Patent application number | Description | Published |
20080235649 | METHOD OF DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT, APPARATUS FOR DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT, RECORDING MEDIUM, AND MASK MANUACTURING METHOD - A method of designing a semiconductor integrated circuit includes a cell arranging and wiring step of arranging and wiring cells for creating a physical layout, a design-rule checking step of verifying a shape of a second physical layout including the cells of the physical layout with reference to a rule library for design rule check, a mask-data creating step of creating mask data corresponding to the physical layout using the second physical layout when the design rule is satisfied in the design-rule checking step, a mask-data processing step of performing, when the design rule is not satisfied in the design-rule checking step, mask data processing for the verification-object second physical layout, and a mask-data creating step for creating mask data corresponding to the physical layout using the second physical layout subjected to the mask data processing in the mask-data processing data. | 09-25-2008 |
20080295049 | PATTERN DESIGNING METHOD, PATTERN DESIGNING PROGRAM AND PATTERN DESIGNING APPARATUS - An embodiment of the invention provides a pattern designing method, including the steps of carrying out transfer simulation calculation and step simulation calculation by using physical layout data produced from circuit design data, and comparing a result of the transfer simulation calculation and the step simulation calculation with a preset standard; and carrying out calculation for electrical characteristics by using parameters obtained from the physical layout when as a result of the comparison, the preset standard is fulfilled, and carrying out calculation for the electrical characteristics by reflecting the result of the transfer simulation calculation and the step simulation calculation in the parameters when as the result of the comparison, the preset standard is not fulfilled, thereby extracting the parameters. | 11-27-2008 |
20090193375 | MANUFACTURING METHOD, MANUFACTURING PROGRAM AND MANUFACTURING SYSTEM FOR SEMICONDUCTOR DEVICE - The present of the invention provides a method of manufacturing a semiconductor device, including the steps of: acquiring information on a graphic composing a physical layout of a semiconductor integrated circuit; carrying out calculation for a transferred image in the physical layout; carrying out calculation for a signal delay based on the physical layout, and obtaining a wiring not meeting a specification having the signal delay previously set therein; and setting a portion into which a repeater is to be inserted based on at least one result of results obtained from the information on the graphic and calculation for the transferred image, respectively, with respect to the wiring not meeting the specification. | 07-30-2009 |
20100035367 | FILM THICKNESS PREDICTION METHOD, LAYOUT DESIGN METHOD, MASK PATTERN DESIGN METHOD OF EXPOSURE MASK, AND FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT - A film thickness prediction method of predicting a film thickness of a second processed layer after planarization includes the steps of: creating first to third actual measurement databases; obtaining a reference film thickness of a second processed layer formed on a region in which no circuit pattern exists; segmenting a first processed layer to be formed on a substrate into grid-like meshes, and obtaining a pattern area ratio occupied by a circuit pattern to be formed on a first processed layer in each mesh and further obtaining a circumferential length of the circuit pattern in each mesh; obtaining an initial thickness of the second processed layer in each mesh; and predicting the film thickness of the second processed layer after planarization from an initial film thickness predicted value and an amount of planarization H | 02-11-2010 |
20100207242 | Capacitive element, designing method of the same and integrated circuit device including the same - Disclosed herein is a capacitive element formed by multilayer wirings, wherein a total capacitance, intralayer capacitance and interlayer capacitance are calculated for a plurality of device structures by changing parameters relating to the multilayer wirings in an integrated circuit, a device structure is identified, from among the plurality of device structures, whose difference in the total capacitance between the device structures is equal to or less than a predetermined level and at least either of whose ratio of the intralayer capacitance to the total capacitance or ratio of the interlayer capacitance to the total capacitance satisfies a predetermined condition, and the parameters of the device structure satisfying the predetermined condition are determined as the parameters of the multilayer wirings. | 08-19-2010 |
20100299643 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE, PROGRAM FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROGRAM FOR GENERATING MASK DATA - A method for manufacturing a semiconductor device includes the steps of reading physical layout data of a circuit to be manufactured and performing calculation to modify a pattern width in the physical layout data by a predetermined amount; reading a physical layout and analyzing a pattern that is predicted to remain as a step difference of a predetermined amount or more in a case where a planarization process is performed on a planarizing film on a pattern by a quantitative calculation by using at least one of a density of patterns, a pattern width, and a peripheral length of a range of interest and a range in the vicinity of the range of interest; and reading data of the pattern that is predicted to remain as a step difference, and making a correction to a layout in which a step difference of a predetermined amount or more does not remain. | 11-25-2010 |
20110108705 | SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD AND DESIGNING METHOD THEREOF, AND ELECTRONIC DEVICE - A solid-state imaging device includes: a semiconductor substrate that includes a photodiode separately provided for each of pixels disposed in a matrix on a light-receiving surface; a first insulating film formed on the semiconductor substrate so as to cover multilayer wiring formed on and in contact with the semiconductor substrate, wherein the first insulating film is formed using material of a first refractive index lower than a refractive index of the semiconductor substrate for at least bottom surface and top surface portions of the first insulating film; a second insulating film of a second refractive index higher than the first refractive index formed on the first insulating film; a third insulating film of a third refractive index higher than the second refractive index formed on the second insulating film; and a color filter formed on the third insulating film in a corresponding manner with each pixel so as to transmit light in a wavelength region of red, green, or blue. | 05-12-2011 |
20110242349 | SOLID-STATE IMAGE CAPTURING DEVICE AND ELECTRONIC DEVICE - A solid-state image capturing device includes: a semiconductor substrate having a photosensitive surface including a matrix of pixels as respective photoelectric converters; and a photochromic film disposed in a light path through which light is applied to each of the photoelectric converters, the photochromic film being made of a photochromic material having a light transmittance variable depending on the intensity of applied light in a predetermined wavelength range; wherein the light transmittance has a half-value period shorter than one frame during which pixel signals generated by the pixels are read from all the pixels. | 10-06-2011 |
20110285881 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC EQUIPMENT - A solid-state imaging device includes: a semiconductor substrate having a light receiving surface sectioned for red, green, blue, and white pixels arranged in a matrix with photodiodes formed thereon; color filters formed on the semiconductor substrate in light incident paths to the photodiodes of the respective formation regions of the red, green, and blue pixels and respectively transmitting lights in red, green, and blue wavelength regions; and photochromic films formed on the semiconductor substrate in the light incident path to the photodiodes in the formation regions of at least some of the white pixels, and containing a photochromic material having light transmittance varying in response to incident light intensity in a predetermined wavelength region, wherein a half period of the light transmittance of the photochromic films is shorter than one frame as a period in which pixel signals obtained in the pixels are read out with respect to all pixels. | 11-24-2011 |
20110302543 | PATTERN DESIGNING METHOD, PATTERN DESIGNING PROGRAM AND PATTERN DESIGNING APPARATUS - A pattern designing method, including the steps of carrying out transfer simulation calculation and step simulation calculation by using physical layout data produced from circuit design data, and comparing a result of the transfer simulation calculation and the step simulation calculation with a preset standard; and carrying out calculation for electrical characteristics by using parameters obtained from the physical layout when as a result of the comparison, the preset standard is fulfilled, and carrying out calculation for the electrical characteristics by reflecting the result of the transfer simulation calculation and the step simulation calculation in the parameters when as the result of the comparison, the preset standard is not fulfilled, thereby extracting the parameters. | 12-08-2011 |
20120025061 | SOLID-STATE IMAGING DEVICE, DRIVING METHOD THEREOF AND ELECTRONIC APPARATUS - A solid-state imaging device includes: a semiconductor substrate including a light receiving surface which is divided according to pixels arranged in a matrix shape and is formed with a photoelectric converting section; an electrochromic film which is formed on the semiconductor substrate on a light incident path corresponding to the photoelectric converting section, in a portion of pixels selected from the pixels, and has light transmittance changing from a first transmittance to a second transmittance according to voltage applied thereto; a lower electrode which is formed below the electrochromic film; and an upper electrode which is formed above the electrochromic film. | 02-02-2012 |
20120249829 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS - A solid-state imaging device includes: a substrate; a photoelectric conversion unit that is formed on the substrate and generates signal charge in correspondence with a light amount of incident light; and a transparent electrode that is formed in an upper portion of the substrate and includes a first area formed from a nano carbon material and a second area that is brought into contact with the first area and has light transmittance higher than that of the first area. | 10-04-2012 |
20130196453 | PRESUMABLY DEFECTIVE PORTION DECISION APPARATUS, PRESUMABLY DEFECTIVE PORTION DECISION METHOD, FABRICATION METHOD FOR SEMICONDUCTOR DEVICE AND PROGRAM - Disclosed herein is a presumably defective portion decision apparatus, including: an arithmetic operation section configured to divide a level difference included in level difference data which indicate a level difference distribution on the surface of a semiconductor device into two or more unit level differences in the depthwise direction of the level difference and determine, for each of the unit level differences obtained by the division, a relationship between the height of a contour line at a level difference position of an upper face and an area of an opening surrounded by the contour line to decide presence or absence of a presumably defective portion. | 08-01-2013 |
20130334402 | SOLID-STATE IMAGINGELEMENT, CALIBRATION METHOD OF SOLID-STATE IMAGINGELEMENT, SHUTTER DEVICE, AND ELECTRONIC APPARATUS - Disclosed herein is a solid-state imaging element including: a plurality of pixels including a photoelectric conversion section; and a nano-carbon laminated film disposed on a side of a light receiving surface of the photoelectric conversion section and formed with a plurality of nano-carbon layers, transmittance of light and a wavelength region of transmissible light changing in the nano-carbon laminated film according to a voltage applied to the nano-carbon laminated film. | 12-19-2013 |
20140017444 | TRANSPARENT CONDUCTIVE FILM, HEATER, TOUCH PANEL, SOLAR BATTERY, ORGANIC EL DEVICE, LIQUID CRYSTAL DEVICE, AND ELECTRONIC PAPER - There are provided a transparent conductive film, as well as a heater, a touch panel, a solar battery, an organic EL device, a liquid crystal device, and an electronic paper that are provided with the transparent conductive film, the transparent conductive film being capable of easing a decline in optical transmittance when graphene is laminated, and of achieving optical transmittance higher than an upper limit of optical transmittance of a single layer of graphene. The transparent conductive film includes a single-layered conductive graphene sheet. The single-layered conductive graphene sheet includes a first region and a second region, the first region being configured of graphene, and the second region being surrounded by the first region and having optical transmittance that is higher than optical transmittance of the first region. | 01-16-2014 |
20140024164 | SOLID-STATE IMAGE CAPTURING DEVICE AND ELECTRONIC DEVICE - A solid-state image capturing device including: a semiconductor substrate having a photosensitive surface including a matrix of pixels as respective photoelectric converters; and a photochromic film disposed in a light path through which light is applied to each of the photoelectric converters, the photochromic film being made of a photochromic material having a light transmittance variable depending on the intensity of applied light in a predetermined wavelength range; wherein the light transmittance has a half-value period shorter than one frame during which pixel signals generated by the pixels are read from all the pixels. | 01-23-2014 |
20140061834 | SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD AND DESIGNING METHOD THEREOF, AND ELECTRONIC DEVICE - A solid-state imaging device including pixel photododes on a light-receiving surface of a substrate; a first insulating film on the substrate covering a multilayer wiring on and in contact with the substrate. The first insulating film comprises material of a first refractive index lower than a refractive index of the substrate for at least bottom and top surface portions of the first insulating film. A second insulating film with a second refractive index higher than the first refractive index is on the first insulating film. A third insulating film with a third refractive index higher than the second refractive index is on the second insulating film. For each pixel, a color filter is on the third insulating film. | 03-06-2014 |
20140240557 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC EQUIPMENT - A solid-state imaging device includes: a semiconductor substrate having a light receiving surface sectioned for red, green, blue, and white pixels arranged in a matrix with photodiodes formed thereon; color filters formed on the semiconductor substrate in light incident paths to the photodiodes of the respective formation regions of the red, green, and blue pixels and respectively transmitting lights in red, green, and blue wavelength regions; and photochromic films formed on the semiconductor substrate in the light incident path to the photodiodes in the formation regions of at least some of the white pixels, and containing a photochromic material having light transmittance varying in response to incident light intensity in a predetermined wavelength region, wherein a half period of the light transmittance of the photochromic films is shorter than one frame as a period in which pixel signals obtained in the pixels are read out with respect to all pixels. | 08-28-2014 |
20140362265 | SOLID-STATE IMAGING DEVICE, DRIVING METHOD THEREOF AND ELECTRONIC APPARATUS - A solid-state imaging device includes: a semiconductor substrate including a light receiving surface which is divided according to pixels arranged in a matrix shape and is formed with a photoelectric converting section; an electrochromic film which is formed on the semiconductor substrate on a light incident path corresponding to the photoelectric converting section, in a portion of pixels selected from the pixels, and has light transmittance changing from a first transmittance to a second transmittance according to voltage applied thereto; a lower electrode which is formed below the electrochromic film; and an upper electrode which is formed above the electrochromic film. | 12-11-2014 |