Patent application number | Description | Published |
20100154357 | METHOD AND DEVICE FOR PACKAGING POLYCRYSTALLINE BULK SILICON - An automated filling system for introducing crushed polysilicon fragments into shipping bags without significant contamination positions a freely suspended energy absorber into a freely suspended bag of non-contaminating material prior to filling, and following filling, the energy absorber is removed, and the bag is sealed. The system can replace manual packaging which has been required for semiconductor applications. | 06-24-2010 |
20120151969 | METHOD AND DEVICE FOR PRODUCING THIN SILICON RODS - A method for producing thin silicon rods includes: a) providing a rod of silicon; b) sequentially cutting with a sawing device slabs from the rod, wherein the rod is respectively rotated axially through 90° or 180° between two successive cuts so that two of four successive cuts respectively take place pairwise on radially opposite sides of the rod or wherein slab cutting takes place simultaneously together at radially opposite sides of the rod; and c) sawing the cut slabs into thin rods having a rectangular cross section. A device for producing thin rods from a silicon rod by sawing, contains a first unit with cutting tools and a cutting tool cooling liquid, a second unit having nozzles for introducing additional cooling liquid into cutting kerfs of the workpiece, and a third unit having a band saw, a wire saw or cutting tools containing one or more shafts. | 06-21-2012 |
20120198793 | METHOD AND DEVICE FOR DOSING AND PACKAGING POLYSILICON CHUNKS AND DOSING AND PACKAGING UNIT - Disclosed is a method for dosing and packaging polysilicon chunks, wherein a product flow of polysilicon chunks is transported via a feed channel, separated by at least one screen into coarse and fine chunks, weighed and dosed to a target weight by a dosing balance, discharged via a discharge channel and transported to a packaging unit where a first plastic bag is filled with the polysilicon chunks and sealed, the plastic bag containing polysilicon chunks being packaged with a further plastic bag which is formed by a shaper and subsequently welded, wherein the at least one screen and the dosing balance at least partially include a hard metal on their surfaces and the shaper for forming the plastic bag includes a wear-resistant coating. Also disclosed are a dosing unit, a packaging unit and a device for dosing and packaging polysilicon chunks, which contains a dosing unit and a packaging unit. | 08-09-2012 |
20130269295 | PACKING OF POLYCRYSTALLINE SILICON - A method for packing polycrystalline silicon in the form of fragments or round rods, wherein at least one film in each case is inserted into a cuboidal cardboard box matched to the dimensions of the polycrystalline silicon to be packed, the polycrystalline silicon is introduced into the at least one film, the at least one film of thickness 10 to 1000 μm subsequently being welded and enclosing the polycrystalline silicon, and this at least one film being surrounded by a further film having a reinforcing structure or by a shaping element. | 10-17-2013 |
20140165503 | PACKING POLYCRYSTALLINE SILICON - The present invention relates to a method for packing polysilicon in the form of chunks by introducing the chunks into a first plastic bag, the first plastic bag being introduced into a second plastic bag after the introduction of the chunks, or the first plastic bag already having been inserted into the second plastic bag prior to the introduction of the chunks into the first plastic bag, as a result of which the chunks are present in a double bag which is sealed, wherein the air present in the two plastic bags in the double bag after the introduction of the chunks is removed before the sealing of the double bag such that the total volume of the double bag relative to the volume of the chunks is 2.4 to 3.0. | 06-19-2014 |
Patent application number | Description | Published |
20090190370 | MOVING LIGHT SPOTS IN ILLUMINATION FIBERS - An electronic display includes a light source system and a light guide system, where the light guide system emits light features laterally, i.e., from the side, at selected positions along its length. The light source system includes one or more electronically controllable light sources and further includes optical switches or other arrangements for coupling the light sources to the optical fibers or other light guides of the light guide system. The light source system can sequentially or progressively increase the selected longitudinal position at which the light feature is emitted, resulting in the appearance of movement of the light feature along the length of the light guide system. | 07-30-2009 |
20100146181 | METHOD AND APPARATUS FOR PROVIDING A HIGH-SPEED COMMUNICATIONS LINK BETWEEN A PORTABLE DEVICE AND A DOCKING STATION - A docking station is provided with a SerDes component, one or more peripheral device I/O ports, and at least one high-speed serial I/O port for interfacing the docking station with a high-speed serial communications link. A portable device that can be docked on the docking station is also provided with a high-speed serial I/O port. A high-speed serial communications link is provided between the high-speed serial I/O port of the docking station and the high-speed serial I/O port of the portable device to enable serial data to be communicated between the portable device and the docking station. Providing the serial communications link obviates the need for a large connector with a high pin count for interfacing the portable device with the docking station. In addition, the inclusion of the SerDes component in the docking station eliminates the need for a southbridge IC on the motherboard of the portable device, or at least enables a southbridge IC having less complexity to be used on the motherboard of the portable device. | 06-10-2010 |
20100215320 | MOLDED INTERCONNECT DEVICE (MID) OPTICAL CONNECTOR WITH METAL RETAINING CLIP - A molded interconnect device (MID) optical connector includes a molded plastic body and a metal retaining clip. The body has a receptacle portion shaped to receive and guide a mating optical fiber ferrule into a connected position. In the connected position, the end of a fiber retained in the ferrule is in optical alignment with an opto-electronic device in the MID optical connector. The retaining clip has one or more contact portions that extend into the receptacle portion of the body and exert a spring force upon the ferrule to retain and stabilize it in the connected position. | 08-26-2010 |
20140367556 | PHOTODETECTOR INTEGRATED CIRCUIT (IC) HAVING ASENSOR INTEGRATED THEREON FOR SENSING ELECTROMAGNETICINTERFERENCE (EMI) - A photodetector integrated circuit (IC) having an electromagnetic interference (EMI) sensor integrated therein is provided for sensing EMI at the photodetector. Integrating the EMI sensor into the photodetector IC ensures that the EMI sensor is in proximity to the photodetector so that any EMI that is sensed is actually EMI to which the photodetector is exposed. The sensed EMI may then be used for a number of reasons, such as to determine the root cause of damage to circuitry of the system, to determine the point in time at which an EMI event occurred, or to trigger a warning when a determination is made that an EMI limit has been reached. | 12-18-2014 |