Patent application number | Description | Published |
20120292071 | AIR CYLINDER UNIT AND PNEUMATIC TOOL HAVING THE SAME - An pneumatic tool includes a front section, a rear section connected to and disposed behind the front section, a driving unit, and an air cylinder unit. The rear section includes a main body, a handle connected to the main body and adjacent to the front section, and an intake passage in fluid communication with the outside. The air cylinder unit includes a first cylinder mounted within the rear section, a second cylinder connected to the first cylinder, an extension portion extending into the handle, and an inclined intake channel having an inlet in fluid communication with intake passage, and an outlet in fluid communication with the first cylinder. The rotor unit is mounted rotatably within the first and second cylinders for activating the driving unit. | 11-22-2012 |
20130180746 | PNEUMATIC IMPACT TOOL WITH A SPINDLE POSITIONING DEVICE - A pneumatic impact tool includes a spindle extending along an X-axis, an output shaft extending along a Z-axis, and a spindle positioning device that includes a bushing and a stop pin. The bushing is threaded in a housing, and has a stop surface and a frustoconical outer surface. The stop surface obstructs the spindle from moving away from the output shaft. The frustoconical outer surface has opposite first and second ends. The first end is nearer to the X-axis and farther away from the Z-axis than the second end. The stop pin is disposed removably in the housing, and has an engaging surface abutting against the frustoconical outer surface, so as to prevent the bushing from moving in the housing in a direction away from the output shaft. | 07-18-2013 |
20130180749 | PNEUMATIC IMPACT TOOL HAVING TWO OIL INLETS - A pneumatic impact tool includes a housing, a power output unit, a transmission unit, and an oil seal assembly. The housing has first and second accommodating chambers, and first and second oil inlets in fluid communication with the first and second accommodating chambers, respectively, and permitting lubricating oil to be fed into the first and second accommodating chambers therethrough. The power output unit is centered at a Z-axis, and is disposed in the first accommodating chamber for power outputting. The transmission unit is centered at an X-axis, and is disposed in the second accommodating chamber for transmitting a power to the power output unit. The oil seal assembly prevents flow of the lubricating oil out of the first and second accommodating chambers. | 07-18-2013 |
20130298755 | MOTOR ASSEMBLY FOR PNEUMATIC TOOL - A motor assembly for a pneumatic tool includes: a motor cylinder coaxially secured in a tubular inner housing, which is coaxially secured in a tubular outer housing and has an inlet passage defining a longitudinal axis, including a valve seat, and defining forward and reverse passages that communicate with a motor chamber and extend through the valve seat, and an exhaust port that communicates with the motor chamber, and a throttle passage defined between the inner and outer housings; a motor rotor supported within the motor chamber and rotatable in a forward or reverse direction; and a rotary valve coaxially disposed in the inner housing, supported by the valve seat, and rotatable about the longitudinal axis between forward and reverse positions. | 11-14-2013 |
20130319714 | Pneumatic Driven Wrench - Apneumatic driven wrench comprises: a housing defining a middle channel; a cylinder defining two fluid passages; a rotor; a first valve; a second valve driven by a valve-switching member for controlling fluid communication between the middle channel and a selected one of the fluid passages; a valve-triggering unit for driving the first valve; and a locking member driven by the valve-triggering unit to move between releasing and locking positions. The locking member engages one of the valve-switching member and the second valve when at the locking position. The locking member is disengaged from the one of the valve-switching member and the second valve when at the releasing position. | 12-05-2013 |
Patent application number | Description | Published |
20130141187 | CROSS-COUPLED BANDPASS FILTER - A cross-coupled bandpass filter includes first, second and third resonators such that a positive mutual inductance is generated between the first and third resonators and mutual inductance generated between the first and second resonators and mutual inductance generated between the second and third resonators have the same polarity, thereby generating a transmission zero in a high frequency rejection band. | 06-06-2013 |
20140015621 | BALANCED-TO-UNBALANCED CONVERTER - A balanced-to-unbalanced converter (balun) is provided, including: a converting circuit having a first processing circuit including a first inductor and a first capacitor connected in series, a second processing circuit including a second capacitor and a second inductor connected in series, the second capacitor being electrically connected to the first inductor, and two balanced output ends connected to the first processing circuit and the second processing circuit, respectively; and a preprocessing circuit connected to the converting circuit and including an unbalanced input end for converting real impedance at the unbalanced input end into complex impedance at the balanced output ends. Accordingly, the balun satisfies the need of the wireless communication chips by providing differential signals with complex impedance. This is done by employing the preprocessing circuit in conjunction with the converting circuit to convert an unbalanced signal with real impedance into a balanced signal with complex impedance. | 01-16-2014 |
20140124950 | SEMICONDUCTOR SUBSTRATE AND FABRICATION METHOD THEREOF - A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of the substrate body, wherein the circuit layer covers an end of the opening and is electrically insulated from the opening. The opening facilitates to increase the thickness of the insulating structure between the circuit layer and the substrate body of a silicon material to prevent signal degradation when high frequency signals are applied to the circuit layer. | 05-08-2014 |
20140184261 | TESTING APPARATUS AND TESTING METHOD - A testing method is provided, including providing a testing apparatus including a carrier member and a testing element, the carrier member comprising a first surface, a second surface opposing the first surface, and an elastic conductive area defined on the first surface; disposing an object-to-be-tested on the elastic conductive area; electrically connecting the testing element to the object-to-be-tested and the carrier member, to form an electric loop among the carrier member, the object-to-be-tested and the testing element. Through the design of the elastic conductive area, the object-to-be-tested can be secured with a small pressure applied thereto, and is prevented from being cracked. | 07-03-2014 |
20140204806 | DUPLEXER, CIRCUIT STRUCTURE THEREOF AND RF TRANSCEIVER APPARATUS COMPRISING THE DUPLEXER - A duplexer is provided, which includes a first, a second and a third signal ports; a first filter and a second filter. The first filter has first, second, and third resonant circuits that have first, second and third inductors, respectively. The first, second and third inductors are mutually inductive. The first and third resonant circuits are electrically connected to the first and second signal ports, respectively. The second filter has fourth, fifth and sixth resonant circuits that have fourth, fifth and sixth inductors, respectively. The fourth resonant circuit is connected in series with the first resonant circuit. The fifth inductor and the fourth inductor are mutually inductive. The sixth resonant circuit is electrically connected to the third signal port. The second filter further has a main capacitor connected in series with the fifth and sixth resonant circuits respectively and located therebetween. | 07-24-2014 |
20140320374 | MULTI BANDWIDTH BALUN AND CIRCUIT STRUCTURE THEREOF - A multi bandwidth balun is provided, including a main signal port, a main inductor electrically connected to the main signal port, a first inductor inducted mutually with the main inductor to constitute a first inductor of a first conversion circuit, a first capacitor module connected in parallel to the first conversion circuit, two first signal ports electrically connected to the first capacitor module, a first main capacitor electrically connected to the first signal port and the first capacitor module therebetween, a second inductor inducted mutually with the main inductor to constitute a second inductor of a second conversion circuit, a second capacitor module connected in parallel to the second conversion circuit, two second signal ports electrically connected to the second capacitor module, and a second main capacitor electrically connected to the second signal port and the second capacitor module therebetween. | 10-30-2014 |
20150188510 | CIRCUIT STRUCTURE - A circuit structure is provided, which includes: a first circuit portion having at least a capacitor; a first dielectric portion combined with the first circuit portion; a second circuit portion electrically connected to the first circuit portion and having at least an inductor; and a second dielectric portion combined with the second circuit portion, wherein the first dielectric portion has a greater dielectric constant than the second dielectric portion, thereby increasing the capacitance value and density and causing the inductor to have a high enough Q value. | 07-02-2015 |
Patent application number | Description | Published |
20120127693 | LIGHT-PERMEATING COVER BOARD, METHOD OF FABRICATING THE SAME, AND PACKAGE HAVING THE SAME - A light-permeating cover board structure includes a first light-permeating board having a light-permeating substrate and a frame formed on the light-permeating substrate, wherein a first recess portion is defined by the frame and the light-permeating substrate; a first fluorescent material filled in the first recess portion; and a second light-permeating board disposed on the first light-permeating board and covering the first fluorescent material in the first recess portion. Therefore, the first light-permeating board and the second light-permeating board prevent the first fluorescent material from contacting moisture. | 05-24-2012 |
20120168777 | LED PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF - An LED package structure includes: a carrier; at least a first protruding portion and a plurality of electrical contacts formed on the carrier; a plurality of LED chips disposed on the first protruding portion and on the carrier in a region free from the first protruding portion, respectively; a plurality of bonding wires electrically connecting the | 07-05-2012 |
20120286308 | LED PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME - An LED package structure and a method of fabricating the same. The LED package structure includes: a package unit including a submount with a cavity, and a light emitting chip disposed in the cavity; a first light-pervious element disposed in the cavity; a multi-layered dam structure concentrically disposed on the first light-pervious element or around a rim of the cavity; a first light-pervious packaging material filled in the dam structure; and a second light-pervious element that combines with the dam structure. Accordingly, the multi-layered dam structure provides an advantage of eliminating gaps and overcomes the problem resulting from the uneven thickness of the first light-pervious packaging material used in the prior technique, thereby ensuring high illumination efficiency and enhanced airtightness. | 11-15-2012 |
20150325556 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A package structure is provided, which includes: a chip carrier having a plurality of conductive connection portions; at least an electronic element disposed on the chip carrier; a plurality of conductive wires erectly positioned on the conductive connection portions, respectively; an encapsulant formed on the chip carrier for encapsulating the conductive wires and the electronic element, wherein one ends of the conductive wires are exposed from the encapsulant; and a circuit layer formed on the encapsulant and electrically connected to exposed ends of the conductive wires. According to the present invention, the conductive wires serve as an interconnection structure. Since the wire diameter of the conductive wires is small and the pitch between the conductive wires can be minimized, the present invention reduces the size of the chip carrier and meets the miniaturization requirement. | 11-12-2015 |
Patent application number | Description | Published |
20090039488 | Semiconductor package and method for fabricating the same - A semiconductor package and a method for fabricating the same are provided. A leadframe including a die pad and a plurality of peripheral leads is provided. A carrier, having a plurality of connecting pads formed thereon, is attached to the die pad, wherein a planar size of the carrier is greater than that of the die pad, allowing the connecting pads on the carrier to be exposed from the die pad. At least a semiconductor chip is attached to a side of an assembly including the die pad and the carrier, and is electrically connected to the connecting pads of the carrier and the leads via bonding wires. A package encapsulant encapsulates the semiconductor chip, the bonding wires, a part of the carrier and a part of the leadframe, allowing a bottom surface of the carrier and a part of the leads to be exposed from the package encapsulant. | 02-12-2009 |
20140080264 | METHOD FOR FABRICATING LEADFRAME-BASED SEMICONDUCTOR PACKAGE - A semiconductor package and a method for fabricating the same are provided. A leadframe including a die pad and a plurality of peripheral leads is provided. A carrier, having a plurality of connecting pads formed thereon, is attached to the die pad, wherein a planar size of the carrier s greater than that of the die pad, allowing the connecting pads on the carrier to be exposed from the die pad. At least a semiconductor chip is attached to a side of an assembly including the die pad and the carrier, and is electrically connected to the connecting pads of the carrier and the leads via bonding wires. A package encapsulant encapsulates the semiconductor chip, the bonding wires, a part of the carrier and a part of the leadframe, allowing a bottom surface of the carrier and a part of the leads to be exposed from the package encapsulant. | 03-20-2014 |
Patent application number | Description | Published |
20100252608 | PNEUMATIC NAIL GUN - A pneumatic nail gun includes a gun body, a connecting mechanism, an acting valve, a trigger, a safety valve, and a trigger valve. The gun body includes a safety compressed air inlet and a firing compressed air inlet. The connecting mechanism is slidably disposed on the gun body. The acting valve is connected to the connecting mechanism. The trigger is connected to the gun body. The safety valve is connected to the acting valve for allowing a safety compressed air came from the compressed air source to drive the acting valve to move the connecting mechanism forwards when the trigger is pulled. The trigger valve releases a firing compressed air came from the compressed air source to project at least one nail only when the trigger is pulled, a workpiece blocks the connecting mechanism, and the trigger opens the trigger valve. | 10-07-2010 |
20120074654 | TOOL HAVING A QUICK RELEASE DEVICE - A tool includes a body having an insert groove formed in and end surface for insertion of the processing member thereinto, a pressing block disposed within the body and abutting against an inclined surface of the body for pressing against the processing member, a controlling member connected pivotally to the body and rotatable about a pivot axis, and a connecting member connected fixedly to the pressing block and connected pivotally to the controlling member, in such a manner to allow the connecting member and the pressing block to rotate about a connecting axis. The controlling member is operable to rotate about the pivot axis to thereby rotate the pressing block about the connecting axis between a first position whereat the processing member is locked in the insert groove, and second position whereat removal of the processing member from the insert groove is allowed. | 03-29-2012 |
Patent application number | Description | Published |
20120159801 | DEHYDRATING DEVICE - The present invention discloses a dehydrating device comprising air diverging duct, linkage tube, dryer, air converging duct, water converging container and dehydrating room. The air blown from the blower sequentially passes through the air diverging duct, the linkage tube, the wavy first flow path and the U-shape second flow path of the dryer to be dehydrated. After being dried by the dryer, the air flows out of the sixth outlet of the air converging duct for further application. The device is designed to accomplish objectives such as improving the efficiency of dehydrating air, saving energy, being expandable and so on. | 06-28-2012 |
20120164008 | NEGATIVE-PRESSURE OXYGEN PROVIDING DEVICE - A negative-pressure oxygen providing device includes a base, a power unit, a first negative-pressure device, a second negative-pressure device, and a water suction member. The power unit is fixed on the base and includes a driving member with a driving shaft and a main shaft which communicates with the driving shaft. The driving member drives the driving shaft and the main shaft. The first negative-pressure device is connected to a lower end of the main shaft and includes multiple blades which are merged in the water. The water suction member is connected to the main shaft and includes multiple paths. Each path has a top portion located above the water and a bottom portion of each path is in the water. The second negative-pressure device is located above the water and fixed to the top of the driving shaft so as to suck air into the driving shaft. | 06-28-2012 |
Patent application number | Description | Published |
20120210832 | HAND TOOL TORSION ADJUSTMENT STRUCTURE - A hand tool torsion adjustment structure includes a main mechanism, a torsion release mechanism and a micro-adjustment mechanism. The main mechanism is composed of a working rod and a tool handle while the torsion release mechanism is provided with a first engage tooth, a second engage tooth and a spring, and the micro-adjustment mechanism consists of a resisting member, an interacting member and at least one adjusting pinion. The torsion value of the hand tool can quickly be adjusted through the main mechanism and the torsion release mechanism, and the torsion preset value of the hand tool can precisely be fine-adjusted via the micro-adjustment mechanism. | 08-23-2012 |
20130319185 | RATCHET SCREWDRIVER ABLE TO CHANGE OPERATING DIRECTION - A ratchet screwdriver includes a handle, a shaft and a ratchet switch device. The shaft is connected to the front end of the handle and a mounting member is connected to the handle so as to be connected with the shaft. The ratchet switch device is located in the chamber in the rear end of the handle and includes a base, a frame, two engaging members, a positioning member, a resilient plate, two positioning pieces, and a ratchet member a switch. The shaft can be replaced by operating the mounting member on the handle. The switch on the rear end of the handle can change the direction of the ratchet member to output torque via the shaft. | 12-05-2013 |
20140109732 | TORSION ADJUSTING STRUCTURE OF A SCREWDRIVER - A torsion adjusting structure of a screwdriver includes an inner tube, a front micro-adjusting rod, a spring, an upper toothed block, a lower toothed block, a stop member, a compressive member, a regulating knob and an interacting member combined together, and the torsion adjusting structure is assembled in the handle of a screwdriver. To adjust the torsion of the screwdriver, an auxiliary tool is inserted in the polygonal recessed groove of the regulating knob to rotate the regulating knob having the graduation and number of a torsion value to be set by the regulating knob aligned to the position of an indication mark on the handle. Thus, the value of the torsion of a screwdriver can conveniently be regulated via the graduations and numbers on the regulating knob. Furthermore, the front micro-adjusting rod can carry out micro-adjustment of torsion. | 04-24-2014 |
20140352502 | TORQUE ADJUSTMENT DEVICE FOR SCREWDRIVER - A torque adjustment device for a screwdriver includes a tube located in the handle of the screwdriver and has an adjusting member connected to the first end thereof, a cap is connected to the second end of the tube. A first block and a second block are connected with each other by engagement of the teeth on the two blocks. A spring is biased between the first block and the adjusting member. A link is connected to the cap which pushes a pushing member to move the second block toward the first block when using an assistance tool to rotate the cap. The first block is able to move toward the second block by rotating the adjusting member so as to change the matching force between the teeth of the blocks. The cap has digits and marks to acknowledge the user the setting value of the torque. | 12-04-2014 |
Patent application number | Description | Published |
20090108977 | TRANSFORMER - A transformer includes a bobbin unit, a primary winding, a secondary winding, and a core unit. The bobbin unit has a first winding portion and a second winding portion. The primary winding is wound around the first winding portion of the bobbin unit. The secondary winding is wound around the second winding portion of the bobbin unit, and is coupled electromagnetically to the primary winding. The core unit is mounted to the bobbin unit, and includes a first core part, and a second core part that forms a magnetic circuit path with the first core part. The first core part is movable relative to the second core part from a tunable position to an assembled position for varying a size of an effective magnetic flux region defined between the first core part and the second core part. | 04-30-2009 |
20100060399 | TRANSFORMER - A transformer includes primary and secondary windings coupled electromagnetically to each other and wounded respectively around primary and secondary winding portions of a bobbin unit, and a core unit mounted to the bobbin unit and including first and second core parts that form a magnetic circuit path. The first core part includes insertion and extension segments extending from a connecting segment. The second core part includes insertion and extension segments, and an adjusting segment extending from a connecting segment toward the first core part. The extension segments of the first and second core parts contact each other. The insertion segments of the first and second core parts extend respectively through the primary and secondary winding portions to contact each other. | 03-11-2010 |
20100321141 | TRANSFORMER - A transformer includes a core unit that includes an elongated first core part extending in a longitudinal direction and having first and second segments, and an E-shaped second core part including a connecting segment that extends in the longitudinal direction, and three extension segments that extend from the connecting segment in a transverse direction. A central one of the extension segments is disposed in contact with the second segment. The second segment has a size in the transverse direction that gradually decreases along the longitudinal direction away from the first segment. The first core part is movable relative to the second core part from a tunable position to an assembled position for adjusting a position of the second segment relative to the central one of the extension segments so as to vary a size of an effective magnetic flux region defined between the first and second core parts. | 12-23-2010 |
Patent application number | Description | Published |
20140252603 | SEMICONDUCTOR DEVICE HAVING A CONDUCTIVE VIAS - A semiconductor device is provided, including: a substrate having opposing first and second surfaces and a plurality of conductive vias passing through the first and second surfaces; an insulating layer formed on the first surface of the substrate and exposing end portions of the conductive vias therefrom; and a buffer layer formed on the insulating layer at peripheries of the end portions of the conductive vias, thereby increasing product reliability and good yield. | 09-11-2014 |
20150014864 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - The present invention provides a semiconductor package and a method of fabricating the same. The semiconductor package includes a substrate, a package unit mounted on and electrically connected to the substrate, and a second encapsulant formed on the substrate and encapsulating the package unit. The package unit includes an interposer, a semiconductor chip mounted on the interposer in a flip-chip manner, and a first encapsulant formed on the interposer and encapsulating the semiconductor chip. The present invention reduces the fabricating time and increases the yield of the final product. | 01-15-2015 |
20150035163 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - The present invention provides a semiconductor package and a method of fabricating the same, including: placing a semiconductor element in a groove of a carrier; forming a dielectric layer on the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second of the carrier on a sidewall of the groove intact for the second portion to function as a supporting part. The present invention does not require formation of a silicon interposer, therefore the overall cost of the final product is much reduced. | 02-05-2015 |
20150035164 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - The present invention provides a semiconductor package and a method of fabricating the same, including: placing in a groove of a carrier a semiconductor element having opposing active and non-active surfaces, and side surfaces abutting the active surface and the non-active surface; applying an adhesive material in the groove and around a periphery of the side surfaces of the semiconductor element; forming a dielectric layer on the adhesive material and the active surface of the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second portion of the carrier on a side wall of the groove intact for the second portion to function as a supporting member. The present invention does not require formation of a silicon interposer, and therefore the overall cost of a final product is much reduced. | 02-05-2015 |
20150041969 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A fabrication method of a semiconductor package is disclosed, which includes the steps of: providing a semiconductor structure having a carrier, a circuit portion formed on the carrier and a plurality of semiconductor elements disposed on the circuit portion; disposing a lamination member on the semiconductor elements; forming an insulating layer on the circuit portion for encapsulating the semiconductor elements; and removing the carrier. The lamination member increases the strength between adjacent semiconductor elements so as to overcome the conventional cracking problem caused by a CTE mismatch between the semiconductor elements and the insulating layer when the carrier is removed. | 02-12-2015 |
20150069628 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package is provided, including a semiconductor substrate having a plurality of conductive vias, a buffer layer formed on the semiconductor substrate, a plurality of conductive pads formed on end surfaces of the conductive vias and covering the buffer layer. During a reflow process, the buffer layer greatly reduces the thermal stress, thereby eliminating the occurance of cracking at the interface of conductive pads. A method of fabricating such a semiconductor package is also provided. | 03-12-2015 |
20150132893 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE - A semiconductor package is provided. The semiconductor package includes a semiconductor chip having opposite first and second surfaces; an RDL structure formed on the first surface of the semiconductor chip and having opposite third and fourth surfaces and a plurality of first conductive through holes penetrating the third and fourth surfaces thereof, wherein the RDL structure is formed on the semiconductor chip through the fourth surface thereof and electrically connected to the semiconductor chip through a plurality of first conductive elements, and the third surface of the RDL structure has a redistribution layer formed thereon; a plurality of conductive bumps formed on the redistribution layer; and an encapsulant formed on the first surface of the semiconductor chip for encapsulating the RDL structure, wherein the conductive bumps are embedded in and exposed from the encapsulant. The invention effectively prevents warpage of the semiconductor package and improves the electrical connection significantly. | 05-14-2015 |
20150155258 | METHOD OF FABRICATING A SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE BUMPS WITH A PLURALITY OF METAL LAYERS - A conductive bump structure used to be formed on a substrate having a plurality of bonding pads. The conductive bump structure includes a first metal layer formed on the bonding pads, a second metal layer formed on the first metal layer, and a third metal layer formed on the second metal layer. The second metal layer has a second melting point higher than a third melting point of the third metal layer. Therefore, a thermal compression bonding process is allowed to be performed to the third metal layer first so as to bond the substrate to another substrate, and then a reflow process can be performed to melt the second metal layer and the third metal layer into each other so as to form an alloy portion, thus avoiding cracking of the substrate. | 06-04-2015 |
20150255311 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE - A semiconductor package is provided, including: a carrier; at least an interposer disposed on the carrier; an encapsulant formed on the carrier for encapsulating the interposer while exposing a top side of the interposer; a semiconductor element disposed on the top side of the interposer; and an adhesive formed between the interposer and the semiconductor element. By encapsulating the interposer with the encapsulant, warpage of the interposer is avoided and a planar surface is provided for the semiconductor element to be disposed thereon, thereby improving the reliability of electrical connection between the interposer and the semiconductor element. | 09-10-2015 |
20160118271 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER STRUCTURE - A method of fabricating a semiconductor package is provided, including: cutting a substrate into a plurality of interposers; disposing the interposers in a plurality of openings of a carrier, wherein the openings are spaced from one another by a distance; forming a first encapsulant to encapsulate the interposers; removing the carrier; and disposing at least a semiconductor element on each of the interposers. By cutting the substrate first, good interposers can be selected and rearranged such that finished packages can be prevented from being wasted due to inferior interposers. | 04-28-2016 |
Patent application number | Description | Published |
20100307298 | Screwdriver bit structure having auxiliary positioning function - A screwdriver bit structure having auxiliary positioning function includes a screwdriver bit of which one end is a circular cylinder and having a driving portion that is any one of a slotted type, a cross type and a polygon type. Another end of the circular cylinder is a fitting portion that is buckled to the screwdriver bar. The features of the invention are that the circular cylinder has a concave ring groove near the front of the driving portion. An auxiliary sheath is a long tube body that has a tube hole. The internal diameter of the tube hole is slightly larger than the periphery of the circular cylinder. A protruding ring is disposed to an internal wall of the tube hole. Accordingly, the tube hole of the auxiliary sheath can cover the periphery of the circular cylinder to allow the screwdriver bit to achieve the absolute positioning. | 12-09-2010 |
20110283842 | Screwdriver bit structure - A screwdriver bit structure sequentially comprises a connection section, a neck reducing section and a driving section. A plurality of arc grooves is circularly disposed to a front of the driving section to form an operating end capable of embedding with a locking member. An effective working section is disposed to a front of the operating end, the characterized in that a reinforcement section is preset between an end of each arc groove of the driving section and a relative bottom edge of the driving section. An external diameter of a maximum cross-section of the effective working section is greater than a length of the neck reducing section. An external diameter of the neck reducing section is greater than or equal to a length of the working section. An upper tapering transition is disposed between the neck reducing section and the driving section. | 11-24-2011 |
20110318090 | Joint recognition member - A joint recognition member is revealed. The joint recognition member includes a joint body formed by a cylinder connected with a polygonal prism. A polygonal hole with a magnet part is set on the cylinder so as to attract driver bits by magnetic force. The device features on that: a narrow neck part with a ring groove is arranged at one end of the cylinder near the polygonal prism. The ring is wrapped around the narrow neck part and outside diameter of the ring is no smaller than that of the cylinder. A protruding ring on the ring is mounted and moved freely in the ring groove. An outer surface of the ring is labeled with words such as size. According to the corresponding polygonal hole, the ring has different shapes and sizes in various colors for fast recognition. | 12-29-2011 |
20120067889 | Padlock container structure - A padlock container structure comprises a container box having one opening end that is connected to an external cover through buckling manner; one end of the external cover provided with a shaped hole capable of filling articles, a sliding cover capable of being moved according to a predetermined path disposed to an external end surface of the external cover; one end of the sliding cover covering the shaped hole; a hangtag, one end of the hangtag having a rod body capable of temporarily integrating the external cover and the sliding cover, another end of the hangtag having a hang hole provided for hanging and exhibiting; wherein after the rod body is cut, the sliding cover is shifted and regulated to allow the shaped hole showing opened state or closed state. | 03-22-2012 |
20130340578 | Screwdriver Bit - A screwdriver bit is revealed. The screwdriver bit includes a driving portion, a narrow neck portion integrated with and extended from the driving portion, and a working segment integrated with and extended from the narrow neck portion. The narrow neck portion consists of a connection portion, a first tapered transition, and a second tapered transition. The first tapered transition is an arc taper and the second tapered transition is a straight taper. When the screwdriver bit is driven by a power tool and is rotated at high speed, the torsional stress generated is dispersed by the first tapered transition while the second tapered transition is used to reduce torsional stress of the narrow neck portion. Thus the wearing of the screwdriver bit is effectively reduced. | 12-26-2013 |
20140369775 | Quick-Change Attachment Configuration for a Hole Saw - The present invention relates to a quick-change attachment means for a hole saw, which is directed to a tool for use with a hole saw for boring holes on a wooden plank, particularly a quick-change attachment means for quickly replacing a longitudinal body, which is a drill bit shank having a driving end, a tool end, and a limiting portion. The present invention is characterized by: it is a quick-change attachment means for assembling a longitudinal body and a hole saw, it has an axial hole for allowing a longitudinal body to move on a quick-change attachment means, a locking component for locking and releasing the longitudinal body on and from the quick-change attachment means. The locking component has a first component and a second component, which when used, the longitudinal body can be easily moved slidably and locked so the shreddings emerging from the hole saw can be cleaned. | 12-18-2014 |
Patent application number | Description | Published |
20130228048 | RATCHET WRENCH AND BODY USED IN RATCHET WRENCH - A ratchet wrench comprises a body, a ratchet, a first pawl, and a second pawl. Each of the first pawl and the second pawl can move between a first position and a second position relative to the ratchet. The first position is a position where the ratchet wrench can transmit torque to said driven element from respective first pawl or second pawl, and the second position is a position where no torque is transmitted from respective first pawl or second pawl. A control member can pivot or rotate to stay in one of a first position, a second position, and a neutral position for different operations. The body has an operating part comprising a groove. The groove comprises two accommodation chambers having inclined surfaces and can accommodate the first pawl and the second pawl. | 09-05-2013 |
20150290779 | RATCHET WRENCH AND BODY USED IN RATCHET WRENCH - A ratchet wrench comprises a body, a ratchet, a first pawl, and a second pawl. Each of the first pawl and the second pawl can move between a first position and a second position relative to the ratchet. The first position is a position where the ratchet wrench can transmit torque to said driven element from respective first pawl or second pawl, and the second position is a position where no torque is transmitted from respective first pawl or second pawl. A control member can pivot or rotate to stay in one of a first position, a second position, and a neutral position for different operations. The body has an operating part comprising a groove. The groove comprises two accommodation chambers having inclined surfaces and can accommodate the first pawl and the second pawl. | 10-15-2015 |