Kurt E.
Kurt E. Geckeler, Gwangju KR
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20090092836 | GOLD NANOPARTICLE-HALLOYSITE NANOTUBE AND METHOD OF FORMING THE SAME - A gold nanoparticle-halloysite nanotube, on a surface of which a gold nanoparticle is formed, and a method for forming the same are disclosed. In order to form the gold nanoparticle on a surface of the halloysite nanotube, a gold salt is added to an agitated suspension solution. By the gold salt, a gold ion is formed on the surface of the halloysite nanotube. If the reducing agent is added to the halloysite nanotube on which the gold ion is formed, the gold ion is reduced into the gold nanoparticles. The formed gold nanoparticle has the very small size, and distributed on the surface of the halloysite nanotube. Accordingly, without the separate protective agent or the surface reformation, the gold nanoparticle may be easily formed. | 04-09-2009 |
20140034881 | CARBON NANOTUBE-RADICAL POLYMER COMPOSITE AND PRODUCTION METHOD THEREFOR - The present invention relates to a carbon nanotube-radical polymer composite and to a production method therefor, and relates to a polymer composite comprising carbon nanotubes and a radical polymer; being a carbon nanotube-radical polymer composite that has outstanding electrical conductivity and transparency and can be used in permeable batteries or flexible batteries, and also relates to a production method therefor. | 02-06-2014 |
20140378563 | SOLID STATE VAPOR PHASE POLYMERIZATION METHOD FOR NANOPOROUS POLYPYRROLE AND NANOPOROUS POLYPYRROLE PREPARED THEREFROM - Disclosed herein is a method for preparing a nanoporous polypyrrole for storing gas such as hydrogen, carbon dioxide, or the like, and a nanoporous polypyrrole prepared therefrom. More particularly, disclosed herein are a solid state vapor phase polymerization method for nanoporous polypyrrole, the method comprising dispersing a solid state oxidant on a substrate; exposing the substrate and the oxidant to vapor phase pyrrole monomers to perform a polymerization reaction of the pyrrole monomers to thereby prepare a solid state polypyrrole; and cleaning and drying the solid state polypyrrole; and a nanoporous polypyrrole prepared therefrom. | 12-25-2014 |
20150017414 | CONDUCTING NETWORK COMPOSITE COMPRISING POLYANILINE AND POLYPYRROLE, AND METHOD FOR PREPARING THE SAME - Disclosed herein are a conducting network for storing gas such as hydrogen, carbon dioxide, or the like, and a method for preparing the same, and particularly, a conducting network composite including: dopant-doped polyaniline nanofiber supporter; and a polypyrrole layer laminated on the supporter, and a method for preparing the same. | 01-15-2015 |
Kurt E. Geckeler, Buk-Gu KR
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20120225126 | SOLID STATE SYNTHESIS METHOD OF SILVER NANOPARTICLES, AND SILVER NANOPARTICLES SYNTHESIZED THEREBY - Disclosed are a solid state synthesis method of silver nanoparticles, and silver nanoparticles synthesized thereby. The method includes mixing a silver salt and a water soluble polymer acting as both a reducing agent and a protecting agent to produce a solid mixture, and milling the solid mixture by a high-speed vibration milling process to form silver nanoparticles within the water soluble polymer. According to the present invention, silver nanoparticles can be easily and simply produced in a solid state through high speed vibration milling, thereby reducing costs for industrial production and transportation of silver nanoparticles. In addition, the synthesized silver nanoparticles can be used for a long time since the silver nanoparticles are stable in a solid state for 1 year or more. | 09-06-2012 |
Kurt E. Koshiol, Minnetonka, MN US
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20110159371 | IMPLANTABLE MEDICAL DEVICE INCLUDING EDDY CURRENT REDUCING BATTERY - An implantable device, such as a pacer, defibrillator, or other cardiac rhythm management device, can include one or more MRI Safe components. In an example, the implantable device includes a battery including a first electrode and a second electrode separate from the first electrode. The second electrode includes a first surface and a second surface. The second electrode includes a slot through the second electrode from the first surface toward the second surface. The slot extends from a perimeter of the second electrode to an interior of the second electrode. The slot is configured to at least partially segment a surface area of the second electrode to reduce a radial current loop size in the second electrode. | 06-30-2011 |
20140335422 | IMPLANTABLE MEDICAL DEVICE INCLUDING EDDY CURRENT REDUCING BATTERY - An implantable device, such as a pacer, defibrillator, or other cardiac rhythm management device, can include one or more MRI Safe components. In an example, the implantable device includes a battery including a first electrode and a second electrode separate from the first electrode. The second electrode includes a first surface and a second surface. The second electrode includes a slot through the second electrode from the first surface toward the second surface. The slot extends from a perimeter of the second electrode to an interior of the second electrode. The slot is configured to at least partially segment a surface area of the second electrode to reduce a radial current loop size in the second electrode. | 11-13-2014 |
Kurt E. Nurmi, Macomb, MI US
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20120007372 | VEHICLE LATCH WITH OVER TRAVEL STOP FEATURE - A latch assembly is provided, the latch assembly having: a frame having a striker opening formed therein; a fork bolt pivotally secured to the latch assembly proximate to the striker opening for movement between an unlatched position and a latched position, the fork bolt having an opening configured to engage a striker when the striker is inserted into the striker opening and the fork bolt is in the unlatched position; and a feature located on an outer periphery of the fork bolt, the feature limiting pivotal movement of the fork bolt by contacting the striker when the striker is inserted into the striker opening and the striker is not received in the opening of the fork bolt. | 01-12-2012 |
20120043766 | HOOD LATCH WITH THEFT PROTECTION FEATURE - A latch assembly is provided, the latch assembly having: a fork bolt pivotally secured to the latch assembly for movement between an unlatched position and a latched position; a detent lever pivotally secured to the latch assembly for movement between an engaged position and a disengaged position, wherein the fork bolt is prevented from moving toward the unlatched position from the latched position when the detent lever is in the engaged position; a frame, the frame having a striker opening and a first opening; and a secondary lever pivotally mounted to the latch assembly for movement between a first position, wherein a hasp of the secondary lever is positioned over the striker opening and a second position wherein the hasp is not positioned over the striker opening and wherein a feature of the secondary lever blocks access to the first opening when the secondary lever is in the first position and wherein the feature of the secondary lever does not block access to the first opening when the secondary lever is in the second position. | 02-23-2012 |
20140217751 | LATCH MECHANISM - A latch is provided including a fork bolt configured to rotate between an unlatched position and a latched position. A detent is configured to cooperate with the fork bolt. At least one of the fork bolt and the detent includes a resilient absorption mechanism. The resilient absorption mechanism is configured to deform upon impact and decelerate the rotation of either the fork bolt of the detent respectively. The latch also includes a housing and a stop tab protruding from the housing. The stop tab is configured to engage a complementary portion of the fork bolt with in a latched position to limit further rotation thereof. | 08-07-2014 |
20140217752 | LATCH MECHANISM - A latch is provided including a fork bolt configured to rotate between an unlatch position and a latched position. A detent is configured to cooperate with the forkbolt. A bumper includes an upper contact portion and an elongated lower portion. The bumper is configured to receive a striker when the fork bolt is in the latched position. A guide member includes a generally curved flexible portion. The flexible portion is configured to deflect about a first end to guide the striker towards the upper contact portion of the bumper. | 08-07-2014 |
Kurt E. Petersen, Milpitas, CA US
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20140357964 | TISSUE-INTEGRATING ELECTRONIC APPARATUS - Tissue-integrating electronic apparatuses, systems comprising such apparatuses and methods of using these apparatuses and systems for the detection of one or more signals are provided. | 12-04-2014 |
Kurt E. Polins, Baltimore, MD US
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20080224107 | Device and System For Lifting a Motor Vehicle - A preferred embodiment of a system includes a lifting device for lifting a motor vehicle, a support structure for mounting the lifting device in a pit, and a carriage for supporting the lifting device from the support structure and being movable within the support structure. The system also includes a cover coupled to opposite sides of the carriage so that the cover extends away from the carriage and continuously between the opposite sides of the carriage. | 09-18-2008 |
20120263570 | DEVICE AND SYSTEM FOR LIFTING A MOTOR VEHICLE - A preferred embodiment of a system includes a lifting device for lifting a motor vehicle, a support structure for mounting the lifting device in a pit, and a carriage for supporting the lifting device from the support structure and being movable within the support structure. The system also includes a cover coupled to opposite sides of the carriage so that the cover extends away from the carriage and continuously between the opposite sides of the carriage. | 10-18-2012 |
20130313498 | DEVICE AND SYSTEM FOR LIFTING A MOTOR VEHICLE - A preferred embodiment of a system includes a lifting device for lifting a motor vehicle, a support structure for mounting the lifting device in a pit, and a carriage for supporting the lifting device from the support structure and being movable within the support structure. The system also includes a cover coupled to opposite sides of the carriage so that the cover extends away from the carriage and continuously between the opposite sides of the carriage. | 11-28-2013 |
Kurt E. Sincerbox, San Jose, CA US
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20120057313 | PACKAGE FOR SYSTEM LEVEL ELECTRONIC PRODUCTS - Methods and arrangements for packaging system level electronics are described. In one aspect, an external skin of the package is formed from isolation paper. In some embodiments, the isolation paper is formed into a box. A printed circuit board is placed within the isolation paper skin and is substantially completely surrounded by a potting material that substantially completely fills the skin. The potting material is cured to solidify the potting material within the isolation paper box and to adhere the potting material to the isolation paper such that the isolation paper forms a skin for a brick of potting material that encapsulates the printed circuit board. The isolation paper skin includes at least one opening that permits an interconnect to be exposed through the skin. With this arrangement, a packaged electronics device is provided and the isolation paper forms the exposed outer surface of the packaged electronics device. The described package is particularly well suited for use in packaging system level power electronics such as power supplies. | 03-08-2012 |
20120285730 | UNIVERSAL CHIP CARRIER AND METHOD - A method of fabricating chip carriers suitable for use in packaging integrated circuits and other electronic, electro-mechanical and opto-electronic devices is described. In general, a number of wires (or wires and rods) are arranged in parallel in a wiring fixture. After the wires are positioned, they are encapsulated to form an encapsulated wiring block. The wiring block is then sliced to form a number of discrete panels. Preferably, the various wires are geometrically positioned such that each resulting panel has a large number of device areas defined therein. The encapsulant in each panel effectively forms a substrate and the wire segments in each panel form conductive vias that extend through the substrate. The resulting panels/chip carriers can then be used in a wide variety of packaging applications. | 11-15-2012 |