Patent application number | Description | Published |
20140301035 | AIR SHIELD FOR RACK-MOUNT SERVER - An air shield is mounted to a cabinet to replace a server unit. The air shield includes a supporting shell detachably mounted in an opening defined the cabinet through which the server unit can enter the receiving space, and an adjusting apparatus slidably installed to the supporting shell. The supporting shell defines a number of vents communicating with the receiving space of the cabinet. The adjusting apparatus includes a number of spaced shield pieces. The adjusting apparatus is operated, to move the shield pieces to cover, partially cover, or uncover the vents of the supporting shell. | 10-09-2014 |
20150049435 | ELECTRONIC DEVICE - An electronic device includes a chassis, a power supply, and an air duct. The chassis includes a top plate, two side plates, a front plate set in a front of the top plate, and a baffle set at an inside of the front plate. The front plate, the baffle, the top plate and the side plates together define a receiving cavity for receiving the power supply. The front plate includes an air inlet adjacent to one end of the power supply. A fan is set at another end of the power supply. The side plate defines an opening. The air duct set on an outside of the side plate with the opening. An air channel is formed between the air duct and the side plate with the opening. A distal end of the channel forms an air outlet. | 02-19-2015 |
Patent application number | Description | Published |
20130034971 | INTERCONNECTING MECHANISM FOR 3D INTEGRATED CIRCUIT - An interconnecting mechanism is provide, which includes paired first sub-interconnecting mechanisms and paired second sub-interconnecting mechanisms. The first pair of sub-interconnecting mechanisms includes first and second axially symmetrical spiral conductive elements. The second pair of sub-interconnecting mechanisms includes third and fourth axially symmetrical spiral conductive elements. Configuring the pairs of sub-interconnecting mechanisms in a differential transmission structure having a spiral shape is used to avert sounds and noise signals between different chips or substrates caused by a miniaturizing fabrication process or an increased wiring density. | 02-07-2013 |
20130141187 | CROSS-COUPLED BANDPASS FILTER - A cross-coupled bandpass filter includes first, second and third resonators such that a positive mutual inductance is generated between the first and third resonators and mutual inductance generated between the first and second resonators and mutual inductance generated between the second and third resonators have the same polarity, thereby generating a transmission zero in a high frequency rejection band. | 06-06-2013 |
20140124950 | SEMICONDUCTOR SUBSTRATE AND FABRICATION METHOD THEREOF - A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer. | 05-08-2014 |
20140320374 | MULTI BANDWIDTH BALUN AND CIRCUIT STRUCTURE THEREOF - A multi bandwidth balun is provided, including a main signal port, a main inductor electrically connected to the main signal port, a first inductor inducted mutually with the main inductor to constitute a first inductor of a first conversion circuit, a first capacitor module connected in parallel to the first conversion circuit, two first signal ports electrically connected to the first capacitor module, a first main capacitor electrically connected to the first signal port and the first capacitor module therebetween, a second inductor inducted mutually with the main inductor to constitute a second inductor of a second conversion circuit, a second capacitor module connected in parallel to the second conversion circuit, two second signal ports electrically connected to the second capacitor module, and a second main capacitor electrically connected to the second signal port and the second capacitor module therebetween. | 10-30-2014 |