Patent application number | Description | Published |
20110141485 | System and Method for Localizing a Carrier, Estimating a Posture of the Carrier and Establishing a Map - Provided is a system for localizing a carrier, estimating a posture of the carrier and establishing a map. The system includes: an inertial measurement device, measuring a motion state and a rotation state of the carrier; a vision measurement device disposed on the carrier for picturing an environment feature in an indoor environment where the carrier locates; and a controller receiving measuring results from the inertial measurement device and the vision measurement device to estimate a posture information, a location information and a velocity information of the carrier, and establishing a map having the environment feature. The controller estimates based on a corrected measuring result from one of the inertial measurement device and the vision measurement device, then controls the other one of the inertial measurement device and vision measurement device to measure, and accordingly corrects the posture, location and velocity information of the carrier and the map. | 06-16-2011 |
20140120894 | Mobile Device and Method for Controlling Application Procedures of the Mobile Device Thereof - A mobile device and a method for controlling application procedures of a mobile device are provided. The mobile device includes a motion sensor configured to detect motion of the mobile device and generate a motion signal, and a micro-processor configured to receive the motion signal, determine whether the mobile device has been continuously knocked for a predetermined number of times, and control an application procedure accordingly. The method for controlling the application procedures for the mobile device is also disclosed. Therefore, a user can control the mobile device conveniently, even in an occasion not convenient for the user to control the mobile device by its touch panel or physical buttons. | 05-01-2014 |
Patent application number | Description | Published |
20090190304 | COOLING DEVICE FOR MEMORY MODULE - A cooling device for memory module is held onto a memory module and includes a first cooling assembly, a second cooling assembly, and a fastener. In the invention, the first cooling assembly includes a cooling plate and a vapor chamber, in which cooling fins are formed at one side of the cooling plate, at upper side of which engaging parts are formed. One inner side of the cooling plate is attached to one side of the vapor chamber, while another side is attached to the memory module. The second cooling assembly also includes a cooling plate and a vapor chamber. Cooling fins are formed at one side of the cooling plate, at upper side of which engaging parts are formed. When the two cooling plates are fixed correspondingly, all cooling fins are aligned correspondingly, and the engaging parts are engaged to each other. In the meantime, at least one fastener is applied for clamping and fixing the first and second cooling assemblies together. Thereby, two sides of the memory module are provided with vapor chambers capable of rapid heat conduction to boost the cooling efficiency of the entire cooling device. | 07-30-2009 |
20090205812 | ISOTHERMAL VAPOR CHAMBER AND SUPPORT STRUCTURE THEREOF - In an isothermal vapor chamber and its support structure, the isothermal vapor chamber includes a casing, a capillary wick, a support structure and a working fluid. The capillary wick is disposed in the casing. The support structure is contained in the capillary wick for supporting the capillary wick and the support structure includes two side panels and a plurality of wavy plates are connected between the two side panels. The wavy plate is formed by a plurality of wave peak sections and a plurality of wave valley sections, and the wave peak sections of any two adjacent wavy plates are installed alternately with each other, and any two adjacent wavy plates are partitioned to form a partition channel. The working fluid is filled into the casing and flowed through the partition channel for improving the heat conducting efficiency of the isothermal vapor chamber. | 08-20-2009 |
20090242169 | HEAT-DISSIPATING DEVICE WITH CURVED VAPOR CHAMBER - A heat-dissipating device includes a vapor chamber shown as a flat long plate, a heat-dissipating plate superposed on the vapor chamber, and a first fin set. The middle portion of the vapor chamber is designed as a heated section, two sides of which respectively have a condensing section. Two curvedly extending sections are respectively disposed between the heated section and the condensing sections. Each condensing section is extended to a higher position of the heated section through the bending of each extending section. The heat-dissipating plate is horizontally attached onto the two condensing sections, thus that a section-differential space formed between the heat-dissipating plate and the heated section accommodates the first fin set thermally contacted with the heated section of the vapor chamber. | 10-01-2009 |
20100006268 | VAPOR CHAMBER AND SUPPORTING STRUCTURE OF THE SAME - A vapor chamber includes a casing, the working fluid, a wick structure and a supporting structure. The casing has a hollow room for allowing the working fluid to be filled therein. The wick structure is distributed in the hollow room. The supporting structure abuts against an inside surface of the wick structure. The supporting structure includes side plates and a plurality of wavelike pieces connected between the side plates. Each of the wavelike pieces is constituted of a plurality of crests and troughs. The crests of any two neighboring wavelike pieces are arranged in an alternating manner. A penetrating hole is provided at the crests and the troughs respectively. The working fluid flows through the separated passages and the penetrating holes. Via the above arrangement, the heat-conducting efficiency of the vapor chamber can be enhanced. | 01-14-2010 |
20100134982 | MEMORY HEAT DISSIPATING STRUCTURE AND MEMORY DEVICE HAVING THE SAME - A memory heat dissipating structure clamped on a surface of a memory module includes two heat dissipating plates and two uniform temperature plates. The uniform temperature plate includes first and second surfaces. The first surface of the uniform temperature plate is attached to an internal side of the heat dissipating plate, and the second surface of the uniform temperature plate is attached to the memory module. At least one heat dissipating body is installed on the memory module and clamped between the two heat dissipating plates and the two uniform temperature plates. The heat dissipating body includes a base and heat dissipating fins extended from the base. The base forms a straight section attached onto the second surface of the uniform temperature plate. The two heat dissipating plates are clamped and fixed by fixing elements. The structure of the invention can improve the heat dissipating effect of the memory module. | 06-03-2010 |
Patent application number | Description | Published |
20100285332 | Aluminum-scandium alloy film applied to vehicle lamps and manufacturing method thereof - An aluminum-scandium (Al—Sc) alloy film applied to vehicle lamps and a manufacturing method thereof are revealed. The Al—Sc alloy film contains a trace of scandium so that both temperature for grain refinement and temperature for recrystallization of the film are increased. This results in a fine and smooth surface of the Al—Sc alloy film and the Al—Sc alloy film has better optical reflectivity. Moreover, the Al—Sc alloy film has high recrystallization temperature and high adhesion strength. After high temperature annealing treatment, the Al—Sc alloy film still has higher corrosion resistance. | 11-11-2010 |
20110253524 | Aluminum-scandium alloy film applied to vehicle lamps and manufacturing method thereof - An aluminum-scandium (Al—Sc) alloy film applied to vehicle lamps and a manufacturing method thereof are revealed. The Al—Sc alloy film contains a trace of scandium so that both temperature for grain refinement and temperature for recrystallization of the film are increased. This results in a fine and smooth surface of the Al—Sc alloy film and the Al—Sc alloy film has better optical reflectivity. Moreover, the Al—Sc alloy film has high recrystallization temperature and high adhesion strength. After high temperature annealing treatment, the Al—Sc alloy film still has higher corrosion resistance. | 10-20-2011 |
20150037694 | PREPARATION METHOD OF ELECTROLYTES FOR SOLID OXIDE FUEL CELLS - The preparation method of electrolytes provided by the present invention includes a first solid oxide powder and a second solid oxide powder, both of which are prepared by using a sol-gel process and a calcination process. Each of the first and second solid oxide powders is a Perovskite-type oxide. After the first and second solid oxide powders are readily mixed, they are compressed into a pellet and then sintered to prepare the afore-mentioned electrolytes for SOFC. It is found in the present invention that by mixing and compressing different solid oxide powders, the solid oxide powder having smaller particle size can fill into the gaps of the other solid oxide powder. After the pellet is sintered, the density of the product is significantly improved. | 02-05-2015 |
Patent application number | Description | Published |
20120146153 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - A chip package includes: a substrate; a drain and a source regions located in the substrate; a gate located on or buried in the substrate; a drain conducting structure, a source conducting structure, and a gate conducting structure, disposed on the substrate and electrically connected to the drain region, the source region, and the gate, respectively; a second substrate disposed beside the substrate; a second drain and a second source region located in the second substrate, wherein the second drain region is electrically connected to the source region; a second gate located on or buried in the second substrate; and a second source and a second gate conducting structure disposed on the second substrate and electrically connected to the second source region and the second gate, respectively, wherein terminal points of the drain, the source, the gate, the second source, and the second gate conducting structures are substantially coplanar. | 06-14-2012 |
20120194301 | CAPACITIVE COUPLER PACKAGING STRUCTURE - Embodiments of the present invention provide a capacitive coupler packaging structure including a substrate with at least one capacitor and a receiver formed thereon, wherein the at least one capacitor at least includes a first electrode layer, a second electrode layer and a capacitor dielectric layer therebetween, and the first electrode layer is electrically connected to the receiver via a solder ball. The capacitive coupler packaging structure also includes a transmitter electrically connecting to the capacitor. | 08-02-2012 |