Patent application number | Description | Published |
20090059342 | METHOD AND DEVICE FOR PACKAGING A SUBSTRATE - A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator. | 03-05-2009 |
20090189230 | METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER - Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal. | 07-30-2009 |
20090219605 | OPTICAL INTERFERENCE DISPLAY PANEL AND MANUFACTURING METHOD THEREOF - A first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrode and the sacrificial layer. The supports are formed in the first openings, and then a second electrode is formed on the sacrificial layer and the supports, thus forming a micro electro mechanical system structure. Afterward, an adhesive is used to adhere and fix a protection structure to the substrate for forming a chamber to enclose the micro electro mechanical system structure, and at least one second opening is preserved on sidewalls of the chamber. A release etch process is subsequently employed to remove the sacrificial layer through the second opening in order to form cavities in an optical interference reflection structure. Finally, the second opening is closed to seal the optical interference reflection structure between the substrate and the protection structure. | 09-03-2009 |
20100024523 | SYSTEM AND METHOD OF TESTING HUMIDITY IN A SEALED MEMS DEVICE - One embodiment provides a method of testing humidity, comprising: i) determining a property of a device which encloses a plurality of interferometric modulators and ii) determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property, wherein the determined property comprises at least one of i) the thickness and width of a seal of the device and ii) adhesive permeability of a component of the device. In one embodiment, the determined property further comprises at least one of the following: i) temperature-humidity combination inside the device, ii) a desiccant capacity inside the device and iii) a device size. | 02-04-2010 |
20100172013 | SYSTEM AND METHOD FOR DISPLAY DEVICE WITH REINFORCING SUBSTANCE - A package structure and method of packaging an interferometric modulator with a reinforcing substance to help support the integrity of the package. In some embodiments the reinforcing substance is a desiccant integrated into the backplate or the transparent substrate. | 07-08-2010 |
20110012219 | OPTIMIZATION OF DESICCANT USAGE IN A MEMS PACKAGE - A MEMS device may be package with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device. This treatment may include baking of the desiccant to as to cause outgassing of moisture or other undesirable material. The structure of the MEMS device may also be altered to improve compatibility with particular desiccants. | 01-20-2011 |
20110210910 | SYSTEM AND METHOD FOR DISPLAY DEVICE WITH END-OF-LIFE PHENOMENA - Systems and methods of displaying an end-of-life image on an electronic display are disclosed. An end-of-life image is displayed on a MEMS display device in the presence of sufficient water vapor and without continued activation of the display. The image can be displayed in response to user input, in response to detection of a predefined level of water vapor within the display package, according to a prestored lifetime of the device, or according to the natural expiration of the lifetime of the display device and packaging. | 09-01-2011 |
20110290552 | METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER - Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal. | 12-01-2011 |
20120002266 | METHOD AND DEVICE FOR PACKAGING A SUBSTRATE - A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator. | 01-05-2012 |
20120127556 | METHOD AND SYSTEM FOR PACKAGING A DISPLAY - A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure. | 05-24-2012 |