Patent application number | Description | Published |
20130207103 | THIN-FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF AND DISPLAY - An embodiment of the invention provides a manufacturing method of a thin-film transistor includes: providing a substrate; sequentially forming a gate electrode, a gate insulating layer, and an active layer on the substrate; forming an insulating metal oxide layer covering the active layer, wherein the insulating metal oxide layer including a metal oxide of a first metal; forming a metal layer covering the active layer, wherein the metal layer includes a second metal; forming a source electrode and a drain electrode on the metal layer with a trench separating therebetween; removing the metal layer exposed by the trench; and performing an annealing process to the metal layer and the insulating metal oxide layer, such that the metal layer reacts with the insulating metal oxide layer overlapping the metal layer to form a conducting composite metal oxide layer including the first metal and the second metal. | 08-15-2013 |
20130207104 | MANUFACTURING METHOD OF THIN FILM TRANSISTOR AND DISPLAY DEVICE - An embodiment of the invention provides a manufacturing method of a thin film transistor including: providing a substrate; sequentially forming a gate electrode, a gate insulating layer covering the gate electrode, and an active layer on the substrate; forming a conductive layer on the active layer and including a source electrode, a drain electrode, and a separating portion connecting therebetween; forming a first photoresist layer on the conductive layer and covering the source electrode and the drain electrode and exposing the separating portion; oxidizing the separating portion into an insulating metal oxide layer so as to electrically insulate the source electrode from the drain electrode; and removing the first photoresist layer. | 08-15-2013 |
20150206980 | MANUFACTURING METHOD OF THIN FILM TRANSISTOR SUBSTRATE - An embodiment of the invention provides a manufacturing method of a thin film transistor substrate including: sequentially forming a gate electrode, a gate insulating layer covering the gate electrode, an active material layer, and a photo-sensitive material layer on a first substrate; performing a photolithography process by using a half tone mask to form a photo-sensitive protective layer which is above the gate electrode and has a first recess and a second recess; etching the active material layer by using the photo-sensitive protective layer as a mask to form an active layer; removing a portion of the photo-sensitive protective layer at bottoms of the first recess and the second recess to expose a first portion and a second portion of the active layer respectively; forming a first electrode connecting to the first portion; and forming a second electrode connecting to the second portion. | 07-23-2015 |
20150340446 | THIN FILM TRANSISTOR SUBSTRATE, METHOD FOR FORMING THE SAME, AND DISPLAY - A thin film transistor substrate includes: a substrate; a gate disposed on the substrate; a gate insulating layer disposed on the substrate and covering the gate; an active layer disposed on the gate insulating layer and above the gate, and the active layer has a first oxygen vacancy portion and a second oxygen vacancy portion; a source electrode and a drain electrode disposed on the active layer, the source electrode is connected to the first oxygen vacancy portion, and the drain electrode is connected to the second oxygen vacancy portion. | 11-26-2015 |
20160035900 | THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY PANEL USING THE SAME - A thin film transistor includes a gate electrode, a semiconductor layer, a source electrode, a drain electrode, a first protective layer, and a second protective layer. The gate electrode is disposed on a substrate. The metal oxide semiconductor layer is disposed on a gate insulating layer and electrically connects the source electrode and the drain electrode. The first protective layer disposed on the metal oxide semiconductor layer has a first oxygen vacancy concentration. The second protective layer disposed on the first protective layer has a second oxygen vacancy concentration. A boundary area located between the first and second protective layers has a third oxygen vacancy concentration. The third oxygen vacancy concentration is respectively greater than the first oxygen vacancy concentration and the second oxygen vacancy concentration. | 02-04-2016 |
20160049517 | THIN FILM TRANSISTOR AND DISPLAY PANEL USING THE SAME - A thin film transistor includes a gate electrode, a gate insulating layer, a source electrode, a drain electrode, and a channel layer. The gate electrode is disposed on a substrate, and the channel layer is electrically insulated from the gate electrode. The gate insulating layer is disposed between the gate electrode and the channel layer. The source electrode and the drain electrode are electrically connected with the channel layer. The channel layer includes a front channel layer proximate to a side of the gate insulating layer, a back channel layer proximate to a side of the source electrode and an intermediate layer between the front channel layer and the back channel layer. The oxygen vacancy concentration of the front channel layer is greater than the oxygen vacancy concentration of the intermediate layer | 02-18-2016 |
20160111453 | THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY - Disclosed is a TFT substrate, including a substrate and a gate electrode thereon. A gate insulation layer over the substrate covers the gate electrode. An active layer is disposed over the gate insulation layer. An etch stop layer is disposed over the active layer and the gate insulation layer. A first opening penetrates the etch stop layer to expose a first part of the active layer. A source electrode over the etch stop layer is electrically connected to the first part of the active layer through the first opening. A first inorganic insulation layer is disposed over the source electrode and the etch stop layer. A second opening penetrates the first inorganic insulation layer and the etch stop layer to expose a second part of the active layer. | 04-21-2016 |
20160131929 | DISPLAY PANELS - A display panel is provided. The display panel includes a first substrate having a display area and a non-display area. A sealant is disposed on the first substrate and on the non-display area. A planarization layer is disposed on the first substrate. The planarization layer has a first trench formed therein on the non-display area. The first trench has a bottom and a side adjacent to the bottom. The bottom has a roughness that is greater than the roughness of the side. | 05-12-2016 |