Lee, MY
Beng Siong Lee, Ampang MY
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20120104583 | SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING SAME - A semiconductor device includes a lead frame that has a die interconnect portion and at least first and second die pads. The die interconnect portion is isolated from the die pads. The device also includes a first die and a second die attached to the first and second die pads and electrically connected to each other by way of the die interconnect portion. The first die is encapsulated in a first medium and the second die is encapsulated in a second medium, the first medium being different from the second medium. | 05-03-2012 |
Boon Kwang Lee, Port Dickson MY
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20120172492 | FORMATION OF LATEX COAGULUM COMPOSITE - A method of producing a coagulated latex composite. A coagulating mixture of a first elastomer latex and a particulate filler slurry is flowed along a conduit, and a second elastomer latex is introduced into the flow of the coagulating mixture. | 07-05-2012 |
20120277344 | Formation of Latex Coagulum Composite for Tire Composition - A tire comprising a rubber composition based on at least an elastomer composite formed by the method of flowing a coagulating mixture of a first elastomer latex comprising a first elastomer and a particulate filler slurry along a conduit; and introducing a second elastomer latex comprising a second elastomer into the flow of the coagulating mixture | 11-01-2012 |
Boon Seong Lee, Malacca MY
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20100281993 | PRESSURE SENSOR PACKAGE - A semiconductor package ( | 11-11-2010 |
Bryan Sik Pong Lee, Selangor MY
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20130026212 | SOLDER DEPOSITION SYSTEM AND METHOD FOR METAL BUMPS - A manufacturing technique includes creating stud bumps on the electrical contacts on a die, either in wafer or die form. A separate stencil or carrier is provided with cavities that correspond to the electrical contacts on the die. The cavities are filled with solder paste and the die is brought into close proximity with the stencil so that the stud bumps extend into the cavities and come into contact with the solder paste. When the die is removed, the solder paste stays affixed to the stud bumps and thereby the solder paste is transferred and delivered to the stud bumps. The die can then be affixed to a substrate such as a PCB. | 01-31-2013 |
Chee Hian Lee, Alor Star MY
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20090233467 | Circuit board connector assembly and method for assembling such an assembly - A circuit board connector assembly mounted in a housing and method of mounting are described. The assembly has orthogonal first and second circuit boards (CB). The CB has a CB connector containing a CB housing with CB electrical contacts. A flexible electrical link has a link connector mounted in a link connector housing with link electrical contacts. A resilient pad is mounted on a link connector housing and a flexible sheet is mounted to both the pad and the link. The sheet spans a length of the link. When the length of the link is substantially planar, the sheet provides a ramp tapering away from the pad. During mounting of the assembly in the housing, the CB connector is operatively coupled to the link connector thereby forming a first connector assembly, and an abutment edge of the second circuit board slidably engages the sheet thereby compressing the pad. | 09-17-2009 |
Chong Yew Lee, Kuala Lumpur MY
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20120184531 | BENZOFURO[3,2-c] PYRIDINES AND RELATED ANALOGS AS SEROTONIN SUB-TYPE 6 (5-HT6) MODULATORS FOR THE TREATMENT OF OBESITY, METABOLIC SYNDROME, COGNITION AND SCHIZOPHRENIA - The present invention relates to benzofuro[3,2-c]pyridine and azepine analogs as serotonin sub-type 6 (5-HT | 07-19-2012 |
Chooi Tian Lee, Melaka MY
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20100217201 | DEVICE FOR PROTECTING AND SECURING MEDICAL DEVICE AT A VENIPUNCTURE SITE - A device for protecting and securing at least a medical device at a venipuncture site and having at least a supporting member in which the medical tube winds around to form a loop, and having restrictor members to retain the loop formed around an arch-shaped passageway. The device is pivotally movable between an open position wherein the venipuncture site is exposed and a close position wherein the venipuncture site is covered and protected. The device further includes a fastening member to secure the device to the patient. | 08-26-2010 |
Chooi Tian Lee, Uep Subang Jaya MY
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20130242984 | APPARATUS AND METHODS FOR MULTIMODE INTERNETWORKING CONNECTIVITY - This invention presents a digital network system able to concurrently provide multimode internetworking connectivity session over a plurality of disparate network systems, from User Premise Device (UPD) to NSP, CSP or ASP network gateways, and providing a plurality of internetwork environment. The invention also provide the methods for the support of the following internetworking connectivity services, concurrently:—a) public and shared-media Internet services; b) MPLS-enabled and IP-based Virtual Private Network (VPN) services; c) hybrid network system connection sessions among disparate connection-oriented and connectionless network systems; and d) end-to-end, connection-oriented, and circuit-switching connection sessions for VDMI-based application services through digital transceiver, be it xDSL or VCC-based land-line or wireless medium. | 09-19-2013 |
Chung Wah Lee, Petaling Jaya MY
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20140106706 | Process to Reload Mobile Prepaid Airtime Using a Self-Service Terminal Across Multiple Telcos and Multiple Currencies - A system and method for purchasing and reloading airtime for a local and foreign prepaid mobile phone account are disclosed. The system comprises a plurality of payment receiving means which are connected to a wireless protocol cloud ( | 04-17-2014 |
Chun-Keong Lee, Perak MY
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20080315906 | FAULTY DANGLING METAL ROUTE DETECTION - A system is provided that facilitates locating long dangling metal routes in a semiconductor chip design. The system includes mechanisms for partitioning metal features of the chip design to discover dangling metal routes that could be potential violations. The system further comprises mechanisms for determining if the dangling metal routes of the chip design exceed a length limit that could result antenna violations, undesired noise in the circuit, circuitry breakdown or the like. The system enables excessively long dangling metal routes to be allowed as exceptional cases. Machine learning is provided to receive feedback to refine the exceptional cases and enable more efficient fault detection. | 12-25-2008 |
Eng Huat Lee, Ayer Itam MY
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20120274375 | FREQUENCY CONTROL CLOCK TUNING CIRCUITRY - Circuits and a method for tuning an integrated circuit (IC) are disclosed. The IC includes multiple programmable fuses coupled to a control block. The programmable fuses used may be one-time programmable (OTP) fuses. The control block reads settings or data stored in the programmable fuses. A tuning circuit coupled to the control block receives the delay transmitted by the control block. The tuning circuit allows tuning of the IC without changes to the fabrication mask. The tuning circuit may include delay chains to provide additional delay to the IC when needed and the delay in the tuning circuit is configured based on the delay value stored in the programmable fuses and transmitted by the control block. | 11-01-2012 |
Ern Yu Lee, Kuala Lumpur MY
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20120284409 | PATH CONSTRUCTING DEVICE AND PATH CONSTRUCTING METHOD - The invention generally relates to a path constructing device and a path constructing method that can be applied to an AV conference system having different network and resource environments, and a plurality of nodes, and that dynamically allocate resources by giving priority levels and optimizing. It is possible for this new technique to dynamically allocate resources by giving priority levels and optimizing based on AV mixing (MCU) abilities, encoding and decoding abilities, participant screen layout options, and conference events to construct AV paths. This technique is suitable for a real-time AV conference system that can optimize given AV processes and network resources by reflecting the dynamic needs of users. | 11-08-2012 |
Eu Soon Lee, Kuala Lumpur MY
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20100134992 | Embedding Thin Film Resistors in Substrates in Power Delivery Networks - Using die side capacitors and embedded resistors, an advantageous power delivery network may be achieved. In some embodiments, the embedded resistors may be more precisely controllable. The number of die side capacitors may be reduced by combining embedded resistors with these capacitors to reduce costs. The embedded resistors may be provided within the metallization layers either at an upper layer or a lower layer, as two examples. | 06-03-2010 |
Heng Soon Lee, Selangor MY
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20100089563 | VEHICLE AIR CONDITIONING IMPROVEMENT - The present device is a temperature regulation system for a vehicle turned on or off. The temperature regulation system includes a rechargeable battery for supplying power to an air moving system and a heat exchanger in accordance with demand signals from the thermostat, independent of the on/off state of the ignition system. In one embodiment, a DC motor is electrically connected to the rechargeable battery and rotationally coupled to a variable-speed compressor replacing the existing compressor of the vehicle, improving efficiency and extending the use of the rechargeable battery. The temperature regulation system may be used to heat or to cool the vehicle when the temperature of the air in the vehicle exceeds a certain threshold. | 04-15-2010 |
Hong Boon Lee, Subang Jaya MY
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20110212955 | ROSAMINE DERIVATIVES AS AGENTS FOR THE TREATMENT OF CANCER - The present invention relates to a new class of rosamine derivatives, in one embodiment, the compounds have the structure (I) or any pharmaceutically acceptable salt or solvate thereof, wherein: R | 09-01-2011 |
Hung Kwang Lee, Pengang MY
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20100079408 | USER INPUT DEVICE WITH PLANAR LIGHT GUIDE ILLUMINATION PLATE - A user input device to generate an optical navigation signal based on an edge-lit pattern. The user input device includes an optical element, a light source, a sensor array, and a navigation engine. The optical element includes a finger interface surface. At least a portion of the optical element exhibits total internal reflection (TIR). The light source provides light to the finger interface surface. The sensor array detects light reflected from the finger interface surface in response to contact between a finger and the finger interface surface. The contact between the finger and the finger interface surface disrupts the TIR and causes light to be reflected out of the optical element towards the sensor array. The navigation engine generates lateral movement information, which is indicative of lateral movement of the finger relative to the sensor array, in response to the detected light. | 04-01-2010 |
Hun Kwang Lee, Simpang Ampat MY
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20090279270 | DUAL-CHANNEL OPTICAL NAVIGATION DEVICE - A dual-channel optical navigation system with vertically aligned sensors. The dual-channel optical navigation system includes a circuit board, a contact navigation sensor, and a free-space navigation sensor. The circuit board mechanically supports and electrically connects multiple navigation sensors on opposing sides of the circuit board. The contact navigation sensor is coupled to a first side of the circuit board. The contact navigation sensor generates a contact navigation signal based on contact navigation images of a contact navigation surface approximately adjacent to the dual-channel optical navigation system. The free-space navigation sensor is coupled to a second side of the circuit board. The free-space navigation sensor generates a free-space navigation signal based on free-space navigation images of an operating environment of the dual-channel optical navigation system. | 11-12-2009 |
20110267268 | BACKLIGHTING FOR OPTICAL FINGER NAVIGATION - An optical finger navigation (OFN) device includes an OFN sensor module, a light source, and a vertical light guide. The OFN sensor module is coupled to a circuit substrate. The OFN sensor module generates a navigation signal in response to a movement detected at a navigation surface based on light reflected from a user's finger. The light source is also coupled to the circuit substrate. The light source generates light (which is separate from the light generated for the OFN sensor module). The vertical light guide is disposed to circumscribe a perimeter of the OFN sensor module. The vertical light guide receives the light from the light source and guides the light toward a light emission surface at a perimeter surface area circumscribing the navigation surface. | 11-03-2011 |
Hun Kwang Lee, Seberang Perai Selatan MY
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20100289775 | FINGER NAVIGATION DEVICE - A finger navigation device is disclosed herein. An embodiment of the navigation device comprises a substrate; a light emitter located on the substrate; a photosensor located on the substrate; and a first cover located above the light emitter and the photosensor. The first cover has a first side and a second side, wherein the first side faces the substrate. A first lens is located in the first cover proximate the light emitter. An aperture is located in the first cover proximate the photosensor. A second cover faces the first side of the first cover and has a second lens proximate a transparent portion. A first light path extends between the light emitter and the first lens. A second light path extends between the first lens and the second lens. A third light path extends between the second lens and the transparent portion. A fourth light path extends between the transparent portion and the photosensor through the aperture. | 11-18-2010 |
Jeremy Jia Jian Lee, Ipoh MY
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20130087834 | GATE ARRAY ARCHITECTURE WITH MULTIPLE PROGRAMMABLE REGIONS - Systems and methods are disclosed for forming a custom integrated circuit (IC) with a first fixed (non-programmable) region on a wafer with non-customizable mask layers, wherein the first fixed region includes multiplicities of transistors and a first interconnect layer and a second interconnect layer above the first interconnect layer which form base cells; and a programmable region above the first fixed region with customizable mask layers, wherein at least one mask layer in the programmable region is coupled to the second interconnect layer which provides electrical access to all transistor nodes of the base cells and wherein the programmable region comprises a third interconnect layer coupled to the customizable mask layers to customize the IC. A second fixed region may be formed above the programmable region to provide multiple fixed regions and reduce the number of required masks in customizing the custom IC. | 04-11-2013 |
Joon Chok Lee, Kuching Sarawak MY
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20080238335 | Light Source Having a Plurality of White LEDs with Different Output Spectra - A solid state light source having first and second component light sources and an interface circuit and a method for making the same are disclosed. The first and second component light sources emit light having first and second color points on different sides of the black body radiation curve. The first and second component light sources include LEDs that emit light of a first wavelength and a layer of a light converting material that converts a portion of that light to light of a second wavelength. The interface circuit powers the first and second component light sources such that the solid state light source has a color point that is closer to the black body radiation curve than either the first or second color points. A third component light source can be included to expand the range of white color temperatures that can be reached by the light source. | 10-02-2008 |
Joon Chok Lee, Sarawak MY
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20080204382 | COLOR MANAGEMENT CONTROLLER FOR CONSTANT COLOR POINT IN A FIELD SEQUENTIAL LIGHTING SYSTEM - A color management system for a field sequential lighting system. The color management system includes a plurality of light sources, a driver circuit, and a controller. The driver circuit is coupled to the plurality of light sources, and the controller is coupled to the driver circuit. The driver circuit drives the plurality of light sources. The controller generates first and second control signals for a first subframe of a temporal sequence of subframes. The first control signal corresponds to a first light source of a first color which is a primary color for the first subframe. The second control signal corresponds to a second light source of a second color which is a supplemental color for the first subframe. Embodiments of the color management system maintain a color point of the primary color of each subframe. | 08-28-2008 |
20090090843 | Illumination and Color Management System - Systems and methods for illumination and color management in a system having a plurality of color sources and a plurality of color sensors, wherein there are more color sources than color sensors are described herein. An embodiment of the method includes emitting a plurality of different colors of light from at least two of the color sources, wherein the plurality of colors consist of different intensities of light emitted by the plurality of color sources. Colors of light emitted by the at least two color sources are detected using at least one of the color sensors. The color rendering index for each of the plurality of colors emitted is determined. A color of light to be emitted by the light sources is selected. The intensities of light to be emitted by the color sources is selected, based at least in part on the color rendering index, to achieve the selected color of light. | 04-09-2009 |
Jun Keat Lee, Seremban MY
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20130168866 | CHIP-ON-LEAD PACKAGE AND METHOD OF FORMING - In one embodiment, a chip-on-lead package structures includes an electronic chip having opposing major surfaces. One major surface of the electronic chip is attached to first and second leads. The one major surface is electrically connected to the first lead, and electrically isolated from the second lead. The other major surface where active device are formed may be electrically connected to the second lead. | 07-04-2013 |
20140248747 | CHIP-ON-LEAD PACKAGE AND METHOD OF FORMING - In one embodiment, a chip-on-lead package structures includes an electronic chip having opposing major surfaces. One major surface of the electronic chip is attached to first and second leads. The one major surface is electrically connected to the first lead, and electrically isolated from the second lead. The other major surface where active device are formed may be electrically connected to the second lead. | 09-04-2014 |
Kah Soon Lee, Ipoh MY
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20110107359 | Apparatus and methods for managing connection cables of portable optical drives - Apparatus and methods for managing a connection cable that is used for interconnecting a small form factor (SFF) portable optical disk drive (ODD) or other similarly configured ODD to an information handling system such as notebook or desktop computer. A retractable fixed connection cable may be provided inside an internal cavity within the external enclosure of a portable ODD apparatus that has an inner chassis with a disk receiving section that is configured to receive an optical disk media and that extends beyond the outer boundary of an electronics section of the inner chassis of an ODD that contains electronic components so as to form a cut-out section that defines the internal cavity between the inner ODD chassis and the inside of an outer ODD enclosure when these components are assembled together. | 05-05-2011 |
Kean Cheong Lee, Melaka MY
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20080290484 | Leadframe Strip and Mold Apparatus for an Electronic Component and Method of Encapsulating an Electronic Component - A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages. | 11-27-2008 |
20090001535 | Semiconductor Module for a Switched-Mode Power Supply and Method for Its Assembly - Semiconductor module for a Switched-Mode Power Supply comprises at least one semiconductor power switch, a control semiconductor chip and a leadframe comprising a die pad and a plurality of leads disposed on one side of the die pad. The die pad comprises at least two mechanically isolated regions wherein the semiconductor power switch is mounted on a first region of the die pad and the control semiconductor chip is mounted on a second region of the die pad. Plastic housing material electrically isolates the first region and the second region of the die pad and electrically isolates the semiconductor power switch from the control semiconductor chip. | 01-01-2009 |
20090051017 | Lead Frame with Non-Conductive Connective Bar - An electronic component includes a lead frame, a semiconductor chip and an encapsulating body. The lead frame includes a heat spreader area, a plurality of conductive lead fingers, at least one non-conductive tie bar, and a metal joint. The metal joint connects the at least one non-conductive tie bar to the heat spreader area. The semiconductor chip is provided on a die pad located on the heat spreader area. The encapsulating body covers at least part of the semiconductor chip, at least part of the at least one non-conductive tie bar and part of the lead frame. | 02-26-2009 |
20130011973 | LEADFRAME STRIP AND MOLD APPARATUS FOR AN ELECTRONIC COMPONENT AND METHOD OF ENCAPSULATING AN ELECTRONIC COMPONENT - A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages. | 01-10-2013 |
20130154123 | Semiconductor Device and Fabrication Method - In various embodiments, a semiconductor device may include: a carrier; a semiconductor chip disposed over a first side of the carrier; a layer stack disposed between the carrier and the semiconductor chip or over a second side of the carrier opposite the semiconductor chip, or both, the layer stack including at least a first electrically insulating layer, the first electrically insulating layer having a laminate having a first electrically insulating matrix material and a first mechanically stabilizing material embedded in the first electrically insulating matrix material. | 06-20-2013 |
Kee Hon Lee, Kuala Lumpur MY
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20100289055 | SILICONE LEADED CHIP CARRIER - In an embodiment, the invention provides a SLCC package comprising first and second electrically conductive terminals, a polysiloxane and glass fiber structural body, a light source and a polysiloxane encapsulant. The first and second electrically conductive terminals are attached to the polysiloxane and glass fiber structural body. The light source is electrically connected to the first and second electrically conductive terminals. The polysiloxane and glass fiber structural body has a cavity that contains at least a portion of the polysiloxane encapsulant. | 11-18-2010 |
20110176573 | Silicone Leaded Chip Carrier - In an embodiment, the invention provides a SLCC package comprising first and second electrically conductive terminals, a polysiloxane and glass fiber structural body, a light source and a polysiloxane encapsulant. The first and second electrically conductive terminals are attached to the polysiloxane and glass fiber structural body. The light source is electrically connected to the first and second electrically conductive terminals. The polysiloxane and glass fiber structural body has a cavity that contains at least a portion of the polysiloxane encapsulant. | 07-21-2011 |
Khee Wooi Lee, Pulau Pinang MY
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20110320742 | METHOD, APPARATUS AND SYSTEM FOR GENERATING ACCESS INFORMATION FROM AN LRU TRACKING LIST - Techniques for generating access information indicating a least recently used (LRU) memory region in a set of memory regions. In an embodiment, data is stored in an entry of an LRU tracking list (LTL) based on a touch message indicating when a memory group has been touched—e.g. read from, written to and/or associated with a memory region. The data stored in an LTL entry may include an identifier of a memory group and/or validity data specifying whether that LTL entry stores a set of default data. In another embodiment, access information may be generated based on the memory group identifier and the validity data. | 12-29-2011 |
20120005386 | METHOD, APPARATUS AND SYSTEM FOR MAINTAINING TRANSACTION COHERECY IN A MULTIPLE DATA BUS PLATFORM - Techniques for maintaining an order of transactions in a multi-bus computer architecture. In an embodiment, an arbitrator receives access requests from a plurality of requestors, each access request requesting a respective access to a bus. Based on an arbitration between the access requests—e.g. between those requestors providing the access requests—the arbitrator may generate a grant message which triggers a carrying of a first message on the first bus. In certain embodiments, the grant message further triggers another carrying of the first message on the second bus. | 01-05-2012 |
Kim Meow Lee, Selangor Darul Ehsan MY
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20090176088 | NITRILE GLOVE - Nitrile rubber compositions and articles of manufacture made therefrom are disclosed. The resulting articles of manufacture, including gloves have ultimate tensile strength and lower modulus which are soft but strong and can be economically manufactured. | 07-09-2009 |
Kock Huat Lee, Ipoh MY
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20080286901 | Method of Making Integrated Circuit Package with Transparent Encapsulant - A method for making an IC package with transparent encapsulant includes providing a leadframe, where the leadframe includes a first die pad and a second die pad, disposing a first die on the first die pad and a second die on the second die pad, forming a cavity on the leadframe, where the cavity includes the first die pad and the second die pad, injecting an encapsulant material into the cavity and cutting the injected encapsulant material and the leadframe to form a first IC package and a second IC package. The encapsulant material is transparent for visible wavelengths. The injection of the encapsulant material is performed at an encapsulant temperature ranging from 140° C. to 160° C. | 11-20-2008 |
Kok Hua Lee, Shah Alam MY
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20110043234 | SOCKET CONNECTOR FOR CONNECTION LEAD OF SEMICONDUCTOR DEVICE UNDER TEST WITH TESTER - A socket connector for electrically connecting a lead of a semiconductor device under test (DUT) with a tester includes a container having a chamber, a conductive end or plug that seals the chamber at one end, and a conductive membrane that seals the chamber at another end. A liquid conductive material fills the chamber. The conductive plug is arranged to be in electrical contact with the tester. The lead of the semiconductor DUT is in electrical contact with the conductive membrane and thus with the tester via the conductive membrane, the liquid conductive material and the conductive plug. | 02-24-2011 |
Kok Hua Lee, Petaling Jaya MY
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20100315109 | BURN-IN SYSTEM FOR ELECTRONIC DEVICES - A burn-in system ( | 12-16-2010 |
Kok Peng Lee, Puchong MY
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20100229084 | RAPID SOFTWARE REPORT DEVELOPMENT TOOL WITH AUTO DATABASE HANDLING AND MENU TOOL-BAR PLUG-IN FOR APPLICATION REPORT ACCESS - A method is provided for generating reports for a computer monitored or aided environment that has a server-side module, a client-side module and a database, the server-side module, client-side module and database being interconnected, The method includes creating a report layout, the report layout containing a predefined number of dynamic fields at predetermined positions; associating, at the server-side, each dynamic field with a data source; collecting, at the server-side, information for each dynamic field according to the associated data source; storing the information in the database; and displaying the information for each dynamic field on a display according to the report layout. The report layout is shared universally for the generation of a displayed report and a printed report. | 09-09-2010 |
Kok-Wah Lee, Melaka MY
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20110055585 | Methods and Systems to Create Big Memorizable Secrets and Their Applications in Information Engineering - Main invention is methods and systems to create big and yet memorizable secret, which are later applied into many novel and innovated applications in information engineering. Among the big secret creation methods are (i) self-created signature-like Chinese character, (ii) two-dimensional key (2D key), (iii) multilingual key, (iv) multi-tier geo-image key, (v) multi-factor key using software token, and their hybrid combinations. Multihash key using hash iteration and hash truncation is further used to increase number of created secret for multiple offline and online accounts. Besides, multihash signature using multiple hash values of a message from different hash iteration provides object-designated signature function. The object may be recipient, action, feature, function, meaning, etc., as representation. Also, random space steganography using stego-data with random noise insertion is proposed. The main application of big memorizable secret is MePKC (Memorizable Public-Key Cryptography) using fully memorizable private key. Here, 160- to 512-bit MePKC can be realized. | 03-03-2011 |
Kwee Hui Lee, Sungai Buloh MY
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20100229084 | RAPID SOFTWARE REPORT DEVELOPMENT TOOL WITH AUTO DATABASE HANDLING AND MENU TOOL-BAR PLUG-IN FOR APPLICATION REPORT ACCESS - A method is provided for generating reports for a computer monitored or aided environment that has a server-side module, a client-side module and a database, the server-side module, client-side module and database being interconnected, The method includes creating a report layout, the report layout containing a predefined number of dynamic fields at predetermined positions; associating, at the server-side, each dynamic field with a data source; collecting, at the server-side, information for each dynamic field according to the associated data source; storing the information in the database; and displaying the information for each dynamic field on a display according to the report layout. The report layout is shared universally for the generation of a displayed report and a printed report. | 09-09-2010 |
Lee Han Meng@eugene Lee, Muar MY
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20120080781 | DELAMINATION RESISTANT DEVICE PACKAGE HAVING RAISED BOND SURFACE AND MOLD LOCKING APERTURE - A semiconductor package configured to attain a thin profile and low moisture sensitivity. Packages of this invention can include a semiconductor die mounted on a die attachment site of a leadframe and further connected with a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. The leadframe having an “up-set” bonding pad arranged with a bonding support for supporting a plurality of wire bonds and a large mold flow aperture in the up-set bonding pad. The package encapsulated in a mold material that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity. | 04-05-2012 |
20140191380 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING - An integrated circuit (“IC”) device and method of making it. The IC device may include a conductive lead frame that has a die pad with a relatively larger central body portion and at least one relatively smaller peripheral portion in electrical continuity with the central body portion. The peripheral portion(s) project laterally outwardly from the central body portion of the die pad. Lateral displacement of a portion(s) of an encapsulation layer overlying the peripheral portion(s) is resisted by abutting surfaces on the peripheral portion(s) and the encapsulation layer. | 07-10-2014 |
20140191381 | INTEGRATED CIRCUIT MODULE WITH DUAL LEADFRAME - An integrated circuit module including a generally flat die attachment pad (DAP) positioned substantially in a first plane; and a generally flat lead bar positioned substantially in a second plane above and parallel to said first plane and having at least one downwardly and outwardly extending lead bar lead projecting therefrom and terminating substantially in the first plane; a top leadframe having a plurality of generally flat contact pads positioned substantially in a third plane above and parallel to the second plane and a plurality of leads having proximal end portions connected to the pad portions and having downwardly and outwardly extending distal end portions terminating substantially in said first plane; an IC die connected to the top leadframe, and the DAP; and encapsulation material encapsulating at least portions of the DAP, the lead bar, the top lead frame, and the IC die. | 07-10-2014 |
20140242755 | MAKING AN INTEGTATED CIRCUIT MODULE WITH DUAL LEADFRAMES - A method of making an integrated circuit module starts with a top leadframe strip comprising a plurality of integrally connected top leadframes. A plurality of flipchip dies are mounted on the top leadframe strip with solder bumps of each flipchip bonded to predetermined pad portions on each of the top leadframes. The top leadframe strip is attached to a bottom leadframe strip. The bottom leadframe strip has a plurality of integrally connected bottom leadframes each having a central die attach pad (DAP) portion and a peripheral frame portion. A back face of each flipchip die contacts the DAP portion of each bottom leadframe. Lead portions of each top leadframe are attached to the peripheral frame portion of each bottom leadframe. The top leadframe strip is attached to the bottom leadframe strip with a back face of each flipchip die contacting the DAP portion of each bottom leadframe and with lead portions of each top leadframe attached to the peripheral frame portion of each bottom leadframe. | 08-28-2014 |
Lee Han Meng Eugene Lee, Muar MY
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20110140249 | TIE BAR AND MOLD CAVITY BAR ARRANGEMENTS FOR MULTIPLE LEADFRAME STACK PACKAGE - A semiconductor chip package having multiple leadframes is disclosed. Packages can include a first leadframe having a first plurality of electrical leads and a die attach pad having a plurality of tie bars, a second leadframe generally parallel to the first leadframe and having a second plurality of electrical leads, and a mold or encapsulant. Tie bars can be located on three main sides of the die attach pad, but not the fourth main side. Gaps in the first and second plurality of electrical leads can be enlarged or aligned with each other to enable the elimination of mold flash outside the encapsulated region, which can be accomplished with mold cavity bar protrusions. Additional components can include a primary die, a secondary die, an inductor and/or a capacitor. The first and second leadframes can be substantially stacked atop one another, and one or both leadframes can be leadless leadframes. | 06-16-2011 |
20110140253 | DAP GROUND BOND ENHANCEMENT - A variety of semiconductor package arrangements and packaging methods are described that improve the reliability of bonding wires that down bond a die to a die attach pad. In one aspect, selected portions of the top surface of a lead frame (which may be in panel form) are plated (e.g., silver plated) to facilitate wire bonding. The plating covers some, but not all of a die attach surface of the die attach pad. In some preferred embodiments, the plating on the die attach pad is arranged as a peripheral ring that surrounds an unplated central region of the die support surface. In other embodiments, the plating on the die attach pad takes the form of bars or other geometric patterns that do not fully cover the die support surface. Unplated portions of the die support surface are roughened to improve the adherence of the die to the die attach pad, thereby reducing the probability of die attach pad delamination and the associated risks to down bonded bonding wires. The described lead frames may be used in a variety of packages. Most commonly, a die is attached to the die support surface of the die attach pad and electrically connected to the lead frame leads by wire bonding as appropriate. At least one of the die's bond pads (typically the ground bond pad(s)) is down bonded to the die attach pad. The die, the bonding wires and at least portions of the lead frame are then typically encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device. | 06-16-2011 |
20110140262 | MODULE PACKAGE WITH EMBEDDED SUBSTRATE AND LEADFRAME - An integrated circuit package is described that includes a substrate, a leadframe and one or more integrated circuits that are positioned between the substrate and the leadframe. Multiple electrical components may be attached to one or both sides of the substrate. The active face of the integrated circuit is electrically and physically connected to the substrate. The back side of the integrated circuit is mounted on a die attach pad of the leadframe. The leadframe includes multiple leads that are physically attached to and electrically coupled with the substrate. A molding material encapsulates portions of the substrate, the leadframe and the integrated circuit. Methods for forming such packages are also described. | 06-16-2011 |
20130045572 | FLEXIBLE ROUTING FOR HIGH CURRENT MODULE APPLICATION - In one aspect of the invention, an integrated circuit package is described. The integrated circuit package includes a substrate formed from a dielectric material that includes multiple electrical contacts and conductive paths. An upper lead frame is attached with and underlies the substrate. The upper lead frame is electrically connected with at least one of the contacts on the substrate. The active surface of an integrated circuit die is electrically and physically coupled to the upper lead frame through multiple electrical connectors. A lower lead frame may be attached with the back surface of the integrated circuit die. A passive device is positioned on and electrically connected with one of the contacts on the substrate and/or the upper lead frame. | 02-21-2013 |
20130087901 | DESIGN FOR EXPOSED DIE PACKAGE - In one aspect of the present invention, an integrated circuit package with an exposed die and a protective housing will be described. The housing extends beyond the exposed back surface of the die to help protect it from damage. The integrated circuit package includes a lead frame and an integrated circuit die. The integrated circuit die is electrically and physically attached to the lead frame. The housing encapsulates the lead frame and the die. The housing also includes a recessed region at the bottom of the package where the back surface of the die is exposed. There is a protruding protective structure at the bottom of the package that helps to protect the die and prevent its exposed back surface from coming in contact with an external object. | 04-11-2013 |
20130127029 | TWO LEVEL LEADFRAME WITH UPSET BALL BONDING SURFACE AND DEVICE PACKAGE - A leadframe, device package, and mode of construction configured to attain a thin profile and improved thermal performance. Leadframes of this invention include a raised die attachment pad arrange above distal ends of leadframe leads. A package will further include a die electrically coupled with an underside surface of the raised die attachment pad, in one example, using ball bonds, the whole sealed in an encapsulant that exposed a bottom portion of the die and a portion of a lead. Two leadframe stacks of such packages are also disclosed as are methods of manufacture. | 05-23-2013 |
20140346656 | Multilevel Leadframe - A multilevel leadframe for an integrated circuit package is provided that has a plurality of lead lines formed in a first level and bond pads formed in a second level. A first set of bond pads is arranged in a first row and are separated from an adjacent bond pad by a bond pad clearance distance. A second set of bond pads is arranged in second row adjacent the first row of bond pads. Each bond pad in the second row may be connected to one of the plurality of lead lines on the first level that is routed between adjacent bond pads in the first row. Since the bond pads in the first row are on a different level then the lead lines, the bond pads may be spaced close together. | 11-27-2014 |
Lee Han Meng Eugene Lee, Johor MY
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20110089556 | LEADFRAME PACKAGES HAVING ENHANCED GROUND-BOND RELIABILITY - Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device. | 04-21-2011 |
20150060123 | LOCKING DUAL LEADFRAME FOR FLIP CHIP ON LEADFRAME PACKAGES - A method of assembling a flip chip on a leadframe package. A locking dual leadframe (LDLF) includes a top metal frame portion including protruding features and a die pad and a bottom metal frame portion having apertures positioned lateral to the die pad. The protruding features and apertures are similarly sized and alignable. A flipped integrated circuit (IC) die having a bottomside and a topside including circuitry connected to bond pads having solder balls on the bond pads is mounted with its topside onto the top metal frame portion. The top metal frame portion is aligned to the bottom metal frame portion so that the protruding features are aligned to the apertures. The bottomside of the IC die is pressed with respect to a top surface of the bottom frame portion, wherein the protruding features penetrate into the apertures. | 03-05-2015 |
Lini Lee, Puchong MY
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20120281450 | ELECTRICALLY PROGRAMMABLE FUSE MODULE IN SEMICONDUCTOR DEVICE - A semiconductor device has an e-fuse module and a programming current generator. The e-fuse module includes an array of electrically programmable e-fuse elements. The programming current generator has a set of reference transistor elements, a selector for actuating the reference transistor elements to generate a selected reference current, and a current mirror for applying a programming current that is a function of the selected reference current to a selected e-fuse element of the array to program the resistance of the e-fuse element. | 11-08-2012 |
20130027053 | METHOD OF TESTING PARALLEL POWER CONNECTIONS OF SEMICONDUCTOR DEVICE - A semiconductor device has an internal power bus, parallel power connections for connecting the power bus with an external power supply and a test module. The test module includes a sensor for producing first and second differential sensor signals that are functions of voltages at spaced positions in one of the parallel connections produced by current in the parallel connection. The test module includes first and second balanced differential pair comparators that receive first and second reference signals and produce a first comparator signal that is a function of the relative values of the first differential sensor signal and the first reference signal, and a second comparator signal that is a function of the relative values of the second differential sensor signal and the second reference signal. The test module includes an output element that produces an output signal that is a function of the first and second comparator signals. | 01-31-2013 |
Meng Ee Lee, Bukit Mertajam MY
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20100188853 | LIGHT EMITTER - A light emitter is disclosed herein. An embodiment of the light emitter comprises a substrate having a substrate surface; a light emitting diode located on the substrate surface; an encapsulant located on the substrate surface and encapsulating the light emitting diode; and a reflector cup attached to the substrate, the reflector cup having a reflector cup first side and a reflector cup second side with a hole extending between the reflector cup first side and the reflector cup second side, wherein the reflector cup first side is attached to the substrate surface so that the hole in the reflector cup first side encompasses the light emitting diode. | 07-29-2010 |
20100296297 | LIGHT EMITTER - A light emitter is disclosed herein. The light emitter may have a lead frame and a plastic reflector cup. The lead frame may have a planar portion; a bond area having a light-emitting diode attached thereto; and at least two terminals configured for surface mount technology. The reflector cup may be proximate the bond area and may have an opening, wherein light emitted from the light-emitting diode passes through the opening; a side wall extending between the planar portion and the opening; and a clear lens located proximate the opening and attached to the reflector cup. The combination of the lens and the reflector cup causes a light beam originating from the light-emitting diode to be less than fifteen degrees. | 11-25-2010 |
20110254032 | Electronic Assembly - An electronic assembly includes a first substrate and a second substrate, a hole through the first substrate, the second substrate having a trace with an indentation, an electronic device mounted over the indentation in the trace, and the first substrate is attached to the second substrate such that the electronic device is positioned within the hole through the first substrate. | 10-20-2011 |
Ming Loong Lee, Petaling Jaya MY
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20130311972 | Automated tagging and tracking of defect codes based on customer problem management record - A routine for tagging and tracking source code may be implemented in a software development environment. The routine begins upon the identification of a defect in a software product or system. Once the defect has been identified and rectified, a search of other source code (typically located in a source code management system that supports version control) is specified. Using the search specification, the system automatically identifies the code snippet to be searched and begins searching the identified codebase for duplicates. A ticket or service record is then created for every duplicate/similar code snippet found during the search. The ticket/record enables software defect tracking to be carried out on the newly-located instances of the code. The system also automatically manages the code snippets identified by the duplicate detection. | 11-21-2013 |
20130311975 | Automated tagging and tracking of defect codes based on customer problem management record - A routine for tagging and tracking source code may be implemented in a software development environment. The routine begins upon the identification of a defect in a software product or system. Once the defect has been identified and rectified, a search of other source code (typically located in a source code management system that supports version control) is specified. Using the search specification, the system automatically identifies the code snippet to be searched and begins searching the identified codebase for duplicates. A ticket or service record is then created for every duplicate/similar code snippet found during the search. The ticket/record enables software defect tracking to be carried out on the newly-located instances of the code. The system also automatically manages the code snippets identified by the duplicate detection. | 11-21-2013 |
Mintak Lee, Johor Bahru MY
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20130288625 | Radio Receiver with Adaptive Tuner - A mobile radio receiver for a vehicle. The mobile radio receiver includes a tuner front-end section, a location data port, a sensor port, and a data processing unit. The location data port is used for receiving tuner location data. The sensor port is used for receiving one or more sensor signals. The data processing unit is operably connected with the tuner front-end section, with the location data port, and with the sensor port. The data processing unit further comprises predetermined tuner location data and predetermined relationship data sets for determining a set of tuner front-end section parameters based on the sensor signals. The mobile radio receiver provides an operational mode, a checking mode, a tuner parameter adjustment mode, and a tuner parameter application mode. | 10-31-2013 |
20140194079 | INCREASING EFFICIENCY OF A RADIO RECEIVER WITH AN ADAPTIVE TUNER - A mobile radio receiver for a vehicle includes a tuner front-end section, a location data port for receiving tuner location data, a sensor port for receiving sensor signal measurement data from at least one vehicle sensor, a tuner front-end section parameter server port for sending the tuner location data, the sensor signal measurement data for receiving a set of tuner front-end section parameter data, and a data processing unit. The data processing unit is operably connected to the tuner front-end section, the location data port, the sensor port, and the tuner front-end section parameter server port. The mobile radio receiver provides an operational mode, a checking mode, a tuner parameter retrieval mode, and a tuner parameter application mode. | 07-10-2014 |
Sang H. Lee, Kulim MY
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20130015516 | ASYMMETRICAL NON-VOLATILE MEMORY CELL AND METHOD FOR FABRICATING THE SAMEAANM Kim; Sang Y.AACI KulimAACO MYAAGP Kim; Sang Y. Kulim MYAANM Lee; Sang H.AACI KulimAACO MYAAGP Lee; Sang H. Kulim MYAANM May; Norhafizah CheAACI KulimAACO MYAAGP May; Norhafizah Che Kulim MY - The asymmetrical non-volatile memory cell is provided on a substrate of first conductivity type and comprises a control region and a floating region, wherein the control region is adjacent to the floating region and isolated from the floating region. The control region further comprises an implant region, having second conductivity type, disposed entirely across the control region and a polycrystalline silicon control gate disposed entirely over the implant region. The floating region further comprises a first voltage state of a drain implant region and a second voltage state of a source implant region, both having second conductivity type, the first voltage state is different from the second voltage state, a channel region that separates the drain implant region and the source implant region, and a polycrystalline silicon floating gate disposed entirely over the channel region and at least partially over the source implant region and drain implant region. | 01-17-2013 |
Seek Ping Lee, Petaling Jaya MY
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20120246799 | ELASTOMERIC RUBBER AND RUBBER PRODUCTS WITHOUT THE USE OF VULCANIZING ACCELERATORS AND SULFUR - A composition for producing an elastomeric thin film comprising a carboxylated acrylonitrile polybutadiene latex which is vulcanized without the use of conventional sulphur and accelerators thereby reducing the possibility of contacting immediate Type I hypersensitivity and delay Type IV hypersensitivity caused by the presence of natural rubber latex proteins and accelerators respectively. The dipping process for making gloves by using a latex composition provided by: premixing carboxylated acrylonitrile polybutadiene latex with methacrylic acid, or alternatively using a self-crosslinked latex, adding zinc oxide, adjusted to 9 to 10 of the pH level, and diluted with water to obtain 18% to 30% by weight of total solid content; dipping the glove former into the composition to form a layer of thin film of the latex composition on the former; drying the thin latex film on the former and crosslinking the latex film on the former. | 10-04-2012 |
20130191964 | ELASTOMER RUBBER GLOVES FOR CLEAN ROOM USE WHICH DOES NOT USE VULCANIZATION ACCELERATOR AND SULFER - A gloves formed from elastomer comprising 25-30 weight % of acrylonitrile, 62-71 weight % of butadiene and 4-8 weight % of unsaturated carboxylic acid (total 100 weight %), wherein crosslink is formed by a bond through at least a part of substituent which is possessed by said unsaturated carboxylic acid, and residual substituent of at least one part of substituent possessed by said unsaturated carboxylic acid is crosslinked by bivalent metal, said elastomer does not contain sulfur which is a crosslinking agent and sulfur composition which is a vulcanization accelerator, Mooney viscosity (ML | 08-01-2013 |
20130198933 | ELASTOMER RUBBER WHICH DOES NOT USE SULFUR AND VULCANIZATION ACCELERATOR AND ELASTOMER RUBBER PRODUCT - An elastomer composition comprising, an emulsion which comprises 25-30 weight % of acrylonitrile, 62-71 weight % of butadiene and 4-8 weight % of unsaturated carboxylic acid (total 100 weight %), wherein crosslink is formed by a bond through at least a part of substituent which is possessed by said unsaturated carboxylic acid, and residual substituent of at least one part of substituent which is possessed by said unsaturated carboxylic acid is left in state of free, further Mooney viscosity (ML | 08-08-2013 |
See Yau Lee, Semabok MY
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20090315172 | Semiconductor chip assembly - A semiconductor chip assembly includes a semiconductor chip and a pyrolytic graphite element that is an electrode that is electrically connected to and provides electrical conduction of current from the chip during operation of the chip. | 12-24-2009 |
Seok Khoon Lee, Seremban MY
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20130319726 | MULTI-CORE WIRE - A wire that can be used in a wire bonding step in the assembly of a semiconductor device has a first conductive core, a second conductive core surrounding the first conductive core, and a third conductive core surrounding the first second conductive core. The first and third conductive cores are formed of a material such as Palladium and the second conductive core is formed of a material such as Copper. When the wire is bonded to a bonding pad of a semiconductor die, the first and third conductive cores melt over the free air ball (FAB)surface for the purpose of inhibiting intermetallic corrosion of the bonded ball. | 12-05-2013 |
20130341378 | SYSTEM AND METHOD FOR INSPECTING FREE AIR BALL - A system for inspecting a free air ball (FAB) formed during a wire bonding process includes a torch for forming a FAB at a tip of a bonding wire held by a capillary. A camera is positioned near the FAB formation location and captures a color image of the FAB. A ball formation monitor inspects the image to determine a composition of an outer surface of the FAB and inhibits bonding of the FAB to a contact element based on a result of the inspecting. The system is particularly useful for bonding Copper wire plated with Palladium, where bonding of the FAB to the contact element is inhibited if the Copper is exposed. | 12-26-2013 |
Sian Tatt Lee, Selangor MY
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20120163028 | MULTI-SEGMENTED LIGHT GUIDE FOR AN INPUT DEVICE - An input device and display apparatus with multi-light segments has been disclosed. The input device may comprise a rigid light guide layer having alignment structures that define the rigid light guide layer into multiple light segments, a plurality of first layer flexible light guide films and a plurality of second layer flexible light guide films. The alignment structures may be formed together when making the rigid light guide layer in an injection molding process. By coupling multiple light sources into each of the light guides, the display may be configured to display multiple color and multiple symbols, independently. In another embodiment, the light guide may be utilized in a display apparatus without a LCD. | 06-28-2012 |
Sian Tatt Lee, Persiaran Tanjung Bungah MY
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20110203911 | KEYPAD ASSEMBLY - A keypad assembly having a light guide sheet having a first surface with a layer of graphics printed thereon, a second surface opposite the first surface, and an edge surface; and a flexible sheet having a central portion engaged with the light guide sheet second surface and having a peripheral portion positioned in light blocking relationship with the light guide sheet edge surface. | 08-25-2011 |
Sian Tatt Lee, Klang MY
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20110304484 | LIGHT GUIDE HAVING A CAPACITIVE SENSING GRID AND RELATED METHODOLOGY - An electronic device may include a keypad having a plurality of predefined key areas and a light guide that may be used to illuminate the key areas. The light guide may include a capacitive sensing grid to sense user contact relative to the keypad. | 12-15-2011 |
20120044716 | MULTI-SEGMENTED LIGHT GUIDE FOR KEYPAD AND DISPLAY APPARATUS - A multi-segmented light guide for keypad and display apparatus has been disclosed. The light guide film may comprise a plurality of light segments configured to transmit light independently. The boundaries of the light segments may be defined by a plurality of micro-optic structures. The micro-optic structures may have a height at least half the thickness of the light guide. | 02-23-2012 |
Sian Tatt Lee, Georgetown MY
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20100258419 | LIGHT GUIDE FILM WITH CUT LINES - A light guide for an optical keypad is described. The light guide includes a light interface surface, top and bottom surfaces, a surface feature pattern, and a cut line. The light interface surface receives light into the light guide from a light source. The light received through the light interface surface reflects according to total internal reflection (TIR) within the light guide between portions of the top and bottom surfaces. The surface feature pattern disrupts the TIR and scatters at least some of the light outside of at least one surface of the top and bottom surfaces. The cut line redirects at least some of the light from a first direction to a second direction within the light guide. The first direction is a direction other than towards the surface feature pattern, while the second direction is a direction substantially towards the surface feature pattern. | 10-14-2010 |
20100288608 | ILLUMINATED KEYPAD - An illuminated keypad is disclosed herein. And embodiment of the keypad comprises a first zone and a second zone; a substrate comprising a substrate surface; a first switch located on the substrate in the first zone; a first light guide having a first light guide first side and a first light guide second side, wherein the first light guide first side faces the first switch; a second light guide having a second light guide first side and a second light guide second side, wherein the second light guide first side faces the substrate surface; a masking layer having a masking layer first side and a masking layer second side, the masking layer first side facing the substrate surface; and at least one cut in the masking layer, wherein the masking layer blocks a light path between the light guides. | 11-18-2010 |
Siew Chin Lee, Sungai Ara MY
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20100289745 | SYSTEM AND METHOD FOR AUTOMATICALLY ADJUSTING LIGHT SOURCE DRIVE CURRENT DURING OPTICAL NAVIGATION OPERATION - A system and method for automatically adjusting a drive current to a light source during an optical navigation operation uses brightness characteristics of captured frames of image data to determine whether each of the frames of image data belongs to one of at least first and second types of frames of image data. The drive current is adjusted depending on counts of the frames of image data belonging to the first and second types of frames of image data. | 11-18-2010 |
Siew Yuen Lee, Pulau Pinang MY
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20130154202 | Handheld machine tool having a tool holding fixture - In a handheld machine tool having a tool holding fixture, which has a multi-faced inner receptacle and a multi-faced outer receptacle, the multi-faced inner receptacle being configured for the connection to a first tool insert, which is able to be locked in the multi-faced inner receptacle using a locking device assigned to the tool holding fixture, and the multi-faced outer receptacle being configured for the connection to a second tool insert, which has an inner multi-faced coupling that is able to be slid onto the multi-faced outer receptacle. The locking device has an actuating element, which is rotatable about a longitudinal axis of the tool holding fixture for unlocking the first tool insert from a specified locking position into a specified unlocking position. | 06-20-2013 |
20130199814 | handheld machine tool having a mechanical striking mechanism - In the case of a handheld machine tool having a mechanical striking mechanism, which includes a striking body provided with at least one actuating cam and an output shaft provided with at least one output cam, the actuating cam being configured for percussively driving the output cam during percussive operation of the mechanical striking mechanism, a damping element, which has an abutment element acted upon by a spring element, is provided at least on one actuating cam and/or on one output cam. | 08-08-2013 |
20140008089 | Impact driver having an impact mechanism - In an impact driver including an impact mechanism for percussive driving of an output drive shaft on which is provided a tool receptacle for receiving an inserted tool, the tool receptacle is embodied as a clamping chuck, a permanent connection being embodied between the clamping chuck and the output drive shaft in order to prevent at least tool-free detachment of the clamping chuck from the output drive shaft. | 01-09-2014 |
Sik Pong Lee, Petaling Jaya MY
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20110101072 | ADJUSTABLE CLAMP SYSTEM AND METHOD FOR WIRE BONDING DIE ASSEMBLY - A method and an adjustable clamp system for clamping a die assembly during wire bonding. The system includes at least one pair of opposing base walls, each of the base walls has a base clamping surface. There is at least one pair of clamping members, each one of the clamping members being movable towards a respective base clamping surface to thereby clamp a lead frame of the die assembly. A die assembly support is disposed between the pair of opposing base walls and the die assembly support and pair of opposing base walls provide a cavity. There is a position sensor coupled to a controller and there is also a drive that is controllable by the controller. The drive provides movement of the die assembly support relative to each the base clamping surface to thereby adjust a depth of the cavity. In operation, after the lead frame is clamped between the base clamping surface and clamping members, the controller allows the drive to provide the relative movement until the position sensor detects that an underside of the lead frame has abutted the die assembly support. | 05-05-2011 |
Swee Kah Lee, Seri Jati MY
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20110309493 | Electronic Device Package Locking System and Method - Device and method for an electronic device package is disclosed. The electronic device package includes a first pad, a second pad and an encapsulation surrounding the first and second pad, wherein the encapsulation includes a first opening underneath the first pad and a second opening underneath the second pad. A first bump is arranged in the first opening and a second bump is arranged in the second opening, wherein the encapsulation mechanically locks the first bump to the first pad and the second bump to the second pad. | 12-22-2011 |
Swee Kah Lee, Melaka MY
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20130277813 | CHIP PACKAGE AND METHOD OF FORMING THE SAME - Embodiments provide a method of forming a chip package. The method may include attaching at least one chip on a carrier, the chip including a plurality of chip pads on a surface of the chip opposite to the carrier; depositing a first adhesion layer on the carrier and on the chip pads of the chip, the first adhesion layer including tin or indium; depositing a second adhesion layer on the first adhesion layer, the second adhesion layer including a silane organic material; and depositing a lamination layer or an encapsulation layer on the second adhesion layer and the chip. | 10-24-2013 |
Teck Sim Lee, Malacca MY
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20090212417 | Semiconductor Device - A semiconductor device including: a heat sink, a die on the heat sink, resin encapsulating the die, and a mounting aperture in the resin having at least a segment between the heat sink and a first end of the resin, wherein the thickness of the heat sink is no greater than 35% of the thickness of the device. | 08-27-2009 |
20100227436 | METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE WITH MOLD LOCK OPENING - A method of fabricating a semiconductor package. In one embodiment the method includes forming a mold cavity about a portion of a first major surface of a leadframe, including about a mold lock opening extending through the leadframe between the first major surface and a second major surface. A spacer is inserted to fill at least a portion of the mold lock opening. The mold cavity is filled with an encapsulating material including filling a portion of the mold lock opening not occupied by the spacer. | 09-09-2010 |
20110121439 | SEMICONDUCTOR DEVICE WITH PROTRUDING COMPONENT PORTION AND METHOD OF PACKAGING - A semiconductor package device having a protruding component portion and a method of packaging the semiconductor device is disclosed. The semiconductor device has a component, such as a leadframe, and a packaging mold body. The packaging mold body is formed around a portion of the component and a recess is formed in the packaging mold body adjacent the protruding portion of the component to prevent the protruding portion of the component from damaging other adjacent and abutting semiconductor devices. | 05-26-2011 |
Teck Sim Lee, Melaka MY
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20120074546 | Multi-chip Semiconductor Packages and Assembly Thereof - Semiconductor packages and method of fabricating them are described. In one embodiment, the semiconductor package includes a substrate having a first and a second die attach pad. A first die is disposed over the first die attach pad. A second die is disposed over the second die attach pad. A third die is disposed between the first and the second die. The third die having a first, a second, and a third portion such that the first portion is disposed above a portion of the first die, the second portion is disposed above a portion of the second die, and the third portion is disposed above an area between the first die and the second die. | 03-29-2012 |
20130154123 | Semiconductor Device and Fabrication Method - In various embodiments, a semiconductor device may include: a carrier; a semiconductor chip disposed over a first side of the carrier; a layer stack disposed between the carrier and the semiconductor chip or over a second side of the carrier opposite the semiconductor chip, or both, the layer stack including at least a first electrically insulating layer, the first electrically insulating layer having a laminate having a first electrically insulating matrix material and a first mechanically stabilizing material embedded in the first electrically insulating matrix material. | 06-20-2013 |
20140210061 | CHIP ARRANGEMENT AND CHIP PACKAGE - Various embodiments provide a chip arrangement. The chip arrangement may include a first chip including a first contact and a second contact; a second chip; a leadframe including a first leadframe portion and a second leadframe portion electrically insulated from the first leadframe portion; and a plurality of pins coupled to the leadframe. At least one first pin is coupled to the first leadframe portion and at least one second pin is coupled to the second leadframe portion. The first contact of the first chip is electrically coupled to the first leadframe portion and the second contact of the first chip is coupled to the second leadframe portion. A contact of the second chip is electrically coupled to the second leadframe portion. | 07-31-2014 |
20140264798 | Packaged Device Comprising Non-Integer Lead Pitches and Method of Manufacturing the Same - Packaged chips comprising non-integer lead pitches, systems and methods for manufacturing packaged chips are disclosed. In one embodiment a packaged device includes a first chip, a package encapsulating the first chip and a plurality of leads protruding from the package, wherein the plurality of leads comprises differing non-integer multiple lead pitches. | 09-18-2014 |
Wei Song Lee, Besar MY
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20120286631 | STORAGE ASSEMBLY - A storage assembly includes a base assembly having a base member and a back member, first and second cabinet assemblies slidable with respect to the base assembly and having top members and a front members, and cooperating with the base assembly to define an interior space. The storage assembly further includes a first guide assembly including a first track member secured to the back member and roller assemblies secured to the top members, and that track within the first track member, and a second guide assembly including a second track member secured to the base member and guide members secured to the second front members, and that track within the second track member, and roller assemblies secured to the front members, wherein the roller assemblies are adapted to roll along the second track member. | 11-15-2012 |
Yee Kim Lee, Segamat MY
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20110140253 | DAP GROUND BOND ENHANCEMENT - A variety of semiconductor package arrangements and packaging methods are described that improve the reliability of bonding wires that down bond a die to a die attach pad. In one aspect, selected portions of the top surface of a lead frame (which may be in panel form) are plated (e.g., silver plated) to facilitate wire bonding. The plating covers some, but not all of a die attach surface of the die attach pad. In some preferred embodiments, the plating on the die attach pad is arranged as a peripheral ring that surrounds an unplated central region of the die support surface. In other embodiments, the plating on the die attach pad takes the form of bars or other geometric patterns that do not fully cover the die support surface. Unplated portions of the die support surface are roughened to improve the adherence of the die to the die attach pad, thereby reducing the probability of die attach pad delamination and the associated risks to down bonded bonding wires. The described lead frames may be used in a variety of packages. Most commonly, a die is attached to the die support surface of the die attach pad and electrically connected to the lead frame leads by wire bonding as appropriate. At least one of the die's bond pads (typically the ground bond pad(s)) is down bonded to the die attach pad. The die, the bonding wires and at least portions of the lead frame are then typically encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device. | 06-16-2011 |
20120080781 | DELAMINATION RESISTANT DEVICE PACKAGE HAVING RAISED BOND SURFACE AND MOLD LOCKING APERTURE - A semiconductor package configured to attain a thin profile and low moisture sensitivity. Packages of this invention can include a semiconductor die mounted on a die attachment site of a leadframe and further connected with a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. The leadframe having an “up-set” bonding pad arranged with a bonding support for supporting a plurality of wire bonds and a large mold flow aperture in the up-set bonding pad. The package encapsulated in a mold material that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity. | 04-05-2012 |
Yee Kim Lee, Johor MY
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20110089556 | LEADFRAME PACKAGES HAVING ENHANCED GROUND-BOND RELIABILITY - Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device. | 04-21-2011 |
Yen Hau Lee, Kelana Jaya MY
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20120281450 | ELECTRICALLY PROGRAMMABLE FUSE MODULE IN SEMICONDUCTOR DEVICE - A semiconductor device has an e-fuse module and a programming current generator. The e-fuse module includes an array of electrically programmable e-fuse elements. The programming current generator has a set of reference transistor elements, a selector for actuating the reference transistor elements to generate a selected reference current, and a current mirror for applying a programming current that is a function of the selected reference current to a selected e-fuse element of the array to program the resistance of the e-fuse element. | 11-08-2012 |
Yeu Wen Lee, Negeri Sembilan MY
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20080246130 | Semiconductor Package Structure Having Enhanced Thermal Dissipation Characteristics - In an exemplary embodiment, a packaged device having enhanced thermal dissipation characteristics includes a semiconductor chip having a major current carrying or heat generating electrode. The semiconductor chip is oriented so that the major current carrying electrode faces the top of the package or away from the next level of assembly. The packaged device further includes a conductive clip for coupling the major current carrying electrode to a next level of assembly, and a heat spreader device formed on or integral with the conductive clip. A portion of the heat spreader device may be optionally exposed. | 10-09-2008 |
20110298115 | SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE - A semiconductor component and a method for manufacturing the semiconductor component, wherein the semiconductor component is configured to permit the determination of circuit parameters. A high side FET has a gate terminal coupled to an output terminal of a high side gate drive circuit, a drain terminal coupled for receiving an input voltage, and a source terminal coupled to the drain terminal of a low side FET. The gate terminal of the low side FET is coupled to the output terminal of low side drive circuit and the source terminal of the low side FET is coupled for receiving a source of operating potential. The high side gate drive circuit has a bias terminal coupled for receiving a floating potential where the bias terminal is electrically isolated or decoupled from the commonly connected source and drain terminals of the high side FET and the low side FET, respectively. | 12-08-2011 |
Yin Fei Lee, Sungai Siput MY
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20100188853 | LIGHT EMITTER - A light emitter is disclosed herein. An embodiment of the light emitter comprises a substrate having a substrate surface; a light emitting diode located on the substrate surface; an encapsulant located on the substrate surface and encapsulating the light emitting diode; and a reflector cup attached to the substrate, the reflector cup having a reflector cup first side and a reflector cup second side with a hole extending between the reflector cup first side and the reflector cup second side, wherein the reflector cup first side is attached to the substrate surface so that the hole in the reflector cup first side encompasses the light emitting diode. | 07-29-2010 |
Yit Meng Lee, Kuala Lumpur MY
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20120073859 | POLYMER CORE WIRE - A wire capable of conducting electrical current has a polymer core and a coating layer surrounding the core. The coating layer, which may be, for example, gold or copper, conducts electrical current and the core provides strength so that the wire is able to withstand bending and breakage. Among other things, the polymer core wire is useful for connecting an integrated circuit to a lead frame or substrate. | 03-29-2012 |
Yit Meng Lee, Kuala Lampur MY
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20100279471 | UNDERFILL DISPENSING SYSTEM FOR INTEGRATED CIRCUITS - A system for dispensing an underfill material between an integrated circuit (IC) chip and a substrate includes a platform at which the underfill material is supplied. The IC chip and the substrate are mounted at the periphery of the platform. The platform rotates and facilitates the movement of the underfill material toward the IC chip and the substrate. The system further includes a Bernoulli tube that is located proximate to the IC chip and the substrate. The Bernoulli tube generates a low pressure in the proximity of the IC packages. The low pressure facilitates the dispensing of the underfill material between the IC chip and the substrate. | 11-04-2010 |
Yong Joo Lee, Melaka MY
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20090248835 | OFFLOADING DATA TRANSFERS BETWEEN A LOCAL AND REMOTE NETWORK - A method, system, and computer readable medium are disclosed. In one embodiment the method includes initiating a data transfer from a first computing device to a second computing device. Then the method continues by designating a third computing device to offload at least a portion of the data associated with the data transfer. Additionally, the method stores the offloaded portion of the data on the designated third computing device for a period of time. Finally, the method concludes by sending the data stored on the third computing device to the second computing device after the period of time. | 10-01-2009 |
Yook Heng Lee, Selangor MY
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20100096277 | AMPEROMETRIC BIOSENSOR FOR HISTAMINE DETERMINATION - There is provided by this invention a simple and rapid amperometric biosensor for determining the level of histamine in seafood or fish. The biosensor combines the technology of screen-printing with immobilized diamine oxidase as the bioreceptor. IQ one embodiment of the present invention, the biosensor incorporates potassium hexacyanoferrate (III) as a mediator. | 04-22-2010 |
Zhan Qiang Lee, Bating MY
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20100077397 | Input/output (I/O) device virtualization using hardware - According to embodiments of the present invention a computer system that is capable of sharing physical devices among several virtual machines (VM) includes hardware assisted logic to allow requests from guest operating systems (guest OS) to circumvent a virtual machine monitor (VMM) and be processed by the hardware assisted logic. | 03-25-2010 |