Lai, Taoyuan City
Chi-Kuang Lai, Taoyuan City TW
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20130133935 | Touch Sensor Assembly and Method of Making the Same - A method of making a touch sensor assembly comprises: forming conductive trace elements on a transparent substrate; forming an insulator layer on the transparent substrate such that the insulator layer covers a portion of the conductive trace elements; and forming a plurality of conductive bridging lines such that each of the conductive bridging lines bridges two corresponding ones of the conductive trace elements. Each of the conductive bridging lines includes a plurality of conductor layers stacked one above the other and differing from one another in reflectivity. One of the conductor layers is formed by reacting a reactive gas with a metallic material, and has a reflectivity less than that of the metallic material. | 05-30-2013 |
Ching-Tsung Lai, Taoyuan City TW
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20140089700 | PERFORMANCE MANAGEMENT METHODS FOR ELECTRONIC DEVICES WITH MUTIPLE CENTRAL PROCESSING UNITS - Performance management methods for an electronic device with multiple central processing units (CPUs) are provided. First, thread loading rearrangement and CPU frequency evaluation are performed to obtain a plurality of evaluated performance values for different amounts of CPUs, wherein the plurality of evaluated performance values are relevant to power consumption values of the multiple CPUs. It is then determined whether to adjust an amount of used CPUs based on the plurality of evaluated performance values corresponding to the different amounts of CPUs. | 03-27-2014 |
20140089936 | MULTI-CORE DEVICE AND MULTI-THREAD SCHEDULING METHOD THEREOF - A multi-core device and a multi-thread scheduling method thereof are disclosed. The multi-thread scheduling method includes the following steps: recording thread performance-associated parameters for a thread; and performing a thread load balancing between multiple central processing units of a multi-core processor of the multi-core device. The thread load balancing is performed according to a thread critical performance condition of the thread and the thread critical performance condition is determined based on the thread performance-associated parameters. | 03-27-2014 |
Chiung-Lin Lai, Taoyuan City TW
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20130026523 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a first light shielding layer disposed on the second surface of the substrate; and a second light shielding layer disposed on the first light shielding layer and directly contacting with the first light shielding layer, wherein a contact interface is between the first light shielding layer and the second light shielding layer. | 01-31-2013 |
Chung-Chi Lai, Taoyuan City TW
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20150214917 | METHOD FOR PERFORMING DYNAMIC IMPEDANCE MATCHING AND A COMMUNICATION APPARATUS THEREOF - Method for performing dynamic impedance matching and communication apparatus thereof are provided. With respect to an operating band of an impedance matching circuit of a communication device, a first number of times of tuning are performed on a first element of an impedance matching circuit, and a second number of times of tuning are performed on a second element of the impedance matching circuit, wherein the first number is different from the second number. | 07-30-2015 |
Hsien-Hao Lai, Taoyuan City TW
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20160105828 | Communication Device of Handling Network-based Internet Protocol Flow Mobility - A communication device which communicates with a network apparatus via a packet data network (PDN) connection simultaneously relying on a first access and a second access is disclosed. The communication device comprises a storage unit for storing instructions of transmitting a first message indicating a status of the second access to the network apparatus; and receiving a second message transmitted by the network apparatus, wherein the second message includes configuration indicating transferring one or more Internet Protocol (IP) flows between the first access and the second access, wherein the first access is used to access a cellular network, and the second access is used to access a non-cellular network; and a processing means, coupled to the storage unit, configured to execute the instructions stored in the storage unit. | 04-14-2016 |
Jay Lai, Taoyuan City TW
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20140212627 | SELF-ALIGNMENT DUE TO WETTABILITY DIFFERENCE OF AN INTERFACE - Some embodiments relate to a method of processing a workpiece. The workpiece includes a first surface region having a first wettability coefficient, and a second surface region having a second wettability coefficient that differs from the first wettability coefficient. A liquid, which corresponds to an optical structure, is dispensed on the first and second surface regions of the workpiece, wherein the liquid self-aligns to the second surface region due to the difference between the first and second wettability coefficients. The self-aligned liquid is hardened to form the optical structure. | 07-31-2014 |
20140376858 | Self-Alignment Due to Wettability Difference of an Interface - Some embodiments relate to a method of processing a workpiece. The workpiece includes a first surface region having a first wettability coefficient, and a second surface region having a second wettability coefficient that differs from the first wettability coefficient. A liquid, which corresponds to an optical structure, is dispensed on the first and second surface regions of the workpiece, wherein the liquid self-aligns to the second surface region due to the difference between the first and second wettability coefficients. The self-aligned liquid is hardened to form the optical structure. | 12-25-2014 |
Jui Hsieh Lai, Taoyuan City TW
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20140269804 | Package Structure and Methods of Forming Same - A semiconductor device, a package structure, and methods of forming the same are disclosed. An embodiment is a semiconductor device comprising a first optical device over a first substrate, a vertical waveguide on a top surface of the first optical device, and a second substrate over the vertical waveguide. The semiconductor device further comprises a lens capping layer on a top surface of the second substrate, wherein the lens capping layer is aligned with the vertical waveguide, and a second optical device over the lens capping layer. | 09-18-2014 |
20140269805 | Light Coupling Device and Methods of Forming Same - An embodiment is a semiconductor device comprising an optical device over a first substrate, a vertical waveguide on a top surface of the optical device, the vertical waveguide having a first refractive index, and a capping layer over the vertical waveguide, the capping layer configured to be a lens for the vertical waveguide and the capping layer having a second refractive index. | 09-18-2014 |
20140363121 | Integrated Metal Grating - An integrated circuit includes a substrate, a metal grating disposed over the substrate, and a waveguide layer disposed over or under the metal grating. The metal grating is arranged to change a propagation direction of an optical signal and the waveguide layer is arranged to guide the optical signal to a desired direction. | 12-11-2014 |
20150036970 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING - A semiconductor device includes a first chip, a dielectric layer over the first chip, and a second chip over the dielectric layer. A conductive layer is embedded in the dielectric layer and is electrically coupled to the first chip and the second chip. The second chip includes an optical component. The first chip and the second chip are arranged on opposite sides of the dielectric layer in a thickness direction of the dielectric layer. | 02-05-2015 |
20150036991 | METHOD OF MAKING A METAL GRATING IN A WAVEGUIDE AND DEVICE FORMED - A method of making a grating in a waveguide includes forming a waveguide material over a substrate, the waveguide material having a thickness less than or equal to about 100 nanometers (nm). The method further includes forming a photoresist over the waveguide material and patterning the photoresist. The method further includes forming a first set of openings in the waveguide material through the patterned substrate and filling the first set of openings with a metal material. | 02-05-2015 |
20150061126 | MANUFACTURE INCLUDING SUBSTRATE AND PACKAGE STRUCTURE OF OPTICAL CHIP - A manufacture includes a package structure, a first substrate, and a conductive member of a same material. The package structure includes a chip comprising a conductive pad, a conductive structure over the chip, and a passivation layer over the conductive structure. The passivation layer has an opening defined therein, and the opening exposes a portion of a planar portion of the conductive structure. The first substrate includes a first surface defining a first reference plane and a second surface defining a second reference plane. The conductive member extends across the first reference plane and the second reference plane and into the opening. The conductive member is electrically coupled to the exposed portion of the planar portion. | 03-05-2015 |
20150061137 | PACKAGE AND METHOD FOR INTEGRATION OF HETEROGENEOUS INTEGRATED CIRCUITS - A package for holding a plurality of heterogeneous integrated circuits includes a first chip having a first conductive pad and a first substrate including a first semiconductor, and a second chip having a second conductive pad and a second substrate including a second semiconductor. The second semiconductor is different from the first semiconductor. The package also includes a molding structure in which the first chip and the second chip are embedded, a conductive structure over the first chip and conductively coupled to the first conductive pad and over the second chip and conductively coupled to the second conductive pad, and a passivation layer over the conductive structure. The passivation layer comprises an opening defined therein which exposes a portion of the second chip. | 03-05-2015 |
20150104909 | APPARATUS AND METHOD FOR SELF-ALIGNING CHIP PLACEMENT AND LEVELING - An approach is provided for aligning and leveling a chip package portion. The approach involves filling, at least partially, a reservoir formed between a first sidewall portion having a first slanted surface and a second sidewall portion having a second slanted surface with a fluid. The approach also involves placing a chip package portion into the reservoir. The approach further involves draining the fluid from the reservoir to cause the chip package portion to align with respect to a center of the reservoir. The chip package portion aligns with respect to the center of the reservoir and levels based on a relationship between the chip package portion, an angle of the first slanted surface, an angle of the second slanted surface, and the fluid. The chip package portion is secured in the aligned and leveled state by a molding compound. | 04-16-2015 |
20150108667 | APPARATUS AND METHOD FOR CHIP PLACEMENT AND MOLDING - An approach is provided for placing and securing a chip package portion in an aligned position during a curing process. The approach involves providing an apparatus having a first reservoir configured to receive a first chip package, a second reservoir, and a third reservoir. The approach also involves placing the first chip package portion into the first reservoir, the second chip package portion into the second reservoir, and the third chip package portion into the third reservoir. The approach further involves causing the first chip package portion to be secured in a first curing position, the second chip package portion to be secured in a second curing position and the third chip package portion to be secured in a third curing position. | 04-23-2015 |
20150131089 | OPTICAL SPECTROSCOPY DEVICE, PROCESS OF MAKING THE SAME, AND METHOD OF USING THE SAME - An optical spectroscopy device includes a first cladding layer is positioned over a photodetector. An optical core region is over the first cladding layer where the optical core region is configured to receive a light beam. The optical core region includes a first grating having a first pitch where the first pitch is positioned to direct a first wavelength of the light beam to a first portion of the photodetector. The optical core region further includes a second grating having a second pitch where the second grating is positioned to direct a second wavelength of the light beam to a second portion of the photodetector. The first pitch is different from the second pitch, the first wavelength is different from the second wavelength, and the first portion of the photodetector is different from the second portion of the photodetector. Additionally, a second cladding layer is over the optical core region. | 05-14-2015 |
20150146203 | BIO-CHIP PACKAGE WITH WAVEGUIDE INTEGRATED SPECTROMETER - A bio-chip package comprises a substrate a first layer over the substrate comprising an image sensor. The bio-chip package also comprises a second layer over the first layer. The second layer comprises a waveguide system a grating coupler. The bio-chip package also comprises a third layer arranged to accommodate a fluid between a first-third layer portion and a second-third layer portion, and to allow the fluid to pass from a first side of the third layer to a second side of the third layer. The third layer comprises a material having a predetermined transparency with respect to a wavelength of a received source light, the waveguide system is configured to direct the received source light to the grating coupler, and the image sensor is configured to determine a change in the wavelength of the source light caused by a coupling between the source light and the fluid. | 05-28-2015 |
20150212270 | Package Structure and Methods of Forming Same - A semiconductor device, a package structure, and methods of forming the same are disclosed. An embodiment is a semiconductor device comprising a first optical device over a first substrate, a vertical waveguide on a top surface of the first optical device, and a second substrate over the vertical waveguide. The semiconductor device further comprises a lens capping layer on a top surface of the second substrate, wherein the lens capping layer is aligned with the vertical waveguide, and a second optical device over the lens capping layer. | 07-30-2015 |
20150287705 | APPARATUS AND PACKAGE STRUCTURE OF OPTICAL CHIP - An apparatus includes a package structure. The package structure includes a chip, a conductive structure over the chip, a molding structure surrounding and underneath the chip, and a first passivation layer over the conductive structure. The chip includes an optical component and a chip conductive pad. The conductive structure is electrically coupled to the chip conductive pad. The conductive structure has a planar portion substantially in parallel with an upper surface of the chip. The first passivation layer has a first opening defined therein. The first opening exposes a portion of the planar portion. The package structure is configured to receive an electrical coupling through the first opening in the first passivation layer. | 10-08-2015 |
20150318239 | APPARATUS AND METHOD FOR CHIP PLACEMENT AND MOLDING - An apparatus includes a base portion having an upper surface and a lower surface opposite the upper surface. The apparatus also includes a first sidewall portion having a first upper portion distal the upper surface of the base portion and a first slanted sidewall between the first upper portion and the upper surface of the base portion. The apparatus further includes a second sidewall portion having a second upper portion distal the upper surface of the base portion and a second slanted sidewall between the second upper portion and the upper surface of the base portion. The first sidewall portion and the second sidewall portion define a first reservoir between the first slanted sidewall and the second slanted sidewall, the first reservoir being configured to receive a first chip package portion and to secure the first chip package portion in a first curing position. | 11-05-2015 |
20160116335 | Optical Spectroscopy Device, Process of Making the Same, and Method of Using the Same - An optical spectroscopy device includes a first cladding layer is positioned over a photodetector. An optical core region is over the first cladding layer where the optical core region is configured to receive a light beam. The optical core region includes a first grating having a first pitch where the first pitch is positioned to direct a first wavelength of the light beam to a first portion of the photodetector. The optical core region further includes a second grating having a second pitch where the second grating is positioned to direct a second wavelength of the light beam to a second portion of the photodetector. The first pitch is different from the second pitch, the first wavelength is different from the second wavelength, and the first portion of the photodetector is different from the second portion of the photodetector. Additionally, a second cladding layer is over the optical core region. | 04-28-2016 |
Kuo-Hua Lai, Taoyuan City TW
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20160082905 | SYSTEM AND METHOD FOR ANALYZING FUEL EFFICIENCY BASED ON DRIVING BEHAVIOR - A fuel efficiency analysis system is provided, which includes a capture device, an analysis process unit and a transform unit. The capture device captures driving data of automobile which is driven by a driver during at least one driving course, the analysis process unit analyzes the driving data to obtain inefficient driving period, and processes the inefficient driving period to generate a plurality of driving time intervals, and the transform unit transforms the plurality of driving time intervals into a plurality of driving efficiencies, and then the plurality of driving efficiencies is transformed into ODE (overall driving effectiveness). A method for analyzing fuel efficiency is also disclosed. | 03-24-2016 |
20160086394 | DRIVING BEHAVIOR ANALYSIS METHOD AND SYSTEM THEREOF - A driving behavior analysis method and a system thereof are provided. The system includes a storage unit, a window splitting unit and a processing unit. The storage unit stores a history fuel-consumption sequence, a driving fuel-consumption sequence and a history reference unit. The history fuel-consumption sequence includes history fuel-consumption data and the driving fuel-consumption sequence includes current fuel-consumption data. The window splitting unit separates history fuel-consumption sequence into multiple basic units and separates driving fuel-consumption sequence into multiple consumption units by utilizing a sliding window to move on the two sequences. By ordering the history fuel-consumption data for each basic unit of the history fuel-consumption sequence in a decreasing order, the processing unit generates a decreasing fuel-consumption sequence. It performs a similarity comparison for the multiple fuel-consumption units and the multiple basic units of the decreasing fuel-consumption sequence, to calculate driving behavior feedback data. | 03-24-2016 |
Mei-Yi Lai, Taoyuan City TW
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20090134783 | Materials for organic light-emitting diodes - The present invention provides for emissive materials comprising compounds of specific chemical structure, and electroluminescent devices comprising such emissive materials. | 05-28-2009 |
Ming-Te Lai, Taoyuan City TW
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20130147760 | COMMUNICATION METHOD FOR CAPACITIVE TOUCH PANEL - A communication system is provided. A first device includes a first capacitive touch panel module. A second device includes a second capacitive touch panel module. A first overlapping area is formed when the second capacitive touch panel module of the second device is near to or contacts with the first capacitive touch panel module of the first device. The second device obtains data from the first device according to an electric field variation of the first overlapping area. | 06-13-2013 |
Ping-Chi Lai, Taoyuan City TW
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20160142486 | DATA-ACCESS SYSTEM AND METHOD FOR STORING DATA AND READING DATA - A data-access system, adapted to a plurality of Cloud storage providers, including a processing module, an access module and a storage module. The processing module receives a file, and obtains a dismantling rule according to file information. The processing module further dismantles the file into a plurality of sub-files according to a storage signal and the dismantling rule. The access module respectively detects the status of the connection of the Cloud storage providers, and the sub-files are stored to at least two of the Cloud storage providers according to the connections statuses. The storage module stores the dismantling rule and the storage records correspond to the sub-files. | 05-19-2016 |
Po-Tung Lai, Taoyuan City TW
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20120067506 | FILM PROCESSING EQUIPMENT AND METHOD USING THE SAME - A film processing equipment and a method for processing a film is provided. A feeding roller feeds the film to a swelling bath and the swelling bath immerses the film. A dyeing bath dyes the film transferred from the swelling bath and a stretching bath stretches the film. The stretching bath comprises three sets of rollers dividing a film transferring path into a first interval length and a second interval length. The first interval length is in an upstream with respect to the film transferring path and smaller than the second interval length. A crosslinking bath performs a crosslinking process on the film transferred from the stretching bath and a washing bath washes the film. A film attaching assembly performs a film attaching process on the film transferred from the washing bath and a winding device winds the film transferred from the film attaching assembly. | 03-22-2012 |
Ray-Chien Lai, Taoyuan City TW
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20160079462 | PACKAGE STRUCTURE OF SOLAR PHOTOVOLTAIC MODULE - A package structure of solar photovoltaic module is provided. The package structure of solar photovoltaic module includes a transparent substrate, a backsheet disposed opposite to the transparent substrate, a plurality of solar cells between the transparent substrate and the backsheet, several encapsulants sandwiched in between the transparent substrate and the backsheet, and an optical board, wherein the encapsulants encapsulate the solar cells. The optical board is adhered to an outer surface of the backsheet, wherein the optical board has an embossing surface, and the embossing surface is a serrated surface, and a vertex angle of the serrated surface is larger than 60° and less than 150°. | 03-17-2016 |
Te-Hsien Lai, Taoyuan City TW
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20160080210 | HIGH DENSITY SERIAL OVER LAN MANAGMENT SYSTEM - A baseboard management controller (BMC) of a system can receive a first serial output from a first server device and a second serial output from a second server device. The BMC can send the first serial output and the second serial output to a network interface controller (NIC) for transmission over a network to a computing device. | 03-17-2016 |
Tsung-Wei Lai, Taoyuan City TW
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20140215453 | METHODS FOR APPLICATION MANAGEMENT IN AN ELECTRONIC DEVICE SUPPORTING HARDWARE ACCELERATION - Methods for application management in an electronic device are provided. It is first determined whether the application to be installed is listed in a first list, wherein the first list lists a set of applications which are hardware accelerable. The application is then marked as a hardware accelerable application in response to the application being listed in the first list. Thereafter, the application is installed, wherein a hardware acceleration function of the application is enabled to activate a hardware acceleration unit of the electronic device for hardware acceleration during executing the application being marked as the hardware accelerable application. | 07-31-2014 |
Wei-Hsun Lai, Taoyuan City TW
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20160099364 | METHOD FOR FORMING DENDRITIC SILVER WITH PERIODIC STRUCTURE AS LIGHHT-TRAPPING LAYER - The invention is related to a method for forming dendritic silver with periodic structure as light-trapping layer, includes these steps: form a photoresist layer on a conductive substrate, and at least two coherent light beams is provided in using a laser interference lithography apparatus, to form a plurality of particular patterns respectively on the setting-exposure positions of the conductive substrate in sequence till the particular periods pattern formed. Thereafter, form the dendritic silver nanostructure with period pattern on the conductive substrate via electrochemical process, wherein operating voltage is 2V or higher, and electrochemical reaction time is 10 sec or higher. | 04-07-2016 |
Wei-Ming Lai, Taoyuan City TW
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20150054124 | INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A manufacturing method of an inductor structure includes the following steps. A protection layer is formed on a substrate, such that bond pads of the substrate are respectively exposed form protection layer openings of the protection layer. A conductive layer is formed on the bond pads and the protection layer. A patterned first photoresist layer is formed on the conductive layer. Copper bumps are respectively formed on the conductive layer located in the first photoresist layer openings. A patterned second photoresist layer is formed on the first photoresist layer, such that at least one of the copper bumps is exposed through second photoresist layer opening and the corresponding first photoresist layer opening. A diffusion barrier layer and an oxidation barrier layer are formed on the copper bump. The first and second photoresist layers, and the conductive layer not covered by the copper bumps are removed. | 02-26-2015 |
20150097268 | INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - An inductor structure includes a substrate, a protection layer, a patterned first conductive layer, copper bumps, a passivation layer, a diffusion barrier layer, and an oxidation barrier layer. The protection layer is located on the substrate. The bond pads of the substrate are respectively exposed through protection layer openings. The first conductive layer is located on the surfaces of the bond pads and the protection layer adjacent to the protection layer openings. The copper bumps are located on the first conductive layer. The passivation layer is located on the protection layer and the copper bumps. At least one of the copper bumps is exposed through a passivation layer opening. The diffusion barrier layer is located on the copper bump that is exposed through the passivation layer opening. The oxidation barrier layer is located on the diffusion barrier layer. | 04-09-2015 |
Wen-Lung Lai, Taoyuan City TW
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20160086822 | PACKAGING SUBSTRATE HAVING A HOLDER, METHOD OF FABRICATING THE PACKAGING SUBSTRATE, PACKAGE STRUCTURE HAVING A HOLDER, AND METHOD OF FABRICATING THE PACKAGE STRUCTURE - A packaging substrate includes a holder, a first conductive pad disposed on the holder, a core layer disposed on the holder, a circuit layer disposed on the core layer, a plurality of conductive vias disposed in the core layer, and an insulating protection layer disposed on the core layer, wherein the first electrical pad is embedded in the core layer. By combining the holder on one side of the packaging substrate, cracks due to over-thinness can be prevented during transferring or packaging. A method of fabricating the packaging substrate, a package structure having a holder, a method of fabricating the package structure are also provided. | 03-24-2016 |
Yu-Chieh Lai, Taoyuan City TW
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20160140977 | NOISE CANCELLATION METHOD - An embodiment of the invention provides a noise cancellation method for an electronic device. The method comprises: receiving an audio signal; applying a Fast Fourier Transform operation on the audio signal to generate a sound spectrum; acquiring a first spectrum corresponding to a noise and a second spectrum corresponding to a human voice signal from the sound spectrum; estimating a center frequency according to the first spectrum and the second spectrum; and applying a high pass filtering operation to the sound spectrum according to the center frequency. | 05-19-2016 |
Yu-Ci Lai, Taoyuan City TW
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20130017705 | POWER SUPPLY STRUCTUREAANM LAI; YU-CIAACI Taoyuan CityAACO TWAAGP LAI; YU-CI Taoyuan City TWAANM CIOU; CHUEI-HANGAACI Taoyuan CityAACO TWAAGP CIOU; CHUEI-HANG Taoyuan City TWAANM LEE; DA-WEIAACI Taoyuan CityAACO TWAAGP LEE; DA-WEI Taoyuan City TW - A power supply structure includes a main body and a plug. The main body has a circular containing space, a cylinder and a plurality of conducting plates. The cylinder has a retaining plane and at least one annular groove. The plug has a plug seat and a first cylinder. The first cylinder has a protrusion and at least one elastic device on an inner side of the bottom of the first cylinder. The elastic device has a resilient arm and a pressing member. The annular groove has a stop block and a fixing space. The protrusion is provided and placed into the annular groove, so that the plug can be fixed into the main body. | 01-17-2013 |