Liao, Taichung
Chao-Che Liao, Taichung TW
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20150062865 | INDICATING LIGHT FOR TRANSPORTATION - An indicating light for transportation has a circuit board, a reflective layer and a light guide plate sequentially attached. Multiple LEDs are mounted on the circuit board and emit light. The light guide plate has an inner surface and an outer surface, wherein at least one indicating portion is formed on the inner surface for reflecting or refracting light of the LEDs to the outer surface. The reflective layer further prevents light leakage. Therefore, the indication portion generates a surface light effect for reducing glare and providing an enlarged illuminating area. | 03-05-2015 |
Chia-Ching Liao, Taichung TW
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20090057176 | Cue bag and manufacturing method thereof - A cue bag including a bag and at least two tubes is provided. Each of the tubes includes a tube body, a cushion and a front block. The tube body includes a penetrated hole defined along an axis, a front opening and a rear opening respectively defined in the two ends of the penetrated hole. The cushion is disposed in the penetrated hole and has a cushion body, a stitching formed along the axis and two folded portions respectively folded on an outer surface of the tube body from the front opening and the rear opening. The front block is mounted in the inner surface of the tube body and disposed adjacent to the front opening of the tube body to define a first diameter less than a second diameter of the front opening. | 03-05-2009 |
Chien-Chao Liao, Taichung TW
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20130182194 | DOCKING DEVICE AND PORTABLE PROJECTOR - A docking device for connecting an electronic device includes a base and a connector. The connector has a body and a connecting port on the base. The body is provided on the base to be moved between a first position and a second position. The connecting port is hidden in the base when the body is moved to the first position, and the connecting is exposed to connect the electronic device when the body is moved to the second position. The docking device may be incorporated in a portable projector. | 07-18-2013 |
Chien-Ko Liao, Taichung TW
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20090001610 | SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER - A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die. | 01-01-2009 |
20090004781 | METHOD OF FABRICATING A SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER - A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die. | 01-01-2009 |
20100289147 | SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER - A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die. | 11-18-2010 |
20110210446 | SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER - A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die. | 09-01-2011 |
Chi-Min Liao, Taichung TW
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20150100016 | Manual breast pump - A manual breast pump is provided with an applicator cup; and a rounded, curved member including a plurality of projections and a coupling releasably secured to the applicator cup. Any two adjacent ones of the projections are separated by a gap. Advantageously, the gaps provide a space to accommodate a flexible deformation of the rounded, curved member when a pumping force is exerted on the breast of a lactating by the pressing. | 04-09-2015 |
Chun-Chun Liao, Taichung TW
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20150183079 | CYLINDER-TYPE POLISHING MACHINE - A polishing machine is disclosed to include a machine body and a carrier movably coupled to the machine body. A polishing device is provided with a movable base movably coupled to the machine body and a plurality of polishing cylinders rotatably connected to the movable base and located above the carrier. A rotary drive device is provided with a plurality of transmission gears each coupled to one of the polishing cylinders, and two rotary drive motors symmetrically mounted to the movable base and each having a gear shaft for driving the transmission gears to rotate through at least one transmission belt. Thus, the polishing cylinders are moved along with the movable base and rotated by the actuation of the rotary drive motors for smoothing the workpieces placed on the carrier. | 07-02-2015 |
Chung-Pin Liao, Taichung TW
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20090293935 | SOLAR COLLECTOR CAPABLE OF RECEIVING LIGHT RAYS WITH DIFFERENT INCIDENT ANGLES - A solar collector includes a base having an internal chamber therein, a plurality of openings, and low reflection materials at an inner periphery thereof, a lens unit for enabling the sun's rays to penetrate into the internal chamber through the openings, an optical transfer unit disposed in the internal chamber to receive the sun's rays and transform that into electric energy, and at least one heat transfer member mounted to the base to transfer heat energy transformed by the sun's rays that is received by the low reflection materials. Thus, the solar collector of the present invention is capable of receiving the sun's rays with different incident angles to transform the sun's rays into the electric energy and the heat energy. | 12-03-2009 |
20090325067 | WET-TO-USE ORGANIC CELL BATTERY - A wet-to-use organic cell battery includes a container filled with an electrolyte that is made from organic materials, an electrolyte solution, such as water, can be repeatedly added into the container to mix with the electrolyte, and two electrodes electrically connected to a mixture of the electrolyte and the electrolyte solution, and insulated from each other. Thus, the organic cell battery of the present invention has the advantages of being able to preserve the electrodes from consumption and rustiness, being refreshable, and being benign to environment and public health. | 12-31-2009 |
Chun-Wei Liao, Taichung TW
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20110147554 | HOLDING DEVICE OF FITMENTS - A holding device of fitments is disposed to a support on one side of the fitment and comprises a holding plate including a coupling portion extending from one side of a bottom thereof; a connecting set including a disc extending upward from one end thereof, a fitting segment extending downward from another end thereof, and an insertion on a distal section of the fitting segment; a clamping set comprised of first and second engaging portions, an acting surface of each of the first and second engaging portions including an uneven contact section to engage with different supports, and including a receiving member with a through aperture to receive the fitting segment and the insertion. | 06-23-2011 |
Ebin Liao, Taichung TW
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20120074582 | DEVICE WITH THROUGH-SILICON VIA (TSV) AND METHOD OF FORMING THE SAME - A device with through-silicon via (TSV) and a method of forming the same includes the formation of an opening in a silicon substrate, the formation of a first insulation layer on the sidewalls and bottom of the opening, the formation of a second insulation layer on the sidewalls and bottom of the opening. A first interface between the first insulation layer and the silicon substrate has an interface roughness with a peak-to-valley height less than 5 nm. A second interface between the second insulation layer and the conductive layer has an interface roughness with a peak-to-valley height less than 5 nm. | 03-29-2012 |
20130323883 | DEVICE WITH THROUGH-SILICON VIA (TSV) AND METHOD OF FORMING THE SAME - A method includes forming an opening extending from a top surface of a silicon substrate into the silicon substrate to a predetermined depth. The method further includes forming an insulation structure on the silicon substrate along the sidewalls and the bottom of the opening and forming a conductive layer on the insulation structure to fill the opening. A first interface between the insulation structure and the silicon substrate has an interface roughness with a peak-to-valley height less than 5 nm, and a second interface between the insulation structure and the conductive layer has an interface roughness with a peak-to-valley height less than 5 nm. | 12-05-2013 |
Eric Liao, Taichung TW
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20100162509 | Caulk bead compressing and smoothing tool - A tool for compressing and smoothing a bead of freshly applied fluent material in a joint at the intersection of two adjacent surfaces is provided. The tool includes a curved elongated handle comprising a front head, a friction section on an upper surface, a rear substantially vertical channel, a blade affixed to a front wall of the channel, and an extension projecting from the rear end; a flexible working member affixed to the head; and a flexible cap releasably secured onto the working member. Manipulation of the tool by hand by pressing the cap against a bead of freshly applied fluent material at the intersection of two adjacent surfaces while pulling causes the cap to flex to compress and smooth the bead. | 07-01-2010 |
20100162573 | Tool for removing caulk bead - A tool for removing a bead of caulk from a joint at the intersection of two adjacent surfaces is provided. The tool includes an arcute handle comprising a friction section on an upper surface; and a hollow scraping section at the head of the handle and comprising a left plane, a right plane, a front tip, a bottom tip, a front edge at the intersection of the left plane and the right plane, and a bottom edge. In one operating mode the front tip, the left plane, and the right plane are adapted to cut and lift the bead from the adjacent surfaces of the joint by inserting the front tip into the bead by pushing the tool. Preferably, the left plane is at an angle of about 90 degrees with respect to the right plane. | 07-01-2010 |
20130227796 | Multi-Functional Filler Processor - A multi-functional filler processor includes a handle and three tool bits. The first tool bit is formed at a first end of the handle. The second tool bit is connected to a second end of the handle. The third tool bit is movably attached to the handle between an idle position and an active position. | 09-05-2013 |
20150330091 | MULTIFUNCTIONAL FILLER TOOL - A multifunctional filler tool is a combination of three different tools, the trowel covers and slides along the scraper between the idle and active positions, namely, the trowel and the scraper do not increase the width of the entire multifunctional filler tool so as to limit the size of the multifunctional filler tool. When in the active position, the trowel fully covers the scraper, while the scraper does not interfere with the operation of the trowel. When in the idle position, the trowel moves away from the scraper while still keeping abutting against the scraper, namely, the trowel won't protrude in the upward direction to stick out of the scraper; therefore, the trowel does not interfere with the gripping of the handle. | 11-19-2015 |
Feng-Chih Liao, Taichung TW
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20140116461 | HEATING APPARATUS FOR HEATING HAIR CURLERS - A heating apparatus for heating hair curlers is disposed in a housing and clamped by at least one hair clip. The heating apparatus comprises two assembling members and two thermal conductive members which are coupled one another and disposed on a base. Each of the thermal conductive members includes a heating member and an elastic piece for fixing the heating member. Above the assembling members and the thermal conductive members is disposed a cover. The two heating members are closely pushed against the thermal conductive layers of the hair clip, so as to reduce the length of heat transferring route, and consequently improving heating efficiency and enhancing temperature control accuracy. Furthermore, the heating apparatus has a simple structure and can be easily assembled at a low manufacturing cost. | 05-01-2014 |
20140166039 | HAIR STYLING HEATING APPARATUS - A hair styler and its heating device which can heat the thermal storage piece inside the hair roller quickly to a desired temperature by electromagnetic heating. The thermal storage piece is made of high thermal conductivity material which absorbs heat quite quick and disposed inside the hair roller to prevent the hair from directly contacting the thermal storage piece during hair styling, consequently preventing the hair from being burned. Then a low thermal conductivity isolating layer retains the heat within the hair roller and enables the heat to be uniformly and constantly transmitted to the outer surface of the hair roller, providing an effect of low energy consumption and long-lasting heat. A temperature sensing piece is used to detect and indicate the temperature of the hair styler by using different colors, making it easier for the user to know the temperature of the hair styler. | 06-19-2014 |
Ferry Liao, Taichung TW
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20110113930 | Open end ratchet wrench - An open end ratchet wrench includes a socket member rotatably received in an opened head member and having a number of teeth and having an open notch for selectively aligning with an open slot of the head member, a pawl engaged in the head member and having a toothed end for selectively engaging with the teeth of the socket member and for allowing the socket member to be rotated in one direction by the head member, and a retaining ring engaged with the pawl and engaged with the inner peripheral recess of the wrench head member for retaining the pawl to the wrench head member and for allowing the pawl to be engaged with the teeth of the socket member, and a spring biasing member biases the pawl to engage with the teeth of the socket member. | 05-19-2011 |
Hsiang-Kai Liao, Taichung TW
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20090138611 | System And Method For Connection Of Hosts Behind NATs - Disclosed is a system and method for connection of host behind network address translators. The system includes a server placed in a public network, and a transparent middleware (TMW). The server records the related data between each host and one or more NAT devices. The TMW may be performed in each host. When a first host of a first NAT device tries to establish connection to a second host of a second NAT device, through the server, the TMW looks up a first IP address mapping from the first host to the second NAT device, and a second IP address mapping from the second host to the first NAT device. Accordingly, the TMW accomplishes the support for establishing connection between the first and the second hosts. | 05-28-2009 |
Hsin-Yi Liao, Taichung TW
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20110175179 | PACKAGE STRUCTURE HAVING MEMS ELEMENT - A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect. | 07-21-2011 |
20110177643 | FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT - A fabrication method of a package structure having at least an MEMS element is provided, including: preparing a wafer having electrical connection pads and the at least an MEMS element; disposing lids for covering the at least an MEMS element, the lids having a metal layer formed thereon; electrically connecting the electrical connection pads and the metal layer with bonding wires; forming an encapsulant for covering the lids, bonding wires, electrical connection pads and metal layer; removing portions of the encapsulant to separate the bonding wires each into first and second sub-bonding wires, wherein top ends of the first and second sub-bonding wires are exposed, the first sub-bonding wires electrically connecting to the electrical connection pads, and the second sub-bonding wires electrically connecting to the metal layer; forming metallic traces on the encapsulant for electrically connecting to the first sub-bonding wires; forming bumps on the metallic traces; and performing a singulation process. | 07-21-2011 |
20120001274 | WAFER LEVEL PACKAGE HAVING A PRESSURE SENSOR AND FABRICATION METHOD THEREOF - A wafer level package having a pressure sensor and a fabrication method thereof are provided. A wafer having the pressure sensor is bonded to a lid, and electrical connecting pads are formed on the wafer. After the lid is cut, wire-bonding and packaging processes are performed. Ends of bonding wires are exposed and serve as an electrical connecting path. A bottom opening is formed on a bottom surface of the wafer, in order to form a pressure sensor path. | 01-05-2012 |
20120018870 | CHIP SCALE PACKAGE AND FABRICATION METHOD THEREOF - A fabrication method of a chip scale package includes: disposing a chip on a carrier board and embedding the chip into a composite board having a hard layer and a soft layer; and removing the carrier board so as to perform a redistribution layer (RDL) process, thereby solving the conventional problems caused by directly attaching the chip on an adhesive film, such as film-softening caused by heat, encapsulant overflow, chip deviation and contamination, etc., all of which may result in poor electrical connection between the wiring layer and the chip electrode pads in the subsequent RDL process and even waste products as a result. | 01-26-2012 |
20120038044 | CHIP SCALE PACKAGE AND FABRICATION METHOD THEREOF - A CSP includes: a hard board having a first wiring layer with conductive pads; a plurality of conductive elements disposed on at least a portion of the conductive pads; an electronic component having opposite active and inactive surfaces and being mounted on the hard board via the inactive surface; an encapsulating layer disposed on the hard board for encapsulating the conductive elements and electronic component, the active surface of the electronic component and the surfaces of the conductive elements being exposed through the encapsulating layer; a first dielectric layer and a third wiring layer disposed on the encapsulating layer, the third wiring layer being electrically connected to the conductive elements and the electronic component and further electrically connected to the first wiring layer through the conductive elements, thereby obtaining a stacked connection structure without the need of PTHs and using the hard board as a main structure to avoid warpage. | 02-16-2012 |
20120056279 | PACKAGE STRUCTURE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF - A package structure having an MEMS element includes: a packaging substrate having first and second wiring layers on two surfaces thereof and a chip embedded therein; a first dielectric layer disposed on the packaging substrate and the chip; a third wiring layer disposed on the first dielectric layer; a second dielectric layer disposed on the first dielectric layer and the third wiring layer and having a recessed portion; a lid disposed in the recessed portion and on the top surface of the second dielectric layer around the periphery of the recessed portion, wherein the portion of the lid on the top surface of the second dielectric layer is formed into a lid frame on which an adhering material is disposed to allow a substrate having an MEMS element to be attached to the packaging substrate with the MEMS element corresponding in position to the recessed portion, thereby providing a package structure of reduced size and costs with better electrical properties. | 03-08-2012 |
20120086117 | PACKAGE WITH EMBEDDED CHIP AND METHOD OF FABRICATING THE SAME - A package embedded with a chip and a method of fabricating the package of embedded chip. The package of embedded chip includes a dielectric layer having a first surface and a second surface opposing the first surface; a plurality of conductive pillars formed in the dielectric layer and exposed from the second surface of the dielectric layer; a chip embedded in the dielectric layer; a circuit layer formed on the first surface of the dielectric layer; a plurality of conductive blind vias formed in the dielectric layer, allowing the circuit layer to be electrically connected via the conductive blind vias to the chip and each of the conductive pillars; and a first solder mask layer formed on the first surface of the dielectric layer and the circuit layer, thereby using conductive pillars to externally connect with other electronic devices as required to form a stacked structure. Therefore, the manufacturing process can be effectively simplified. | 04-12-2012 |
20120104517 | PACKAGE STRUCTURE WITH MICRO-ELECTROMECHANICAL ELEMENT AND MANUFACTURING METHOD THEREOF - A package structure includes a micro-electromechanical element having a plurality of electrical contacts; a package layer enclosing the micro-electromechanical element and the electrical contacts, with a bottom surface of the micro-electromechanical element exposed from a lower surface of the package layer; a plurality of bonding wires embedded in the package layer, each of the bonding wires having one end connected to one of the electrical contacts, and the other end exposed from the lower surface of the package layer; and a build-up layer structure provided on the lower surface of the package layer, the build-up layer including at least one dielectric layer and a plurality of conductive blind vias formed in the dielectric layer and electrically connected to one ends of the bonding wires. The package structure is easier to accurately control the location of an external electrical contact, and the compatibility of the manufacturing procedures is high. | 05-03-2012 |
20120292722 | PACKAGE STRUCTURE HAVING MEMS ELEMENTS AND FABRICATION METHOD THEREOF - A package structure having MEMS elements includes: a wafer having MEMS elements, electrical contacts and second alignment keys; a plate disposed over the MEMS elements and packaged airtight; transparent bodies disposed over the second alignment keys via an adhesive; an encapsulant disposed on the wafer to encapsulate the plate, the electrical contacts and the transparent bodies; bonding wires embedded in the encapsulant and each having one end connecting a corresponding one of the electrical contacts and the other end exposed from a top surface of the encapsulant; and metal traces disposed on the encapsulant and electrically connected to the electrical contacts via the bonding wires. The present invention eliminates the need to form through holes in a silicon substrate as in the prior art so as to reduce fabrication costs. Further, the present invention accomplishes wiring processes by using a common alignment device to thereby reduce equipment costs. | 11-22-2012 |
20120313243 | CHIP-SCALE PACKAGE - A chip-scale package includes an encapsulating layer, a chip embedded in the encapsulating layer and having an active surface exposed from the encapsulating layer, a buffering dielectric layer formed on the encapsulating layer and the chip, a build-up dielectric layer formed on the buffering dielectric layer, and a circuit layer formed on the build-up dielectric layer and having conductive blind vias penetrating the build-up dielectric layer and being in communication with the openings of the buffering dielectric layer and electrically connected to the chip, wherein the build-up dielectric layer and the buffering dielectric layer are made of different materials. Therefore, delamination does not occur between the buffering dielectric layer and the encapsulating layer, because the buffering dielectric layer is securely bonded to the encapsulating layer and the buffering dielectric layer is evenly distributed on the encapsulating layer. | 12-13-2012 |
20130203200 | FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT - A fabrication method of a package structure having at least an MEMS element is provided, including: preparing a wafer having electrical connection pads and the at least an MEMS element; disposing lids for covering the at least an MEMS element, the lids having a metal layer formed thereon; electrically connecting the electrical connection pads and the metal layer with bonding wires; forming an encapsulant for covering the lids, bonding wires, electrical connection pads and metal layer; removing portions of the encapsulant to separate the bonding wires each into first and second sub-bonding wires, wherein top ends of the first and second sub-bonding wires are exposed, the first sub-bonding wires electrically connecting to the electrical connection pads, and the second sub-bonding wires electrically connecting to the metal layer; forming metallic traces on the encapsulant for electrically connecting to the first sub-bonding wires; forming bumps on the metallic traces; and performing a singulation process. | 08-08-2013 |
20130256875 | SEMICONDUCTOR PACKAGE, PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - A semiconductor package includes: a dielectric layer having opposite first and second surfaces; a semiconductor chip embedded in the dielectric layer and having a plurality of electrode pads; a plurality of first metal posts disposed on the electrode pads of the semiconductor chip, respectively, such that top ends of the first metal posts are exposed from the first surface; at least a second metal post penetrating the dielectric layer such that two opposite ends of the second metal post are exposed from the first and second surfaces, respectively; a first circuit layer formed on the first surface for electrically connecting the first and second metal posts; and a second circuit layer formed on the second surface for electrically connecting the second metal post. The semiconductor package dispenses with conventional laser ablation and electroplating processes for forming conductive posts in a molding compound, thereby saving fabrication time and cost. | 10-03-2013 |
20140035156 | METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE - A method of fabricating a semiconductor package is provided, including: disposing a semiconductor element on a carrier; forming an encapsulant on the carrier to encapsulant the semiconductor element; forming at least one through hole penetrating the encapsulant; forming a hollow conductive through hole in the through hole and, at the same time, forming a circuit layer on an active surface of the semiconductor element and the encapsulant; forming an insulating layer on the circuit layer; and removing the carrier. By forming the conductive through hole and the circuit layer simultaneously, the invention eliminates the need to form a dielectric layer before forming the circuit layer and dispenses with the conventional chemical mechanical polishing (CMP) process, thus greatly improving the fabrication efficiency. | 02-06-2014 |
20140042638 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package is provided, which includes: a soft layer having opposite first and second surfaces and first conductive through hole vias; a chip embedded in the soft layer and having an active surface exposed from the first surface of the soft layer; a support layer formed on the second surface of the soft layer and having second conductive through hole vias in electrical connection with the first conductive through hole vias; a first RDL structure formed on the first surface of the soft layer and electrically connected to the active surface of the chip; and a second RDL structure formed on the support layer and electrically connected to the first RDL structure through the first and second conductive through hole vias. The invention prevents package warpage by providing the support layer, and allows disposing of other packages or electronic elements by electrically connecting the RDL structures through the conductive through hole vias. | 02-13-2014 |
20140080242 | METHOD FOR MANUFACTURING PACKAGE STRUCTURE WITH MICRO-ELECTROMECHANICAL ELEMENT - A package structure includes a micro-electromechanical element having a plurality of electrical contacts; a package layer enclosing the micro-electromechanical element and the electrical contacts, with a bottom surface of the micro-electromechanical element exposed from a lower surface of the package layer; a plurality of bonding wires embedded in the package layer, each of the bonding wires having one end connected to one of the electrical contacts, and the other end exposed from the lower surface of the package layer; and a build-up layer structure provided on the lower surface of the package layer, the build-up layer including at least one dielectric layer and a plurality of conductive blind vias formed in the dielectric layer and electrically connected to one ends of the bonding wires. The package structure is easier to accurately control the location of an external electrical contact, and the compatibility of the manufacturing procedures is high. | 03-20-2014 |
20140117537 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - Disclosed is a semiconductor package including an encapsulant having a top surface and a bottom surface opposite to the top surface; a semiconductor chip embedded in the encapsulant having an active surface, an inactive surface opposite to the active surface, and lateral surfaces interconnecting the active surface and the inactive surface, wherein the active surface protrudes from the bottom surface of the encapsulant and the semiconductor chip further has a plurality of electrode pads disposed on the active surface; a positioning member layer formed on a portion of the bottom surface of the encapsulant, covering the lateral surfaces of the semiconductor chip that protrude therefrom, and exposing the active surface; and a build-up trace structure disposed on the active surface of the semiconductor chip and the positioning member layer formed on the bottom surface of the encapsulant. The present invention also provides a method of fabricating a semiconductor package. | 05-01-2014 |
20140342507 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE - A semiconductor package includes: a dielectric layer having opposite first and second surfaces; a semiconductor chip embedded in the dielectric layer and having a plurality of electrode pads; a plurality of first metal posts disposed on the electrode pads of the semiconductor chip, respectively, such that top ends of the first metal posts are exposed from the first surface; at least a second metal post penetrating the dielectric layer such that two opposite ends of the second metal post are exposed from the first and second surfaces, respectively; a first circuit layer formed on the first surface for electrically connecting the first and second metal posts; and a second circuit layer formed on the second surface for electrically connecting the second metal post. The semiconductor package dispenses with conventional laser ablation and electroplating processes for forming conductive posts in a molding compound, thereby saving fabrication time and cost. | 11-20-2014 |
20150102433 | PACKAGE STRUCTURE HAVING MEMS ELEMENT - A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect. | 04-16-2015 |
20150344299 | FABRICATION METHOD OF WAFER LEVEL PACKAGE HAVING A PRESSURE SENSOR - A wafer level package having a pressure sensor and a fabrication method thereof are provided. A wafer having the pressure sensor is bonded to a lid, and electrical connecting pads are formed on the wafer. After the lid is cut, wire-bonding and packaging processes are performed. Ends of bonding wires are exposed and serve as an electrical connecting path. A bottom opening is formed on a bottom surface of the wafer, in order to form a pressure sensor path. | 12-03-2015 |
Jiunn-Wang Liao, Taichung TW
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20130102829 | METHOD FOR TREATING OSTEOSARCOMA BY BORON NEUTRON CAPTURE THERAPY USING BORIC ACID AS A BORON DRUG - The present invention provides a treatment of osteosarcoma by boron neutron capture therapy using boric acid as a single boron drug. | 04-25-2013 |
Kun-Chi Liao, Taichung TW
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20080225151 | DEVICE OF OFFSET COMPENSATION FOR SOLID-STATE IMAGING DEVICE AND RELATED METHOD - A method of offset compensation for solid-state imaging devices is provided. In the method a first and second detection signal are obtained. The two signals are compared to obtain a difference value. A variable voltage is output according to the difference value to drive a magnetic element. The solid-state imaging device is moved by the magnetic element to compensate the offset of the solid-state imaging device. A system of offset compensation of the solid-state imaging device is also disclosed. | 09-18-2008 |
20090070399 | ARITHMETIC PROCESSING SYSTEM AND METHOD THEREOF - An arithmetic processing system processes a sensing signal and a first approximate offset signal to obtain a second approximate offset signal. The system includes a first arithmetic processor and a second arithmetic processor. The first arithmetic processor receives and processes the sensing signal and the first approximate offset signal to output a first arithmetic signal. The second arithmetic processor processes the first arithmetic signal to output a second arithmetic signal, and the second arithmetic signal is added with a predetermined offset signal to obtain the second approximate offset signal, and the second approximate offset signal is closer to a real offset signal of the sensing signal than the first approximate offset signal. A method of arithmetic processing is also disclosed. | 03-12-2009 |
20090185043 | IMAGE CAPTURE METHODS - Image capture systems capable of ensuring clear images are provided, in which an image capture module senses at least one image, and an operational module performs a compensation to the image capture system according to a modulation transfer function (MTF) value corresponding to the image, such that the image capture system can be operated under an optimized total gain thereby ensuring clear images. | 07-23-2009 |
20090213230 | IMAGE CAPTURE METHOD AND SYSTEM - An image capture method for capturing an image with a single lens is provided. The method includes: (a) sequentially moving an image capture unit to predetermined positions; (b) sequentially capturing a plurality of frames of images by the image capture unit at the predetermined positions, wherein at least one image distance difference exists among the images; and (c) generating at least one image file by a processing unit according to the images. | 08-27-2009 |
Kuo-Chang Liao, Taichung TW
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20110147554 | HOLDING DEVICE OF FITMENTS - A holding device of fitments is disposed to a support on one side of the fitment and comprises a holding plate including a coupling portion extending from one side of a bottom thereof; a connecting set including a disc extending upward from one end thereof, a fitting segment extending downward from another end thereof, and an insertion on a distal section of the fitting segment; a clamping set comprised of first and second engaging portions, an acting surface of each of the first and second engaging portions including an uneven contact section to engage with different supports, and including a receiving member with a through aperture to receive the fitting segment and the insertion. | 06-23-2011 |
Kuo- Liang Liao, Taichung TW
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20110130987 | ELECTRONIC SEAL - An electronic seal of the present invention includes a bolt. The bolt is used to mount on a door latch of a cargo and inserts into a shell. The shell is provided with a control circuit to actively send a warning signal as the bolt is moved. As such, the user of the electronic seal can be properly informed to prevent theft. | 06-02-2011 |
Kuo-Yu Liao, Taichung TW
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20140043697 | Imaging Lens - A thin imaging lens assembly with four lenses, having one defined as an object side and an opposite end defined as an image side, and comprising: a lens set, including a first lens, a second lens, a third lens, and a fourth lens that are arranged from the object side to the image side in sequence so as to form an optical structure; and a fixed aperture, deposited between the object side and the image side, wherein the first lens has a positive refractive power around an optical axis thereof; the second lens has a negative refractive power around an optical axis thereof; the third lens has a positive refractive power around an optical axis thereof; and the fourth lens comprises a seventh surface, a convex surface around an optical axis thereof, and an eighth surface, a wavy and concave surface around an optical axis thereof. | 02-13-2014 |
20140313598 | THIN-TYPE WIDE-ANGLE IMAGING LENS ASSEMBLY WITH FOUR LENSES - A thin-type wide-angle imaging lens assembly comprises a fixing diaphragm and an optical set including four lenses. An arranging order from an object side to an image side is: a first lens; a second lens; a third lens; a fourth lens; and the fixing diaphragm disposed between an object and the second lens. By the concatenation between the lenses and the adapted curvature radius, thickness/interval, refractivity, and Abbe numbers, the assembly attains a big diaphragm with ultra-wide-angle, a shorter height, and a better optical aberration. | 10-23-2014 |
20160097917 | OPTICAL IMAGE CAPTURING SYSTEM - A five-piece optical lens for capturing image and a five-piece optical module for capturing image, along the optical axis in order from an object side to an image side, include a first lens with positive refractive power having a convex object-side surface; a second lens with refractive power; a third lens with refractive power; a fourth lens with refractive power; and a fifth lens with negative refractive power; and at least one of the image-side surface and object-side surface of each of the five lens elements are aspheric. The optical lens can increase aperture value and improve the imagining quality for use in compact cameras. | 04-07-2016 |
20160097918 | OPTICAL IMAGE CAPTURING SYSTEM - A five-piece optical lens for capturing image and a five-piece optical module for capturing image, along the optical axis in order from an object side to an image side, include a first lens with positive refractive power having a convex object-side surface; a second lens with refractive power; a third lens with refractive power; a fourth lens with refractive power; and a fifth lens with negative refractive power. An image-side surface of the fifth lens can be concave, and both surfaces thereof are both aspheric, wherein at least one surface thereof has an inflection point. The first to the fifth lenses of the five-piece optical lens have refractive power. The optical lens can increase aperture value and improve the imaging quality for use in compact cameras. | 04-07-2016 |
20160103298 | OPTICAL IMAGE CAPTURING SYSTEM - A five-piece optical lens for capturing image and a five-piece optical module for capturing image includes, in order from an object side to an image side, a first lens with positive refractive power having a convex object-side surface; a second lens with refractive power; a third lens with refractive power; a fourth lens with refractive power; and a fifth lens with negative refractive power. An image-side surface of the fifth lens can be concave, and both surfaces thereof are both aspheric, wherein at least one surface thereof has an inflection point. The first to the fifth lenses of the five-piece optical lens have refractive power. The optical lens can increase aperture value and improve the imaging quality for use in compact cameras. | 04-14-2016 |
Li-Chuan Liao, Taichung TW
Patent application number | Description | Published |
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20090265159 | SPEECH RECOGNITION METHOD FOR BOTH ENGLISH AND CHINESE - The present invention can recognize both English and Chinese at the same time. The most important skill is that the features of all English words (without samples) are entirely extracted from the features of Chinese syllables. The invention normalizes the signal waveforms of variable lengths for English words (Chinese syllables) such that the same words (syllables) can have the same features at the same time position. Hence the Bayesian classifier can recognize both the fast and slow utterance of sentences. The invention can improve the feature such that the speech recognition of the unknown English (Chinese) is guaranteed to be correct. Furthermore, since the invention can create the features of English words from the features of Chinese syllables, it can also create the features of other languages from the features of Chinese syllables and hence it can also recognize other languages, such as German, French, Japanese, Korean, Russian, etc. | 10-22-2009 |
20110035216 | SPEECH RECOGNITION METHOD FOR ALL LANGUAGES WITHOUT USING SAMPLES - The invention can recognize any several languages at the same time without using samples. The important skill is that features of known words in any language are extracted from unknown words or continuous voices. These unknown words represented by matrices are spread in the 144-dimensional space. The feature of a known word of any language represented by a matrix is simulated by the surrounding unknown words. | 02-10-2011 |
20120116764 | Speech recognition method on sentences in all languages - A speech recognition method on all sentences in all languages is provided. A sentence can be a word, name or sentence. All sentences are represented by E×P=12×12 matrices of linear predict coding cepstra (LPCC) 1000 different voices are transformed into 1000 matrices of LPCC to represent 1000 databases. E×P matrices of known sentences after deletion of time intervals between two words are put into their closest databases. To classify an unknown sentence, use the distance to find its F closest databases and then from known sentences in its F databases, find a known sentence to be the unknown one. The invention needs no samples and can find a sentence in one second using Visual Basic. Any person without training can immediately and freely communicate with computer in any language. It can recognize up to 7200 English words, 500 sentences of any language and 500 Chinese words. | 05-10-2012 |
Lin-Yao Liao, Taichung TW
Patent application number | Description | Published |
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20140049837 | IMAGE CAPTURING LENS SYSTEM - This invention provides an image capturing lens system comprising: a positive first lens element having a convex object-side surface; a negative second lens element having a concave object-side surface and a convex image-side surface; a third lens element with refractive power; a positive fourth lens element having a convex image-side surface, both of the object-side and image-side surfaces being aspheric; a fifth lens element with refractive power having a concave image-side surface, both of the object-side and image-side surfaces being aspheric, at least one inflection point is positioned on the image-side surface thereof. When some particular relations are satisfied, the light-focusing spots of various wavelengths can be favorably adjusted for extending the depth of field; therefore, the present image capturing lens system shall be suitable for compact electronic products with Extended Depth of Field (EDOF) function. | 02-20-2014 |
20140185151 | IMAGE CAPTURING LENS SYSTEM - An image capturing lens system includes four lens elements with refractive power, in order from an object side to an image side, a first lens element, a second lens element, a third lens element and a fourth lens element. The positive first lens element has a convex object-side surface at a paraxial region. The negative second lens element has a concave object-side surface at a paraxial region and an image-side surface changing from concave at a paraxial region to convex at a peripheral region, wherein the surfaces of the second lens element are aspheric. The positive third lens element has a concave object-side surface at a paraxial region and a convex image-side surface at a paraxial region. The negative fourth lens element has an image-side surface changing from concave at a paraxial region to convex at a peripheral region, and the surfaces of the fourth lens element are aspheric. | 07-03-2014 |
20150198786 | IMAGING LENS ASSEMBLY, IMAGING DEVICE AND MOBILE TERMINAL - An imaging lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, and a sixth lens element. The first lens element has refractive power. The second lens element has refractive power. The third lens element has positive refractive power. The fourth lens element has negative refractive power. The fifth lens element with refractive power has an image-side surface being concave in a paraxial region thereof. The sixth lens element with refractive power has an image-side surface being concave in a paraxial region thereof, wherein the image-side surface of the sixth lens element has at least one convex shape in an off-axis region thereof. The imaging lens assembly has a total of six lens elements with refractive power. | 07-16-2015 |
20150338607 | PHOTOGRAPHING OPTICAL LENS ASSEMBLY, IMAGE CAPTURING UNIT AND MOBILE DEVICE - A photographing optical lens assembly includes, in order from object side to image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The first lens element has positive refractive power. The second lens element with negative refractive power has an object-side surface being convex in a paraxial region and an image-side surface being concave in a paraxial region. The third and fourth lens elements have refractive power. The fifth lens element with refractive power has an object-side surface being convex in a paraxial region. The sixth lens element with negative refractive power has an image-side surface being concave in a paraxial region, and an object-side surface and the image-side surface of the sixth lens element are aspheric. The image-side surface of the sixth lens element has at least one inflection point. | 11-26-2015 |
Lu-Chia Liao, Taichung TW
Patent application number | Description | Published |
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20090185874 | GLASS CUTTING TOOL - A glass cutting tool includes a cutter body provided at a bottom portion thereof with a hole-cutting portion. The hole-cutting portion has a circular cross section and a recessed hole recessed inwardly from a bottom end thereof, such that the contact area between the hole-cutting portion and a workpiece of glass panel can be minimized when the hole-cutting portion is rotated to work on the glass panel, thereby avoiding cracking of the glass panel during working and lowering the defect rate and processing cost. | 07-23-2009 |
20090185876 | GLASS WORKING APPARATUS AND GLASS WORKING METHOD USING THE SAME - A glass working apparatus a casing, in which a rotating mechanism and an oscillating unit are installed. The rotating mechanism has a shaft rotatably mounted in the casing. The oscillating unit is connected with the shaft such that the oscillating unit is rotatable with the shaft. A glass cutting tool is connected to the oscillating unit, such that the glass cutting tool can be driven to rotate by the rotating mechanism through the oscillating unit and/or driven to oscillate by the oscillating unit for working on a glass workpiece. | 07-23-2009 |
20150183079 | CYLINDER-TYPE POLISHING MACHINE - A polishing machine is disclosed to include a machine body and a carrier movably coupled to the machine body. A polishing device is provided with a movable base movably coupled to the machine body and a plurality of polishing cylinders rotatably connected to the movable base and located above the carrier. A rotary drive device is provided with a plurality of transmission gears each coupled to one of the polishing cylinders, and two rotary drive motors symmetrically mounted to the movable base and each having a gear shaft for driving the transmission gears to rotate through at least one transmission belt. Thus, the polishing cylinders are moved along with the movable base and rotated by the actuation of the rotary drive motors for smoothing the workpieces placed on the carrier. | 07-02-2015 |
Lu-Shih Liao, Taichung TW
Patent application number | Description | Published |
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20120129413 | HALOGEN-FREE AND PHOSPHORUS-FREE RESIN FORMULATION AND COMPOSITE MATERIALS PREPARED THEREFROM - A halogen-free and phosphorus-free resin formulation, prepared by the following method, is provided. The method includes mixing a carboxy anhydride derivative, diisocyanate, a styrene maleic anhydride (SMA) copolymer derivative and a solvent to form a mixture, and heating the mixture to form a resin formulation. The disclosure also provides a halogen-free and phosphorus-free composite material with a low dielectric constant and flame resistance prepared from the resin formulation. | 05-24-2012 |
Pen Liang Liao, Taichung TW
Patent application number | Description | Published |
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20140272738 | BURNER IGNITING SYSTEM FOR GAS STOVE - A burner igniting system includes a burner disposed in a gas stove, a pilot light disposed in the gas stove for supplying a flame to the burner, an igniting and sensing device disposed in the gas stove for igniting the pilot light and for sensing a presence of flame on the pilot light, and a control device includes two or more processing devices (MCU 1-n), a high voltage circuit electrically connected the processing devices (MCU 1-n) for being actuated by the processing devices (MCU 1-n), and the processing devices (MCU 1-n) and the high voltage circuit are electrically connected to the igniting and sensing device for actuating the igniting and sensing device to selectively ignite the burner with the pilot light. | 09-18-2014 |
20160040876 | BURNER IGNITING SYSTEM FOR GAS STOVE - A burner igniting system includes a pilot light disposed in a gas stove for supplying a flame to a burner, an igniting and sensing device for igniting the pilot light and for sensing a presence of flame on the pilot light, and a control device includes a circuit board, a flame signal amplifying device electrically connected to the pilot light for detecting whether a flame in the pilot light is existed or not, and a processing device (MCU n) electrically connected to the flame signal amplifying device for processing the flame signal from the flame signal amplifying device into a processed signal, and to determine whether the pilot light and the burner have been successfully ignited or not. | 02-11-2016 |
Pen-Yi Liao, Taichung TW
Patent application number | Description | Published |
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20110278050 | NON-DELETERIOUS TECHNIQUE FOR CREATING CONTINUOUS CONDUCTIVE CIRCUITS UPON THE SURFACES OF A NON-CONDUCTIVE SUBSTRATE - A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region. | 11-17-2011 |
20140102775 | NON-DELETERIOUS TECHNIQUE FOR CREATING CONTINUOUS CONDUCTIVE CIRCUITS UPON THE SURFACES OF A NON-CONDUCTIVE SUBSTRATE - A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region. | 04-17-2014 |
20140116885 | NON-DELETERIOUS TECHNIQUE FOR CREATING CONTINUOUS CONDUCTIVE CIRCUITS UPON THE SURFACES OF A NON-CONDUCTIVE SUBSTRATE - A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region. | 05-01-2014 |
Po-Jui Liao, Taichung TW
Patent application number | Description | Published |
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20160097917 | OPTICAL IMAGE CAPTURING SYSTEM - A five-piece optical lens for capturing image and a five-piece optical module for capturing image, along the optical axis in order from an object side to an image side, include a first lens with positive refractive power having a convex object-side surface; a second lens with refractive power; a third lens with refractive power; a fourth lens with refractive power; and a fifth lens with negative refractive power; and at least one of the image-side surface and object-side surface of each of the five lens elements are aspheric. The optical lens can increase aperture value and improve the imagining quality for use in compact cameras. | 04-07-2016 |
20160097918 | OPTICAL IMAGE CAPTURING SYSTEM - A five-piece optical lens for capturing image and a five-piece optical module for capturing image, along the optical axis in order from an object side to an image side, include a first lens with positive refractive power having a convex object-side surface; a second lens with refractive power; a third lens with refractive power; a fourth lens with refractive power; and a fifth lens with negative refractive power. An image-side surface of the fifth lens can be concave, and both surfaces thereof are both aspheric, wherein at least one surface thereof has an inflection point. The first to the fifth lenses of the five-piece optical lens have refractive power. The optical lens can increase aperture value and improve the imaging quality for use in compact cameras. | 04-07-2016 |
20160103298 | OPTICAL IMAGE CAPTURING SYSTEM - A five-piece optical lens for capturing image and a five-piece optical module for capturing image includes, in order from an object side to an image side, a first lens with positive refractive power having a convex object-side surface; a second lens with refractive power; a third lens with refractive power; a fourth lens with refractive power; and a fifth lens with negative refractive power. An image-side surface of the fifth lens can be concave, and both surfaces thereof are both aspheric, wherein at least one surface thereof has an inflection point. The first to the fifth lenses of the five-piece optical lens have refractive power. The optical lens can increase aperture value and improve the imaging quality for use in compact cameras. | 04-14-2016 |
Po-Lin Liao, Taichung TW
Patent application number | Description | Published |
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20080229647 | Fishing rod fixing device - A fishing rod fixing device includes a base that is supported by two suction cups for easy and efficient attachment of the device to a smooth fixture surface. A seat is rotatably mounted on the base and is releasably set any desired horizontal direction by an adjustment knob. The seat includes a tubular bar on which at least one retainer is mounted and rotatable about the bar for setting the retainer at any desired inclination angle. An angle locking member is provided to releasably secure the retainer at the desired inclination angle. The retainer has a base support mounted to the tubular bar and a top wall member spaced from the base support to define a passage therebetween for receiving a fishing rod. A locking member is provided on the top wall and is manually movable to releasably and selectively secure the fishing rod to the base support. | 09-25-2008 |
20090166490 | AUTOMATIC ALERT DEVICE FOR SUCTION CUP - An automatic alert device is provided for a suction cup, including a pump and a suction cup positionable on an object to be handled. The pump is operable to drive air out of the suction cup thereby inducing suction force on the object to be handled. When the suction cup gradually loses the suction force, a plunger of the pump gets moved out of the pump. When the outward movement of the plunger reaches a preset extent, the alert device that includes a warning light and an audio alert is activated to cause the warning light and the audio alert to give off warnings of light and sound respectively. Thus, an operator can be immediately notified of the situation of losing suction force for taking remedial operation to get the suction force back to the desired level. | 07-02-2009 |
20100133863 | STEPWISE POWERFUL SUCTION DEVICE - A stepwise powerful suction device includes suction holders, suction elements, resilient elements, a support frame, and rotary knobs. The support frame and the three suction holders are integrally formed together. A portion of the support frame forms a handle. Each suction element forms an upright post extending through the respective resilient element and suction holder. Each suction holder forms a multi-step stepwise recess, and each rotary knob has a handgrip that forms a multi-step stepwise projection overlappingly engaging the multi-step stepwise recess and including a safety button, a spacer ring, and a bolt extending through the handgrip of the rotary knob to engage an inner-threaded hole defined in the respective suction element. Each suction holder forms a stop, and the handgrip of the respective rotary knob forms a counterpart raised portion. When the handgrip of the rotary knob is rotated from a released position to first, second, and third engaging position, respective suction forces, which are sequentially of small, intermediate, and large magnitudes, are induced to effect various sucking operations on plates of different materials and thicknesses. | 06-03-2010 |
20110100940 | STRUCTURE OF PARTS STAND - A parts stand includes a base that is coupled to and supports a coupling collar with a cylindrical section thereof. The coupling collar is coupled to and supports a tray. A support collar is then assembled thereto and another tray is further assembled. Guide blocks of the tray engage lug plates of the support collar. Afterwards, the support collars is coupled to another support collar, and the another support collars is fit into another tray, so that the trays are vertically and sequentially stacked. The parts stand may further include a coupling tube composed of tubular sections extending internally the parts stand and a coupling bar composed of bar segments extending internally through the coupling tube. The coupling bar is secured to a bottom cap and a crown tray with bolts to facilitate smooth rotation of the trays of the parts stand. The trays form storage chambers for storing parts. The trays and the support collars or the coupling collar are rotatable on the base or other support collars to facilitate access to the parts. An additional small-sized tray can be selectively provided above the trays to facilitate access to the parts stored in the next large-sized tray. | 05-05-2011 |
20120043439 | OMNI-DIRECTION ROTATABLE DUAL-CUP SUCTION DEVICE - An omni-direction rotatable dual-cup suction device includes two suction cups, which are respectively combined with and in communication with two evacuation structures, so that the two evacuation structures can evacuate air from the suction cups to induce vacuum suction forces. The two suction cups are respectively provided with a mounting seat and an attaching seat for securely coupling the two evacuation structures. The mounting seat includes a pillar fixed thereto. A collar receives a ball end of a bar therein and is attached to the pillar. The ball-ended bar is coupled to a threaded rod, which extends through an internally-threaded locking knob and received into the attaching seat to be secured by a nut. With such an arrangement, one of the suction cups can be attached to a planar fixture surface, while the other suction cup can be used to hold an article and is orientation adjustable in any direction. | 02-23-2012 |
20120210570 | DISMOUNTING DEVICE FOR ENVIRONMENT-FRIENDLY OIL FILTER - A dismounting device is provided for efficiently and effectively dismounting an environment-friendly oil filter from an engine. The device includes an oil storage container that forms an oil discharge mouth and includes an oil guide tube extending into an internal oil storage space thereof. The oil guide tube has an exposed upper end carrying a pusher in which a central bore is defined and communicating the internal oil storage space of the container. The pusher has an upper portion forming a threaded section that is engageable with an internal thread of an oil discharge opening of the oil filter and a push tube extendable into the oil filter to open an internal valve of the oil filter so that oil remaining in the filter is allowed to flow into the central bore of the pusher and is conducted by the oil guide tube into the oil storage space of the container. | 08-23-2012 |
20120267006 | FUNNEL STRUCTURE FOR OIL CASE - A funnel structure includes a funnel body, which has a top surface made inclining at a predetermined slope and a circumferential wall forming opposite cut-offs for stably holding an oil bottle that pours oil into an oil case and has a bottom end forming a joint tube and a first key, an extender, which has a top end forming a first joint bore and a first keyway for receiving and jointing the first joint tube and the first key and a bottom end forming a second joint tube and a second key, and a conic cap, which forms a second joint bore and a second keyway for receiving and jointing the second joint tube and the second key. The conic cap has a bottom end forming a round tube and two opposite projections to mate inward-projecting flanges and notches forming in an oil feeding port of the oil. | 10-25-2012 |
20130037766 | HAND-OPERATING VACUUM PULLING DEVICE - A hand-operated vacuum pulling device includes a shank, over which a backward ram is slidable fit. The shank has a front end to which a suction cup is attached and a rear end to which a handgrip defining a cylinder and having a pressure relief seat is attached. The pressure relief seat forms a ram stop at a joint thereof with the shank. The handgrip has a rear end to which a ring-shaped cover assembly is attached. The piston assembly is manually operable to induce a vacuum inside the cylinder. And then, the ring-shaped cover assembly can be manually operated to pull the piston assembly backward for repeated operation of the piston assembly to thereby make a spring contained in the piston assembly stiffer and increase the suction power of the suction cup. The backward ram can be quickly moved backward to impact the ram stop for improving pulling effect. | 02-14-2013 |
20140093410 | MULTI-PURPOSE LARGE CAPACITY PUMP - A multi-purpose large capacity pump includes a cylinder having top and bottom ends closed by a top lid and a bottom lid. The top lid is provided with an inlet port that is in communication through a first one-way valve with an interior space of the cylinder. The bottom lid includes a second one-way valve in communication with the interior space of the cylinder. An output tube connects between the second one-way valve and an outlet port of the top lid. A protection enclosure is set around an outer circumference of the cylinder and a base is provided to fix and support the bottom end of the cylinder. A pull bar extends through the top lid into the cylinder to allow an inner end thereof to couple to a piston. The pull bar has an outer end to which a handle is mounted. | 04-03-2014 |
20140196816 | STRUCTURE OF OIL FILLING DEVICE - An oil filling device includes an oil filling funnel, an extendable tube assembly, a direction adjustment assembly, and a coupling assembly. The oil filling funnel is mounted to a first end of the extendable tube assembly. The extendable tube assembly has a second end mounted to the direction adjustment assembly. The direction adjustment assembly is mounted to the coupling assembly that is attachable to an oil filling hole of an engine. The direction adjustment assembly enables adjustment of the direction of the extendable tube assembly and the oil filling funnel with respect to the engine, while the extendable tube assembly allows the oil filling funnel to be selectively moved toward or away from the oil filling hole. Thus, the oil filling device may accommodate various heights and angles of oil filling hole of engine and allows filling of oil into the engine to be conducted in a smoother manner. | 07-17-2014 |
20150017026 | STRUCTURE OF PUMP - A pump includes a cap that is fit into an opening of a pump body. The pump body has an external thread formed on an outer circumference close to a top face thereof for engagement with and coupling to a rotatable fixing ring having an internal thread so as to retain a cap from top side thereof. The threading engagement along the circumference fixes the cap and the pump body together. The cap has an underside from which a projecting ring extends downward. The projecting ring has a thread. A piston cylinder has an end forming a thread engageable with the thread of the projecting ring to complete the assembling of the piston cylinder. | 01-15-2015 |
20160090977 | STRUCTURE OF TRIGGER-BOOSTING PULLING DEVICE - A trigger-boosting pulling device includes an elongate shank, which receives a backward ram to slidably fit thereon, a suction cup, which is fixed to a rear end of the elongate shank, a hand-operating pump structure, which is fixed to a front end of the elongate shank and includes a T-shaped pull grip that is connected by a connection bar to a piston assembly. The connection bar includes a spring fit thereon for position restoration of the pull grip. The pump cylinder includes a handle mounted thereto. The handle has a trigger that is arranged to drive, via a connection lever, the connection bar. As such, the T-shaped pull grip can be first pulled to induce a suction force to reach an initial level and then the handle is held by a hand and the trigger is pulled to drive the connection lever for doubling the force so as to induce enhanced vacuum suction force in the suction cup. | 03-31-2016 |
Sheng-Ren Liao, Taichung TW
Patent application number | Description | Published |
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20090283083 | VALVE CHANGE-OVER DEVICE - A valve change-over device includes a motor-driving unit having a spindle fitted thereon with a sleeve having at least one side wall axially bored with a guide slot. A pushing rod received in the sleeve is fixed with a position-limiting member at a location corresponding with the guide slot of the sleeve. A valve body is installed at the front open end of the sleeve, having a valve rod axially inserted in the interior. The spindle of the motor-driving unit is rotated to actuate the pushing rod to slidably shift in the guide slots of the sleeve and control the valve rod to open and close the through holes of the valve body for permitting air to flow in and exhaust out and controlling air flowing directions, able to quickly change the phase and elevate the working efficiency of the valve body. | 11-19-2009 |
20090283085 | PERCUSSION CONTROLLING MECHANISM OF PAINTBALL GUNS - A percussion controlling mechanism of paintball guns includes a percussion member and an air valve separately installed in a gun body. A main air passage is located in front of and separated from the air valve by a spring. Located behind the air valve is a driving chamber having a driving member. An air sub-passage is formed under the air valve chamber for communicating with the main air passage. A driving valve is installed in a grip to correspond to the driving chamber, having an ever-opened buffering hole communicating with a front end of the driving chamber and the air sub-passage, and a driving hole communicating with a rear end of the driving chamber. By means of the air sub-passage to provoke a difference of pressure in the driving chamber, the backlash of percussion can be greatly lowered to boost speed of continuous shooting. | 11-19-2009 |
Shih-Kuei Liao, Taichung TW
Patent application number | Description | Published |
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20120177881 | SUPER-HYDROPHOBIC MICROSTRUCTURE - A super-hydrophobic microstructure includes a base body on which plural protrusions with different heights are formed. Some of the protrusions with different heights construct at least one closed curve from the top view. The super-hydrophobic microstructure has the advantages of higher structural strength and lower cost, and is easy to be manufactured. | 07-12-2012 |
Su-Chen Liao, Taichung TW
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20130057109 | BRUSH HOLDER OF SLIP RING - A brush holder of the present invention is formed by a plurality of brush holder units in serial connection. Each brush holder unit includes an insulating base, a brush frame, and two carbon brushes. The insulating base has a protrusion and a recess on opposite sides. The brush frame has a main body received in the recess and two branches projected from opposite ends of the main body. The carbon brushes are provided on the branches of the brush frame. The protrusion of the brush holder unit is inserted into the recess of another brush holder unit to serially connect the brush holder units as well as to secure the brush frame in the recess. Therefore, the brush holder may be formed by serially connecting the brush holder units in a fast and easy way, and it provides a stable signal transmission. | 03-07-2013 |
Sung-Yie Liao, Taichung TW
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20090184140 | Device For Manufacturing Seamless Hat - A device for manufacturing a seamless hat comprises an assembling cutting device and a layer connecting device, wherein the assembling cutting device comprises an ultrasonic metal wheel, an ultrasonic metal platform, a feeding rubber wheel, and a feeding metal wheel; the ultrasonic metal wheel and the feeding rubber wheel are concentric and closed each other, a metal wheel is disposed at the bottom of the feeding rubber wheel, the ultrasonic metal platform is disposed at the bottom of the ultrasonic metal wheel, a top end of a cone peripheral surface of the ultrasonic metal wheel has a sharp edge and a platform portion, which is disposed at a side away from the rubber wheel. Accordingly, the seam allowance cut pieces of the hat may not be initially connected to the edge of the hat. And, the assembling cutting device simultaneously proceeds the ultrasonic connection of the seam allowance cut pieces and the cut to the residue of the cloth in order to uniform the connection so as to get more efficient. | 07-23-2009 |
20110210685 | LIGHTED HAT WITH A POWER SUPPLY DEVICE AS FLASHLIGHT - A lighted hat includes a hat unit comprising a crown including a pocket on one side, a visor, and an adjuster; a light assembly on the hat unit; and a removable power supply device in the pocket and comprising a rechargeable battery and a control assembly including a push button switch, a slide switch for switching the power supply device to a flashlight or illumination mode, and a light emitting member. In the flashlight mode, a pressing of the push button switch causes the light emitting member to electrically connect to the battery for light emission, and a next pressing of the push button switch causes the light emitting member to electrically disconnect from the battery. In the illumination mode, the light assembly is electrically connect to the battery such that a pressing of the push button switch cause the light assembly to emit light, blink, or turn off. | 09-01-2011 |
Syuan-Jhe Liao, Taichung TW
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20080319663 | Method for smart broadcasting of stop names - A method for smart broadcasting of stop names includes the steps of using a global positioning device to receive positioning signals transmitted from a satellite to obtain data of current vehicle geographic longitude and latitude coordinates and moving speed, and to compute a distance between the current vehicle position and a next stop based on the obtained current vehicle coordinates and moving speed data; and causing a microprocessor to use analyzed vehicle speed data to compute parameters for adjusting a predicted distance and the predicted distance, so that the microprocessor determines based on the predicted distance and the distance to the next stop whether a broadcasting device is to be actuated or not. Therefore, a mass transportation vehicle running on the same route at different hours in a day may automatically broadcast and timely inform passengers of the next stop name depending on the current vehicle moving speed. | 12-25-2008 |
Tien-Tzu Liao, Taichung TW
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20100126807 | Screw elevator - A screw elevator comprises a pair of counterweight guide rails, a pair of deflection wheels, a counterweight frame, a screw, a power unit, a cable, a car and a car guide rail. The power unit, the screw and the counterweight frame are all disposed between the pair of counterweight guide rails. The power unit drives the screw and the counterweight frame to move, and then the movement of the screw will drive the cable to make the car move upwards and downwards along the car guide rail. The cable has one end fixed at a position above the counterweight rails and the other end of the cable is finally fixed at the center of the top of the car after being wound around a traction wheel and straddled over the deflection wheels. | 05-27-2010 |
Ting-Wei Liao, Taichung TW
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20150130067 | OHMIC CONTACT STRUCTURE AND SEMICONDUCTOR DEVICE HAVING THE SAME - This invention provides an ohmic contact structure including: a semiconductor substrate having a top surface which includes a plurality of micro-structures; and a conductive layer, which is formed on the micro-structures. An ohmic contact is formed by the conductive layer and the semiconductor substrate. The present invention also provides a semiconductor device having the ohmic contact structure. | 05-14-2015 |
Tsun-Chi Liao, Taichung TW
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20150059555 | PORTABLE CAJON HITTING ASSEMBLY - A portable cajon hitting assembly comprises a foot pedal, a wire tube, an upright plank, a bracing bar, a hitter and a holding rack. The wire tube is threaded by a drawing wire having a start end and a distal end. The upright plank has a turnable axle. The foot pedal is connected to the start end of the drawing wire through a chain. The bracing bar has two ends fastened respectively to the axle and the distal end of the drawing wire. The hitter is fastened to the axle. The holding rack clamps and holds a cajon. Thus, through relative positions of the bracing bar and drawing wire and a lever action, the drawing wire can draw the axle to turn at an optimal angle, and also increase instantaneous torsional force to enhance smoothness during treading of the foot pedal. Moreover, the invention also can be stored easily. | 03-05-2015 |
Tzu-Ching Liao, Taichung TW
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20140347751 | SIGHT - A sight includes a cylinder, a first lens, a first lens seat, and at least one first elastic member. The first lens is disposed in the cylinder. The first lens seat carrying the first lens is disposed in the cylinder. The first elastic member is disposed between an outer surface of the first lens seat and an inner periphery of the cylinder, wherein the first lens seat is tightly fitted with the cylinder and light enters the cylinder through the first lens. | 11-27-2014 |
Wei-Ju Liao, Taichung TW
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20130165533 | METHOD FOR CROSSLINKING A COLLOID, AND CROSSLINKED COLLOID THEREFROM - The disclosure provides a method for crosslinking a colloid, including: (a) providing a colloid solution; (b) adding a crosslinking agent and solid particles to the colloid solution, wherein the amount of solid particles added is enough to convert the colloid solution into a solid mixture, and wherein a crosslinking reaction proceeds in the solid mixture; and (c) removing the solid particles from the solid mixture. | 06-27-2013 |
20130236965 | METHOD FOR ENZYMATIC TREATMENT, DEVICE AND KIT USED THE SAME - One embodiment provides a method for enzymatic treatment, including the steps of forming a closed space on a local tissue area with a device and infusing an enzyme solution into the closed space for enzymatic treatment. The method according to the embodiment is capable of treating the local tissue area with enzymes for enhancing cell proliferation in the treated tissue area and preventing damage of the adjacent normal tissues. A device and kit used for the method are also provided. | 09-12-2013 |
Wei-Li Liao, Taichung TW
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20120038410 | CIRCUIT AND METHOD FOR CHARACTERIZING THE PERFORMANCE OF A SENSE AMPLIFIER - An integrated circuit includes a sensing circuit, a fuse box, and a fuse bus decoder. The sensing circuit includes an output node, and the fuse box includes a plurality of switches coupled in series with a plurality of resistive elements. The fuse box is coupled to the output node of the sensing circuit from which the fuse box is configured to receive a current. The fuse bus decoder is coupled to the fuse box and includes at least one demultiplexer configured to receive a signal and in response output a plurality of control signals for selectively opening and closing the switches of the fuse box to adjust a resistance across the fuse box. A voltage of the output node of the sense amplifier is based on a resistance the fuse box and the current. | 02-16-2012 |
Wei-Zhi Liao, Taichung TW
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20080255395 | Process for producing bis-alkoxylated diols of bisphenol a from spent polycarbonate discs(PC) or PC waste - This invention provides one-pot reaction for digesting polycarbonate waste with alkylene glycol in the presence of a basic catalyst at 180° C. under normal atmospheric pressure. The digested product mixture was found to consist of bisphenol A (BPA) and monoalkoxylated and bisalkoxylated diols of BPA. Alkoxylation of BPA and monoalkoxylated diols of BPA is performed by adding urea or urea derivative (or carbonic acid ester or amine ester) to the digested product mixture at a high temperature under normal atmospheric pressure to obtain the final product, i.e., bisalkoxylated diols of BPA in high yield. The bisalkoxylated diols of BPA may be used as raw materials to synthesize polymer such as polyurethane (PU) or polyester. | 10-16-2008 |
Wen-Kai Liao, Taichung TW
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20150214168 | SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF - A substrate structure is provided, which includes: a substrate body having a plurality of conductive pads; an insulating layer formed on the substrate body and having a plurality of openings for correspondingly exposing the conductive pads; and a plurality of ring bodies formed in the openings and corresponding in position to edges of the conductive pads. As such, a plurality of conductive elements can be subsequently formed inside the ring bodies so as to be prevented by the ring bodies from expanding outward during a reflow process, thereby protecting the insulating layer from being compressed by the conductive elements and preventing cracking of the insulating layer. | 07-30-2015 |
20160079148 | SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A substrate structure is provided, including: a carrier having at least a wiring area defined and positioned on a portion of a surface of the carrier; a first insulating layer formed on the wiring area; a wiring layer formed on the first insulating layer formed on the wiring area; and a second insulating layer formed on the wiring area. Therefore, a contact surface between the carrier and the first and second insulating layers is reduced by reducing the areas of the first and second insulating layers, whereby a substrate warpage due to mismatch of coefficients of thermal expansion (CTE) is avoided. The present invention further provides a method of manufacturing the substrate structure as described above. | 03-17-2016 |
Wen - Ting Liao, Taichung TW
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20080310973 | Water pumping device by using pressure differential - A water pumping device includes a water storage tank, a water tower, a pressure differential pump, and two pumping pipes. The pressure differential pump includes two opposite cylinders, two pistons, a connecting rod, two equivalent-diameter retractable air pipes, and two air control valves. Thus, the air pipes are expanded by the compressed air from the air control valves, and the two pistons are movable reciprocally in the cylinders by driving of the air pipes to introduce the water in the water storage tank through the pumping pipes into the water tower in an alternating manner so as to pump and supply the water into the water tower successively. | 12-18-2008 |
Xian-Gen Liao, Taichung TW
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20120308037 | MICROELECTROMECHANICAL MICROPHONE CHIP HAVING STEREOSCOPIC DIAPHRAGM STRUCTURE AND FABRICATION METHOD THEREOF - A microelectromechanical microphone chip having a stereoscopic diaphragm structure includes a base, having a chamber; a diaphragm, disposed on the chamber and having steps with height differences; and a back plate, disposed on the diaphragm, forming a space with the diaphragm in between, and having a plurality of sound-holes communicating with the space. | 12-06-2012 |
Yan-Sin Liao, Taichung TW
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20150117802 | DEVICE OF THE AXIAL-DIRECTIONAL OIL CHAMBER OF HYDROSTATIC SPINDLE - A device of the axial-directional oil chamber of hydrostatic spindle comprises integrated oil seal structures at both the axial direction and the radial direction. The oil seal structures increase the work area of the oil chamber by extending and thus connecting an axial-directional oil seal edge to a radial-directional oil seal edge. Then, the rigidity of the axial hydrostatic bearing can be increased, and thus the application capability of the hydrostatic spindle can be upgraded to perform the multi-task machining from the mono-task machining. | 04-30-2015 |
Yan-Yi Liao, Taichung TW
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20140183721 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A fabrication method of a semiconductor package is provided, which includes the steps of: providing a carrier having an adhesive layer and at least a semiconductor element having a protection layer; disposing the semiconductor element on the adhesive layer of the carrier through the protection layer; forming an encapsulant on the adhesive layer of the carrier for encapsulating the semiconductor element; removing the carrier and the adhesive layer to expose the protection layer from the encapsulant; and removing the protection layer to expose the semiconductor element from the encapsulant. Since the semiconductor element is protected by the protection layer against damage during the process of removing the adhesive layer, the product yield is improved. | 07-03-2014 |
20140332976 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is disclosed, which includes: a carrier having at least an opening; a plurality of conductive traces formed on the carrier and in the opening; a first semiconductor element disposed in the opening and electrically connected to the conductive traces; a second semiconductor element disposed on the first semiconductor element in the opening; and a redistribution layer structure formed on the carrier and the second semiconductor element for electrically connecting the conductive traces and the second semiconductor element. Since the semiconductor elements are embedded and therefore positioned in the opening of the carrier, the present invention eliminates the need to perform a molding process before forming the redistribution layer structure and prevents the semiconductor elements from displacement. | 11-13-2014 |
20140342505 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE - A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a carrier; disposing at least a semiconductor element on the carrier; forming an encapsulant on the carrier and the semiconductor element for encapsulating the semiconductor element; removing the carrier; disposing a pressure member on the encapsulant; and forming an RDL structure on the semiconductor element and the encapsulant, thereby suppressing internal stresses through the pressure member so as to mitigate warpage on edges of the encapsulant. | 11-20-2014 |
Yi-Chian Liao, Taichung TW
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20150255311 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE - A semiconductor package is provided, including: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top side of the interposer; a semiconductor element disposed on the top side of the interposer; and an adhesive formed between the interposer and the semiconductor element. By encapsulating the interposer with the encapsulant, warpage of the interposer is avoided and a planar surface is provided for the semiconductor element to be disposed thereon, thereby improving the reliability of electrical connection between the interposer and the semiconductor element. | 09-10-2015 |
Yi-Chun Liao, Taichung TW
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20100218686 | PORTABLE ESPRESSO COFFEE APPARATUS - A brewing device comprising a brewing system; a handle assembly coupled to the brewing system and containing a source of compressed fluid; and a valve system, coupled to the handle, to selectively place the source of compressed fluid in fluid communication with the brewing system. | 09-02-2010 |
20130260964 | EXERCISE APPARATUS - An exercise apparatus includes a base providing a relatively higher first terminal end, a relatively lower second terminal end, and a track between the first and second terminal ends. The exercise apparatus also includes a seat unit movable along the track between a first position adjacent to the first terminal end and a second position located far apart from the first terminal end. An elevation difference relative to the seat unit is produced by a wheel pedal unit movable along the track between a first pedaling position adjacent to the second terminal end and located horizontally far apart from the seat unit, and a second pedaling position located far from the second terminal end and horizontally adjacent to the seat unit. Thus, changing the position of the wheel pedal unit and the position of the seat unit can change the elevation difference between the seat unit and the wheel pedal unit in both the vertical and horizontal directions. This enables a user to selectively perform different exercise modes in either a normal sitting posture or a recumbent sitting posture. | 10-03-2013 |
20130260965 | EXERCISE APPARATUS - An exercise apparatus includes a base having a bracket member and a wheel pedal unit mounted at the base at a location far apart from the bracket member. A moving arm member is retractably coupled to the bracket member and movable relative to the bracket member in an angle of inclination between a first position and a second position. A seat unit is mounted at the moving arm member. Moving the moving arm member between a first location and a second location can change the elevation difference between the seat unit and the wheel pedal unit in both the vertical and horizontal directions, thus enabling the user to selectively perform different exercise modes in either a normal sitting posture or a recumbent sitting posture. | 10-03-2013 |
20130260966 | SUPPORT FRAME FOR EXERCISE APPARATUS - A support frame for an exercise apparatus includes a base providing a fulcrum, and a moving arm member having a rotating portion located at one end thereof, and a swinging portion located at an opposite end thereof and equipped with a seat unit. The rotating portion is equipped with a wheel pedal unit and is rotatably supported on the fulcrum of the base. The swinging portion is swingable on the center of the rotating portion between a high position located far apart from the base, and a low position located in closer proximity to the base. The support frame is configurable to change the elevation difference between the seat unit and the wheel pedal unit in both a vertical direction and a horizontal direction. Thus, the elevation difference is relatively changed by means of moving the moving arm member relative to the base. This causes the relative position between the wheel pedal unit and the seat unit to change for allowing the user to exercise in a normal upright, or elevated, sitting exercise mode or a recumbent sitting exercise mode. | 10-03-2013 |
20130260967 | SUPPORT FRAME FOR EXERCISE APPARATUS - A support frame for an exercise apparatus includes a base, and a smoothly arched moving arm member slidably coupled to the base. The moving arm member defines a first end connected to a wheel pedal unit and an opposing second end connected to a saddle unit, such that the elevation difference between the first and second ends in the vertical direction, as well as in the horizontal direction, changes subject to changing the relative position between the moving arm member and the base. Thus, by means of moving the moving arm member relative to the base, the elevation difference between the first and second ends is relatively changed, causing change of the relative position between the wheel pedal unit and the saddle unit. This allows the user to select a normal upright sitting exercise mode or a recumbent sitting exercise mode. | 10-03-2013 |
Yi-Lin Liao, Taichung TW
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20120171449 | ANTI-FLAME FILM AND METHOD FOR PRODUCING THE SAME - To produce an anti-flame film, nanoscale silicate platelets (NSP) are first diluted with water or an organic solvent; the dispersion is then dried on a surface to remove the water or organic solvent and finally an almost inorganic and flexible film with a thickness of 1 to 1,000 μm is obtained. The film has a regularly layered alignment of primary platelet (1 nm thickness) structure. The NSP film has excellent anti-flame and heat insulation properties that can effectively shield a flame of more than 800° C. without apparent deformation in shape. The NSP can be blended with polymers with a composition over 30% or preferably 70% of NSP to make composite films with significant improvement in flame and heat shielding. | 07-05-2012 |
20150274909 | ANTI-FLAME FILM AND METHOD FOR PRODUCING THE SAME - To produce an anti-flame film, nanoscale silicate platelets (NSP) are first diluted with water or an organic solvent; the dispersion is then dried on a surface to remove the water or organic solvent and finally an almost inorganic and flexible film with a thickness of 1 to 1,000 μm is obtained. The film has a regularly layered alignment of primary platelet (1 nm thickness) structure. The NSP film has excellent anti-flame and heat insulation properties that can effectively shield a flame of more than 800° C. without apparent deformation in shape. The NSP can be blended with polymers with a composition over 30% or preferably 70% of NSP to make composite films with significant improvement in flame and heat shielding. | 10-01-2015 |
Ying-Chieh Liao, Taichung TW
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20090101551 | Oil changing device - An oil changing device includes a used oil tank connected with an air suction device which is connected with a compressor and a vacuum generating device. A switch is connected between the vacuum generating device and the compressor. A new oil tank includes a pipe connected to a mechanical item whose oil is to be changed and another pipe connected to a connector of the used oil tank. The compressor and the vacuum generating device suck air in the mechanical item so as to form a negative pressure status to suck the used oil from the mechanical item into the used oil tank. The new oil in the new oil tank is then sucked into the mechanical item via another pipe controlled by another switch. | 04-23-2009 |
Ying-Tso Liao, Taichung TW
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20090035626 | Portable hydrogen gas generator - A portable hydrogen gas generator primarily comprises a body containing a hollow reaction chamber. The reaction chamber has a material inlet and a gas outlet, wherein the material inlet allows a reaction solution and a metal material to be filled into the reaction chamber so as to perform chemical reaction therebetween. The hydrogen gas generator further comprises a gas-pressure detecting unit for detecting the status of the gas pressure in the reaction chamber, a reaction solution detecting unit for detecting the status of the reaction solution in the reaction chamber; and a gas-dispatching unit for exporting hydrogen gas in the reaction chamber to an external apparatus that consumes hydrogen gas for operation, such as a fuel cell. | 02-05-2009 |
Yuankai Liao, Taichung TW
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20090011673 | Porous carbonized fabric with high efficiency and its preparation method and uses - A porous carbonized fabric with high efficiency and its preparation method and uses are provided. The carbonized fabric is prepared from a mixed spun fabric containing an oxidized fiber and a polyamide fiber. The carbonized fabric has excellent gas permeability, high porosity, and good electric conductivity. The carbonized fabric can be used as the gas diffusion layer (electrode) material in a fuel cell. The fuel cell can provide a relatively high power density. Moreover, the carbonized fabric is useful as an anti-electromagnetic material and a reinforced composite material. | 01-08-2009 |
20090047549 | MODIFIED CARBONIZED SUBSTRATE AND ITS MANUFACTURING METHOD AND USE - A process for modifying a carbonized substrate and a modified carbonized substrate obtained therefrom are provided. The process involves the application of a mixture containing a hydrophobic polymer and a carbonaceous material onto a carbonized substrate which is not subjected to a hydrophobic treatment. The subject invention uses a simpler procedure to modify a carbonized substrate to provide a modified carbonized substrate with good conductivity, air permeability, and hydrophobicity. The modified carbonized substrate is suitable for use as the material for the gas diffusion layer of the electrode in fuel cells. | 02-19-2009 |
20090061275 | Carbonized Paper With High Strength And Its Preparation Method And Uses - Strengthened carbonized paper, its preparation method and uses are provided. The carbonized paper comprises a mixed spun fabric containing oxidized fibers and polyamide fibers as the reinforced material. The carbonized paper has good tensile strength and electric conductivity. The carbonized paper can be used as the gas diffusion layer material in the fuel cell for better performance. Moreover, the carbonized paper of the subject invention is useful as the anti-electromagnetic material and reinforced composite material. | 03-05-2009 |
Yung-Yuan Liao, Taichung TW
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20150062865 | INDICATING LIGHT FOR TRANSPORTATION - An indicating light for transportation has a circuit board, a reflective layer and a light guide plate sequentially attached. Multiple LEDs are mounted on the circuit board and emit light. The light guide plate has an inner surface and an outer surface, wherein at least one indicating portion is formed on the inner surface for reflecting or refracting light of the LEDs to the outer surface. The reflective layer further prevents light leakage. Therefore, the indication portion generates a surface light effect for reducing glare and providing an enlarged illuminating area. | 03-05-2015 |