Patent application number | Description | Published |
20090154067 | CHIP-TYPE FILTER - A chip-type filter has a laminated body formed by stacking a plurality of capacitor elements, a pair of positive electrode terminals, a pair of negative electrode terminals, insulating outer resin, and an inductor section. The laminated body includes capacitor elements in a first group and capacitor elements in a second group, the positive electrode sections in both groups are disposed on the opposite sides with respect to the negative electrode sections. Positive electrode terminals are electrically connected to the positive electrode sections of capacitor elements in the first group and those of capacitor elements in the second group, respectively. Negative electrode terminals are electrically connected to the negative electrode sections in the laminated body, and are disposed at both ends of the direction crossing the connecting direction between the positive electrode terminals. The inductor section is insulated from the negative electrode sections and couples the positive electrode terminals. | 06-18-2009 |
20090160579 | DIGITAL SIGNAL PROCESSOR - A digital signal processor includes a component for processing a digital signal, a power line for supplying a power to the component, and a decoupling capacitor connected between the power line and a ground. The decoupling capacitor has an equivalent series resistance larger than zero and not larger than 25 mΩ at 100 kHz and an equivalent series inductance larger than zero and not larger than 800 pH at 500 MHz. This digital signal processor does not generate a lot of digital noise, and has a small, thin size. | 06-25-2009 |
20090174502 | PRINTED BOARD AND FILTER USING THE SAME - A printed board is mounted with a chip-type solid electrolytic capacitor of a four-terminal structure where a pair of positive electrode terminals are disposed at opposite positions and a pair of negative electrode terminals are disposed at opposite positions on a mounting surface. The printed board has a pair of positive electrode patterns and a pair of negative electrode patterns to which the positive electrode terminals and negative electrode terminals of the chip-type solid electrolytic capacitor are connected, respectively. The printed board further has an inductor section that is insulated from the negative electrode patterns, and electrically connects the positive electrode patterns. | 07-09-2009 |
20100165547 | SOLID ELECTROLYTIC CAPACITOR - A capacitor element includes a positive electrode body made of valve metal, a dielectric oxide layer on the positive electrode body, a solid electrolytic layer made of conductive polymer on the dielectric oxide layer, and a negative electrode layer on the solid electrolytic layer. A solid electrolytic capacitor includes the capacitor element, a package made of insulating resin covering the capacitor element, a base electrode provided at an edge surface of the package and made of non-valve metal coupled with the positive electrode body, a diffusion layer for connecting the positive electrode body to the base electrode, an external electrode on the base electrode, and an external electrode connected to the negative electrode layer. The solid electrolytic capacitor reduces the number of components and processes to reduce its cost and to have a small size, and has a small equivalent series resistance and a small equivalent series inductance. | 07-01-2010 |
20110127694 | METHOD OF MANUFACTURING RESIN MOLDED ELECTRONIC COMPONENT (AS AMENDED) - A method of manufacturing a resin molded electronic component using a first mold having a cavity with an open top surface and a second mold combined with the first mold on top includes the following steps: (A) inserting a element of the electronic component and a liquid resin precursor into the cavity of the first mold, the liquid resin precursor having viscosity of 10 Pa·s or lower at 40° C.; (B) arranging the second mold such that the element and the resin precursor are sandwiched after the step (A); and (C) pressing the element and the resin precursor between the first mold and the second mold, and curing the resin precursor by heat from the second mold after the step (B). A temperature of the second mold is set to be higher than that of the first mold. | 06-02-2011 |
20120087062 | SURFACE MOUNT ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A surface mount electronic component includes an element, an anode terminal, a cathode terminal, and an outer package body. The element has a configuration including an anode, and a cathode formed on a part of the surface of the anode via a dielectric substance. An anode terminal is electrically connected to the anode, and a cathode terminal is electrically connected to the cathode. The outer package body covers an element laminated body such that a part of the anode terminal and a part of the cathode terminal are exposed. The outer package body is made of a norbornene resin. Thus, an electronic component having high reliability can be achieved. | 04-12-2012 |
Patent application number | Description | Published |
20090017379 | SECONDARY BATTERY, POWER SUPPLY SYSTEM USING SAME AND USAGE OF POWER SUPPLY SYSTEM - A secondary battery is equipped with a reaction container and a current collector that is built in at least one of a positive electrode side and a negative electrode side. The positive electrode side and the negative electrode side are separated from each other by an ion conductive separator. In the reaction container, an organic matter excluding a metal complex and a radical and capable of reversibly being electrochemically oxidized and reduced is used as an active material together with a supporting salt. The active material and the supporting salt form a liquid. On the surface of the current collector, the active material contained in the liquid is charged and discharged. | 01-15-2009 |
20090096718 | PLASMA DISPLAY DEVICE - The plasma display device has the following structure: a panel having a plurality of discharge cells; an electrode-dedicated power supply for generating voltage to be applied to any one of the electrodes disposed on the panel; a driving-waveform generator that has a switching element for outputting voltage of the electrode-dedicated power supply so as to generate a waveform of driving voltage for driving the electrodes; a switch controller for controlling the switching element; a controller-dedicated power supply for supplying the switch controller with electric power; and an auxiliary power supply that generates a voltage lower than that of the controller-dedicated power supply by reducing voltage of the electrode-dedicated power supply so as to supply the switch controller with electric power. | 04-16-2009 |
20100066718 | DRIVING DEVICE AND DRIVING METHOD OF PLASMA DISPLAY PANEL, AND PLASMA DISPLAY DEVICE - In a driving device of a plasma display panel including switch circuits (Q | 03-18-2010 |
20100164927 | PLASMA DISPLAY DEVICE - A plasma display device includes a scan electrode drive circuit including a sustain pulse generating circuit, which includes an electric power recovery capacitor, a first recovery switch and a first recovery inductor connected in series so as to form an electric current passage in which an electric current is allowed to flow from the electric power recovery capacitor to a scan electrode, a second recovery switch and a second recovery inductor connected in series so as to form an electric current passage in which an electric current is allowed to flow from the scan electrode to the electric power recovery capacitor, a first damper capacitor connected to a node between a diode of the first recovery switch and the first recovery inductor, and a second damper capacitor connected to a node between a diode of the second recovery switch and the second recovery inductor. | 07-01-2010 |
20100188387 | DRIVING DEVICE AND DRIVING METHOD OF PLASMA DISPLAY PANEL, AND PLASMA DISPLAY DEVICE - A scan IC includes a switch circuit and a logic circuit. The switch circuit includes first and second transistors and a level shift circuit. First and second control signals that change between a logical “1” and a logical “0” are applied to an input terminal of the logic circuit. The logic circuit applies a third control signal to the first transistor and applies a fourth control signal to the second transistor based on the applied first and second control signals. A detection circuit is connected to the input terminal of the logic circuit. An abnormality of the scan IC is detected by the detection circuit. | 07-29-2010 |
20110227545 | VIBRATION POWER GENERATOR, VIBRATION POWER GENERATING DEVICE AND COMMUNICATION DEVICE HAVING VIBRATION POWER GENERATING DEVICE MOUNTED THEREON - Electricity generated by a vibration power generator | 09-22-2011 |
20130249565 | POWER STORAGE APPARATUS, MOBILE DEVICE, AND ELECTRIC-POWERED VEHICLE - Provided is a power storage apparatus having an impedance measuring function and is capable of, when the apparatus has a large number of power storage elements connected in series, judging a deteriorated power storage element in a short period of time. The power storage apparatus having the impedance measuring function measures and compares impedances of power storage units in a high-voltage side half and a low-voltage side half using a first judgment circuit, measures impedances of high-voltage side and low-voltage side power storage elements by selectively using a second judgment circuit installed adjacent to a power storage unit judged to have a large impedance. With this, the power storage apparatus identifies a power storage element that has high impedance among the whole and its impedance, and detects and displays deterioration or malfunction through a threshold-value judgment. | 09-26-2013 |