Patent application number | Description | Published |
20090168330 | ELECTRONIC DEVICE WITH AIRFLOW GUIDING DUCT - An electronic device includes an enclosure ( | 07-02-2009 |
20090168361 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly includes a printed circuit board with a heat generating component attached thereon, a base, and a thermal plate. The heat generating component comprises a side surface. The base defines a receiving room and an opening configured for access into the receiving room. The printed circuit board is received in the receiving room via the opening. The thermal plate is mounted on the base to cover the opening. A conducting piece is formed on the thermal plate and extends into the receiving room. The conducting piece includes a contacting portion extending from the thermal plate and in contact with the side surface. The conducting piece is configured for conducting heat from the heat generating component to the thermal plate. A heat dissipating hole is defined on the thermal plate in alignment with the contacting portion configured for dissipating heat from the base. | 07-02-2009 |
20090190309 | ELECTRONIC APPARATUS WITH AIR GUIDING ELEMENT - An electronic apparatus includes an enclosure ( | 07-30-2009 |
20090213549 | HEAT SINK ASSEMBLY - A heat sink assembly includes a printed circuit board, an electronic component mounted on the printed circuit board, and a heat sink mounted on the printed circuit board for dissipating heat from the electronic component. The printed circuit board includes a heat-conduction layer. The heat sink includes a base configured to contact the heat-conduction layer, and a main body extending upward from the base configured to contact the electronic component. The cross section of the base is larger than the cross section of the main body. A plurality of fins extends from the main body. | 08-27-2009 |
20100002373 | HEAT DISSIPATING DEVICE FOR ELECTRONIC DEVICE - A heat dissipating device is provided. The heat dissipating device includes a seat and a plurality of fins secured on the seat. The fins are regularly aligned in a matrix. A first set of fins comprise of a convex profile. | 01-07-2010 |
20100014244 | THERMAL DEVICE FOR HEAT GENERATING SOURCE - A heat sink for dissipating heat from a heat source, includes a base configured to connect with a heat source, and a plurality of fins positioned on the base. A cutout is defined within the plurality of parallel fins. | 01-21-2010 |
20100097754 | COMPUTER ENCLOSURE WITH AIRFLOW GUIDE - A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis. | 04-22-2010 |
20100134971 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted on the heat sink configured to generate airflow through the heat dissipation apparatus. The fan includes a plurality of fan blades, and a motor configured for rotating the fan. The motor is located a distance from the fan blades. | 06-03-2010 |
20100147495 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted to the heat sink. The heat sink includes a base with a bottom surface for contacting the heat source, and a plurality of radial fins angling upwardly from a top surface of the base to form a truncated conical space in the middle of the heat sink. A cross section area of the truncated conical space gradually increases from the top surface of the base to top of the fins. | 06-17-2010 |
20100296237 | ELECTRONIC DEVICE ENCLOSURE - An apparatus includes a side plate and a rear plate perpendicular to the side plate. A motherboard is mounted on the side plate. The motherboard has a heat source attached thereon. The rear plate defines a ventilation area. The ventilation and the heat source are located at different heights. A fan is mounted on the ventilation area. The fan inclines towards the plurality of expansion cards. | 11-25-2010 |