Patent application number | Description | Published |
20140246751 | Integrated Circuit Using Deep Trench Through Silicon (DTS) - An embodiment radio frequency area of an integrated circuit includes a substrate having a first resistance, the substrate including an implant region, a buried oxide layer disposed over the substrate, an interface layer between the substrate and the buried oxide layer, the interface layer having a second resistance lower than the first resistance, a silicon layer disposed over the buried oxide layer, and an interlevel dielectric disposed in a deep trench, the deep trench extending through the silicon layer, the buried oxide layer, and the interface layer over the implant region. In an embodiment, the deep trench extends through a polysilicon layer disposed over the silicon layer. | 09-04-2014 |
20150115381 | MECHANISMS FOR FORMING RADIO FREQUENCY (RF) AREA OF INTEGRATED CIRCUIT STRUCTURE - Embodiments of mechanisms of forming a radio frequency area of an integrated circuit are provided. The radio frequency area of an integrated circuit structure includes a substrate, a buried oxide layer formed over the substrate, and an interface layer formed between the substrate and the buried oxide layer. The radio frequency area of an integrated circuit structure also includes a silicon layer formed over the buried oxide layer and an interlayer dielectric layer formed in a deep trench. The radio frequency area of an integrated circuit structure further includes the interlayer dielectric layer extending through the silicon layer, the buried oxide layer and the interface layer. The radio frequency area of an integrated circuit structure includes an implant region formed below the interlayer dielectric layer in the deep trench and a polysilicon layer formed below the implant region. | 04-30-2015 |
20150132918 | Integrated Circuit Using Deep Trench Through Silicon (DTS) - An embodiment radio frequency area of an integrated circuit is disclosed. The radio frequency area includes a substrate having an implant region. The substrate has a first resistance. A buried oxide layer is disposed over the substrate and an interface layer is disposed between the substrate and the buried oxide layer. The interface layer has a second resistance lower than the first resistance. A silicon layer is disposed over the buried oxide layer and an interlevel dielectric is disposed in a deep trench. The deep trench extends through the silicon layer, the buried oxide layer, and the interface layer over the implant region. The deep trench may also extend through a polysilicon layer disposed over the silicon layer. | 05-14-2015 |
20150137234 | MECHANISMS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH FLOATING SPACER - Embodiments of mechanisms for forming a semiconductor device structure with floating spacers are provided. The semiconductor device structure includes a silicon-on-insulator (SOI) substrate and a gate stack formed on the SOI substrate. The semiconductor device structure also includes gate spacers formed on sidewalls of the gate stack. The gate spacers include a floating spacer. The semiconductor device structure further includes a contact etch stop layer formed on the gate stack and the gate spacers. The contact etch stop layer is formed between the floating spacer and the SOI substrate. | 05-21-2015 |
20150206902 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME - Embodiments for forming a semiconductor device structure are provided. The semiconductor device structure includes a substrate and a buried oxide layer formed over the substrate. An interface layer is formed between the substrate and the buried oxide layer. The semiconductor device structure also includes a silicon layer formed over the buried oxide layer; and a polysilicon layer formed over the substrate and in a deep trench. The polysilicon layer extends through the silicon layer, the buried oxide layer and the interface layer. | 07-23-2015 |
20150206964 | SEMICONDUCTOR DEVICE STRUCTURE WITH METAL RING ON SILICON-ON-INSULATOR (SOI) SUBSTRATE - In accordance with some embodiments, a semiconductor device is provided. The semiconductor device structure includes a substrate, and the substrate has a device region and an edge region. The semiconductor device structure also includes a silicon layer formed on the substrate and a transistor formed on the silicon layer. The transistor is formed at the device region of the substrate. The semiconductor device structure further includes a metal ring formed in the silicon layer. The metal ring is formed at the edge region of the substrate, and the transistor is surrounded by the metal ring. | 07-23-2015 |
Patent application number | Description | Published |
20080256376 | MULTI-THREAD POWER-GATING CONTROL DESIGN - The invention relates to a multi-thread power gating control design, setting idle components into a sleep mode to reduce power consumption due to current leakage. Based on compiler techniques, the invention arranges predicted-power-gating instructions into every thread of a may-happen-in-parallel region. A predicted-power-on instruction determines whether the corresponding component has been powered on, and powers on the component when it has not been powered on yet. A predicted-power-off instruction determines whether the component is required in the rest of the may-happen-in-parallel region, and powers off the component when it is required later. | 10-16-2008 |
20100238312 | IMAGE SENSOR HAVING OUTPUT OF INTEGRAL IMAGE - An image sensor having an output of an integral image is provided. The image sensor includes a pixel circuit, a line accumulator, and a volume accumulator. The pixel circuit includes a plurality of pixels for capturing pixel values of the pixels. The line accumulator is used for accumulating the pixel values of the pixels from a first pixel to a target pixel in a target pixel line of the image so as to obtain an accumulated line pixel value. The volume accumulator is used for adding the accumulated line pixel value output by the line accumulator to an integral pixel value of the pixel corresponding to the target pixel in a previous pixel line of the target pixel line, and using an adding result as the integral pixel value of the target pixel, so as to output the integral pixel value of the target pixel to form an integral image. | 09-23-2010 |
20120040623 | METHOD AND SYSTEM FOR TRIGGERING CORRESPONDING FUNCTIONS OF ELECTRONIC DEVICES - An exemplary method for triggering a corresponding function of an electronic device and a system using the same are provided. The method includes detecting radio signals between a first electronic device and a second electronic device, generating a radio signal quality evaluation value according to the characteristic of the radio signals and setting the function triggering module to one of the working modes according to the radio signal quality evaluation value. | 02-16-2012 |
Patent application number | Description | Published |
20140313595 | THIN-TYPE WIDE-ANGLE IMAGING LENS ASSEMBLY WITH FIVE LENSES - A thin-type wide-angle imaging lens assembly comprises a fixing diaphragm and an optical set including five lenses. An arranging order from an object side to an image side is: a first lens; a second lens; a third lens; a fourth lens; a fifth lens; and the fixing diaphragm disposed between an object and the third lens. At least one surface of the first, second, and third lenses is aspheric. At least one surface of the fourth and fifth lenses is aspheric. By the concatenation between the lenses and the adapted curvature radius, thickness, interval, refractivity, and Abbe numbers, the assembly attains a shorter height and a better optical aberration. | 10-23-2014 |
20140320983 | IMAGING LENS ASSEMBLY WITH FIVE LENSES - An imaging lens assembly comprises a fixing diaphragm and an optical set including five lenses. An arranging order from an object side to an image side is: a first lens; a second lens; a third lens; a fourth lens; a fifth lens; and the fixing diaphragm disposed between an object and the third lens. By the concatenation between the lenses and the adapted curvature radius, thickness, interval, refractivity, and Abbe numbers, the assembly attains a big diaphragm with wide-angle, a shorter height, and a better optical aberration. | 10-30-2014 |
20140334018 | IMAGING LENS ASSEMBLY - An imaging lens assembly includes first, second and third optical lenses that are arranged sequentially from an object side to an image side along an optical axis, and a constant-aperture diaphragm disposed between the second optical lens and the object side. Each of the first and second optical lenses has a positive refractive power near the optical axis. The third optical lens has a negative refractive power near the optical axis and has an object-side surface and an image-side surface, at least one of which has at least an inflection point. The imaging lens assembly satisfies: 0.5511-13-2014 | |
20140376111 | WIDE-ANGLE IMAGING LENS ASSEMBLY WITH THREE LENSES - A wide-angle imaging lens assembly comprises a fixing diaphragm and an optical set including three lenses. An arranging order from an object side to an image side is: a first lens; a second lens; a third lens. Two surfaces of the third lens have at least one inflection point from the optical axis to an end point of the aspheric surfaces. At least one surface of the three lenses are aspheric. The fixing diaphragm is disposed at any position between an object and the second lens. By the concatenation between the lenses and the adapted curvature radius, thickness, interval, refractivity, and Abbe numbers, the assembly attains a big diaphragm with ultra-wide-angle, a shorter height, and a better optical aberration. | 12-25-2014 |
20150015972 | THIN-TYPE IMAGING LENS ASSEMBLY WITH FOUR LENSES - An imaging lens assembly comprises a fixing diaphragm and an optical set including four lenses. An arranging order from an object side to an image side is: a first lens; a second lens; a third lens; and a fourth lens. At least one surface of the first and the second lenses is aspheric. At least one surface of the third and the fourth lenses are aspheric. The fixing diaphragm is disposed between an object and the second lens. By the concatenation between the lenses and the adapted curvature radius, thickness, interval, refractivity, and Abbe numbers, the assembly attains a big diaphragm with wide-angle, a shorter height, and a better optical aberration. | 01-15-2015 |
20150077868 | IMAGING LENS MODULE - An imaging lens module includes first, second and third optical lenses that are arranged sequentially from an object side to an image side along an optical axis, and a constant-aperture diaphragm disposed between the first and second optical lenses. The first optical lens has a positive refractive power, and the second optical lens has a negative refractive power. The third optical lens has a positive refractive power and has an object-side surface and an image-side surface, At least one of which has at least an inflection point. The imaging lens module satisfies: 0.8 | 03-19-2015 |
20150116847 | IMAGING LENS MODULE - An imaging lens module includes first, second, third and fourth optical lens elements that are arranged sequentially from an object side to an image side along an optical axis and that respectively have positive, positive, negative and negative refractive powers, and a fixed aperture stop that is disposed between the object side and the second optical lens element. The fourth optical lens element has an object-side surface and an image-side surface that has a concave surface segment near the optical axis. At least one of the object-side surface and the image-side surface of the fourth optical lens element has at least an inflection point. | 04-30-2015 |
20150146086 | SIX-PIECE OPTICAL LENS FOR CAPTURING IMAGE AND SIX-PIECE OPTICAL MODULES FOR CAPTURING IMAGE - The invention discloses a six-piece optical lens for capturing image and a six-piece optical module for capturing image. In order from an object side to an image side, the optical lens along the optical axis comprises a first lens element having a convex object-side surface and a convex image-side surface; a second lens element having a convex object-side surface and a concave image-side surface; a third lens element with positive refractive power having a convex object-side surface and a convex image-side surface; a fourth lens element with refractive power; a fifth lens element having a convex image-side surface; and a sixth lens element having a concave image-side; and at least one of the image-side surface and object-side surface of each of the six lens elements are aspheric. The optical lens can reduce the sensitivity for use in compact cameras with camera functionalities. | 05-28-2015 |
20150185441 | SEVEN-PIECE OPTICAL LENS FOR CAPTURING IMAGE AND SEVEN-PIECE OPTICAL MODULES FOR CAPTURING IMAGE - The invention discloses a seven-piece optical lens for capturing image and a seven-piece optical module for capturing image. In order from an object side to an image side, the optical lens along the optical axis comprises a first lens element; a second lens element; a third lens element; a fourth lens element with positive refractive power; a fifth lens element; a sixth lens element with positive refractive power having a convex image-side; and a seventh lens element with positive refractive power having a convex object-side, and the first lens element, the second lens element, the third lens element, and the fifth lens element have refractive power, and at least one of the image-side surface and object-side surface of the second lens element, the sixth lens element, and the seventh lens element are aspheric. | 07-02-2015 |
20150205072 | FIVE-PIECE LENS SET FOR CAPTURING IMAGES - The invention discloses a five-piece lens set for capturing images. The lens set comprises an aperture stop, an image-plane, and a five-piece optical lens for capturing images. The optical lens comprises a first lens element having a convex object-side surface; a second lens element having a concave image-side surface; a third lens element with positive refractive power having a convex object-side surface, and both the object-side surface and the image-side surface of the fifth lens element are aspheric; a fourth lens element having a concave object-side surface and a convex image-side surface; both the object-side surface and the image-side surface of the fifth lens element are aspheric. Wherein, at least one of the image-side surface and object-side surface of the first lens element, the second lens element, and the fourth lens element are aspheric, and at least two of the aspheric surfaces have one inflection point. | 07-23-2015 |