Patent application number | Description | Published |
20100315004 | Lamp - A lamp includes a lighting module having a lighting element and a control circuit electrically connected to the lighting element. The lamp further includes a control unit having a temperature sensor and a processor electrically connected to the temperature sensor and the control circuit. The temperature sensor senses a temperature of the lighting element and generates a temperature sensing result. The processor controls brightness of the lighting element based on the temperature sensing result of the temperature sensor. Since the brightness of the lighting element can be controlled by the processor through the control circuit using the temperature sensing result, overheating of the lighting element during operation can be avoided. The service life of the lighting element is, thus, prolonged. | 12-16-2010 |
20110101776 | LAMP CIRCUIT - A lamp circuit is disclosed, comprising a direct current (DC) power supplier adapted to provide a supply voltage, a driving unit coupled to the DC power supplier so as to receive the supply voltage, and a light-radiating module coupled to the driving unit and having a DC output side. The driving unit generates a constant DC current that passes through the light-radiating module such that a DC voltage to be supplied to a DC load is built at the DC output side. | 05-05-2011 |
20110175537 | AC LED LAMP - An alternating current (AC) light-emitting diode (LED) lamp includes a first AC power end, a second AC power end, a lighting module and a direct current (DC) power output circuit. The lighting module has a first end, a second end and at least one LED unit, wherein the first end is electrically coupled to the first AC power end. The at least one LED unit has one or more LEDs connected in series. The DC power output circuit has a first end and a second end, wherein the second end of the DC power output circuit is electrically coupled to the second AC power end, while the first end of the DC power output circuit is electrically coupled to the second end of the lighting module. The DC power output circuit has a DC output side. | 07-21-2011 |
20110221364 | ROTATION CONTROL CIRCUIT OF FAN - A rotation control circuit comprises a motor-driving unit and a rotation-switching unit. The motor-driving unit is coupled to a motor of a fan. The rotation-switching unit is coupled to the motor-driving unit and has at least a charging-discharging circuit for generating a rotation control command, the rotation control command controls the motor to rotate in a forward direction for a time period when the motor starts to operate, and controls the motor to rotate in a backward direction opposite to the forward direction. | 09-15-2011 |
20110279981 | Heat Dissipating Assembly - A heat dissipating assembly includes a circuit board having opposite first and second faces. The circuit board further includes a through-hole extending from the first face through the second face. A heat generating element is mounted on the first face of the circuit board and electrically coupled to the circuit board. The heat generating element includes a heat conducting portion aligned with the through-hole. A heat dissipating unit includes a base having an engaging face in contact with the second face of the circuit board. A metal solder is filled in the through-hole. The metal solder is engaged with the engaging face of the base and the heat conducting portion of the heat generating element. The heat generating element is directly engaged with the heat dissipating unit by the metal solder to effectively enhance the overall heat dissipating efficiency while reducing the number of members to lower the manufacturing costs. | 11-17-2011 |
20110292614 | Cooling Module Assembly Method - A cooling module assembly method comprises forming at least one through-hole on a circuit board; coupling the circuit board to a heat dissipating unit so that a face of the circuit board is coupled to a coupling face of the heat dissipating unit; filling the at least one through-hole with metal solders; fixing at least one heat-generating element to another face of the circuit board, wherein the at least one heat-generating element aligns with and covers the at least one through-hole; and soldering the at least one heat-generating element and the heat dissipating unit together by melting the metal solders in the at least one through-hole. | 12-01-2011 |
20110310559 | Heat Dissipating Assembly - A heat dissipating assembly includes a circuit board having opposite first and second faces. The circuit board further includes a through-hole extending from the first face through the second face. A heat generating element is mounted on the first face of the circuit board and electrically coupled to the circuit board. The heat generating element includes a heat conducting portion aligned with the through-hole. A heat dissipating unit includes a base having an engaging face in contact with the second face of the circuit board. A heat conducting adhesive is filled in the through-hole. The heat conducting adhesive is engaged with the engaging face of the base and the heat conducting portion of the heat generating element. The heat generating element is directly engaged with the heat dissipating unit by the heat conducting adhesive to effectively enhance the overall heat dissipating efficiency while reducing the number of members to lower the manufacturing costs. | 12-22-2011 |
20120176054 | LIGHT DEVICE AND POWER CONTROL CIRCUIT THEREOF - A light device comprising a light emitting unit, a voltage control unit, and a current control unit is provided. The light emitting unit is capable of receiving DC power. The voltage control unit has a power input terminal, a power output terminal, and a voltage setting member, with the power input terminal connecting with the light emitting unit, the voltage setting member having a threshold value to control the voltage of the power output terminal in a value equal to or lower than the threshold value. The current control unit has a voltage regulating member and a current adjusting member, with the voltage regulating member connecting with the power output terminal of the voltage control unit and generating a stable DC voltage, and with the current adjusting member connected between the voltage regulating member and a ground point to stabilize a current passing through the current adjusting member. | 07-12-2012 |
20140210347 | AC LED LAMP - An AC LED lamp includes first and second AC power ends, a lighting module and a DC power output circuit. The lighting module has first and second ends and an LED unit. The first end is connected to the first AC power end. The LED unit has one or more LEDs. The DC power output circuit has first and second ends. The second end of the DC power output circuit is coupled to the second AC power end. The first end of the DC power output circuit is coupled to the second end of the lighting module. The DC power output circuit has a DC output side and is not directly connected to the first AC power end. The DC power output circuit has a rectifying unit and a voltage limiting and filtering unit. The rectifying unit and the voltage limiting and filtering unit are coupled to the lighting module. | 07-31-2014 |
Patent application number | Description | Published |
20090288761 | COMPOSITE WITH THERMO-FORMABILITY, METHOD FOR MAKING THE SAME AND METHOD FOR MAKING A CASING WITH TEXTURE ON SURFACE THEREOF - The present invention relates to a composite with thermo-formability, a method for making the same and a method for making a casing with a texture on the surface thereof. The composite includes a PU medium layer, a thermo-formable resin layer, a base layer and a surface layer. The thermo-formable resin layer is disposed on the PU medium layer, and includes polyol. The base layer is disposed on the thermo-formable resin layer. The surface layer is disposed on the base layer. As a result, the composite has good stability after thermoforming, and plastic can be injected into the composite, so a PC film is unnecessary. Moreover, the composite may be adhered to a substrate directly or after thermoforming. | 11-26-2009 |
20110194293 | STRUCTURE WITH LUMINOUS AND VISUAL EFFECTS AND LIGHT TRANSMISSIVE SHEET THEREOF AND METHOD FOR MAKING THE SAME - The present invention relates to a structure with luminous and visual effects, a light transmissive sheet thereof, and a method for making the same. The light transmissive sheet includes a first layer, a light transmissive intermediate layer and a second layer. The material of the first layer, the light transmissive intermediate layer and the second layer is polyurethane resin. The light transmissive intermediate layer is disposed on the first layer, and the second layer is disposed on the light transmissive intermediate layer. At least one pattern is formed on the first layer or the second layer, and the pattern penetrates the first layer or the second layer. When light irradiates the light transmissive sheet, the pattern is shown, so the light transmissive sheet has luminous and visual effects. | 08-11-2011 |
Patent application number | Description | Published |
20110175217 | Semiconductor Packages Including Die and L-Shaped Lead and Method of Manufacture - The present technology is directed toward semiconductors packaged by electrically coupling a plurality of die to an upper and lower lead frame. The opposite edges of each corresponding set of leads in the upper lead frame are bent. The leads in the upper lead frame are electrically coupled between respective contacts on respective die and respective lower portion of the leads in the lower lead frame. The bent opposite edges of each corresponding set of leads of the upper lead frame support the upper lead frame before encapsulation, for achieving a desired position of the plurality of die between the leads of the upper and lower lead frames in the packaged semiconductor. After the encapsulated die are separated, the upper leads have an L-shape and electrically couple die contacts on upper side of the die to leads on the lower side of the die so that the package contacts are on the same side of the semiconductor package. | 07-21-2011 |
20140332939 | Dual Lead Frame Semiconductor Package and Method of Manufacture - A semiconductor package and a method for making the same are provided. In the method, a clip is used to conduct a lead frame and at least one chip. The clip has at least one second connection segment, at least one third connection segment, and at least one intermediate connection segment. The second connection segment is electrically connected to a second conduction region of the chip and a second pin of the lead frame respectively, and the third connection segment is electrically connected to a third conduction region of the chip and a third pin of the lead frame respectively. The intermediate connection segment connects the at least one second connection segment and the at least one third connection segment, and is removed in a subsequent process. Thereby, the present invention does not need to use any gold wire, which effectively saves the material cost and the processing dine. | 11-13-2014 |
20140370661 | Dual Lead Frame Semiconductor Package and Method of Manufacture - A semiconductor package and a method for making the same are provided. In the method, a clip is used to conduct a lead frame and at least one chip. The clip has at least one second connection segment, at least one third connection segment, and at least one intermediate connection segment. The second connection segment is electrically connected to a second conduction region of the chip and a second pin of the lead frame respectively, and the third connection segment is electrically connected to a third conduction region of the chip and a third pin of the lead frame respectively. The intermediate connection segment connects the at least one second connection segment and the at least one third connection segment, and is removed in a subsequent process. Thereby, the present invention does not need to use any gold wire, which effectively saves the material cost and the processing time. | 12-18-2014 |
Patent application number | Description | Published |
20130023589 | MEDICATION FOR THERAPY OR PROPHYLAXIS OF ASTHMA - A medication for therapy or prophylaxis of asthma, comprises a ginger compound selected from a group of [6]-gingerol, [10]-gingerol, [6]-shogaol and [6]-gingerol; and an acceptable carrier or excipient, which can relieve the airway remodeling symptoms of asthma, particularly to phthalate induced airway remodeling, by suppressing the proliferation and migration of bronchial smooth muscle cells and reducing the instances of fatal asthma. | 01-24-2013 |
20130281543 | METHOD OF TREATING AIRWAY REMOLDING SYMPTOM - A method of treating airway remolding symptom caused by phthalate esters, by providing a medication comprising: a ginger compound selected from one of (a) [6]-shogaol, (b) [6]-shogaol and [10]-gingerol, (c) [6]-shogaol and [8]-gingerol, and (d) [6]-shogaol and [6]-gingerol, and an acceptable carrier or excipient, which can relieve, the airway remodeling symptoms of asthma, particularly to phthalate ester-induced airway remodeling, by suppressing the proliferation and migration of bronchial smooth muscle cells and reducing the instances of fatal asthma. | 10-24-2013 |
Patent application number | Description | Published |
20140186799 | DENTAL IMPLANT - The invention provides a dental implant including a body portion, an abutment portion and a connection portion. The body portion has a body outer diameter. The connection portion is connected between the body portion and the abutment portion. The body portion, the connection portion and the abutment portion are integrally formed. The connection portion has a first area connected to the body portion. An outer diameter of the first area is less than the body outer diameter of the body portion adjacent to the first area. The connection portion has an indented structure to adhere the alveolar bone and grow the soft tissue, so that a biologic width is formed between the soft tissue and the hard tissue to prevent bacteria in the mouth from invading the alveolar bone tissue, thereby solving the problem of osteanabrosis in conventional dentistry, and satisfying the clinical aesthetic requirement of the anterior teeth. | 07-03-2014 |
20140186800 | DENTAL IMPLANT - The invention provides a dental implant including a neck portion, a bottom portion and a body portion. The body portion connects the neck portion and the bottom portion. The body portion has a first end, a second end and a plurality of threads. The threads are disposed between the first end and the second end. Along a long axial direction and a direction from the first end to the second end, the cusp widths of the threads gradually increase, or heights from the cusp to the root of the threads gradually decrease. Therefore, the dental implant can be used to gradually squeeze and expand the alveolar bone and meanwhile improve the density of the alveolar bone, so that the dental implant has desirable initial-stage stability after the dental implant surgery, thereby solving the micromotion phenomenon after the instant dental implant surgery, and facilitating subsequent osseointegration. | 07-03-2014 |
Patent application number | Description | Published |
20080289449 | Method for measuring an outline of a stratum of a reactant and a path of charging the reactant in a blast furnace - A method has steps of providing a three-dimensional (3-D) laser scanner, providing a computer, obtaining point group data (PGD) and calculating measuring an outline of a top reactant stratum from the PGD. The step of providing a 3-D laser scanner directs a 3-D laser scanner at reactant strata in a blast furnace and output PGD that represent digital data of an inside of the blast furnace. The step of providing a computer connects the 3-D laser scanner to a computer having a point group analysis program. The step of calculating an outline of the top reactant stratum from the PGD is performed by the point group analysis program to calculate an outline of the top reactant stratum in the blast furnace from the PGD. At least one two-dimensional laser scanner is used to measure a path of the reactant being charged. | 11-27-2008 |
20090231141 | RFID TAG USING MONOPOLE ANTENNA - A radio frequency identification (RFID) tag using a monopole antenna is provided, in which an antenna structure is disposed on a metal plate, two ends of an RFID chip are electrically connected to the antenna structure, and the antenna structure and the RFID chip form a loop structure. The RFID tag can be disposed on a surface of an object to be measured, or disposed in an inner accommodation space of the object to be measured, so it is widely used in various applications. Additionally, the RFID tag is easily manufactured, so the production cost can be reduced. Furthermore, the RFID tag has a larger readable distance, and an electromagnetic wave emitting direction of the RFID tag is adjustable according to different included angles between the metal plate and the antenna structure, thereby causing signals to be read easily and identification ability to improve, two desirable effects. | 09-17-2009 |
20110193274 | RESIDENT MEASUREMENT SYSTEM FOR CHARGE LEVEL OF BLAST FURNACE - A resident measurement system for a charge level of a blast furnace includes a chamber, a servo system, a distance measurement unit, and a cooling-cleaning unit. The chamber is combined with a lateral furnace wall of the blast-furnace, covers an opening of the furnace wall, and has a pivoting hole. A pivot of the distance measurement unit is pivotally disposed at the pivoting hole, and the distance measurement unit is driven by the servo system to perform a motion with the pivot as a movement center, so as to measure the charge level. The cooling-cleaning unit is used to supply a high-pressure gas, which flows through the distance measurement unit to perform cooling and cleansing operations. The measurement system is small in dimension, and capable of scanning the charge level in an environment with high temperature, high concentration of dust, and high corrosion in the blast furnace furnace, establishing charge level information into a two-dimensional charge level mode, and obtaining a charge level profile distribution situation in real time, thereby promptly modifying a burden distribution mode. | 08-11-2011 |