Patent application number | Description | Published |
20150325297 | EFFICIENT REPROGRAMMING METHOD FOR TIGHTENING A THRESHOLD VOLTAGE DISTRIBUTION IN A MEMORY DEVICE - Techniques are provided for programming memory cells while reducing the effects of detrapping which cause a downshift in the threshold voltage distribution. Detrapping is particularly problematic for charge-trapping memory cells such as in a 3D stacked non-volatile memory device. During programming, a temporary lockout mode is provided for memory cells which pass a verify test. During a checkpoint program-verify iteration, all memory cells of a target data state are subject to the verify test. The memory cells in the temporary lockout mode are therefore subject to the verify test a second time. Memory cells that fail the verify test in the checkpoint program-verify iteration are programmed further. A normal or slow programming mode is used for a memory cell depending on whether it had reached the temporary lockout mode. Threshold voltage distributions are narrowed by reprogramming some of the memory cells. | 11-12-2015 |
20160055915 | Avoiding Unintentional Program Or Erase Of A Select Gate Transistor - Techniques are provided for preventing inadvertent program or erase of select gate transistors and dummy memory cells during an erase operation involving data-storing memory cells in a three-dimensional memory device. The erase operation charges up a channel of a NAND string using gate-induced drain leakage from the select gate transistors. An erase voltage waveform and a select gate waveform are ramped up to intermediate levels which allow some charging of the channel to occur. The intermediate level of the select gate waveform is low enough to avoid inadvertent programming of the select gate transistors. Subsequently, the erase voltage waveform and the select gate waveform are ramped up to peak levels which allow additional charging of the channel to occur. The peak levels are set to avoid inadvertent erasing of the select gate transistors. | 02-25-2016 |
20160064084 | Programming Memory With Reduced Short-Term Charge Loss - Techniques are provided for reducing the effects of short-term charge loss while programming charge-trapping memory cells. Short-term charge loss can result in a downshift and widening of a threshold voltage distribution. A programming operation includes a rough programming pass in which memory cells are programmed close to a final threshold voltage distribution, for each target data state. Subsequently, a negative voltage is applied to control gates of the memory cells. Subsequently, a final programming pass is performed in which the memory cells are programmed to the final threshold voltage distribution. Since the negative voltage accelerates charge loss, there is reduced charge loss after the final programming pass. The rough programming pass can use incremental step pulse programming for the lowest target data state to obtain information regarding programming speed. An initial program voltage in the final programming pass can be set based on the programming speed. | 03-03-2016 |
20160093380 | MODIFYING PROGRAM PULSES BASED ON INTER-PULSE PERIOD TO REDUCE PROGRAM NOISE - Techniques are provided for more accurately programming memory cells by reducing program noise caused by charge loss in a programming pass in which the number of verify tests varies in different program loops. In an nth program loop, at least one programming characteristic is modified based on the number (N) of data states which were subject to verify tests in the n−1 | 03-31-2016 |
20160093390 | Read With Look-Back Combined With Programming With Asymmetric Boosting In Memory - A read operation compensates for program disturb when distinguishing between an erased-state and a lowest programmed data state, where the program disturb is a function of the data state of an adjacent, previously-programmed memory cell on a common charge-trapping layer. The read operation occurs in connection with a programming operation which avoids program disturb of the programmed data states by using asymmetric pass voltages. Before reading the memory cells on a selected word line (WLn), the memory cells on the adjacent, previously-programmed word line (WLn−1) are read. The read operation for WLn uses multiple read voltages—one for each data state on WLn−1, and one of the read results is selected based on the data state of the adjacent memory cell. Other read operations distinguish between each pair of adjacent programmed data states using a read voltage which is independent of the data state of the adjacent memory cell. | 03-31-2016 |
20160093636 | Alternating Refractive Index In Charge-Trapping Film In Three-Dimensional Memory - Techniques are provided for fabricating a three-dimensional, charge-trapping memory device with improved long term data retention. A corresponding three-dimensional, charge-trapping memory device is also provided which includes a stack of alternating word line layers and dielectric layers. A charge-trapping layer is deposited in a memory hole. The refractive index of portions of the charge-trapping layer which are adjacent to the word line layers is increased relative to the refractive index of portions of the charge-trapping layer which are adjacent to the dielectric layers. This can be achieved by doping the portions of the charge-trapping layer which are adjacent to the word line layers. In one approach, the charge-trapping layer is SiON and is doped with Si or N. In another approach, the charge-trapping layer is HfO and is doped with Hf. In another approach, the charge-trapping layer is HfSiON and is doped with Hf, Si or N. | 03-31-2016 |
20160111435 | THREE-DIMENSIONAL MEMORY STRUCTURE HAVING SELF-ALIGNED DRAIN REGIONS AND METHODS OF MAKING THEREOF - A memory stack structure can be formed through a stack of an alternating plurality of first material layers and second material layers and through an overlying temporary material layer having a different composition than the first and second material layers. The memory stack structure can include a memory film and a semiconductor channel layer. The overlying temporary material layer is removed selective to the stack to form a lateral recess. Portions of the memory film are removed around the lateral recess, and dopants are laterally introduced into an upper portion of the semiconductor channel to form a self-aligned drain region. | 04-21-2016 |
20160111437 | THREE-DIMENSIONAL MEMORY STRUCTURE HAVING SELF-ALIGNED DRAIN REGIONS AND METHODS OF MAKING THEREOF - A memory stack structure can be formed through a stack of an alternating plurality of first material layers and second material layers and through an overlying temporary material layer having a different composition than the first and second material layers. The memory stack structure can include a memory film and a semiconductor channel layer. The overlying temporary material layer is removed selective to the stack to form a lateral recess. Portions of the memory film are removed around the lateral recess, and dopants are laterally introduced into an upper portion of the semiconductor channel to form a self-aligned drain region. | 04-21-2016 |