Patent application number | Description | Published |
20110144393 | PRODUCTION OF BUTANEDIOL BY ANAEROBIC MICROBIAL FERMENTATION - The invention provides methods for producing 2,3-butanediol by anaerobic fermentation. According to particular methods of the invention, 2,3-butanediol is produced by anaerobic fermentation of substrates including carbohydrate and carbon monoxide. | 06-16-2011 |
20120252083 | FERMENTATION PROCESS FOR PRODUCING ISOPROPANOL USING A RECOMBINANT MICROORGANISM - The invention provides, inter alia, methods for the production of acetone, isopropanol and/or precursors of acetone and/or isopropanol by microbial fermentation of substrates comprising CO, genetically modified microorganisms of use in such methods, nucleic acids suitable for preparation of genetically modified microorganisms, a novel alcohol dehydrogenase and nucleic acids encoding same. | 10-04-2012 |
20130177955 | PROCESS FOR PRODUCTION OF ALCOHOLS BY MICROBIAL FERMENTATION - The invention provides method for producing butanediol and specifically 2,3-butanediol by anaerobic fermentation of a gaseous substrate comprising CO by a culture of at least one micro-organism. In accordance with particular methods of the invention, 2,3-butanediol is produced by anaerobic fermentation of substrates including carbohydrates and carbon monoxide. The invention further provides for the up-regulation of a native 2,3-butanediol dehydrogenase gene in the at least one micro-organism. The 2,3-butanediol can be further converted to compounds such as butene(s), butadiene and methyl ethyl ketone. These compounds can be further converted to chemical products such as 2-butanol. | 07-11-2013 |
20130224839 | Recombinant Microorganism and Methods of Production Thereof - The invention relates to a recombinant carboxydotrophic acetogenic microorganism capable of producing one or more products by fermentation of a substrate comprising CO, wherein the microorganism has an increased tolerance to ethanol versus a parental carboxydotrophic acetogenic microorganism. The invention also provides, inter alia, methods for the production of ethanol and one or more other products from a substrate comprising CO using the recombinant carboxydotrophic acetogenic microorganism. | 08-29-2013 |
20130323820 | Recombinant microorganisms and uses therefor - Terpenes are valuable commercial products used in a diverse number of industries. Terpenes may be produced from petrochemical sources and from terpene feed-stocks, such as turpentine. However, these production methods are expensive, unsustainable and often cause environmental problems including contributing to climate change. Microbial fermentation provides an alternative option for the production of terpenes. One or more terpenes and/or precursors can be produced by microbial fermentation of a substrate comprising CO. Recombinant microorganisms may be used in such methods. Carboxydotrophic, acetogenic, recombinant microorganisms can be used in such methods. The recombinant microorgnsims may contain exogenous mevalonate (MVA) pathway enzymes and/or DXS pathway enzymes, for example. | 12-05-2013 |
20130344547 | RECOMBINANT MICROORGANISMS MAKE BIODIESEL - A carboxydotrophic acetogenic recombinant microorganism is modified so that it produces biodiesel and optionally one or more other products by fermentation of a substrate comprising CO. Biodiesel is produced by microbial fermentation of a substrate comprising CO. The recombinant microorganism is modified to express one or more exogenous enzymes in the biodiesel biosynthesis pathway not present in a parental microorganism from which the recombinant microorganism is derived. The one or more enzymes comprise a nonspecific acyltransferase. | 12-26-2013 |
20140186928 | Recombinant Microorganism and Methods of Production Thereof - The invention relates, inter alia, to novel genetically modified microorganisms capable of using CO to produce 1-butanol and/or a precursor thereof, novel methyltransferases and nucleic acids encoding same, methods for producing genetically modified microorganisms using said novel methyltransferases, and methods of producing 1-butanol and/or a precursor thereof by microbial fermentation. | 07-03-2014 |
20150376654 | RECOMBINANT MICROORGANISMS WITH INCREASED TOLERANCE TO ETHANOL - The invention relates to a recombinant carboxydotrophic acetogenic microorganism capable of producing one or more products by fermentation of a substrate comprising CO, wherein the microorganism has an increased tolerance to ethanol versus a parental carboxydotrophic acetogenic microorganism. The invention also provides, inter alia, methods for the production of ethanol and one or more other products from a substrate comprising CO using the recombinant carboxydotrophic acetogenic microorganism. | 12-31-2015 |
Patent application number | Description | Published |
20110236941 | RECOMBINANT MICROORGANISM AND METHODS OF PRODUCTION THEREOF - A novel genetically modified microorganisms capable of using CO to produce 1-butanol and/or a precursor thereof, novel methyltransferases and nucleic acids encoding same, methods for producing genetically modified microorganisms using said novel methyltransferases, and methods of producing 1-butanol and/or a precursor thereof by microbial fermentation. | 09-29-2011 |
20110256600 | Recombinant Microorganisms and Methods of Use Thereof - The invention provides a recombinant microorganism capable of producing one or more products by fermentation of a substrate comprising CO, wherein the microorganisms has an increased tolerance to ethanol. The invention also provides, inter alia, methods for the production of ethanol and one or more other products from a substrate comprising CO. | 10-20-2011 |
20130224838 | RECOMBINANT MICROORGANISMS AND USES THEREFOR - The invention provides, inter alia, methods for the production of acetone, isopropanol and/or precursors of acetone and/or isopropanol by microbial fermentation of substrates comprising CO, genetically modified microorganisms of use in such methods, nucleic acids suitable for preparation of genetically modified microorganisms, a novel alcohol dehydrogenase and nucleic acids encoding same. | 08-29-2013 |
20150284692 | RECOMBINANT MICROORGANISMS AND USES THEREFOR - The invention provides, inter alia, methods for the production of acetone, isopropanol and/or precursors of acetone and/or isopropanol by microbial fermentation of substrates comprising CO, genetically modified microorganisms of use in such methods, nucleic acids suitable for preparation of genetically modified microorganisms, a novel alcohol dehydrogenase and nucleic acids encoding same. | 10-08-2015 |
Patent application number | Description | Published |
20150191747 | MICROBIAL FERMENTATION FOR THE PRODUCTION OF TERPENES - The invention provides a method for producing a terpene or a precursor thereof by microbial fermentation. Typically, the method involves culturing a recombinant bacterium in the presence of a gaseous substrate whereby the bacterium produces a terpene or a precursor thereof, such as mevalonic acid, isopentenyl pyrophosphate, dimethylallyl pyrophosphate, isoprene, geranyl pyrophosphate, farnesyl pyrophosphate, and/or farnesene. The bacterium may comprise one or more exogenous enzymes, such as enzymes in mevalonate, DXS, or terpene biosynthesis pathways. | 07-09-2015 |
20160040193 | GENETICALLY ENGINEERED BACTERIUM WITH ALTERED CARBON MONOXIDE DEHYDROGENASE (CODH) ACTIVITY - The invention provides genetically engineered microorganisms with altered carbon monoxide dehydrogenase (CODH) activity and methods related thereto. In particular, the invention provides a genetically engineered carboxydotrophic acetogenic bacterium having decreased or eliminated activity of CODH1 and/or CODH2. In certain embodiments, the bacterium may also have increased activity of CODH/ACS. The invention further provides a method for producing a product by culturing the bacterium in the presence of a gaseous substrate comprising one or more of carbon monoxide, carbon dioxide, and hydrogen. | 02-11-2016 |
Patent application number | Description | Published |
20100203171 | Therapeutic Foam - A therapeutic foam for the treatment of, inter alia, varicose veins comprises a sclerosing solution foamed with a physiological gas such as carbon dioxide, oxygen or a mixture thereof. The foam has a nitrogen content of less than 0.8%. It may be generated using a pressurised canister system incorporating a fine mesh of micron dimensions through which the gas and sclerosing liquid are passed to make the foam. Alternatively, the foam may be generated by passing gas and solution between two syringes through a fine mesh. Techniques are described for minimising the amount of nitrogen in a canister or syringe based product. A technique for generating and delivering foam simultaneously using a syringe based device is also disclosed. | 08-12-2010 |
20130059923 | Therapeutic Foam - A therapeutic foam for the treatment of, inter alia, varicose veins comprises a sclerosing solution foamed with a physiological gas such as carbon dioxide, oxygen or a mixture thereof. The foam has a nitrogen content of less than 0.8%. It may be generated using a pressurised canister system incorporating a fine mesh of micron dimensions through which the gas and sclerosing liquid are passed to make the foam. Alternatively, the foam may be generated by passing gas and solution between two syringes through a fine mesh. Techniques are described for minimising the amount of nitrogen in a canister or syringe based product. A technique for generating and delivering foam simultaneously using a syringe based device is also disclosed. | 03-07-2013 |
20140221501 | THERAPEUTIC FOAM - A therapeutic foam for the treatment of, inter alia, varicose veins comprises a sclerosing solution foamed with a physiological gas such as carbon dioxide, oxygen or a mixture thereof. The foam has a nitrogen content of less than 0.8%. It may be generated using a pressurised canister system incorporating a fine mesh of micron dimensions through which the gas and sclerosing liquid are passed to make the foam. Alternatively, the foam may be generated by passing gas and solution between two syringes through a fine mesh. Techniques are described for minimising the amount of nitrogen in a canister or syringe based product. A technique for generating and delivering foam simultaneously using a syringe based device is also disclosed. | 08-07-2014 |
20160101881 | THERAPEUTIC FOAM - A therapeutic foam for the treatment of, inter alia, varicose veins comprises a sclerosing solution foamed with a physiological gas such as carbon dioxide, oxygen or a mixture thereof. The foam has a nitrogen content of less than 0.8%. It may be generated using a pressurised canister system incorporating a fine mesh of micron dimensions through which the gas and sclerosing liquid are passed to make the foam. Alternatively, the foam may be generated by passing gas and solution between two syringes through a fine mesh. Techniques are described for minimising the amount of nitrogen in a canister or syringe based product. A technique for generating and delivering foam simultaneously using a syringe based device is also disclosed. | 04-14-2016 |
Patent application number | Description | Published |
20090321949 | BACKSIDE MOLD PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY - In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, forming a stiffening mold on a backside of the coreless substrate strip adjacent to sites where solder balls are to be attached, and attaching solder balls to the backside of the coreless substrate strip amongst the stiffening mold. Other embodiments are also disclosed and claimed. | 12-31-2009 |
20130230946 | BACKSIDE MOLD PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY - In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, forming a stiffening mold on a backside of the coreless substrate strip adjacent to sites where solder balls are to be attached, and attaching solder balls to the backside of the coreless substrate strip amongst the stiffening mold. Other embodiments are also disclosed and claimed. | 09-05-2013 |
20150072474 | BACKSIDE MOLD PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY - In some embodiments, selective electroless plating for electronic substrates is presented. In this regard, a method is introduced including receiving a coreless substrate strip, forming a stiffening mold on a backside of the coreless substrate strip adjacent to sites where solder balls are to be attached, and attaching solder balls to the backside of the coreless substrate strip amongst the stiffening mold. Other embodiments are also disclosed and claimed. | 03-12-2015 |
Patent application number | Description | Published |
20140241404 | NETWORK-CODING BUILDING BLOCKS AND DECOMPOSITION SCHEDULING BASED THEREON - Methods and systems are disclosed involving physical-layer network coding (PNC) atoms as building blocks of PNC networks to solve the scheduling problem in PNC networks using a decomposition framework based on PNC atoms. Ten PNC atoms and their straightforward network coding (SNC) counterparts are disclosed. Performance evaluation results are discussed, which indicate that decomposition based on the ten PNC atoms outperforms the traditional multi-hop (non-NC) scheduling by about 100%. Furthermore, decomposition based on the ten PNC atoms can yield performance gain of 40% or more compared with decomposition based on the TWRC atom alone. | 08-28-2014 |
20150049751 | NETWORK-CODED MULTIPLE ACCESS - Systems and methods described herein include a first wireless local area network (“WLAN”) system that jointly exploits physical-layer network coding (“PNC”) and multiuser decoding (“MUD”) to boost system throughput. This multiple access mode is referred to as Network-Coded Multiple Access (“NCMA”). NCMA allows multiple nodes to transmit simultaneously to the access point (“AP”) to boost throughput in a non-relay environment. When two nodes A and B transmit to the AP simultaneously, the AP desires to obtain both packet A and packet B rather than their network-coded packet. | 02-19-2015 |
20150372748 | NETWORK-CODING BUILDING BLOCKS AND DECOMPOSITION SCHEDULING BASED THEREON - Methods and systems involving network coding (NC) atoms as building blocks of NC networks solve the scheduling problem in NC networks using a decomposition framework based on NC atoms. Ten physical-layer network coding (PNC) atoms and their straightforward network coding (SNC) counterparts are disclosed. SNC network can generate a transmission schedule based on SNC atoms. PNC network can generate transmission schedule based on PNC atoms. Performance evaluation results indicate that decomposition based on PNC atoms outperforms the traditional multi-hop (non-NC) scheduling by about 100% and can yield performance gain of 40% or more compared with decomposition based on the PNC TWRC atom alone. Further performance evaluation results indicate that decomposition based on SNC atoms outperforms the traditional multi-hop (non-NC) scheduling by about 33% and can yield performance gain of 14% or more compared with decomposition based on the SNC TWRC atom alone. | 12-24-2015 |
20160065297 | NETWORK-CODING BUILDING BLOCKS AND DECOMPOSITION SCHEDULING BASED THEREON - Methods and systems involving network coding (NC) atoms as building blocks of NC networks solve the scheduling problem in NC networks using a decomposition framework based on NC atoms. Ten physical-layer network coding (PNC) atoms and their straightforward network coding (SNC) counterparts are disclosed. SNC network can generate a transmission schedule based on SNC atoms. PNC network can generate transmission schedule based on PNC atoms. Performance evaluation results indicate that decomposition based on PNC atoms outperforms the traditional multi-hop (non-NC) scheduling by about 100% and can yield performance gain of 40% or more compared with decomposition based on the PNC TWRC atom alone. Further performance evaluation results indicate that decomposition based on SNC atoms outperforms the traditional multi-hop (non-NC) scheduling by about 33% and can yield performance gain of 14% or more compared with decomposition based on the SNC TWRC atom alone. | 03-03-2016 |
Patent application number | Description | Published |
20090026594 | Thin Plastic Leadless Package with Exposed Metal Die Paddle - A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps. The electronic package includes a leadframe having a plurality of leads, wherein each of the leads has a lead tip, an opening formed within the leadframe, a die paddle that is disposed within the opening and is isolated from each of the lead tips, a tape that is adhered to a back side of the leadframe, leads, and die paddle, and a die, wherein the die is attached to the die paddle and is connected by wires to a bump disposed on each of the lead tips. | 01-29-2009 |
20160049357 | THIN PLASTIC LEADLESS PACKAGE WITH EXPOSED METAL DIE PADDLE - A method of making electronic packages includes providing a leadframe strip that includes a plurality of leadframes, wherein the leadframes comprise a plurality of leads, etching a surface of each of the leadframes to form an opening, wherein each of the leads has a lead tip that connects to a die paddle within the opening, isolating each of the leads from the die paddle, adhering a tape to a bottom side of the leadframe strips, leads, and die paddle, attaching a die to the die paddle, placing ball bumps on each of the lead tips, and connecting the die to the ball bumps. The electronic package includes a leadframe having a plurality of leads, wherein each of the leads has a lead tip, an opening formed within the leadframe, a die paddle that is disposed within the opening and is isolated from each of the lead tips, a tape that is adhered to a back side of the leadframe, leads, and die paddle, and a die, wherein the die is attached to the die paddle and is connected by wires to a bump disposed on each of the lead tips. | 02-18-2016 |
Patent application number | Description | Published |
20150127983 | TEST, VALIDATION, AND DEBUG ARCHITECTURE - An apparatus and method is described herein for providing a test, validation, and debug architecture. At a target or base level, hardware (Design for Test or DFx) are designed into and integrated with silicon parts. A controller may provide abstracted access to such hooks, such as through an abstraction layer that abstracts low level details of the hardware DFx. In addition, the abstraction layer through an interface, such as APIs, provides services, routines, and data structures to higher-level software/presentation layers, which are able to collect test data for validation and debug of a unit/platform under test. Moreover, the architecture potentially provides tiered (multiple levels of) secure access to the test architecture. Additionally, physical access to the test architecture for a platform may be simplified through use of a unified, bi-directional test access port, while also potentially allowing remote access to perform remote test and de-bug of a part/platform under test. In essence, a complete test architecture stack is described herein for test, validation, and debug of electronic parts, devices, and platforms. | 05-07-2015 |
20150269109 | METHOD, APPARATUS AND SYSTEM FOR SINGLE-ENDED COMMUNICATION OF TRANSACTION LAYER PACKETS - Techniques and mechanisms for exchanging single-ended communications with a protocol stack of an integrated circuit package. In an embodiment, an integrated circuit (IC) chip includes a protocol stack comprising a transaction layer which performs operations compatible with a Peripheral Component Interconnect Express™ (PCIe™) specification. Transaction layer packets, exchanged between the transaction layer and a link layer of the protocol stack, are compatible with a PCIe™ format. In another embodiment, a physical layer of the protocol stack is to couple the IC chip to another IC chip for an exchange of the transaction layer packets via single-ended communications. A packaged device includes both of the IC chips. | 09-24-2015 |
20150341260 | MANAGING SIDEBAND ROUTERS IN ON-DIE SYSTEM FABRIC - Methods and apparatus for managing sideband routers in an On-Die System Fabric (OSF) are described. In one embodiment, a sideband OSF router is configurable during runtime based, at least in part, on information stored in a table accessible by an agent coupled to the sideband OSF router. Other embodiments are also disclosed. | 11-26-2015 |
20160092381 | IN-BAND CONFIGURATION MODE - A first state of an interconnect protocol is entered. A particular signal is sent according to the protocol to a device over a link. During the first state, it is detected that a response to the particular signal is received in the first state. It is determined that the device supports a configuration mode outside the protocol based on the received response. The configuration mode is entered based on the response. One or more in-band configuration messages are sent within the configuration mode. | 03-31-2016 |
Patent application number | Description | Published |
20090143049 | MOBILE TELEPHONE HUGS INCLUDING CONVEYED MESSAGES - Described is a technology by which a mobile telephone sends and/or receives and outputs a “mobile hug” comprising a personalized special message. A mobile hug output comprises vibration rhythms (patterns) and/or other sound and/or image data that identifies a source of the incoming information, and/or may convey a personal message. A mobile hug protocol is exemplified in which a vibration timeline, a sound timeline, and/or an image timeline each comprising units from which a sender can assemble a “sentence” to convey the special message. | 06-04-2009 |
20090143056 | MODIFYING MOBILE DEVICE OPERATION USING PROXIMITY RELATIONSHIPS - Described is a technology by which a mobile computing device such as a mobile telephone operates differently based on detected proximity to another mobile device with which the first mobile device has a defined relationship. For example, the first mobile device may transfer content to the second mobile computing device when proximity corresponds to a non-cellular communications coupling, such as Bluetooth® or Wi-Fi coupling. In this manner, content transfer is deferred until a non-cellular coupling exists. The mobile device (or both devices) may output a notification to indicate that the other mobile computing device has been detected within a threshold proximity, such as via GPS data or by being within the same cellular tower. The type and/or settings of an output notification may vary based on different thresholds. | 06-04-2009 |
20090149218 | Mobile telephone relationships - Described is a technology by which mobile telephones are organized and/or operate based upon special relationships with other users and/or other mobile telephones. A mobile computing device is coupled to another mobile computing device so as to have a special relationship therewith, including after subsequent decoupling. When the mobile telephones that have a special relationship are thereafter coupled together, the devices may operate differently (relative to their operation when coupled to other mobile telephones). Also described is a single user interface screen that outputs an identifier (e.g., an image) of a potential recipient, along with communication options, such as to call, send a text message, share data, show information or send a predefined message. | 06-11-2009 |
20140364166 | MODIFYING MOBILE DEVICE OPERATION USING PROXIMITY RELATIONSHIPS - Described is a technology by which a mobile computing device such as a mobile telephone operates differently based on detected proximity to another mobile device with which the first mobile device has a defined relationship. For example, the first mobile device may transfer content to the second mobile computing device when proximity corresponds to a non-cellular communications coupling, such as Bluetooth® or Wi-Fi coupling. In this manner, content transfer is deferred until a non-cellular coupling exists. The mobile device (or both devices) may output a notification to indicate that the other mobile computing device has been detected within a threshold proximity, such as via GPS data or by being within the same cellular tower. The type and/or settings of an output notification may vary based on different thresholds. | 12-11-2014 |
Patent application number | Description | Published |
20140246701 | Flexible, space-efficient I/O circuitry for integrated circuits - Flexible, space-efficient I/O architectures for integrated circuits simplify circuit design and shorten design times. In one aspect, cells for power supply pads are eliminated, in part by locating ESD protection circuitry for these pads underneath the pads themselves, leaving only signal I/O buffers. Pads coupled to the signal I/O buffers may be defined as either signal I/O pads or power supply pads in accordance with customization circuitry. Customization circuitry also provides for flexible bank architectures, where signal I/O buffers within a bank share power supply requirements that may be different from power supply requirements of signal I/O buffers of another bank. The number of banks and the number of signal I/O buffers belonging to each bank is flexibly defined. Customization circuitry also provides for flexible pad options, whereby the IC pads may be configured for different packaging technology, for example, for wire bonding for flip-chip bonding, or for other types of bonding. | 09-04-2014 |
20140246702 | Flexible, space-efficient I/O circuitry for integrated circuits - Flexible, space-efficient I/O architectures for integrated circuits simplify circuit design and shorten design times. In one aspect, cells for power supply pads are eliminated, in part by locating ESD protection circuitry for these pads underneath the pads themselves, leaving only signal I/O buffers. Pads coupled to the signal I/O buffers may be defined as either signal I/O pads or power supply pads in accordance with customization circuitry. Customization circuitry also provides for flexible bank architectures, where signal I/O buffers within a bank share power supply requirements that may be different from power supply requirements of signal I/O buffers of another bank. The number of banks and the number of signal I/O buffers belonging to each bank is flexibly defined. Customization circuitry also provides for flexible pad options, whereby the IC pads may be configured for different packaging technology, for example, for wire bonding for flip-chip bonding, or for other types of bonding. | 09-04-2014 |
20140247525 | Flexible, space-efficient I/O circuitry for integrated circuits - Flexible, space-efficient I/O architectures for integrated circuits simplify circuit design and shorten design times. In one aspect, cells for power supply pads are eliminated, in part by locating ESD protection circuitry for these pads underneath the pads themselves, leaving only signal I/O buffers. Pads coupled to the signal I/O buffers may be defined as either signal I/O pads or power supply pads in accordance with customization circuitry. Customization circuitry also provides for flexible bank architectures, where signal I/O buffers within a bank share power supply requirements that may be different from power supply requirements of signal I/O buffers of another bank. The number of banks and the number of signal I/O buffers belonging to each bank is flexibly defined. Customization circuitry also provides for flexible pad options, whereby the IC pads may be configured for different packaging technology, for example, for wire bonding for flip-chip bonding, or for other types of bonding. | 09-04-2014 |