Patent application number | Description | Published |
20110198112 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a method for manufacturing a printed circuit board, including: (A) preparing an aluminum substrate; (B) patterning and etching an etching resist on the aluminum substrate; (C) forming an insulating layer by performing an anodizing treatment on the patterned aluminum substrate; and (D) forming a metal wiring layer by removing the etching resist. The aluminum wiring and the insulating layer are simultaneously formed on the surface of the aluminum patterned by etching through an anodizing method, thereby simplifying the manufacturing process of the substrate and improving adhesion between the metal wiring layer and the insulating layer. In addition, the thickness of the insulating layer and the thickness of the metal wiring layer can be controlled by controlling the anodizing treatment time, thereby providing a method for manufacturing a printed circuit board that can be manufactured to fit for use purpose. | 08-18-2011 |
20110284382 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a metal substrate; an anodic oxide layer formed by anodizing the metal substrate; circuit layers formed on the anodic oxide layer; and a first sol-gel layer formed by applying a photocatalytic material between circuit wirings of the circuit layers and then curing the applied photocatalytic material. The printed circuit board is advantageous in that it can be realized into a high-voltage package printed circuit board because a sol-gel layer is formed between circuit wirings of circuit layers. | 11-24-2011 |
20110303437 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; and a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by the heat generated from the heat generating element. | 12-15-2011 |
20110303440 | HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same. | 12-15-2011 |
20110304990 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space. | 12-15-2011 |
20120000697 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a substrate having a cavity formed therein; an anodic oxide layer formed by anodizing the substrate; and a circuit layer formed in the cavity. The printed circuit board is advantageous in that, since a circuit layer is formed in a cavity of a substrate, a circuit layer having a thickness necessary for realizing a high-power semiconductor package can be easily formed, and the difficulty of supplying and demanding the raw material of a thick film plating resist can be overcome. Further, the printed circuit board is advantageous in that electrical shorts occurring at the time of forming a thick circuit layer and electrical shorts generated by the compounds remaining after etching can be prevented, thus improving the electrical reliability and stability of a circuit layer. | 01-05-2012 |
20120067623 | HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a heat-radiating substrate, including: a copper substrate; an alumina layer formed on one side of the copper substrate; a first circuit layer formed on the alumina layer; and a second circuit layer formed on the first circuit layer, wherein a heat-radiating element is mounted on a first pad of the first circuit layer or a second pad of the second circuit layer, or is directly mounted on the exposed side of the copper substrate after forming an opening on the alumina layer. | 03-22-2012 |
20120073863 | ANODIZED HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an anodized heat-radiating substrate. The anodized heat-radiating substrate is advantageous in that it has good radiation characteristics because an anodized oxide layer is formed on the entire surface of a metal layer. And, the anodized heat-radiating substrate is advantageous in that it has high-density/high accumulation characteristics because it forms multi-layered structure by using the connecting member. | 03-29-2012 |
20120103588 | HEAT-DISSIPATING SUBSTRATE - Disclosed herein is a heat-dissipating substrate in order to improve heat-dissipating characteristics. The heat-dissipating substrate, comprising: a copper layer having a predetermined thickness; anodized insulating layers formed on upper and lower surfaces of the copper layer; and aluminum (Al) layers formed between the copper layer and the anodized insulating layer. Therefore, a heat-dissipating function of the base made of the aluminum (Al) layer and the copper (Cu) layer is improved, thereby making it possible to provide a high-output metal substrate appropriate for high-integration/high capacity electronic components. | 05-03-2012 |
20120111610 | HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method for manufacturing the same. The heat-radiating substrate includes: an anodized substrate having an anodized film formed over a metal substrate; a circuit pattern formed on one surface of the anodized substrate; and a metal layer formed on the other surface of the anodized substrate. The metal layer formed on the other surface of the anodized substrate has the same area as that of the circuit pattern formed on one surface thereof, and is formed within an edge of the anodized substrate. The metal layer is added, making it possible to minimize a warpage problem of the substrate. In addition, a heat radiating plate is in direct contact with the anodized substrate, thereby making it possible to solve a performance deterioration problem of the heat-radiating substrate and a heat generating element and improve a heat-radiating performance. | 05-10-2012 |
20120319259 | POWER MODULE PACKAGE AND METHOD FOR FABRICATING THE SAME - Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames. | 12-20-2012 |
20120319260 | POWER MODULE PACKAGE AND SYSTEM MODULE HAVING THE SAME - Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate. | 12-20-2012 |
20130009290 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a power module package including: a first substrate; a second substrate having a pad for connection to the first substrate formed on one side or both sides of one surface thereof and having external connection terminals for connection to the outside formed on the other surface thereof; and a lead frame having one end bonded to the first substrate and the other end bonded to the pad of the second substrate to thereby vertically connect the first and second substrates to each other. | 01-10-2013 |
20130009291 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves. | 01-10-2013 |
20130010425 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer. | 01-10-2013 |
20130020111 | SUBSTRATE FOR POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a substrate for a power module package and a method for manufacturing the same, including: a base substrate made of a metal material; an anodized layer formed on the base substrate; and a circuit layer formed on the anodized layer, wherein the anodized layer is formed to correspond to circuit patterns on the circuit layer or is formed to be divided into a plurality of areas. | 01-24-2013 |
20130020687 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames. | 01-24-2013 |
20130042963 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space. | 02-21-2013 |
20130062743 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a heat dissipation plate including a first heat dissipation plate and a second heat dissipation plate disposed to be spaced apart from each other; insulating layers formed on the heat dissipation plate; metal layers formed on the insulating layers, semiconductor devices mounted on the metal layers; and lead spacers formed to connect the metal layer of the first heat dissipation plate side or the metal layer of the second heat dissipation plate side with the semiconductor layers, wherein the semiconductor devices formed on the metal layers of the first heat dissipation plate side and the semiconductor devices formed on the metal layer of the second heat dissipation plate side are disposed in a multi-layered type. | 03-14-2013 |
20130062744 | POWER MODULE PACKAGE - Disclosed herein is a power module package, including: a first substrate having one surface and the other surface; first vias formed to penetrate from one surface of the first substrate to the other surface thereof; a metal layer formed on one surface of the first substrate; semiconductor devices formed on the metal layer; and a metal plate formed on the other surface of the first substrate. | 03-14-2013 |
20130069108 | POWER SEMICONDUCTOR MODULE - Disclosed herein is a power semiconductor module including: a circuit board having gate, emitter, and collector patterns formed thereon; a first semiconductor chip mounted on the circuit board, having gate and emitter terminals each formed on one surface thereof, and having a collector terminal formed on the other surface thereof; a second semiconductor chip mounted on the first semiconductor chip, having a cathode terminal formed on one surface thereof, and having an anode terminal formed on the other surface thereof; a first conductive connection member having one end disposed between the collector terminal of the first semiconductor chip and the cathode terminal of the second semiconductor chip and the other end contacting the collector pattern of the circuit board; and a second conductive connection member having one end contacting the anode terminal of the second semiconductor chip and the other end contacting the emitter pattern of the circuit board. | 03-21-2013 |
20130069210 | POWER MODULE PACKAGE - Disclosed herein is a power module package including: a first substrate having one surface and the other surface; a second substrate contacting one side of one surface of the first substrate; and a first lead frame contacting the other side of one surface of the first substrate. The power module package further includes: a first metal layer formed on one side of one surface of the first substrate; a first bonding layer formed on the first metal layer and contacting a lower surface of the second substrate; a second metal layer formed on the other side of one surface of the first substrate; and a second bonding layer formed on the second metal layer and contacting a lower surface of the first lead frame. | 03-21-2013 |
20130105953 | POWER MODULE PACKAGE | 05-02-2013 |
20130105956 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 05-02-2013 |
20130134571 | POWER MODULE PACKAGE - Disclosed herein is a power module package including: a first heat dissipation plate including a first flow path, a second flow path, and a third flow path which are sequentially formed, the first flow path and the third flow path being formed to have a step therebetween; and a second heat dissipation plate formed under the first heat dissipation plate, having one face and the other face, having a semiconductor device mounting groove formed in the one face thereof, and including a fourth flow path having one end connected to the second flow path and the other end connected to the third flow path, wherein a cooling material introduced through the first flow path is distributed to the third flow path and the fourth flow path based on the second flow path. | 05-30-2013 |
20130154083 | SEMICONDUCTOR PACKAGE - Disclosed herein is a semiconductor package. The semiconductor package includes a semiconductor module, a first heat dissipation unit, a second heat dissipation unit and a housing. The semiconductor module contains a semiconductor device. The first heat dissipation unit is provided under the semiconductor module. The first heat dissipation unit includes at least one first pipe through which first cooling water passes. A first rotator is rotatably disposed in the first pipe. The second heat dissipation unit is provided on the semiconductor module. The second heat dissipation unit includes at least one second pipe through which second cooling water passes. A second rotator is rotatably to disposed in the second pipe. The housing is provided on opposite sides of the semiconductor module, the first heat dissipation unit and the second heat dissipation unit and supports the semiconductor module, the first heat dissipation unit and the second heat dissipation unit. | 06-20-2013 |
20130233599 | SUBSTRATE FOR POWER MODULE - Disclosed herein is a substrate for a power module. The substrate may include a metal base substrate, an insulating layer formed on the metal base substrate and including a plurality of insulating adhesion layers and a ceramic filler layer formed on a joining interface between the plurality of insulating adhesion layers, and a circuit layer formed on the insulating layer. | 09-12-2013 |
20130270687 | DOUBLE SIDE COOLING POWER SEMICONDUCTOR MODULE AND MULTI-STACKED POWER SEMICONDUCTOR MODULE PACKAGE USING THE SAME - Disclosed herein is a double side cooling power semiconductor module including: a first cooler having a concave part formed in one surface thereof in a thickness direction; a first semiconductor chip mounted on the concave part of the first cooler; a second cooler having one surface and the other surface and formed on one surface of the first cooler so that one surface thereof contacts the first semiconductor chip; a circuit board formed on the other surface of the second cooler; a second semiconductor chip mounted on the circuit board; and a flexible substrate having a circuit layer electrically connecting the first and second semiconductor chips to each other. | 10-17-2013 |
20130337613 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames. | 12-19-2013 |
20130343002 | HEAT DISSIPATION SYSTEM FOR POWER MODULE - Disclosed herein is a heat dissipation system for a power module, including: first cooling medium flow parts and second cooling medium flow parts allowing cooling media to flow in first and second directions, respectively. | 12-26-2013 |
20140096380 | HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same. | 04-10-2014 |
20140160817 | POWER FACTOR CORRECTION CIRCUIT AND POWER SUPPLY INCLUDING THE SAME - There are provided a power factor correction circuit, and a power supply including the same, the power factor correction circuit including a main switch adjusting a phase difference between a current and a voltage of input power, a main inductor storing or discharging the power according to switching of the main switch, a snubber circuit unit including a snubber switch forming a transfer path for surplus power present before the main switch is turned on and a snubber inductor adjusting an amount of a current applied to the snubber switch, and a reduction circuit unit including an auxiliary inductor inductively coupled to the snubber inductor and an auxiliary resistor consuming power induced from the snubber inductor through the auxiliary inductor. | 06-12-2014 |
Patent application number | Description | Published |
20120103955 | Laser Optical System, Repair Apparatus And Method Using The Same - According to example embodiments, a laser optical system includes a laser generator, at least one scan module, an objective lens, a relay lens, a review optical system, and a control device. The laser generator is configured to generate a laser beam. The at least one scan module is configured to reflect the laser beam generated by the laser generator and to direct the laser beam in different directions. The objective lens is configured to focus the laser beam on a substrate. The relay lens is configured to guide the laser beam scanned by the at least one scan module to within an incident range of the objective lens. The review optical system is configured to monitor, in real time, repair of the substrate using the laser beam. The control device is configured to control the at least one scan module. | 05-03-2012 |
20120105859 | Optical Measuring Apparatuses - An optical measuring apparatus may include a light source, linear polarizer, polarized beam splitter, quarter wave plate, objective lens, and/or light receiver. The polarized beam splitter may be configured to transmit linearly polarized light from the linear polarizer to any one of a first and second optical path. The quarter wave plate may be configured to circularly polarize light transmitted through the first optical path from the polarized beam splitter and transmit the circularly polarized light to an object to be measured, and the quarter wave plate may be configured to linearly polarize the circularly polarized light reflected from the object to be measured and transmit the linearly polarized reflected light to the second optical path of the polarized beam splitter. The objective lens may be configured to generate light having different wavelengths by generating chromatic aberration in the circularly polarized light from the quarter wave plate. | 05-03-2012 |
20130070334 | AUTO FOCUSING DEVICES FOR OPTICAL MICROSCOPES - A focusing device for an optical microscope may include a light emitting unit configured to emit laser light having a specific wavelength, a wedge mirror configured to enable the emitted laser light to be incident on a plurality of locations of a surface of a specimen, first and second light receiving units configured to detect an amount of laser light reflected from the surface of the specimen, a spatial filter configured to eliminate out-of-focus light from light beams reflected from the surface of the specimen and to detect an amount of in-focus light, and a control unit configured to generate a control signal used to carry out focus adjustment of the optical microscope using a plurality of light-amount information detected by the first and second light receiving units and the spatial filter. | 03-21-2013 |
20130214121 | POSITION DETECTOR AND AUTOFOCUS CONTROL APPARATUS - An autofocus control apparatus includes a beam splitter, a condenser lens and a detector. The beam splitter directs light beams from a light source toward a sample and passes light beams reflected from the sample to the condenser lens. The condenser lens condenses the light beams, and the detector detects a focal point deviation of the sample relative to a focal point of the condenser lens. The focal point deviation is detected based on an intersection of a focal line passing through different focal points of the condenser lens and a light receiving plane configured to receive the light beams passing through the condenser lens. | 08-22-2013 |
20140198322 | Surface Profile Measurement System - A profile measurement system includes a light source configured to generate light. A beam shaper configured to shape the light generated from the light source. A beam splitter configured to partially transmit and reflect the light shaped by the beam shaper. An object lens configured to receive the light from the beam splitter and irradiate the light to a stage in which a workpiece is mounted. A profile estimating part has a plurality of continuously varying focal points. The profile estimating part includes a focusing lens and a light detector configured to receive the light transmitted through the focusing lens. | 07-17-2014 |
20140220736 | POWER MODULE PACKAGE AND METHOD FOR FABRICATING THE SAME - Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames. | 08-07-2014 |
20150214126 | POWER SEMICONDUCTOR MODULE - Disclosed herein is a power semiconductor module. The power semiconductor module includes: a printed circuit board (PCB); first and second heat spreaders mounted on the PCB and having one surface arranged with terminal slots; power devices mounted on the first heat spreader and connected to one another in parallel and electrically connected to the second heat spreader; and first and second terminals provided with protrusion inserted into the terminal slots and provided with connection terminals for connecting external terminals. Therefore, it is possible to improve heat radiating properties of the power semiconductor module and improve a reliability problem such as solder crack or delamination in connection with terminal connection. | 07-30-2015 |
20150214140 | LEADLESS PACKAGE TYPE POWER SEMICONDUCTOR MODULE - There is provided a leadless package type power semiconductor module. According to an exemplary embodiment of the present disclosure, the leadless package type power semiconductor module includes: connection terminals of a surface mounting type (SMT) formed at edges at which respective sides of four surfaces meet each other; a first mounting area connected to the connection terminals through a bridge to be disposed at a central portion thereof and mounted with power devices or control ICs electrically connected to the power devices to control the power devices; and second mounting areas formed between the connection terminals and mounted with the power devices or the control ICs, wherein the first mounting area is disposed at a different height from the second mounting area through the bridge to generate a phase difference from the second mounting area. Therefore, it is possible to implement a high-integration, high-performance, and small power semiconductor module by applying a three-dimensional structure deviating from a one-dimensional flat structure. | 07-30-2015 |
20150214199 | POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a power module package and a method of manufacturing the same. According to a preferred embodiment of the present invention, the power module package includes: a lead frame on which a power device and a control IC electrically connected to the power device and controlling the power device are mounted; and a thermal sheet bonded to one surface of the lead frame, wherein the thermal sheet includes first and second resin layers which include a thermal conductive inorganic filler and are added with a mixture of phenyl glycidyl ether (PGE) and alkyl glycidyl ether (Alkyl (C12 to C14) glycidyl ether), and a thermal spreader of a metal material disposed at a bonded interface which is formed between the first and second resin layers. Therefore, it is possible to easily improve a thermal property of the power module package by a thermal spreading effect due to the thermal spreader. | 07-30-2015 |
Patent application number | Description | Published |
20090276525 | METHOD AND APPARATUS FOR INTEGRATING HETEROGENEOUS SENSOR DATA IN UBIQUITOUS SENSOR NETWORK - Provided is an apparatus and method for integrating heterogeneous sensor data in a ubiquitous sensor network. The method includes steps of receiving an integrated query for heterogeneous sensor networks from a sensor network management system, disintegrating the received integrated query to be suitable for each sensor network and transmitting the disintegrated queries to each corresponding sensor network. The method further includes steps of generating responses as integrated sensor data and storing the integrated sensor data into an integrated database, when receiving responses to respective queries from each of the sensor networks, and converting the integrated sensor data stored in the integrated database into a preset data format and transmitting the converted sensor data to the sensor network management system. | 11-05-2009 |
20100141406 | METHOD FOR GROUPING SENSOR NODES IN HETEROGENEOUS WIRELESS SENSOR NETWORKS - A method for grouping sensor nodes in heterogeneous wireless sensor networks has a sensor network management system. The method includes: receiving a group forming code from the sensor network management system at the respective sensor nodes, wherein the group forming code have sensor conditions and selecting group information from the group forming code in accordance with the conditions at the respective sensor nodes. The method further includes transmitting the selected group information IDs to the sink node. | 06-10-2010 |
20100245076 | SYSTEM AND METHOD FOR TRACKING POSITION OF MOVING OBJECT - The present invention relates to a system and method for tracking the position of a moving object. A system for tracking the position of a moving object includes: WSNs composed of a plurality of sensor nodes, each generating connection release information representing that the connection between the corresponding WSN and a moving object having a moving node serving as a sensor node attached thereto has released if having perceived the departure of the moving object; base stations managing the plurality of WSNs and collecting position information on the plurality of sensor nodes; a node information database storing the position information on the plurality of sensor nodes collected by the plurality of base stations; middleware checking the current position information on the moving object stored in the node information database if receiving the connection release information through any of the plurality of base stations, and deleting the current position information on the moving object stored in the node information database if the checked current position of the moving object is in a WSN having perceived the departure of the moving object; and a moving-object tracking application provided with the position information on the moving object by the middleware to track the position of the moving object. According to the present invention, it is possible to efficiently process information of a WSN managed by each base station in middleware managing a plurality of base stations, thereby improving the accuracy in tracking the position of a moving object. | 09-30-2010 |
20110130849 | SENSOR ACTUATOR NODE AND METHOD FOR HANDLING CIRCUMSTANTIAL CHANGES IN SENSOR ACTUATOR NETWORK USING SAME - A sensor actuator node includes a sensor unit for generating sensing information on circumstantial changes; a communications unit; a countermeasure information generation unit for generating countermeasure information to the circumstantial changes; and a drive unit for driving one or more actuators. When the sensor actuator node acts as a host node, the sensing information becomes main sensing information, the countermeasure information generation unit generates the countermeasure information based on the main sensing information and selectively transmits the countermeasure information to the adjacent sensor actuator nodes via the communications unit, and the drive unit drives the actuator based on the countermeasure information. When the sensor actuator node acts as a non-host node, the sensing information becomes auxiliary sensing information, and the drive unit drives the actuator based on the countermeasure information selectively transmitted thereto by the host node. | 06-02-2011 |
20110153107 | APPARATUS AND METHOD FOR SMART ENERGY MANAGEMENT BY CONTROLLING POWER CONSUMPTION - Disclosed are an apparatus and a method for smart energy management by controlling power consumption. Power consumption information is collected from one or more electrical device groups with a smart meter and electrical devices connected through gateways. When the method estimates that the power consumption will be larger than a threshold value, a control command is outputted to a load controller connected through the gateway and power consumption of electrical devices that belong to the electrical device using group is remotely controlled. According to an embodiment of the present invention, an energy company that produces and supplies energy can supply energy depending on a consumer's demand by using current facilities because the present invention can collect remotely energy consumption, analyze energy consumption patterns, and control automatically the energy consumption of electrical devices installed in a customer's area. The consumer who consumes energy can save the energy consumption and the charge of the energy consumption. | 06-23-2011 |
20110235329 | Lamp Using LED - Provided is a lamp using LED which has a heat sink and an air-flowing part formed in a body and is equipped with a heat pipe to make higher a heat-conductive efficiency and thereby to make higher a heat-generation performance considerably so that the light emitting diode can be applied to a high-output illumination device to increase a life-time. | 09-29-2011 |
20120014099 | Lamp - Provided is a lighting system having a printed circuit board on which a plurality of light emitting diodes are arranged; a base holding the printed circuit board; a heat sink provided on a lateral side of the base in a horizontal direction of the printed circuit board; a heat pipe which connects the base with the heat sink; and a rotating unit provided in at least end portion of one end portions and the other end portions of the base or the heat sink, to easily control the illuminating angle and the illuminating range and therefore to improve the energy efficiency, and to improve the heat-radiating property since the heat sink is provided in the lateral side of the substrate of heat-generating member. | 01-19-2012 |
20120134177 | LIGHT GUIDE PLATE FOR SURFACE LIGHT SOURCE DEVICE AND BACKLIGHT UNIT USING THE SAME - A light guide plate for a surface light source device is provided, which includes an incident surface configured to have light from lamps disposed along a predetermined axis, be incident thereon, an emitting surface configured to have the incident light emitted therefrom, a back surface configured to face the emitting surface, and a plurality of unit cells configured to have microprism patterns engraved thereon and distributed and arranged on the back surface. A crossing angle of a microprism arrangement axis, formed by a ridge direction of the microprism patterns, and of an arrangement axis of the lamps is disposed in an alternate angle. The light guide plate has a high front brightness and an excellent uniformity in brightness and does not have a moire phenomenon. In a backlight unit, the use of optical sheets stacked on the light guide plate can be reduced. | 05-31-2012 |
20130285835 | METHOD AND APPARATUS FOR DATA MANAGEMENT IN ADVANCED METERING INFRASTRUCTURE NETWORK - A method for transmitting, storing and managing data by compressing data packets to be transmitted and received over an advanced metering infrastructure (AMI) network with low-capacity memory and low-transfer rate. A number of transmission packets may be reduced using at least one of a bitmap interval algorithm that assigns a bitmap value to each interval, thereby reducing a number of request packets, a repeated-bitmap interval algorithm that represents sequential data values as bitmap values by toggling a bit value between 0 and 1 in each data value when a change occurs in the sequential data values, and a run-length encoding algorithm that compresses data by encoding run length of sequential identical data. | 10-31-2013 |
20130304423 | HIGH ENERGY EFFICIENCY SENSOR NODE AND OPERATING METHOD THEREOF - A high energy efficiency sensor node and an operating method thereof are provided. The high energy efficiency sensor node may include a sensing unit to generate sensed information and to store the sensed information in a database when a set period commences, and a control unit to obtain n pieces of sensed information corresponding to n periods from the database, and to transmit the n pieces of sensed information obtained to a first neighbor node when the n periods elapse. | 11-14-2013 |
20130311558 | PROFILE-BASED WIRELESS SENSOR NETWORK SYSTEM AND COMMUNICATION METHOD - In a sensor network system including at least one sensor node and at least one actuator node, a group is formed based on attribute of each node. Sensing data is shared among the nodes in the group, and each node performs autonomous processing to process an event by comparing the sensing data with a preset event threshold value. | 11-21-2013 |
20130320864 | METHOD OF CONTROLLING LIGHTS AND SYSTEM FOR MANAGING LIGHTS USING THE SAME - In a light-installed area where a plurality of lights are installed, a light managing system senses a moving object that enters the light-installed area and predicts an predicted stop position of the moving object based on record information on a channel of movement corresponding to identification information on the moving object. The light managing system calculates a predicted channel of movement of the moving object based on the predicted stop position, and selects lights to be driven based on the calculated predicted channel of movement. The light managing system turns on the selected lights. | 12-05-2013 |
20140142173 | PHARMACEUTICAL COMPOSITION FOR THE PREVENTION OR TREATMENT OF A NEURODEGENERATIVE DISEASE, COMPRISING A DAPHNE GENKWA EXTRACT OR A COMPOUND ISOLATED THEREFROM - The present invention relates to: a pharmaceutical composition or a Nurr1 activating composition for the prevention or treatment of a neurodegenerative disease or a disease induced by impaired Nurr1 function, wherein the composition comprises an active ingredient in the form of genkwanin N or yuanhuacine, a | 05-22-2014 |
20140218942 | COOLING STRUCTURE FOR LED LIGHTING DEVICE AND LIGHT EMITTING MODULE HAVING THE SAME - Provided are a cooling structure for an LED lighting device and a light emitting module having the same. The cooling structure for an LED lighting device according to the present invention has a structure in which an LED module is disposed in a tray-shaped heat sink coupled with a lower portion of a lighting box having an LED module disposed therein to block the lower portion of the lighting box and perforated with a ventilation hole to make external air flow therein, thereby discharging heat generated from the LED module through the heat sink. Therefore, the cooling structure for an LED lighting device can have excellent cooling efficiency and can be implemented as an LED lighting device by minimizing the replacement of components of the existing metal lamp lighting device. | 08-07-2014 |
20140370132 | COMPOSITION CONTAIING JETBEAD EXTRACTS - The present invention relates to a pharmaceutical composition for preventing or treating Parkinson's disease, which comprises, as an active ingredient, a | 12-18-2014 |
Patent application number | Description | Published |
20130270689 | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR MODULE, AND MOUNTING STRUCTURE THEREOF - Provided are a semiconductor package capable of packaging and modularizing power semiconductor devices which are difficult to integrate due to heat generation, a semiconductor package module using the same, and a mounting structure thereof. The semiconductor package includes: a common connection terminal formed to have a flat plate shape; first and second electronic devices respectively bonded to both surfaces of the common connection terminals; first and second connection terminals having a flat plate shape and bonded to the first electronic device; and a third connection terminal having a flat plate shape and bonded to the second electronic device. | 10-17-2013 |
20130341782 | SEMICONDUCTOR PACKAGE MODULE - There is provided a semiconductor package module, and more particularly, a semiconductor package module constituted by modularizing power semiconductor devices incapable of being able to be easily integrated due to heat generated therefrom. To this end, the semiconductor package module includes a plurality of semiconductor packages; and a plurality of semiconductor packages; and a heat dissipation member having a pipe shape including a flow channel formed therein and including at least one or more through holes into which the semiconductor packages are inserted. | 12-26-2013 |
20140003013 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 01-02-2014 |
20140084447 | POWER MODULE PACKAGE - Disclosed herein is a power module package including: a body member having a polyhedral shape and made of a metal material; a semiconductor device mounted on the body member; and a block member formed at an edge region of the body member and made of a metal material. | 03-27-2014 |
20140110156 | HEAT RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a heat radiating substrate including: a heat radiating plate having a step formed so that one side and the other side thereof have thicknesses different from each other; a conductor pattern layer formed over the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer. | 04-24-2014 |
20140116670 | HEAT SINK AND COOLING SYSTEM INCLUDING THE SAME - Disclosed herein is a heat sink including: a heat radiation pattern member having at least one bend cross section; and a heat radiation plate having the heat radiation pattern member disposed on an upper surface thereof, wherein the heat radiation pattern member includes wire patterns having a plurality of bends or a mesh bend pattern having a form of a plurality of bent cross sections. | 05-01-2014 |
20140117373 | SEMICONDUCTOR DEVICE - Disclosed herein is a semiconductor device including: a source electrode formed on one side of an N-type AlGaN layer; N-type and P-type AlGaN layers formed on the other side of the P-type AlGaN layer and formed in a direction perpendicular to the source electrode; a gate electrode formed on one side of the N-type and P-type AlGaN layers; and a drain electrode formed on the other side of the N-type and P-type AlGaN layers. | 05-01-2014 |
20140117408 | UNIT POWER MODULE AND POWER MODULE PACKAGE COMPRISING THE SAME - Disclosed herein is a unit power module including: a first semiconductor chip having one surface on which a 1-1-th electrode and a 1-2-th electrode spaced apart from the 1-1-th electrode are formed and the other surface on which a 1-3-th electrode is formed, a second semiconductor chip having one surface on which a 2-1-th electrode is formed and the other surface on which a 2-2-th electrode is formed, a first metal plate contacting the 1-1-th electrode of the first semiconductor chip and the 2-1-th electrode of the second semiconductor chip, a second metal plate contacting the 1-2-th electrode of the first semiconductor chip and spaced apart from the first metal plate, a third metal plate contacting the 1-3-th electrode of the first semiconductor chip and the 2-2-th electrode of the second semiconductor chip, and a sealing member formed to surround the first metal plate, the second metal plate, and the third metal plate. | 05-01-2014 |
20140117524 | POWER SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF - There are provided a power semiconductor module and a manufacturing method thereof, the power semiconductor module including: a lead frame; a base substrate including a circuit wiring formed on an insulating layer thereof; a plurality of power semiconductor devices disposed to contact the circuit wiring; and a multilayer substrate formed by stacking a plurality of substrates and electrically connecting the power semiconductor devices and the lead frame to one another using a connection line formed therein and having conductivity. | 05-01-2014 |
20140117525 | POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a power module package including: a base substrate; a metal layer including a circuit pattern and a connection pad formed on the base substrate; a semiconductor device including a plurality of electrodes mounted on the circuit pattern of the metal layer; and a plurality of lead frames formed on the connection pad of the metal layer and respectively connected to the plurality of electrodes of the semiconductor device. | 05-01-2014 |
20140118956 | ALL-IN-ONE POWER SEMICONDUCTOR MODULE - Disclosed herein is an all-in-one power semiconductor module including a plurality of first semiconductor devices formed on a substrate; a housing molded and formed to include bridges formed across upper portions of the plurality of first semiconductor devices; and a plurality of lead members integrally formed with the housing and electrically connecting the plurality of first semiconductor devices and the substrate. | 05-01-2014 |
20140118961 | POWER MODULE PACKAGE - Disclosed herein is a power module package including: a base substrate; a post having one end and the other end, the one end being formed on the base substrate; and a case formed on the base substrate such that it covers a lateral surface and an upper surface of the base substrate, and spaced apart from the upper surface of the base substrate. | 05-01-2014 |
20140119070 | POWER FACTOR CORRECTION CIRCUIT AND METHOD FOR CONTROLLING POWER FACTOR CORRECTION - Disclosed herein is a power factor correction circuit, including: a boost converter circuit in which a plurality of boost circuits including a boost inductor, a rectifying diode, and a boost switch are connected with each other; and a snubber circuit including a snubber inductor and a snubber switch so as to snubber the boost converter circuit. The snubber inductor is controlled so as to be turned on before the boost inductor is turned on to apply zero voltage to the boost inductor. It is possible to reduce switching loss occurring when the boost switch is turned on and increase efficiency of an AC-DC power supply apparatus. | 05-01-2014 |
20140119079 | POWER FACTOR CORRECTION CIRCUIT AND POWER SUPPLY DEVICE INCLUDING THE SAME - There are provided an interleaved power factor correction circuit and a power supply device including the same, the power factor correction circuit including: a main switching unit including a first main switch and a second main switch; an auxiliary switching unit including a first auxiliary switch and a second auxiliary switch; an inductor unit positioned between an input power terminal to which the input power is applied and the main switching unit and storing or discharging power according to the switching operations of the main switching unit; and an auxiliary inductor adjusting an amount of current flowing in the auxiliary switching unit when the auxiliary switching unit performs switching operations. | 05-01-2014 |
20140152271 | POWER FACTOR CORRECTION APPARATUS AND METHOD FOR CORRECTING POWER FACTOR USING THE SAME - There are provided a power factor correction device and a method for controlling power factor correction using the same. The power factor correction device includes a power factor correction circuit and a control circuit. The power factor correction circuit includes first and second inductors connected to an input power source stage and first and second main switches performing a switching operation on the first and second inductors, respectively. The control circuit may provide control signals to the first and second main switches, respectively, and when phase currents flowing in the respective first and second inductors are unbalanced, the control circuit may change a phase of at least one of the first and second main switches to correct an imbalance of the phases. | 06-05-2014 |
20140167123 | POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - There is provided a power semiconductor device including: a body region having a first conductivity; a well formed in an upper portion of the body region and having a second conductivity; and a conductive via formed in the body region while traversing the well. | 06-19-2014 |
20140167237 | POWER MODULE PACKAGE - Disclosed herein is a power module package, including: a substrate; semiconductor chips mounted on one surface of the substrate; external connection terminals connected to one surface of the substrate; and a connecting member having one end contacting the semiconductor chips and the other end contacting the external connection terminals and electrically and mechanically connecting between the semiconductor chips and the external connection terminals. | 06-19-2014 |
20140167242 | POWER MODULE PACKAGE - Disclosed herein is a power module package including: a first module configured of a first substrate having one surface and the other surface, a first semiconductor chip mounted on one surface of the first substrate, and a first sealing member formed to cover the first semiconductor chip mounted on one surface of the first substrate from both sides in a thickness direction of the first substrate and expose the other surface of the first substrate; and a case enclosing the first module. | 06-19-2014 |
20140175631 | SEMICONDUCTOR MODULE HAVING SLIDING CASE AND MANUFACTURING METHOD THEREOF - There is provided a semiconductor module capable of being easily manufactured and a manufacturing method thereof, the semiconductor module including a module substrate on which at least one electronic element is mounted, at least one external connection terminal fastened to the module substrate, and a case formed by coupling a first case and a second case, wherein the first case and the second case accommodate the module substrate at both ends of the module substrate and are coupled to each other. | 06-26-2014 |
20140177288 | FLYBACK CONVERTER - There is provided a flyback converter, including: a power supply unit supplying input power; a transformer unit including first and second transformers converting first and second primary current from the power supply unit into first and second secondary current, respectively; a main switch unit including first and second main switches respectively intermitting the first and second primary current flowing in respective primary windings of the first and second transformers; an auxiliary switch unit including first and second auxiliary switches forming respective transfer paths for dump power present before the first and second main switches are switched on; and an auxiliary inductor unit including first and second auxiliary inductors respectively adjusting the amount of current flowing in the first and second auxiliary switches during the switching operation thereof, wherein the first and second main switches perform a switching operation while having a predetermined phase difference therebetween. | 06-26-2014 |
20140185242 | POWER SEMICONDUCTOR MODULE - There is provided a power semiconductor module in which power semiconductor elements, integration of which may be difficult due to heating, are modularized. The power semiconductor module includes: a heat dissipation substrate electrically connected to a common connection terminal; and a plurality of electronic elements disposed on the heat dissipation substrate, wherein the electronic elements have varying spaces therebetween. | 07-03-2014 |
20140239344 | POWER SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - There is provided a power semiconductor device, including a first conductive type drift layer; a second conductive type body layer formed on the drift layer, a second conductive type collector layer formed below the drift layer; a first gate formed by penetrating through the body layer and a portion of the drift layer, a first conductive type emitter layer formed in the body layer and formed to be spaced apart from the first gate, a second gate covering upper portions of the body layer and the emitter layer and formed as a flat type gate on the first gate, and a segregation stop layer formed between contact surfaces of the first and second gates with the body layer, the emitter layer, and the drift layer. | 08-28-2014 |
20140285972 | HOUSING AND POWER MODULE HAVING THE SAME - There are provided a housing capable of evenly distributing stress generated at the time of assembly thereof and a power module having the same. The housing for a power module according to an embodiment of the invention includes: a body part having a space formed therein, the space receiving a module substrate having electronic devices mounted thereon; a plurality of fastening parts protruded from sides of the body part; and a fastening member having a leaf spring form and having both ends coupled to two of the fastening parts, respectively, wherein the fastening member includes: a coupling portion coupled to a fixing member; and elastic portions extending from both edges of the coupling portion to be coupled to the fastening parts and elastically deformed when the coupling portion is fastened to a heat radiating substrate to provide elastic force to the fastening parts. | 09-25-2014 |
20140285973 | HOUSING AND POWER MODULE HAVING THE SAME - There are provided housing, capable of preventing a fastening part from being damaged by stress generated at the time of assembly thereof, and a power module having the same. The housing for the power module includes a body part having a space formed therein, the space accommodating a module substrate on which electronic elements are mounted, a plurality fastening parts formed to be protruded from side surfaces of the body part, and an elastic member coupled to the fastening parts in a plate spring manner and elastically supporting lower portions of the fastening parts. | 09-25-2014 |
Patent application number | Description | Published |
20080221790 | METHOD AND TERMINAL FOR PROVIDING A ROUTE IN A NAVIGATION SYSTEM USING SATELLITE IMAGE - A method and a terminal for providing a route in a navigation system using a satellite image are provided. The terminal includes a route calculation unit for calculating a route from a current location to a destination when a user inputs the destination, a satellite image requesting unit for requesting a satellite image server for satellite images corresponding to locations on the route and for downloading the requested satellite images, a satellite image storage unit for storing the downloaded satellite images, and a controller for retrieving a satellite image corresponding to the current location from the satellite image storage unit and for displaying the retrieved satellite image simultaneously while downloading the satellite images corresponding to the locations on the route. | 09-11-2008 |
20110043132 | Lighting device - A lighting device including a housing, a coupling member being coupled to an inner upper surface of the housing, having an insertion groove formed in the middle part thereof in a direction of the inner upper surface of the housing, and having a first connection terminal provided in the middle of the insertion groove, at least one reflector coupled between an inner wall surface of the housing and an outer wall surface of the coupling member; and a light source unit having an upper part thereof attachable to and removable from the coupling member by using the insertion groove, having a second connection terminal provided in the upper part thereof, the second connection terminal being electrically connected to the first connection terminal when connected to the coupling member, and having a lower part thereof emitting light toward the reflector. | 02-24-2011 |
20110044023 | Lighting device - A lighting device includes a housing, at least one reflector disposed inside the housing; and a light source unit being disposed inside the housing and emitting light toward the reflector, wherein the light source unit includes a light emitting groove formed therein, the light emitting groove including a basal surface sloped toward the reflector, and wherein a plurality of light emitting devices are disposed sloping along the basal surface in the light emitting groove, and wherein the light emitting groove includes a projection part formed from the basal surface, the projection part blocking the light emitted directly from a plurality of the light emitting devices to the outside of the housing. | 02-24-2011 |
20110044024 | Lighting device - A lighting device includes: a housing, a coupling member, at least one reflector, and a light source unit, wherein the light source unit includes: a first body having a first coupling unit, a first sloping surface, and a first hinge protruding, a second body having a second coupling unit, a second sloping surface, and a second hinge protruding, a middle body having a second insertion groove and having a second connection terminal, the second connection terminal electrically connected to the first connection terminal, when the light source unit is coupled to the coupling member, and a main light emitting diode module disposed on the first sloping surface and the second sloping surface respectively. | 02-24-2011 |
20110157890 | Lighting Device - Disclosed is a lighting device. The lighting device includes a housing, a coupling member being disposed on a bottom surface of the housing and including an insertion groove having an opening in direction to an inner portion of the housing, at least one reflector attachable and removable between the housing and the coupling member, and a light source unit which is attachable to and removable from the insertion groove of the coupling member. | 06-30-2011 |
20110176306 | Lighting Device - Disclosed is a lighting device. The lighting device includes: a housing; a coupling member; at least one reflector; and a light source unit, including a second connection terminal being electrically connected to a first connection terminal, wherein the first connection terminal includes at least one pair of female blocks, wherein at least one pair of terminals are formed within each female block, wherein the pair of terminals in one female block is symmetric to the pair of terminals in the other female block, wherein the second connection terminal includes at least one pair of male blocks, and wherein at least one pair of sockets are formed respectively on the pair of the male blocks. | 07-21-2011 |
20110188246 | LIGHTING DEVICE - Disclosed is a lighting device. The lighting device includes: a housing; a coupling member being coupled to the housing and having an insertion groove; at least one reflector disposed within the housing and having a parabolic surface; and a power supply unit being disposed in a space formed between the reflector and the corner of the housing, and providing at least one of electric power and a driving signal to a light source unit coupled to the insertion groove, wherein at least one first groove is formed on the wall surface of the coupling member, wherein at least one second groove is formed on the wall surface of the housing, wherein a first side of the reflector is inserted and coupled to the second groove, and wherein a second side of the reflector is inserted and coupled to the first groove. | 08-04-2011 |
20110222279 | Lighting Device - Disclosed is a lighting device. The lighting device includes: a first body including a first surface; a second body including a second surface; a plurality of light emitting devices disposed on the first surface and the second surface; a coupler that is disposed at at least one of the ends of the first and the second bodies; and a limit switch connecting and is connecting electric power supplied to the plurality of the light emitting diodes in accordance with change of a distance between the first body and the second body. | 09-15-2011 |
20110222284 | STREET LAMP - Disclosed is a street lamp. The street lamp includes:
| 09-15-2011 |
20120039067 | LIGHTING DEVICE - Disclosed is a lighting device that comprises a first body having a first sloping surface toward a reflector; a second body having a second sloping surface toward the reflector; a middle body having an insertion groove formed respectively on both sides of the lower part of the middle body, and allowing the first body and the second body to be coupled to both sides of the middle body by inserting a first hinge and a second hinge into the insertion groove, respectively; and a main light emitting device module disposed on a first sloping surface and a second sloping surface respectively, wherein the first sloping surface and the second sloping surface face outward with respect to the middle body. | 02-16-2012 |
20120057032 | APPARATUS AND METHOD FOR PROVIDING AUGMENTED REALITY USING OBJECT LIST - An apparatus to provide augmented reality includes an image acquisition unit to acquire an image including a target object, a supplementary information acquisition unit to acquire supplementary information, an object recognition unit to recognize the target object from the acquired image, and a candidate nomination unit to generate candidate objects based on the supplementary information. A method for providing augmented reality includes transmitting, at a terminal, an image including a target object or supplementary information of the target object, and location information of the terminal to a server; and determining, at the server, whether the target object is recognized, and generating a list of candidate objects based on the supplementary information, if the target object is not recognized. | 03-08-2012 |
20120057357 | LIGHTING MODULE AND LIGHTING APPARATUS COMPRISING THE SAME - A lighting module may be provided that includes a light emitting device module including at least one light emitting diode; and a heat sink radiating heat generated from the light emitting device module and including at least one partition wall formed on a base. | 03-08-2012 |
20120140437 | LIGHTING MODULE AND LIGHTING DEVICE - A lighting module may be provided that includes: a light emitter; a clad metal substrate which is disposed under the light emitter; an insulating structure which insulates the light emitter from the clad metal substrate; an optical structure which is disposed on the light emitter; and a case which is disposed on the optical structure and is coupled to the clad metal substrate, wherein the light emitter includes a semiconductor based light emitting device. | 06-07-2012 |
20120206901 | LED LIGHTING DEVICE INCLUDING MODULE WHICH IS CHANGEABLE ACCORDING TO POWER CONSUMPTION AND HAVING IMPROVED HEAT RADIATION AND WATERPROOF - A LED lighting device includes a light source module including a plurality of light emitting device, at least one heat radiating member including the at least one light source module disposed therein, a side frame which is coupled to both sides of the heat radiating member respectively, and a support frame which is coupled to one side of the side frame and supports the side frame. | 08-16-2012 |
20120212930 | LIGHTING DEVICE - A lighting device may be provided that includes a light emitting module including a substrate and a light emitting device disposed on the substrate; and a case receiving the light emitting module therewithin and including an upper case disposed on the substrate and a lower case in which the substrate is disposed. The lower case includes a seating portion which is coupled to a heat sink. The seating portion is either a projection projecting outward from the outer surface of the lower case or a recess which is formed by digging inward the outer surface of the lower case. | 08-23-2012 |
20120275155 | STREET LAMP - The street lamp comprises: a heat radiating body comprising top surface, a bottom surface and a plurality of heat radiating fins being formed on the top surface; an LED module comprising a substrate disposed on the bottom surface of the heat radiating body and a plurality of LEDs disposed on one side of the substrate; and a heat radiating body cover disposed on the top surface of the heat radiating body, wherein the heat radiating body cover comprises a plurality of heat radiating openings corresponding to the plurality of the heat radiating fins, and wherein the heat radiating body cover is disposed at positions higher or lower than positions of peaks of the plurality of the heat radiating fins. | 11-01-2012 |
20130057660 | USER HEALTH MONITORING SYSTEM COMPRISING 3D GLASSES AND DISPLAY APPARATUS, AND DISPLAY APPARATUS AND CONTROL METHOD THEREOF - A user health monitoring system having 3D glasses and a display apparatus and a display apparatus and a control method thereof, the user health monitoring system including: 3D glasses which obtain biosignal information of a user and transmit; and a display apparatus which receives the biosignal information transmitted by the 3D glasses, obtains a health index of the user by using the biosignal information and controls a display state according to the health index. With this configuration, a user's health condition may be monitored in real-time with a biosignal of the user viewing a 3D image and a 3D display state may be controlled according to the user's health condition to thereby protect a user's health. | 03-07-2013 |
20130194804 | LIGHTING MODULE AND LIGHTING APPARATUS COMPRISING THE SAME - A lighting module may be provided that includes a light emitting device module including at least one light emitting diode; a heat sink radiating heat generated from the light emitting device module and including at least one partition wall formed on a base; and a cover accommodating the light emitting device module disposed therein and including a connector which is formed in one side of the cover and is connected to a power supplier for driving the light emitting device module, wherein the connector comprises a depression allowing the terminal of the power supplier to be directly inserted into the connector. | 08-01-2013 |
20130297209 | METHOD AND TERMINAL FOR PROVIDING A ROUTE IN A NAVIGATION SYSTEM USING SATELLITE IMAGE - A method and a terminal for providing a route in a navigation system using a satellite image are provided. The terminal includes a route calculation unit for calculating a route from a current location to a destination when a user inputs the destination, a satellite image requesting unit for requesting a satellite image server for satellite images corresponding to locations on the route and for downloading the requested satellite images, a satellite image storage unit for storing the downloaded satellite images, and a controller for retrieving a satellite image corresponding to the current location from the satellite image storage unit and for displaying the retrieved satellite image simultaneously while downloading the satellite images corresponding to the locations on the route. | 11-07-2013 |
20140003028 | LIGHTING DEVICE | 01-02-2014 |
20140188150 | HAIR TRANSPLANTER - Disclosed is a hair transplanter which may finely adjust and set the length of a hair transplantation tool, into which a hair root is inserted, according to thicknesses of skin tissue layers within the scalps of individuals during hair transplantation and thus be conveniently used. | 07-03-2014 |
20140207811 | ELECTRONIC DEVICE FOR DETERMINING EMOTION OF USER AND METHOD FOR DETERMINING EMOTION OF USER - A system and method for determining an emotional state of a user of an electronic device. The system is configured to execute a method of receiving, using the electronic device, input emotional data, comparing the input emotional data with reference emotional data and determining an emotional state of a user of the electronic device, and transmitting the determined emotional state of the user to an external device to share the emotional state with the external device. | 07-24-2014 |
20140233755 | WIRELESS NETWORK AUDIO SYSTEM HAVING AUTO-PAIRING FUNCTION AND AUTO-PAIRING METHOD USING THE SAME - A system and method of auto-pairing in a wireless network audio system is provided. The auto-pairing method including: entering, by an audio source device, an auto-pairing mode in response to power being supplied; retrieving, by the audio source device, a peripheral wireless speaker; and providing, by the audio source device, a home identifier (ID) for pairing with the wireless speaker in response to the audio source device retrieving the wireless speaker. | 08-21-2014 |
20140321100 | LED LIGHTING DEVICE INCLUDING MODULE WHICH IS CHANGEABLE ACCORDING TO POWER CONSUMPTION AND HAVING IMPROVED HEAT RADIATION AND WATERPROOF - Disclosed is an LED lighting device of which the number of LED modules thereof is changeable according to power consumption. Through a structural change of the module, heat radiation and waterproof can be greatly improved and the size, weight and manufacturing cost can be reduced. Also, a fastening bolt allows the module to be simply attached and separated and maintenance, repair and stability can be improved by providing a wiring space inside the device. Further, there is an advantage of additionally adding a light detection sensor through a cover. The LED lighting device according to the embodiment includes a plurality of heat radiating plates; at least one light source module disposed on one surface of the heat radiating plate. | 10-30-2014 |
20140359969 | MOTOR APPARATUS AND CLEANER HAVING THE SAME - A motor apparatus having a high efficiency and reducing manufacturing cost by using a cost effective ferrite permanent magnet includes a rotatable shaft, a fan connected to one side of the shaft to generate a flow of air, a stator including stator cores arranged in a circumferential direction, and a coil wound around the stator core, and a rotor disposed at an inside of the stator and provided in a form of a cylinder having a passage allowing the shaft to pass through the rotor includes a rotor core provided with a protrusion structure and one or more ferrite magnets coupled to the rotor core to provide a magnetic force. By using a ferrite magnet, when compared to a conventional universal motor, a superior efficiency is obtained, and when compared to a BLDC motor using a Nd magnet, a low cost BLDC motor is implemented. | 12-11-2014 |
20150077992 | LIGHTING DEVICE - A lighting device comprises a housing including an upper surface and an inner wall surface; a coupling member coupled to the upper surface of the housing; a reflector disposed between the coupling member and the inner wall surface of the housing; a light source unit coupled to the coupling member and having a light emitting groove in which a light emitting device is disposed, wherein the reflector is disposed over the light emitting groove, wherein the light source unit comprises a projection part disposed around the light emitting groove, and wherein the projection part is provided a prescribed distance from the upper surface, the prescribed distance being greater than or equal to a distance of an end of the housing from the upper surface. | 03-19-2015 |
20150214802 | BRUSHLESS DIRECT CURRENT MOTOR AND CLEANER USING THE SAME - A cleaner includes a BLDC motor and a power unit. The BLDC motor includes a rotor and a stator provided with a DC coil and an AC coil in a separate manner. The power unit is configured to supply DC power and AC power to the DC coil and the AC coil, respectively. | 07-30-2015 |
20150241072 | ENERGY-SAVED SMART SAFETY COOLING/WARMING WIND APPARATUS FOR THE FOUR SEASONS - An energy-saving, four-season, smart, and safe cold/hot air blower of the present invention relates to a technique, which enables cold-air humidification by removing moisture when being used in the summer, can supply instantaneous hot air when the room temperature temporarily goes down, enables hot-air humidification by supplying moisture when being used in the winter, and further enables a four-season use by using an additional humidification function in the spring and fall seasons and enables the control of room temperature and room humidity by providing an indoor temperature/humidity sensor and a water temperature sensor, saves energy by intelligently operating and stopping all the functions thereof and operating a function for continuously connecting the operations, can improve the convenience of use by providing warning signs through lamps for indicating supply or discharge or lack of water according to the attachment of a high/low water level gauge of a water tank and a high water level gauge of a water tank for dehumidification, prevents safety accidents such as damage or conflagration and the like of components related to a fan driving motor by providing a fan driving motor overheating prevention sensor as a thermostat sensor at one side of the inner surface of the fan driving motor, and particularly, fundamentally prevents the leakage of water to the outside when a main body is falls down due to the negligence of a user. | 08-27-2015 |
Patent application number | Description | Published |
20090253617 | DIAGNOSIS AND TREATMENT OF ATTENTIONAL DISORDERS - This invention features methods and compositions useful for the treatment and diagnosis of attentional disorders including attention deficit hyperactivity disorder (ADHD). Also disclosed are methods for identifying compounds useful for such therapy. | 10-08-2009 |
20120128655 | INDUCED PLURIPOTENT STEM CELLS - The present invention concerns the delivery of certain reprogramming factor proteins into cells, such as differenti-atedsomatic cells, in order to induce the epi-genetic reprogramming of the cell so it becomes a pluripotent stem cell. The reprogramming factor protein(s) may be Sox2, Klf4, Oct3/4, c-Myc, Lin28, Nanog, or any protein with reprogramming (-enhancing) activity. These proteins may be linked recombinantly or chemically to a cell penetrating peptide that helps facilitate the introduction of these proteins into the target cell and may be preferably expressed in mammalian cells to maintain them in active forms. Accordingly, the present method of inducing pluripotent stem cell (iPS) formation avoids the use of viral or DNA-based expression vectors or the expression of reprogramming factor genes within target cells, which are known to be harmful to the host target cell and cause cancer. | 05-24-2012 |
20130052268 | COMPOSITIONS AND METHODS FOR TREATMENT OF PARKINSON'S DISEASE - The present invention relates to methods for producing neural cells from progenitor or stem cells by activating both the Wnt1-Lmx1a/Lmx1b and the SHH-FoxA2 signaling pathways by, for example, increasing the biological activity of one or more of Wnt1, Lmx1a, Lmx1b, Otx2 and Pitx3 and one or more of SHH, FoxA2 and Nurr1 in the progenitor or stem cells including embryonic stem cells and iPS cells. Such cells may be used for the treatment of Parkinson's disease. The invention further relates to methods for treating Parkinson's disease by increasing the biological activity of one or more of Wnt1, Lmx1b, Lmx1b, Otx2 and Pitx3 and one or more of SHH, FoxA2 and Nurr1 in the midbrain of a patient. In particular, the biological activity of the proteins can be increased by virtue of a cell penetrating peptide fused to the proteins or by transfecting RNAs encoding the proteins such that the host chromosomal DNAs remain intact. | 02-28-2013 |
20140199274 | NEURONAL PROGENITOR CELLS AND USES - Provided are methods of isolating a novel cell population of midbrain dopaminergic neuronal progenitor cells derived from stem cells using a novel combination markers. The cell population may be used for cell therapies for the treatment of Parkinson's disease and as substrates in pharmacological assays. | 07-17-2014 |
20150023930 | AMINOQUINOLINE DERIVATIVES AND USES THEREOF - Described herein are aminoquinoline and aminoacridine based hybrids, pharmaceutical compositions and medicaments that include such aminoquinoline and aminoacridine based hybrids, and methods of using such compounds for diagnosing and/or treating infections, neurodegerative diseases or disorders, inflammation, inflammation associated diseases and disorders, and/or diseases or disorders that are treatable with dopamine agonists such as the restless leg syndrome. | 01-22-2015 |