPER BUMP STRUCTURES - The mechanisms of forming a copper post structures described enable formation of copper post structures on a flat conductive surface. In addition, the copper post structures are supported by a molding layer with a Young's modulus (or a harder material) higher than polyimide. The copper post structures formed greatly reduce the risk of cracking of passivation layer and delamination of at the dielectric interface surrounding the copper post structures. | 05-23-2013 |
20130134563 | Electrical Connection Structure - A structure comprises a top metal connector formed underneath a bond pad. The bond pad is enclosed by a first passivation layer and a second passivation layer. A polymer layer is further formed on the second passivation layer. The dimension of an opening in the first passivation layer is less than the dimension of the top metal connector. The dimension of the top metal connector is less than the dimensions of an opening in the second passivation layer and an opening in the polymer layer. | 05-30-2013 |
20130256870 | PACKAGING DEVICE AND METHOD OF MAKING THE SAME - A device includes a first and a second package component. A metal trace is disposed on a surface of the first package component. The metal trace has a lengthwise direction. The second package component includes a metal pillar, wherein the second package component is disposed over the first package component. A solder region bonds the metal pillar to the metal trace, wherein the solder region contacts a top surface of the metal trace. | 10-03-2013 |
20130256874 | Elongated Bumps in Integrated Circuit Devices - A device includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. The passivation layer has a first opening overlapping the metal pad, wherein the first opening has a first lateral dimension measured in a direction parallel to a major surface of the substrate. A polymer layer is over the passivation layer and covering the edge portions of the metal pad. The polymer layer has a second opening overlapping the metal pad. The second opening has a second lateral dimension measured in the direction. The first lateral dimension is greater than the second lateral dimension by more than about 7 μm. A Under-Bump metallurgy (UBM) includes a first portion in the second opening, and a second portion overlying portions of the polymer layer. | 10-03-2013 |
20130288473 | Electrical Connection Structure - A structure comprises a top metal connector formed underneath a bond pad. The bond pad is enclosed by a first passivation layer and a second passivation layer. A polymer layer is further formed on the second passivation layer. The dimension of an opening in the first passivation layer is less than the dimension of the top metal connector. The dimension of the top metal connector is less than the dimensions of an opening in the second passivation layer and an opening in the polymer layer. | 10-31-2013 |
20140008785 | Package Redistribution Layer Structure and Method of Forming Same - A package-on-package (PoP) device comprises a bottom package on a substrate and a first set of conductive elements coupling the bottom package and the substrate. The PoP device further comprises a top package over the bottom package and a redistribution layer coupling the top package to the substrate. A method of forming a PoP device comprises coupling a first package to a substrate; and forming a redistribution layer over the first package and a top surface of the substrate. The method further comprises coupling a second package to the redistribution layer, wherein the redistribution layer couples the second package to the substrate. | 01-09-2014 |
20140054750 | Scribe line structure for wafer dicing and method of making the same - A scribe line structure between die regions is disclosed. The scribe line structure includes a dielectric layer disposed on a substrate; and a plurality of metal structures arranged up-and-down in the dielectric layer on the substrate, the plurality of metal structures comprising metal layers and metal vias, wherein the metal vias are disposed on the dicing path and regions outside the dicing path and the metal vias on the dicing path have a lower metal density than the metal vias not on the dicing path. | 02-27-2014 |
20140191394 | Bumps for Chip Scale Packaging - A chip scale semiconductor device comprises a semiconductor die, a first bump and a second bump. The first bump having a first diameter and a first height is formed on an outer region of the semiconductor die. A second bump having a second diameter and a second height is formed on an inner region of the semiconductor die. The second diameter is greater than the first diameter while the second height is the same as the first height. By changing the shape of the bump, the stress and strain can be redistributed through the bump. As a result, the thermal cycling reliability of the chip scale semiconductor device is improved. | 07-10-2014 |
20140252591 | REINFORCEMENT STRUCTURE AND METHOD FOR CONTROLLING WARPAGE OF CHIP MOUNTED ON SUBSTRATE - A semiconductor device comprises a substrate, a die mounted on the substrate, a reinforcement plate bonded to the die, and an adhesive layer coupling the reinforcement plate to the die. | 09-11-2014 |
20140264803 | PACKAGE DEVICE INCLUDING AN OPENING IN A FLEXIBLE SUBSTRATE AND METHODS OF FORMING THE SAME - Methods and apparatus are disclosed for forming ultra-thin packages for semiconductor devices on flexible substrates. A flexible substrate may comprise a plurality of insulating layers and redistribution layers. Openings of the flexible substrate may be formed at one side of the flexible substrate, two sides of the flexible substrate, or simply cut through the flexible substrate to divide the flexible substrate into two parts. Connectors may be placed within the opening of the flexible substrate and connected to redistribution layers of the flexible substrate. Dies can be attached to the connectors and electrically connected to the connectors and to the redistribution layers of the flexible substrate. Structure supports may be placed at another side of the flexible substrate on the surface or within an opening. | 09-18-2014 |
Patent application number | Description | Published |
20120047358 | METHOD AND SYSTEM FOR ACCELERATING BOOTING PROCESS - A method and a system for accelerating booting process are provided. The method is adapted to an electronic device having a processor, an embedded controller, and a system memory, in which program codes of a basic input/output system (BIOS) and the embedded controller of the electronic apparatus are commonly stored in the system memory. In the method, when receiving a booting triggering signal of the electronic apparatus, the processor controls the embedded controller to cease accessing the system memory, so as to load the BIOS program code from the system memory to a cache memory and execute power-on self test (POST) procedure. After the program code is loaded, the processor controls the embedded controller to return to a normal mode so as to access the system memory and execute monitoring functions. | 02-23-2012 |
20120090478 | MACHINE FOR CUTTING AND GRINDING FRUITS, VEGETABLES AND FOODS - A machine for cutting and grinding fruits, vegetables and foods includes a frame, an operating motor is disposed in the frame, and a cutting and grinding component is disposed above the frame. The cutting and grinding component includes an adapter, in which, an openable and closable juice outlet is disposed at a side of the adapter, a container is located above the adapter, a space is formed between the top of the adapter and the bottom of the container, and the space is in communication with the juice outlet. In addition, a cutting tool, a first abrasive disc and a second abrasive disc are sequentially disposed between the bottom of the container and the top of the adapter from top to bottom, and the cutting tool, the second abrasive disc and a spindle are coaxially connected. Thereby, when the operating motor operates, the cutting tool cuts the fruits, vegetables and foods in the container, and the first abrasive disc and the second abrasive disc grind the cut fruits, vegetables and foods, and then juice flows out from the juice outlet after grinding. | 04-19-2012 |
20120311310 | COMPUTER SYSTEM AND METHOD FOR RESETTING THE SAME - A computer system and a method for resetting the same are provided. The computer system includes a basic input output system (BIOS) chip and a keyboard controller. In the method, the BIOS chip monitors the keyboard controller to determine whether a time that the keyboard controller remains in a hang up state reaches an idle time limit. Besides, the keyboard controller monitors the BIOS chip to determine whether a time that the BIOS chip remains in the hang up state reaches the idle time limit When it is determined that the time of one of the BIOS chip and the keyboard controller remaining in the hang up state reaches the idle time limit, the computer system is reset in accordance with a hardware reset signal trigger by the other one of the BIOS chip and the keyboard controller. | 12-06-2012 |
20130256437 | CIRCULATING PROCESSOR - A circulating processor includes a base, a container, a cutlery and a pressurizing mechanism. An operating motor is disposed in the base and is disposed with a mandrel therein. The container is disposed above the base, where a space is formed on its bottom part, and a reflux opening is formed on its upper half part and in communication with the space. The cutlery is positioned on the container's bottom part and connected to the mandrel. Thereby, when the operating motor operates, the mandrel and the cutlery are enabled to rotate synchronously, to mash food, vegetables and fruits in the container. The pressurizing mechanism is in communication with the space of the container. Through the pressurizing effect of the pressurizing mechanism, the mashed food, vegetables and fruits can be transferred into the container via the reflux opening, so as to perform circulating mashing treatment. | 10-03-2013 |
20140099693 | HIGH CONCENTRATION H2S ELIMINATION SYSTEM AND HIGH CONCENTRATION H2S ELIMINATION METHOD - A high concentration H | 04-10-2014 |
20140327425 | PORTABLE ELECTRONIC APPARATUS AND POWER MANAGEMENT METHOD THEREOF - A portable electronic apparatus and a power management method are provided. The portable electronic apparatus includes a power manager and a controller. The power manager is used to receive a supply power generated by a power adapter. The power manager determines whether to generate a detecting signal by detecting whether a voltage value variation of the supply power is greater than a preset range. The power manager generates a current detecting value according to an input current provided by the supply power. The controller receives the detecting signal and the current detecting value, and generates an input current limit value according to a receiving status of the detecting signal and the current detecting value. The power manager controls the input current according to the input current limit value. | 11-06-2014 |
20140338445 | METHOD OF UTILIZING MOBILE DEVICE TO DETECT EMERGENCY AND RELATED EMERGENCY DETECTING SYSTEM - A method of utilizing a mobile device to detect an emergency includes detecting whether the mobile device is carried by a user; detecting an acceleration status of the mobile device when the mobile device is determined to be carried by the user; and determining whether the user is in the emergency according to the acceleration status of the mobile device. | 11-20-2014 |
Patent application number | Description | Published |
20120169601 | WIRELESS MOUSE AND CHARGING SYSTEM USING THE SAME - A wireless mouse and a charging system using the same are provided. The wireless mouse includes a main body, an intermediary unit, a battery and a wireless transmitting unit. The main body has a bottom surface. The intermediary unit includes a frame, a first connector and a second connector. The frame is connected to the bottom surface of the main body. The first and second connectors are accommodated in the frame. The battery is disposed in the main body and electrically connected to the intermediary unit. The wireless transmitting unit is disposed on one side of the intermediary unit with the intermediary unit located between the wireless transmitting unit and the main body. | 07-05-2012 |
20120170220 | KEYBOARD - A keyboard including a case, a first fan, an air deflector and a keycap module is provided. The case includes a first side and a second side. The first side has an opening, the second side is disposed at a side of the first side and has at least one hole. The first fan is disposed at the second side and located between the first side and the second side. The air deflector is disposed between the first side and the second side of the case and corresponding to the hole of the second side and the opening of the first side. The keycap module is disposed at the opening of the first side. | 07-05-2012 |
20120319953 | MOUSE WITH SWITCH DEVICE AND SWITCH DEVICE THEREOF - A switch device includes a positive power terminal, a negative power terminal, a plurality of battery slots and a change-over switch. Each battery slot has a positive battery terminal and a negative battery terminal. The positive battery terminal of a battery slot electrically connects to the positive power terminal. The negative battery terminal of another battery slot electrically connects to the negative power terminal. The change-over switch electrically connects with the positive power terminal, the negative power terminal, the negative battery terminal of the battery slot which electrically connecting to the positive power terminal, and the positive battery terminal of the battery slot which electrically connecting to the negative power terminal. The change-over switch is toggled to connect the battery slots as a parallel connection or a series connection optionally. | 12-20-2012 |
20130076628 | MOUSE WITH ADJUSTABLE RESOLUTION FUNCTION - A mouse with an adjustable resolution function executes the cursor control function normally. The mouse includes an adjustment unit, a processor, and a sensor unit. The adjustment unit optionally generates an adjusting signal and transmits the adjusting signal to the processor. The processor receives the adjusting signal, generates a control signal correspondingly and transmits the control signal to the sensor unit. According to the control signal and the moving path of the mouse, the sensor unit correspondingly generates a displacement signal to the processor and enables the mouse to execute the cursor moving function in accordance with the displacement signal. | 03-28-2013 |
20130140165 | INPUT DEVICE AND MANUFACTURING METHOD THEREOF - An input device and a manufacturing method of the input device are provided. The input device includes a circuit board and a plurality of mechanical switches. The circuit board has a first surface, a second surface and a plurality of conductive sheets. A plurality of holes are formed on the circuit board and the conductive sheets are disposed at one side of the first surface in pairs around the hole, and the conductive sheets have a coupling section bent toward the first surface along the direction of the second surface. The mechanical switches are detachable from the circuit board and include a plunger and a plurality of pins. Each of the plungers has a positioning column embedded in the hole. One end of the pin is connected to the plunger, and the other end of the pin is attached to the coupling section of the conductive sheets. | 06-06-2013 |
20130142376 | EARMUFF AND HEADSET WITH THE SAME - An earmuff which is adapted to covering a driver includes a first case having a first through hole and a second case having a second through hole. The second case accommodated within the first case to form an inner chamber where the driver is disposed therein. Since air flows between the first case and the second case via the first through hole and the second through hole, a satisfactory ventilation effect can be achieved and thus feeling of being at ease can be furnished. | 06-06-2013 |
20130278505 | WIRELESS INPUT DEVICE - A wireless input device configured for a computer device is provided. The wireless input device includes a main body and an extension base, wherein the main body has a control unit, an operating unit, a switch, and a first wireless transceiver unit, and the extension base has a processor, a memory unit, a second wireless transceiver unit, and a display. When the switch is triggered, the switch transmits a switch signal to the control unit, and the control unit, according to the operating signal, transmits an adjusting signal to the processor of the extension base in response to the switch signal via the first wireless transceiver unit and the second wireless transceiver unit. The processor changes the parameter(s) in the memory unit according to the adjusting signal and then the changed parameter(s) is stored in the memory unit. | 10-24-2013 |
20140022748 | MOUSE DEVICE - A mouse device used on a surface includes a main body, a circuit assembly and a back cover. The main body includes a bottom and at least one slot formed at the bottom. The circuit assembly is disposed within the main body and executing a default function of the mouse device. The back cover comprises a first side, a second side, at least one hook at the first side, and a plurality of pads at the second side. The back cover contacts with the surface via the plurality of the pads, is disposed detachably at the bottom of the main body and is buckled to the slot by the hook. | 01-23-2014 |
20140132520 | KEYBOARD - A keyboard is used for operating an electronic device, wherein an operation system of the electronic device has a plurality of graphical user interfaces. The keyboard includes a main body, a plurality of keycaps, a circuit board and an interface switching button, wherein the keycaps and the interface switching button are disposed on the body and move along up and down directions with respect to the main body when pressed. The circuit board is electrically provided with a plurality of trigger switches and a controller. When the trigger switches are triggered, the controller outputs an operating signal to electronic device. When the corresponding trigger switch is triggered, the controller outputs a switching signal to the electronic device, so as to execute one of the user interfaces. Besides, the objective of the present invention is to switch different user interfaces on the operation system via operating the function switching button. | 05-15-2014 |
20140185855 | HEADPHONE DEVICE - A headphone device includes a first audio output module, a second audio output module, and a head module connected between the first and second audio output modules that are located at both ends of the head module respectively. The head module stays bent when in use and stays straight when in compact storage. Thus the form factor of the headphone device in compact storage is relatively smaller. | 07-03-2014 |
20140219481 | MULTIPLE SOUND CHANNELS SPEAKER - A multiple sound channels speaker is disclosed herein and includes a first speaker, at least one second speaker, a sensing switch and an audio decoder. The second speaker is adjacent to the first speaker, and the sensing switch is disposed between the first speaker and the second speaker. The audio decoder is electrically connected to the sensing switch. When the second speaker and the first speaker are separated, the sensing switch outputs a signal to the audio decoder and the sound channels are switched. | 08-07-2014 |
Patent application number | Description | Published |
20120122281 | METHOD FOR FABRICATING A GaN-BASED THIN FILM TRANSISTOR - A method for fabricating a GaN-based thin film transistor includes: forming a semiconductor epitaxial layer on a substrate, the semiconductor epitaxial layer having a n-type GaN-based semiconductor material; forming an insulating layer on the semiconductor epitaxial layer; forming an ion implanting mask on the insulating layer, the ion implanting mask having an opening to partially expose the insulating layer; ion-implanting a p-type impurity through the opening and the insulating layer to form a p-doped region in the n-type GaN-based semiconductor material, followed by removing the insulating layer and the ion implanting mask; forming a dielectric layer on the semiconductor epitaxial layer; partially removing the dielectric layer; forming source and drain electrodes; and forming a gate electrode. | 05-17-2012 |
20120313107 | Semiconductor Device - A semiconductor device includes a main body made of a GaN-based semiconductor material, and at least one electrode structure. The electrode structure includes an ohmic contact layer that is formed on the main body, a buffer layer that is formed on the ohmic contact layer opposite to the main body, and a circuit layer that is made of a copper-based material and that is formed on the buffer layer opposite to the ohmic contact layer. The ohmic contact layer is made of a material selected from titanium, aluminum, nickel, and alloys thereof. The buffer layer is made of a material different from the material of the ohmic contact layer and selected from titanium, tungsten, titanium nitride, tungsten nitride, and combinations thereof. | 12-13-2012 |
20130175537 | HIGH ELECTRON MOBILITY GaN-BASED TRANSISTOR STRUCTURE - A high electron mobility GaN-based transistor structure comprises a substrate, an epitaxial GaN layer formed on the substrate, at least one ohmic contact layer formed on the epitaxial GaN layer, a metallic gate layer formed on the epitaxial GaN layer, and a diffusion barrier layer interposed between the metallic gate layer and the epitaxial GaN layer. The diffusion barrier layer hinders metallic atoms of the metallic gate layer from diffusing into the epitaxial GaN layer, whereby are improved the electric characteristics and reliability of the GaN-based transistor. | 07-11-2013 |
20140346523 | Enhanced GaN Transistor and the Forming Method Thereof - An enhanced GaN transistor is provided. The structure comprises a substrate, a heterostructure, a p-element epitaxy growth layer, a drain ohmic contact and a source ohmic contact disposed on the heterostructure and on two sides of the p-element epitaxy growth layer, a gate structure disposed on the p-element epitaxy growth layer, and is separated from the drain ohmic contact and the source ohmic contact, a surface passivation layer covered the drain ohmic contact, source ohmic contact, and p-element epitaxy growth layer, and covered portion of the gate structure. | 11-27-2014 |
Patent application number | Description | Published |
20120205368 | HINGE MECHANISM AND CLAMSHELL DEVICE THEREOF - A hinge mechanism and a clamshell device thereof are disclosed. The clamshell device includes a first cover and a second cover and the first cover can rotate with respect to the second cover via the hinge mechanism. The hinge mechanism includes a main body, an elastic component, and a base. The main body is connected to the first cover and includes a shaft and a projecting part. The elastic component covers the shaft. An internal diameter of the elastic component matches with an outer diameter of the shaft so as to generate a friction force. The first cover can be maintained at any angle by the friction force. The elastic component has a groove used for connecting with the projecting part when the main body rotates to a specific angle. The base is connected to the second cover and has a stop structure used for fixing the elastic component. | 08-16-2012 |
20120306557 | CALIBRATION CIRCUIT AND CALIBRATION METHOD - A calibration circuit and a calibration method are provided. The calibration circuit has a delay circuit, a phase detector, and a controller. The delay circuit delays an input signal to output an output signal, wherein a delay time between the input signal and the output signal is related to an equivalent capacitance and an equivalent resistance of the delay circuit. The phase detector coupled to the delay circuit compares the phases of the input signal and the output signal. The controller coupled to the delay circuit and the phase detector generates a control signal according to the comparison result of the phase detector to adjust the equivalent resistance of the delay circuit. | 12-06-2012 |
20130071176 | QUICK-RELEASE FIXING STRUCTURE FOR ELECTRONIC EQUIPMENTS - In a quick-release fixing structure for an electronic equipment, the electronic equipment includes a plurality of holes and a snap slot, and the quick-release fixing structure includes a substrate, a turning element and a plurality of fixing elements. The substrate includes a plurality of grooves and a port, and each groove includes a first groove hole and a second groove hole interconnected to the first groove hole, and the second groove hole is greater than the first groove hole. The turning element is coupled to the substrate and includes a bump exposed from the port and snapped into the snap slot. Each fixing element is passed through each first groove hole and fixed to each hole. The turning element can be turned to push the electronic equipment to move each fixing element into each second groove hole, and separate the electronic equipment from the substrate. | 03-21-2013 |
20130175264 | Hinge Mechanism and Clamshell Device Thereof - A hinge mechanism and a clamshell device thereof are disclosed. The hinge mechanism includes a base, an axis portion, and a magnetic ring. The base is a metal material and has a pivot portion. The axis portion is pivoted to the pivot portion and can rotate with respect to the base, wherein the axis portion has at least one guiding groove. The magnetic ring is connected to the axis portion and adjacent to the base. The magnetic ring has at least one guiding portion used for sliding along the least one guiding groove. When the axis portion is rotating with respect to the base, the magnetic ring separates from the base and moving along the least one guiding groove by the at least one guiding portion. When the axis portion stops rotating, the magnetic ring attracts to connect to the base by a magnetic force. | 07-11-2013 |
20130321241 | INTERFACE CARD AND ANTENNA FIXTURE STRUCTURE OF COMMUNICATION MODULE - In an interface card and antenna fixture structure of a communication module, an interface card includes a printed circuit board, a circuit module, a plurality of pins, and an antenna connector, and the antenna is conductively coupled to the antenna connector, and the pressing component is disposed on the printed circuit board and installed at a corresponding connecting position of the antenna and the antenna connector, and the locking component is passed through the pressing component and the printed circuit board and coupled to the motherboard, such that the pressing component presses the antenna and the antenna connector. | 12-05-2013 |
20140013894 | KEY MECHANISM WITH EASY ASSEMBLY - A key mechanism includes a tray, at least one keycap, at least one supporting structure and an engaging component. The at least one keycap is disposed on a side of the tray. The at least one supporting structure is connected to the tray and the at least one keycap for supporting the at least one keycap on the tray. The engaging component is installed on the tray. The engaging component includes a pivoting portion and an engaging portion. The pivoting portion is pivoted to the at least one supporting structure, and the engaging portion engages into an opening on a casing as the tray is assembled on the casing, so as to fix the tray on the casing. | 01-16-2014 |
20140077358 | Bump Structure and Method of Forming Same - An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal bump on the under bump metallurgy feature, and a substrate trace on a substrate, the substrate trace coupled to the metal bump through a solder joint and intermetallic compounds, a ratio of a first cross sectional area of the intermetallic compounds to a second cross sectional area of the solder joint greater than forty percent. | 03-20-2014 |
20140077360 | Interconnection Structure and Method of Forming Same - An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion. | 03-20-2014 |
20140210688 | ANTENNA SHEATH - An antenna sheath includes a tubular member and a base unit. One end of the tubular member is formed with two lateral boards corresponding to each other, an opening is formed between the two lateral boards, each of the lateral boards is formed with a shaft hole, and the inner periphery of at least one of the two shaft holes is formed with at least one first convex tooth; the base unit is installed with a connector inserted in the opening and formed with two lateral surfaces corresponding to each other, the two lateral surfaces are respectively installed with a rotation shaft correspondingly pivoted in the shaft hole, the outer periphery of at least one of the two rotation shafts is formed with plural second convex teeth annularly arranged, and the first convex teeth is engaged between any two of the adjacent second convex teeth. | 07-31-2014 |