Patent application number | Description | Published |
20080217764 | Piezoelectric cooling of a semiconductor package - In one embodiment, the present invention includes a semiconductor package having a plurality of fan blades embedded within a first surface of the package, where a first group of the fan blades extend from a first side of the package and a second group of the fan blades extend from a second side of semiconductor package. The fan blades may be powered by piezoelectric devices to cause motion of the fan blades. Other embodiments are described and claimed. | 09-11-2008 |
20080218972 | Cooling device, system containing same, and cooling method - A cooling device includes a heat sink ( | 09-11-2008 |
20080229053 | Expanding memory support for a processor using virtualization - In one embodiment, the present invention includes a system including a processor to access a maximum memory space of a first size using a memory address having a first length, a chipset coupled to the processor to interface the processor to a memory including a physical memory space, where the chipset is to access a maximum memory space larger than the first maximum memory space, and a virtual machine monitor (VMM) to enable the processor to access the full physical memory space of a memory. Other embodiments are described and claimed. | 09-18-2008 |
20080238256 | Dual direction rake piezo actuator - Methods and apparatus relating to use and/or provision of a rake piezo actuator are described. In one embodiment, a piezo patch may be coupled to a plurality of blades (e.g., to cause the blades to oscillate and provide air flow between fins of one or more heat sinks). Other embodiments are also described. | 10-02-2008 |
20090034197 | HEATSINK, METHOD OF MANUFACTURING SAME, AND MICROELECTRONIC PACKAGE CONTAINING SAME - A heatsink comprises a base ( | 02-05-2009 |
20100118490 | AIRFLOW CONTROL SYSTEM - A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment. | 05-13-2010 |